KCA55L7UMF681KL01#_技术文档

Reference Specification

Safety Standard Certified Metal Terminal Type Multilayer Ceramic Capacitors

for Automotive in accordance with AEC-Q200

Type MF Safety Standard certified ceramic capacitor of Class X1,Y2

Product specifications in this catalog are as of Apr. 2023, and are subject to change or

obsolescence without notice.

Please consult the approval sheet before ordering.Please read rating and Cautions first.

Reference only

Caution

Storage and Operation Conditions

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

1-1. Store the capacitors in the following conditions:Room Temperature of +5°C to +40°C and a Relative Humidity

of 20% to 70%.

(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity

conditions during storage may affect solderability and packaging performance. Therefore, please maintain

the storage temperature and humidity. Use the product within six months after delivery, as prolonged storage

may cause oxidation of the electrodes.

(2) Please confirm solderability before using after six months. Store the capacitors without opening the original bag.

Even if the storage period is short, do not exceed the specified atmospheric conditions.

1-2. Corrosive gas can react with the termination(external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas

(e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and electrical

performance may deteriorate. Do not store capacitors under direct sunlight or in high humidity conditions.

Rating

1. Temperature Dependent Characteristics

1. The electrical characteristics of a capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes.

The following actions are recommended in order to ensure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature. When you use a high dielectric constant type

capacitor in a circuit that needs a tight (narrow) capacitance tolerance (e.g., a time-constant circuit),

please carefully consider the temperature characteristics, and carefully confirm the various characteristics

in actual use conditions and the actual system.

2. Measurement of Capacitance

1. Measure capacitance with the voltage and frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.

3. Applied Voltage

1. Do not apply a voltage to a safety standard certified product that exceeds the rated voltage as called out in the

specifications. Applied voltage between the terminals of a safety standard certified product shall be less than or equal

to the rated voltage (+ 10%). When a safety standard certified product is used as a DC voltage product, the AC rated

voltage value becomes the DC rated voltage value.

(Example:AC250V (r.m.s.) rated product can be used as DC250V (+ 10%) rated product.)

If both AC rated voltage and DC rated voltage are specified, apply the voltage lower than the respective rated voltage.

1-1. When a safety standard certified product is used in a circuit connected to a commercial power supply,

ensure that the applied commercial power supply voltage including fluctuation should be less than 10% above

its rated voltage.

1-2. When using a safety standard certified product as a DC rated product in circuits other than those connected to

a commercial power supply.

When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.

Typical Voltage Applied to the DC Capacitor

DC Voltage

DC Voltage+AC

AC Voltage

Pulse Voltage

E

0

E

0

(E: Maximum possible applied voltage.)

2. Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.

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Caution

4. Type of Applied Voltage and Self-heating Temperature

1. Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the continuous

application of an AC voltage or pulse voltage. When a DC rated voltage product is used in an AC voltage circuit or a

pulse voltage circuit, the AC current or pulse current will flow into the capacitor; therefore check the self-heating condition.

Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits of the

operating temperature, including the rise in temperature due to self-heating. When the capacitor is used with a

high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.

5. DC Voltage and AC Voltage Characteristics

1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied.

Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage (see figure).

Please confirm the following in order to secure the capacitance.

(1) Determine whether the capacitance change caused by the applied voltage is within the allowed range.

(2) In the DC voltage characteristics, the rate of capacitance change becomes larger as voltage increases, even if the

applied voltage is below the rated voltage. When a high dielectric constant type capacitor is used in a circuit that

requires a tight (narrow) capacitance tolerance (e.g., a time constant circuit), please carefully consider the voltage

characteristics, and confirm the various characteristics in actual operating conditions in an actual system.

2. The capacitance values of high dielectric constant type capacitors changes depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.

6. Capacitance Aging

1. The high dielectric constant type capacitors have the characteristic in which the capacitance value decreases with the

passage of time. When you use high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance

tolerance (e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors, such as their

aging, voltage, and temperature characteristics. In addition, check capacitors using your actual appliances at the intended

environment and operating conditions.

7. Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.

Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to being dropped may cause damage or a crack in the dielectric material of the capacitor.

Do not use a dropped capacitor because the quality and reliability may be deteriorated.

Crack

Floor

3. When printed circuit boards are piled up or handled, the corner of another printed circuit board should not be allowed

to hit the capacitor, in order to avoid a crack or other damage to the capacitor.

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Caution

Soldering and Mounting

1. Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing

or bending the printed circuit board.

1-1. Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.

[Component Direction]

Locate chip horizontal to the direction in which stress acts.

[Chip Mounting Close to Board Separation Point]

It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all

of the following three measures; however, implement as many measures as possible to reduce stress.

C

Contents of Measures

(1) Turn the mounting direction of the component parallel

(1) to the board separation surface.

Stress Level

A>D

Perforation

B

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away

(3) from the board separation surface.

A>B

D

A

Slit

A>C

[Mounting Capacitors Near Screw Holes]

When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.

Screw Hole Recommended

2. Information before Mounting

1. Do not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7. The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.

3. Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum

to prevent them from any bending damage or cracking. Please take into account the following precautions and

recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.

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Caution

2. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving

moving smoothly. This imposes greater force upon the chip during mounting, causing cracked chips. Also, the locating

claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips.

The suction nozzle and the locating claw must be maintained, checked, and replaced periodically.

4-1. Reflow Soldering

[Standard Conditions for Reflow Soldering]

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes deformation

inside the components. In order to prevent mechanical damage

to the components, preheating is required for both the

components and the PCB. Preheating conditions are shown

in table 1. It is required to keep the temperature differential

Reflow

Temperature (

)

Soldering

Gradual

Peak Temperature

220 (200

)

Cooling

190 (170

170 (150

150 (130

)

Preheating

as possible.

2. Solderability of tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of tin

is used. Please confirm the solderability of tin plated

termination chips before use.

Time

60 to 120 seconds 30 to 60 seconds

Temperature

Incase of Lead Free Solder

( ): In case of Pb-Sn Solder

3. When components are immersed in solvent after mounting,

Vapor Reflow

Temperature (

)

the component and the solvent within the range shown in table 1.

Table 1

Soldering

Peak Temperature

Gradual

Cooling

190 (170

170 (150

)

Part Number

KCA55

Temperature Differential

130°C

150 (130

)

Preheating

Recommended Conditions

Pb-Sn Solder

Lead Free

Solder

Reflow

Vapor Reflow

230 to 240°C

Time

60 to 120 seconds 20 seconds max.

Peak Temperature 230 to 250°C

240 to 260°C

Air or N2

Saturated vapor

of inactive solvent

Atmosphere

Air

[Allowable Reflow Soldering Temperature and Time]

280

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

270

260

250

240

230

220

0

30

60

90

120

Soldering Time (sec.)

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

4. Optimum Solder Amount for Reflow Soldering

4-1. If solder paste is excessive, solder between a chip and a

metal terminal melts. This causes the chip to move and

come off.

The level of

the bottom of the chip

0.3 mm min. and

4-2. If solder paste is too little, it causes a lack of adhesive

strength on the metal terminal and the capacitor comes off.

4-3. Please make sure that solder is smoothly applied higher

than 0.3mm and lower than the level of the bottom of the

chip.

lower than the level of

the bottom of the chip

In section

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to the PCB.

4-2. Flow Soldering

1. Do not apply flow soldering.

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Reference only

Caution

4-3. Correction of Soldered Portion

1. For the shape of the soldering iron tip, refer to the figure

on the right.

2. Regarding the type of solder, use a wire diameter of

3. Apply the tip of the soldering iron against the lower end

of the metal terminal.

(1) In order to prevent cracking caused by sudden heating

of the ceramic device, do not touch the ceramic base

directly.

(2) In order to prevent deviations and dislocating of the

chip, do not touch the junction of the chip and the metal

terminal, and the metal portion on the outside directly.

4. The amount of solder for corrections by soldering iron,

should be lower than the level of the bottom of the chip.

The level of

the bottom of the chip

Solder amount

In section

5. Washing

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken

solder joints. Take note not to vibrate PCBs.

6. Electrical Test on Printed Circuit Board

1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a capacitor after

mounting on the printed circuit board.

1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc. The thrusting force of the test probe can

flex the PCB, resulting in cracked chips or open solder joints. Provide backup pins on the back side of the PCB

to prevent warping or flexing. Install backup pins as close to the capacitor as possible.

1-2. Avoid vibration of the board by shock when a test-probe contacts a printed circuit board.

[Not Recommended]

[Recommended]

Backup Pin

Peeling

Test-probe

7. Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that causes bending

or twisting the board.

1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack. Cracked capacitors may cause

deterioration of the insulation resistance, and result in a short. Avoid this type of stress to a capacitor.

[Bending]

[Twisting]

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Caution

2. Check the cropping method for the printed circuit board in advance.

2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disk separator, router type separator,

etc.) to prevent the mechanical stress that can occur to the board.

Board Separation Apparatus

Hand Separation

Nipper Separation

Board Separation Method

(1) Board Separation Jig

(2) Disk Separator

(3) Router Type Separator

Low

Level of stress on board

Recommended

High

×

Medium

*

Medium

*

· Board handling

Hand and nipper separation

apply a high level of stress.

Use another method.

· Board handling

· Board bending direction

· Layout of capacitors

· Layout of slits

Notes

· Design of V groove

· Arrangement of blades

· Controlling blade life

Board handling

* When a board separation jig or disk separator is used, if the following precautions are not observed,

a large board deflection stress will occur and the capacitors may crack. Use router type separator if at all possible.

(1) Example of a suitable jig

[In the case of Single-side Mounting]

An outline of the board separation jig is shown as follows. Recommended example: Stress on the component

mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards

the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the

capacitors increases due to large stress being applied to the component mounting position, if the portion away

from the jig is held and bent in the direction opposite the side where the capacitors are mounted.

Recommended

Not Recommended

[Outline of Jig]

[In the case of Double-sided Mounting]

Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the

above method. Therefore, implement the following measures to prevent stress from being applied to the components.

(Measures)

Consider introducing a router type separator. If it is difficult to introduce a router type separator, implement

the following measures. (Refer to item 1. Mounting Position)

Mount the components at a right angle to the board separation surface.

When mounting components near the board separation point, add slits in the separation position

near the component.

Keep the mounting position of the components away from the board separation point.

(2) Example of a Disk Separator

An outline of a disk separator is shown as follows. As shown in the Principle of Operation, the top blade and bottom

blade are aligned with the V-grooves on the printed circuit board to separate the board. In the following case, board

deflection stress will be applied and cause cracks in the capacitors.

When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom, left-right

or front-rear directions

The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned

top-bottom IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of

the V groove with consideration about strength of material of the printed circuit board.

[Outline of Machine]

[Principle of Operation]

[Cross-section Diagram]

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Caution

Not Recommended

Left-right Misalignment

Recommended

Top-bottom Misalignment

Front-rear Misalignment

Top Blade

Bottom Blade

Not Recommended

Example of Recommended

V-groove Design

Left-right Misalignment

Low-Angle

Depth too Shallow

Depth too Deep

(3) Example of Router Type Separator

The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the

cutting process, stress on the board can be suppressed during board separation. When attaching or removing

boards to/from the router type separator, carefully handle the boards to prevent bending.

[Outline Drawing]

Router

8. Assembly

1. Handling

If a board mounted with capacitors is held with one hand, the board may bend. Firmly hold the edges of the board with

both hands when handling. If a board mounted with capacitors is dropped, cracks may occur in the capacitors.

Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.

2. Attachment of Other Components

2-1. Mounting of Other Components

Pay attention to the following items, when mounting other

components on the back side of the board after capacitors

have been mounted on the opposite side. When the bottom

dead point of the suction nozzle is set too low, board deflection

stress may be applied to the capacitors on the back side

(bottom side), and cracks may occur in the capacitors.

Suction Nozzle

After the board is straightened, set the bottom dead point

of the nozzle on the upper surface of the board.

Periodically check and adjust the bottom dead point.

2-2. Inserting Components with Leads into Boards

When inserting components (transformers, IC, etc.) into boards,

bending the board may cause cracks in the capacitors or

cracks in the solder. Pay attention to the following.

Increase the size of the holes to insert the leads, to reduce

the stress on the board during insertion.

Fix the board with backup pins or a dedicated jig before

insertion.

Component with Leads

Support below the board so that the board does not bend.

When using multiple backup pins on the board, periodically

confirm that there is no difference in the height of each

backup pin.

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Caution

2-3. Attaching/Removing Sockets

When the board itself is a connector, the board may bend when

a socket is attached or removed. Plan the work so that the board

does not bend when a socket is attached or removed.

Socket

2-4. Tightening Screws

The board may be bent, when tightening screws, etc. during the

attachment of the board to a shield or chassis.

Pay attention to the following items before performing the work.

Plan the work to prevent the board from bending.

Use a torque screwdriver, to prevent over-tightening of the

screws.

Screwdriver

The board may bend after mounting by reflow soldering, etc.

Please note, as stress may be applied to the chips by forcibly

flattening the board when tightening the screws.

Other

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.

1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not

expose a capacitor to a conductive liquid, including any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will operate is under the specified conditions. Do not use

the equipment under the following environments.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to ozone, ultraviolet rays, or radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.)

(5) Any vibrations or mechanical shocks exceeding the specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.

2. Other

2-1. In an Emergency

(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment. If the

equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.

(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be

caused by the capacitor's high temperature.

2-2. Disposal of Waste

When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate

licenses.

2-3. Circuit Design

(1) Addition of Fail Safe Function

Capacitors that are cracked by dropping or bending of the board may cause deterioration of the insulation

resistance, and result in a short. If the circuit being used may cause an electrical shock, smoke or fire when

a capacitor is shorted, be sure to install fail-safe functions, such as a fuse, to prevent secondary accidents.

(2) Capacitors used to prevent electromagnetic interference in the primary AC side circuit, or as a

connection/insulation, must be a safety standard certified product, or satisfy the contents stipulated

in the Electrical Appliance and Material Safety Law. Install a fuse for each line in case of a short.

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Caution

2-4. Test Condition for AC Withstanding Voltage

(1) Test Equipment

Test for AC withstanding voltage should be made with equipment capable of creating a wave similar

to a 50/60 Hz sine wave.

(2) Voltage Applied Method

The capacitor's leads or terminals should be firmly connected to the output of the withstanding

voltage test equipment, and then the voltage should be raised from near zero to the test voltage.

If the test voltage is applied directly to the capacitor without raising it from near zero, it should be

applied with the zero cross. *At the end of the test time, the test voltage should be reduced to near

zero, and then the capacitor's leads or terminals should be taken off the output of the withstanding

voltage test equipment. If the test voltage is applied directly to the capacitor without raising it from

near zero, surge voltage may occur and cause a defect.

*ZERO CROSS is the point where voltage sine wave passes 0V.

- See the figure at right -

2-5. Remarks

Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.

The above notices are for standard applications and conditions. Contact us when the products are used

in special mounting conditions. Select optimum conditions for operation as they determine the reliability of

the product after assembly. The data herein are given in typical values, not guaranteed ratings.

3. Limitation of applications

Please contact us before using our products for the applications listed below which require especially high reliability

(1) Aircraft equipment

(5) Medical equipment

(2) Aerospace equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(3) Undersea equipment

(4) Power plant control equipment

(7) Traffic signal equipment

(8) Disaster prevention/crime prevention equipment

(9) Data-processing equipment exerting influence on public

(10) Application of similar complexity and/or reliability requirements to the applications listed in the above.

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Notice

Rating

1. Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1. Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with

a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider

the temperature distribution in equipment and the seasonal temperature variable factor.

1-2. Consider the self-heating factor of the capacitor. The surface temperature of the capacitor shall be the upper

operating temperature or less when including the self-heating factors.

2. Atmosphere Surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion

of the terminations and the penetration of moisture into the capacitor.

1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject

to moisture condensation.

1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal

electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents

for long periods of time.

3. Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates at specific frequencies

and noise may be generated. Moreover, when the mechanical vibration or shock is added to the capacitor, noise may occur.

Soldering and Mounting

1. PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly

on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these tresses and cause chip cracking. When designing substrates,

take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height.

1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is

different depending on PCB material and structure. When the thermal expansion coefficient greatly differs between

the board used for mounting and the chip, it will cause cracking of the chip due to the thermal expansion and

contraction. When small size capacitors of 1005 size or less are mounted on a single-layered glass epoxy board,

it will also cause cracking of the chip for the same reason.

Pattern Forms

Prohibited

Correct

Chassis

Solder Resist

Solder(ground)

Placing Close to Chassis

Electrode Pattern

Lead Wire

Solder Resist

Placing

of Chip Components

and Leaded Components

Soldering Iron

Lead Wire

Solder Resist

Placing

of Leaded Components

after Chip Component

Solder Resist

Lateral Mounting

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Notice

2. Land Dimensions

2-1. Chip capacitors can be cracked due to the stress of PCB

bending, etc. if the land area is larger than needed and

has an excess amount of solder. Please refer to the land

dimensions in the following table for reflow soldering.

Please confirm the suitable land dimension by evaluating

of the actual SET / PCB.

Unit

Dimensions

Body size (L×W)

a

b

c

Part Number

KCA55 7UMF

L

6.1×5.1

3.2 to 4.0

2.0 to 2.4

5.5 to 5.7

3. Board Design

When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size

and material of the board.

Relationship with amount of strain to the board thickness, length, width, etc.]

3PL

Ewh²

Relationshipbetweenloadandstrain

2

Strain on center of board ( st)

Distance between supporting points (mm)

Board width (mm)

P

L

w

h

E

Y

P

Y

Board thickness (mm)

Elastic modulus of board (N/m²=Pa)

Deflection (mm)

h

Load (N)

w

L

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,the amount of strain also increases.

· As the elastic modulus (E) decreases, the amount of strain increases.

As the board width (w) decreases, the amount of strain increases.

As the board thickness (h) decreases, the amount of strain increases.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.

4. Washing

1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality, and select the

solvent for cleaning.

2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of electrical

characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or insufficient) may result in deterioration of the performance of the capacitors.

5. Coating

1. A crack may be cause in the capacitor due to the stress of the thermal contraction of the resin during curing process. The

stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction. The difference

in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor may cause the

destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration of insulation

resistance or dielectric breakdown. Select a resin for which the thermal expansion coefficient is as close to that of the

capacitor as possible. A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic. Using hygroscopic resins under high humidity conditions may cause

the deterioration of the insulation resistance of a capacitor. An epoxy resin can be used as a less hygroscopic resin.

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Notice

Other

1. Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

1-1. The capacitors shall be protected against excessive temperature, humidity, and mechanical force during

transportation.

(1) Climatic condition

low air temperature : -40

change of temperature air/air : -25 /+25

low air pressure : 30kPa

change of air pressure : 6kPa/min.

(2) Mechanical condition

Transportation shall be done in such a way that the boxes are not deformed and forced are not directly passed

on to the inner packaging.

1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.

(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur

in the ceramic body of the capacitor.

(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface

of the capacitor, the capacitor may crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was applied by dropping, etc. A capacitor dropped accidentally

during processing may be damaged.

2. Characteristics Evaluation in the Actual System

1. Evaluate the capacitor in the actual system, to confirm that there is no problem with the performance and specification

values in a finished product before using.

2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic

capacitors, the capacitance may change depending on the operating conditions in the actual system. Therefore,

be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity, which will affect

the capacitance value of the capacitor.

3. In addition, voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in the actual

system. Evaluate the surge resistance in the actual system as required.

Note

1. Please make sure that your product has been evaluated in view of your specifications with our product being mounted

to your product.

2. You are requested not to use our product deviating from this specification.

EGKCA03A

12 / 22

Reference only

1. Application

This specification is applied to Safety Standard Certified Metal Terminal Type Multilayer Ceramic

Capacitors Type MF in accordance with AEC-Q200 requirements used for Automotive Electronics

equipment.

Type MF is Safety Safety Standard Certified Metal Terminal Type Multilayer Ceramic Capacitors of

Class X1,Y2.

Approval standard and certified number

AC Rated

voltage

V(r.m.s.)

DC Rated

voltage

V

Standard number

*Certified number

UL60384-14/

E37921

250

1000

UL/cUL

CSA E60384-14

ENEC

(VDE)

40039447

250

-

EN 60384-14

*Above Certified number may be changed on account of the revision of standards and

the renewal of certification.

2. Rating

2-1. Operating temperature range

-55 to +125°C

2-2. Rated voltage

AC250V(r.m.s.)

DC1000V

2-3. Part name configuration

ex.) KCA

55

W

7U

MF

103

M

L01

K

Series Chip

Height Temperature Type Capacitance Capacitance Individual Packing

tolerance specification style

dimension dimension characteristic name

(L×W)

•Chip dimension(L×W)

Code

Nominal Chip dimension (mm)

L

W

55

5.7

5.0

•Height dimension

Code

Dimension (mm)

L

Q

T

W

2.8

3.7

4.8

6.4

Please refer to [Part number list] on the dimensions of metal terminal product.

•Temperature characteristic

Code

7U

Temperature characteristic

U2J

Please confirm detailed specification on [Specification and test methods].

•Type name

This denotes safety certified type name Type MF.

•Capacitance

The first two digits denote significant figures ; the last digit denotes the multiplier of 10 in pF.

ex.) In case 103.

10 x10³= 10000pF

ETKCA5502A

13 / 22

Reference only

•Capacitance tolerance

Please refer to [Part number list].

•Individual specification

Murata’s control code

Please refer to [ Part number list ].

•Packing style

Code

Style

K

φ330mm reel Plastic taping

2-4. Marking

Type name

: Code

Company name : Abbreviation

ETKCA5502A

14 / 22

Reference only

3. Part number list

Unit : mm

Dimension(mm)

Cap.

Pack

Chip

T.C.

tol.

Customer Part Number

Murata Part Number

qty.

(pF)

type

L

W

T

e

d

(%)

(pcs)

6.1

±0.4

5.1

±0.3

2.8

0.9

4.0

U2J

100

150

±10

±20

KCA55L7UMF101KL01K

KCA55L7UMF151KL01K

KCA55L7UMF221KL01K

KCA55L7UMF331KL01K

KCA55L7UMF471KL01K

KCA55L7UMF681KL01K

KCA55L7UMF102KL01K

KCA55L7UMF152KL01K

KCA55L7UMF222KL01K

KCA55L7UMF332KL01K

KCA55Q7UMF472KL01K

KCA55T7UMF682ML01K

KCA55W7UMF103ML01K

1

2

2000

1000

500

±0.2 ±0.2 min.

6.1

5.1

±0.3

2.8 0.9 4.0

±0.2 ±0.2 min.

±0.4

6.1

5.1

±0.3

2.8 0.9 4.0

220

±0.4

±0.2 ±0.2 min.

2.8 0.9 4.0

6.1

5.1

±0.3

330

±0.4

6.1

±0.2 ±0.2 min.

5.1

±0.3

2.8 0.9 4.0

470

±0.4

±0.2 ±0.2 min.

2.8 0.9 4.0

6.1

5.1

±0.3

680

±0.4

6.1

±0.2 ±0.2 min.

5.1

±0.3

2.8 0.9 4.0

1000

1500

2200

3300

4700

6800

±0.4

±0.2 ±0.2 min.

2.8 0.9 4.0

6.1

5.1

±0.3

±0.4

6.1

±0.2 ±0.2 min.

5.1

±0.3

2.8 0.9 4.0

±0.4

±0.2 ±0.2 min.

2.8 0.9 4.0

6.1

5.1

±0.3

±0.4

6.1

±0.2 ±0.2 min.

5.1

±0.3

3.7 0.9 4.0

±0.4

±0.2 ±0.2 min.

4.8 0.9 4.0

6.1

5.1

±0.3

±0.4

6.1

±0.2 ±0.2 min.

5.1

±0.3

6.4 0.9 4.0

±0.3 ±0.2 min.

U2J 10000 ±20

±0.4

ETKCA5502A

15 / 22

Reference only

4. AEC-Q200 Murata Standard Specifications and Test Methods

No.

1

AEC-Q200 Test Item

Specifications

AEC-Q200 Test Method

Pre-and Post-Stress Electrical Test**

High Temperature Exposure (Storage)**

-

2

The measured and observed characteristics should

satisfy the specifications in the following table.

Set the capacitor for 1,000±12 h at 150±3 °C.

Let sit for 24±2 h at *room temperature, then measure.

Appearance

No marking defects

Capacitance

Change

Within ±5.0 % or ±0.5 pF

(Whichever is larger.)

Q

Q ≧ 1,000

I.R.

More than 1,000 MΩ or 50 MΩ･µF

(Whichever is smaller.)

3

Temperature Cycle**

The measured and observed characteristics should

satisfy the specifications in the following table.

Fix the capacitor to the supporting jig in the same manner and under the same

conditions as (20).

Perform the 1,000 cycles according to the four heat treatments listed in the

following table.

Appearance

No marking defects

Let sit for 24±2 h at *room condition, then measure.

Capacitance

Change

Within ±5.0 % or ±0.5 pF

(Whichever is larger.)

Step

1

2

3

4

Q

Q ≧ 1,000

Temp.

(℃)

Time

Room

Temp.

Room

Temp.

-55+0/-3

125+3/-0

I.R.

More than 1,000 MΩ or 50 MΩ･µF

(Whichever is smaller.)

Per Item 18

15±3

1

15±3

1

(min.)

Dielectric

Strength

4

5

Destructive Physical Analysis**

Moisture Resistance**

No defects or abnormalities

Per EIA-469

The measured and observed characteristics should

satisfy the specifications in the following table.

Apply the 24 h heat (25 to 65 °C) and humidity (80 to 98 %) treatment shown

below, 10 consecutive times.

Let sit for 24±2 h at *room condition, then measure.

Appearance

No marking defects

Capacitance

Change

Within ±6.0 % or ±0.6 pF

(Whichever is larger.)

Q

Q ≧ 350

I.R.

More than 1,000 MΩ or 50 MΩ･μF

(Whichever is smaller.)

6-1 Humidity Loading(AC)

The measured and observed characteristics should

satisfy the specifications in the following table.

Apply the AC250 V(r.m.s.) for 1,000±12 h at 85±3 ℃ in 80 to 85 % relative

humidity.

Remove and let sit for 24±2 h at *room condition, then measure.

The charge/discharge current is less than 50 mA.

Appearance

No marking defects

Capacitance

Change

Within ±6.0 % or ±0.6 pF

(Whichever is larger.)

Q

Q ≧ 200

I.R.

More than 100 MΩ or 5 MΩ･μF

(Whichever is smaller.)

6-2 Biased Humidity

(Humidity Loading (DC))**

The measured and observed characteristics should

satisfy the specifications in the following table.

Apply the rated voltage (DC1000 V) and DC1.3+0.2-0 V (add 100 kΩ resistor) at

85±3 °C and 80 to 85 % humidity for 1,000±12 h.

Remove and let sit for 24±2 h at *room condition, then measure.

The charge/discharge current is less than 50 mA.

Appearance

No marking defects

Capacitance

Change

Within ±6.0 % or ±0.6 pF

(Whichever is larger.)

Q

Q ≧ 200

I.R.

More than 100 MΩ or 5 MΩ･μF

(Whichever is smaller.)

* “room condition” Temperature : 15 to 35 °C, Relative humidity : 45 to 75 %, Atmosphere pressure : 86 to 106 kPa

** : AEC-Q200 requirement

ESKCA5502B

16 / 22

Reference only

No.

AEC-Q200 Test Item

Specifications

AEC-Q200 Test Method

7-1 Operational Life (AC)

The measured and observed characteristics should

satisfy the specifications in the following table.

Impulse voltage

Each individual capacitor should be subjected to a 5 kV impulses for three times

or more. Then the capacitors are applied to life test.

Appearance

No marking defects

Front time (T1) = 1.7 μs=1.67T

Time to half-value (T2) = 50 μs

Capacitance

Change

Within ±6.0 % or ±0.6 pF

(Whichever is larger.)

Q

Q ≧ 350

I.R.

More than 100 MΩ or 5 MΩ･μF

(Whichever is smaller.)

Per Item 18

Dielectric

Strength

The capacitors are placed in a circulating air oven for a period of 1,000 h.

The air in the oven is maintained at maximum operating temperature +2/-0 °C,

and relative humidity of 50 % max..

The charge/discharge current is less than 50 mA.

Throughout the test, the capacitors are subjected to a AC425 V(r.m.s.) (170 %

of ac rated voltage) <50/60 Hz> alternating voltage of mains frequency, except

that once each hour the voltage is increased to AC1000 V(r.m.s.) for 0.1 s.

7-2 Operational Life (DC)**

The measured and observed characteristics should

satisfy the specifications in the following table.

Impulse voltage

Each individual capacitor should be subjected to a 5 kV impulses for three times

or more. Then the capacitors are applied to life test.

Appearance

No marking defects

Front time (T1) = 1.7 μs=1.67T

Time to half-value (T2) = 50 μs

Capacitance

Change

Within ±6.0 % or ±0.6 pF

(Whichever is larger.)

Q

Q ≧ 350

I.R.

More than 100 MΩ or 5 MΩ･μF

(Whichever is smaller.)

Per Item 18

Dielectric

Strength

Apply DC1700 V (170 % of dc rated voltage) for 1,000±12 h at maximum

operating temperature ±2 °C, and relative humidity of 50 % max..

Remove and let sit for 24±2 h at *room condition, then measure.

The charge/discharge current is less than 50 mA.

8

9

External Visual

No defects or abnormalities

Within the specified dimensions

To be easily legible.

Visual inspection

Physical Dimension

Using calipers and micrometers.

The capacitor should be inspected by naked eyes.

10 Marking

11 Resistance to

Solvents**

Appearance

No marking defects

Per MIL-STD-202 Method 215

Solvent 1 : 1 part (by volume) of isopropyl alcohol 3 parts (by volume)

of mineral spirits

Capacitance

Within the specified tolerance.

Solvent 2 : Terpene defluxer

Q

Q ≧ 1,000

Solvent 3 : 42 parts (by volume) of water 1part (by volume) of propylene

glycol monomethyl ether 1 part (by volume) of

monoethanolomine

I.R.

More than 1,000 MΩ or 50 MΩ･μF

(Whichever is smaller.)

12 Mechanical Shock**

Appearance

Capacitance

Q

No marking defects

Within the specified tolerance.

Q ≧ 1,000

Three shocks in each direction should be applied along 3 mutually perpendicular

axes of the test specimen (18 shocks).

The specified test pulse should be half sine and should have a duration : 0.5 ms,

peak value : 1,500 g and velocity change : 4.7 m/s.

13 Vibration**

Appearance

Capacitance

Q

No defects or abnormalities

Within the specified tolerance.

Q ≧ 1,000

Solder the capacitor to the test jig (glass epoxy board) in the same manner and

under the same conditions as (20).

The capacitor should be subjected to a simple harmonic motion having a total

amplitude of 1.5 mm, the frequency being varied uniformly between the

approximate limits of 10 and 2,000 Hz. The frequency range, from 10 to 2,000

Hz and return to 10 Hz, should be traversed in approximately 20 min.

This motion should be applied for 12 items in each 3 mutually perpendicular

directions (total of 36 times).

* “room condition” Temperature : 15 to 35 °C, Relative humidity : 45 to 75 %, Atmosphere pressure : 86 to 106 kPa

** : AEC-Q200 requirement

ESKCA5502B

17 / 22

Reference only

No.

AEC-Q200 Test Item

Specifications

AEC-Q200 Test Method

Reflow Soldering : Peak 260+0/-5 °C

14 Resistance to Soldering Heat

The measured and observed characteristics should

satisfy the specifications in the following table.

The area of soldering 230 °C min., 20 to 40 s

Let sit for 24±2 h at room condition*, then measure.

Appearance

No marking defects

Within the specified tolerance.

Q ≧ 1,000

Capacitance

300 ℃

260+0/-5 ℃

230 ℃ min.

Q

20 to 40 s

I.R.

More than 1,000 MΩ or 50 MΩ･μF

(Whichever is smaller.)

Per Item 18

200 ℃

180 ℃

Dielectric

Strength

150 ℃

100 ℃

60 to 120 s

15 Thermal Shock**

The measured and observed characteristics should

satisfy the specifications in the following table.

Fix the capacitor to the supporting jig in the same manner and under the same

conditions as (20). Perform the 300 cycles according to the two heat treatments

listed in the following table (Maximum transfer time is 20 s.).

Let sit for 24±2 h at *room condition, then measure.

Appearance

No marking defects

Capacitance

Change

Within ±5.0 % or ±0.5 pF

(Whichever is larger.)

Step

1

2

Temp.

(℃)

-55+0/-3

125+3/-0

Q

Q ≧ 1,000

Time

(min.)

I.R.

More than 1,000 MΩ or 50 MΩ･μF

(Whichever is smaller.)

15±3

16 ESD**

Appearance

Capacitance

Q.

No marking defects

Per AEC-Q200-002

Within the specified tolerance.

Q ≧ 1,000

I.R.

More than 1,000 MΩ or 50 MΩ･μF

(Whichever is smaller.)

17 Solderbility

95 % of the terminations are to be soldered evenly

and continuously.

a) Preheat at 155 °C for 4 h.

After the preheating, following test is done.

Reflow Soldering : Peak 260+0/-5 °C

The area of soldering 230 °C min., 20 to 40 s

Let sit for 24±2 h at room condition*, then measure.

300 ℃

260+0/-5 ℃

230 ℃ min.

20 to 40 s

200 ℃

180 ℃

150 ℃

100 ℃

60 to 120 s

b) Should be placed into steam aging for 8 h±15 min.

After the preheating, following test is done.

Reflow Soldering : Peak 260+0/-5 °C

The area of soldering 230 °C min., 20 to 40 s

Let sit for 24±2 h at room condition*, then measure.

300 ℃

260+0/-5 ℃

230 ℃ min.

20 to 40 s

200 ℃

180 ℃

150 ℃

100 ℃

60 to 120 s

* “room condition” Temperature : 15 to 35 °C, Relative humidity : 45 to 75 %, Atmosphere pressure : 86 to 106 kPa

** : AEC-Q200 requirement

ESKCA5502B

18 / 22

Reference only

No.

AEC-Q200 Test Item

Apperance

Specifications

No defects or abnormalities

AEC-Q200 Test Method

18 Electrical

Visual inspection.

Characterization

Capacitance

Q

Within the specified tolerance

The capacitance/Q should be measured at 25 °C at the frequency and voltage

shown in the table.

Q≧1,000

Nominal

capacitance

C＜1000 pF

Measuring

frequency

1±0.2 MHz

Measuring

volgate

AC1.0±0.2 V(r.m.s.)

C≧1000 pF

1±0.2 kHz

I.R. 25 °C

The insulation resistance should be measured with DC500±50 V at 25 °C and

125 °C within 2 min. of charging.

More than 10,000 MΩ or 100 MΩ･μF

(Whichever is smaller.)

I.R. 125 °C

More than 1,000 MΩ or 10 MΩ･μF

(Whichever is smaller.)

No failure

Dielectric

Strength

No failure should be observed when voltage in the table is applied between the

terminations for 60±1 s., provided the charge/discharge current is less than 50

mA.

Test Voltage

AC2000 V(r.m.s.)

DC3000 V

19 Board Flex

Appearance

No marking defects

Solder the capacitor on the test jig (glass epoxy board) shown in Fig1 using

solder. Then apply a force in the direction shown in Fig 2 for 5±1 s. The

soldering should be done by the reflow method and should be conducted with

care so that the soldering is uniform and free of defects such as heat shock.

Capacitance

Change

Within ±10.0 % or ±1.0 pF

(Whichever is larger.)

Type

a

b

c

KCA55

4.5

8.0

5.6

(in mm)

20 50

Pressurizing

speed:1.0mm/s

Pressurize

R4

Flexure: 5 mm.

Capacitance meter

45

Fig.2

Fig.1

20 Terminal Strength

Appearance

No marking defects

Within specified tolerance

Q ≧ 1,000

Solder the capacitor to the test jig (glass epoxy board) shown in Fig.3 using

solder. Then apply 18 N force in parallel with the test jig for 60 s.

The soldering should be done by the reflow method and should be conducted

with care so that the soldering is uniform and free of defects such as heat shock.

Capacitance

Q

I.R.

More than 1,000 MΩ or 50 MΩ・μF

(Whichever is smaller)

Type

a

b

c

KCA55

4.0

8.0

5.6

(in mm)

c

(t : 1.6 mm)

Solder resist

Fig.3

Baked electrode or

copper foil

21 Beam Load Test

Destruction value should be exceed following one.

15 N

Place the capacitor in the beam load fixture as in Fig 4.

Apply a force.

L

0.6L

Fig.4

Speed supplied the Stress Load : 2.5 mm/s

ESKCA5502B

19 / 22

Reference only

No.

AEC-Q200 Test Item

Specifications

AEC-Q200 Test Method

22 Capacitance

Temperature

Temp. Coefficient -750±120 ppm/°C

(Temp.Range : 25 to 125 °C)

The capacitance change should be measured after 5 min. at each specified

temperature stage.

Characteristics

-750+120,-347 ppm/°C

(Temp.Range : -55 to 25 °C)

Step

Temperature (℃)

1

2

3

4

5

25±2

Min. Operating Temp. ±3

25±2

Capacitance

Drift

Within ±0.5 % or ±0.05 pF

(Whichever is larger.)

Max. Operating Temp. ±3

25±2

The ranges of capacitance change compared with the above 25 °C value over

the temperature ranges shown in the table should be within the specified ranges.

23 Active Flammability

The cheese-cloth should not be on fire.

The capacitors should be individually wrapped in at least one, but not more than

two, complete layers of cheese-cloth. The capacitor should be subjected to 20

discharges. The interval between successive discharges should be 5 s. The UAc

should be maintained for 2 min. after the last discharge.

C1,2

: 1 µF±10 %, C3 : 0.033 µF±5 % 10 kV

L1 to L4 : 1.5 mH±20 % 16 A Rod core choke

R

: 100 Ω±2 %, Ct : 3 µF±5 % 10 kV

: UR ±5 % UR : Rated working voltage

: Capacitor under test

UAc

Cx

F

: Fuse, Rated 10 A

Ut

: Voltage applied to Ct

24 Passive Flammability

The burning time should not be exceeded the time 30 The capacitor under test should be held in the flame in the position which best

s. The tissue paper should not ignite.

promotes burning. Time of exposure to flame is for 30 s.

Length of flame : 12±1 mm

Gas burner : Length 35 mm min.

Inside Dia.

Outside Dia. 0.9 mm max.

Gas : Butane gas Purity 95 % min.

0.5±0.1 mm

ESKCA5502B

20 / 22

Reference only

5. Packing (Taping is standard packing method)

(1) Appearance of taping

(a) Plastic Tape

Cover Tape (Thickness: Around 60µm) is put on capacitor on Base Tape (Blister carrier Tape).

(b) The sprocket holes are to the right as the Tape is pulled toward the user.

(2) Packed capacitors

Capacitor

(3) Dimensions of Tape

(a) Height dimension code : L, Q, R, T

2.0±0.05

φ1.5+0.1/-0

8.0±0.1

0.4±0.1

4.0±0.1

•

C max.

A

Nominal value

Part Number

A

B

C

K□□55L

5.5

6.4

4.1

K□□55Q

K□□55R

K□□55T

5.5

6.4

5.8

(Unit : mm)

(b) Height dimension code : V, W

2.0±0.1

φ1.5+0.1/-0

12.0±0.1

4.0±0.1

0.4±0.1

•

C max.

A

Nominal value

Part Number

K□□55V

A

B

C

5.7

6.7

7.4

K□□55W

(Unit : mm)

EKTK5503

21 / 22

Reference only

(4) Dimensions of Reel

(a) Height dimension code : L, Q, R, T

17.5±1.5

2.0±0.5

φ21±0.8

330±2.0

φ13±0.2

13.5±1.0

21.5±1.0

(Unit : mm)

(b) Height dimension code : V, W

2.0±0.5

φ21±0.8

330±2.0

φ13±0.2

17.5±1.0

(Unit : mm)

(5) Part of the leader and part of the empty tape should be attached to the end of the tape as follows.

Vacant section : 160 min.

210 min.

Capacitors mounting unit

Vacant section : 190 min.

Direction of feed

(Unit : mm)

(6) The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of

5 pitches.

(7) Missing capacitors number within 0.1% of the number per reel or 1pc, whichever is greater, and not

continuous

(8) The top tape or cover tape and bottom tape should not protrude beyond the edges of the tape and

should not cover sprocket holes.

(9) Cumulative tolerance of sprocket holes, 10 pitches : ±0.3mm.

(10) Peeling off force : 0.1 to 0.6N in the direction shown on the follows.

165 to 180°

Top Tape or Cover Tape

Base Tape

EKTK5503

22 / 22


型号：	KCA55L7UMF681KL01#
厂家：	muRata
描述：	汽车[动力总成 / 安全设备],汽车[信息娱乐 / 舒适设备],民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C] 医疗医疗器械
文件：	总23页 (文件大小：1518K)
中文：	中文翻译
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KCA55L7UMF681KL01# [MURATA]

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