KCM55QR71H226KH13#_技术文档

Reference only

Caution

■Storage and Operation Conditions

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

1-1. Store the capacitors in the following conditions:Room Temperature of +5°C to +40°C and a Relative Humidity

of 20% to 70%.

(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity

conditions during storage may affect solderability and packaging performance. Therefore, please maintain

the storage temperature and humidity. Use the product within six months, as prolonged storage may cause

oxidation of the electrodes.

(2) Please confirm solderability before using after six months. Store the capacitors without opening the original bag.

Even if the storage period is short, do not exceed the specified atmospheric conditions.

1-2. Corrosive gas can react with the termination(external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas

(e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and electrical

performance may deteriorate. Do not store capacitors under direct sunlight or in high humidity conditions.

■Rating

1. Temperature Dependent Characteristics

1. The electrical characteristics of a capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes.

The following actions are recommended in order to ensure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature. When you use a high dielectric constant type

capacitor in a circuit that needs a tight (narrow) capacitance tolerance (e.g., a time-constant circuit),

please carefully consider the temperature characteristics, and carefully confirm the various characteristics

in actual use conditions and the actual system.

2. Measurement of Capacitance

1. Measure capacitance with the voltage and frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.

3. Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.

Typical Voltage Applied to the DC Capacitor

DC Voltage

DC Voltage+AC

AC Voltage

Pulse Voltage

E

0

E

0

(E: Maximum possible applied voltage.)

1-2. Influence of over voltage

Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown

of the internal dielectric layers. The time duration until breakdown depends on the applied voltage

and the ambient temperature.

2. Use a safety standard certified capacitor in a power supply input circuit (AC filter), as it is also necessary

to consider the withstand voltage and impulse withstand voltage defined for each device.

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Caution

4. Type of Applied Voltage and Self-heating Temperature

1. Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the continuous

application of an AC voltage or pulse voltage. When a DC rated voltage product is used in an AC voltage circuit or a

pulse voltage circuit, the AC current or pulse current will flow into the capacitor; therefore check the self-heating condition.

Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits of the

operating temperature, including the rise in temperature due to self-heating. When the capacitor is used with a

high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.

1-1. The load should be contained to the level such that when measuring at atmospheric temperature of 25℃, the product's

self-heating remains below 20℃ and the surface temperature of the capacitor in the actual circuit remains within the

maximum operating temperature.

1-2. The load should be contained so that the self-heating of the capacitor body remains below 20°C, when measuring at

an ambient temperature of 25°C. In addition, use a K thermocouple of φ0.1mm with less heat capacity when

measuring, and measure in a condition where there is no effect from the radiant heat of other components or air flow

caused by convection. Excessive generation of heat may cause deterioration of the characteristics and reliability of the

capacitor. (Absolutely do not perform measurements while the cooling fan is operating, as an accurate measurement

may not be performed.)

5. DC Voltage and AC Voltage Characteristics

1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied.

Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage (see figure).

Please confirm the following in order to secure the capacitance.

(1) Determine whether the capacitance change caused by the applied voltage is within the allowed range.

(2) In the DC voltage characteristics, the rate of capacitance change becomes larger as voltage increases, even if the

applied voltage is below the rated voltage. When a high dielectric constant type capacitor is used in a circuit that

requires a tight (narrow) capacitance tolerance (e.g., a time constant circuit), please carefully consider the voltage

characteristics, and confirm the various characteristics in actual operating conditions in an actual system.

2. The capacitance values of high dielectric constant type capacitors changes depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.

6. Capacitance Aging

1. The high dielectric constant type capacitors have the characteristic in which the capacitance value decreases with the

passage of time. When you use high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance

tolerance (e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors, such as their

aging, voltage, and temperature characteristics. In addition, check capacitors using your actual appliances at the intended

environment and operating conditions.

7. Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.

Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to being dropped may cause damage or a crack in the dielectric material of the capacitor.

Do not use a dropped capacitor because the quality and reliability may be deteriorated.

Crack

Floor

3. When printed circuit boards are piled up or handled, the corner of another printed circuit board should not be allowed

to hit the capacitor, in order to avoid a crack or other damage to the capacitor.

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Caution

■Soldering and Mounting

1. Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing

or bending the printed circuit board.

1-1. Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.

[Component Direction]

Locate chip horizontal to the direction in which stress acts.

[Chip Mounting Close to Board Separation Point]

It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all

of the following three measures; however, implement as many measures as possible to reduce stress.

C

Contents of Measures

(1) Turn the mounting direction of the component parallel

(1) to the board separation surface.

Stress Level

A>D

Perforation

B

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away

(3) from the board separation surface.

A>B

D

A

Slit

A>C

[Mounting Capacitors Near Screw Holes]

When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.

Screw Hole Recommended

2. Information before Mounting

1. Do not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7. The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.

8. We have also produced a DVD which shows a summary of our opinions, regarding the precautions for mounting.

Please contact our sales representative to request the DVD.

3. Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum

to prevent them from any bending damage or cracking. Please take into account the following precautions and

recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.

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Caution

2. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving

moving smoothly. This imposes greater force upon the chip during mounting, causing cracked chips. Also, the locating

claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips.

The suction nozzle and the locating claw must be maintained, checked, and replaced periodically.

4-1. Reflow Soldering

[Standard Conditions for Reflow Soldering]

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes deformation

inside the components. In order to prevent mechanical damage

to the components, preheating is required for both the

components and the PCB. Preheating conditions are shown

in table 1. It is required to keep the temperature differential

between the solder and the components surface (ΔT) as small

as possible.

Reflow

Temperature (℃)

Soldering

Peak Temperature

Gradual

Cooling

220℃(200℃)

ΔＴ

190℃(170℃)

170℃(150℃)

150℃(130℃)

Preheating

2. Solderability of tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of tin

is used. Please confirm the solderability of tin plated

termination chips before use.

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT) between

the component and the solvent within the range shown in table 1.

Time

60 to 120 seconds 30 to 60 seconds

Temperature

Incase of Lead Free Solder

( ): In case of Pb-Sn Solder

Vapor Reflow

Temperature (℃)

Soldering

Peak Temperature

Gradual

Cooling

Table 1

ΔＴ

190℃(170℃)

170℃(150℃)

150℃(130℃)

Part Number

K□□21 / K□□31

K□□55

Temperature Differential

ΔT≦190°C

Preheating

ΔT≦130°C

Recommended Conditions

Pb-Sn Solder

Time

60 to 120 seconds 20 seconds max.

Lead Free

Solder

Reflow

Vapor Reflow

230 to 240°C

Peak Temperature 230 to 250°C

240 to 260°C

Air or N2

[Allowable Reflow Soldering Temperature and Time]

280

Saturated vapor

of inactive solvent

Atmosphere

Air

Pb-Sn Solder: Sn-37Pb

270

260

250

Lead Free Solder: Sn-3.0Ag-0.5Cu

240

230

220

0

30

60

90

120

Soldering Time (sec.)

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

4. Optimum Solder Amount for Reflow Soldering

4-1. If solder paste is excessive, solder between a chip and a

metal terminal melts. This causes the chip to move and

come off.

4-2. If solder paste is too little, it causes a lack of adhesive

strength on the metal terminal and the capacitor comes off.

4-3. Please make sure that solder is smoothly applied higher

than 0.3mm and lower than the level of the bottom of the

chip.

0.3mm min.

In section

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to the PCB.

4-2. Flow Soldering

1. Do not apply flow soldering.

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Caution

4-3. Correction of Soldered Portion

1. For the shape of the soldering iron tip, refer to the figure

on the right.

2. Regarding the type of solder, use a wire diameter of

φ0.5mm or less (rosin core wire solder).

3. Apply the tip of the soldering iron against the lower end

of the metal terminal.

(1) In order to prevent cracking caused by sudden heating

of the ceramic device, do not touch the ceramic base

directly.

(2) In order to prevent deviations and dislocating of the

chip, do not touch the junction of the chip and the metal

terminal, and the metal portion on the outside directly.

4. The amount of solder for corrections by soldering iron,

should be lower than the height of the lower side of the chip.

Solder Amount

In section

5. Washing

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken

solder joints. Take note not to vibrate PCBs.

6. Electrical Test on Printed Circuit Board

1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a capacitor after

mounting on the printed circuit board.

1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc. The thrusting force of the test probe can

flex the PCB, resulting in cracked chips or open solder joints. Provide backup pins on the back side of the PCB

to prevent warping or flexing. Install backup pins as close to the capacitor as possible.

1-2. Avoid vibration of the board by shock when a test-probe contacts a printed circuit board.

[Not Recommended]

[Recommended]

Peeling

Backup Pin

Test-probe

7. Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that causes bending

or twisting the board.

1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack. Cracked capacitors may cause

deterioration of the insulation resistance, and result in a short. Avoid this type of stress to a capacitor.

[Bending]

[Twisting]

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Caution

2. Check the cropping method for the printed circuit board in advance.

2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disk separator, router type separator,

etc.) to prevent the mechanical stress that can occur to the board.

Board Separation Apparatus

Hand Separation

Nipper Separation

Board Separation Method

(1) Board Separation Jig

(2) Disk Separator

(3) Router Type Separator

Level of stress on board

Recommended

High

×

Medium

Low

△*

○

· Board handling

Hand and nipper separation

apply a high level of stress.

Use another method.

· Board handling

· Board bending direction

· Layout of capacitors

· Layout of slits

Notes

· Design of V groove

· Arrangement of blades

· Controlling blade life

Board handling

* When a board separation jig or disk separator is used, if the following precautions are not observed, a large board deflection stress will occur and the capacitors

may crack. Use router type separator if at all possible.

(1) Example of a suitable jig

[In the case of Single-side Mounting]

An outline of the board separation jig is shown as follows. Recommended example: Stress on the component

mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards

the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the

capacitors increases due to large stress being applied to the component mounting position, if the portion away

from the jig is held and bent in the direction opposite the side where the capacitors are mounted.

Recommended

Not Recommended

[Outline of Jig]

[In the case of Double-sided Mounting]

Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the

above method. Therefore, implement the following measures to prevent stress from being applied to the components.

(Measures)

① Consider introducing a router type separator. If it is difficult to introduce a router type separator, implement

the following measures. (Refer to item 1. Mounting Position)

② Mount the components at a right angle to the board separation surface.

③ When mounting components near the board separation point, add slits in the separation position

near the component.

④ Keep the mounting position of the components away from the board separation point.

(2) Example of a Disk Separator

An outline of a disk separator is shown as follows. As shown in the Principle of Operation, the top blade and bottom

blade are aligned with the V-grooves on the printed circuit board to separate the board. In the following case, board

deflection stress will be applied and cause cracks in the capacitors.

① When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom, left-right

or front-rear directions

② The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned

top-bottom IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of

the V groove with consideration about strength of material of the printed circuit board.

[Outline of Machine]

[Principle of Operation]

[Cross-section Diagram]

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Caution

Not Recommended

Left-right Misalignment

Recommended

Top-bottom Misalignment

Front-rear Misalignment

Top Blade

Bottom Blade

Not Recommended

Example of Recommended

V-groove Design

Left-right Misalignment

Low-Angle

Depth too Shallow

Depth too Deep

(3) Example of Router Type Separator

The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the

cutting process, stress on the board can be suppressed during board separation. When attaching or removing

boards to/from the router type separator, carefully handle the boards to prevent bending.

[Outline Drawing]

Router

8. Assembly

1. Handling

If a board mounted with capacitors is held with one hand, the board may bend. Firmly hold the edges of the board with

both hands when handling. If a board mounted with capacitors is dropped, cracks may occur in the capacitors.

Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.

2. Attachment of Other Components

2-1. Mounting of Other Components

Pay attention to the following items, when mounting other

components on the back side of the board after capacitors

have been mounted on the opposite side. When the bottom

dead point of the suction nozzle is set too low, board deflection

stress may be applied to the capacitors on the back side

(bottom side), and cracks may occur in the capacitors.

Suction Nozzle

・ After the board is straightened, set the bottom dead point

of the nozzle on the upper surface of the board.

・ Periodically check and adjust the bottom dead point.

2-2. Inserting Components with Leads into Boards

When inserting components (transformers, IC, etc.) into boards,

bending the board may cause cracks in the capacitors or

cracks in the solder. Pay attention to the following.

・ Increase the size of the holes to insert the leads, to reduce

the stress on the board during insertion.

・ Fix the board with backup pins or a dedicated jig before

Component with Leads

insertion.

・ Support below the board so that the board does not bend.

When using multiple backup pins on the board, periodically

confirm that there is no difference in the height of each

backup pin.

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Caution

2-3. Attaching/Removing Sockets

When the board itself is a connector, the board may bend when

a socket is attached or removed. Plan the work so that the board

does not bend when a socket is attached or removed.

Socket

2-4. Tightening Screws

The board may be bent, when tightening screws, etc. during the

attachment of the board to a shield or chassis.

Pay attention to the following items before performing the work.

・ Plan the work to prevent the board from bending.

・ Use a torque screwdriver, to prevent over-tightening of the

screws.

Screwdriver

・ The board may bend after mounting by reflow soldering, etc.

Please note, as stress may be applied to the chips by forcibly

flattening the board when tightening the screws.

■Other

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.

1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not

expose a capacitor to a conductive liquid, including any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will operate is under the specified conditions. Do not use

the equipment under the following environments.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to ozone, ultraviolet rays, or radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.)

(5) Any vibrations or mechanical shocks exceeding the specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.

2. Other

2-1. In an Emergency

(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment. If the

equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.

(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be

caused by the capacitor's high temperature.

2-2. Disposal of Waste

When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate

licenses.

2-3. Circuit Design

(1) Addition of Fail Safe Function

Capacitors that are cracked by dropping or bending of the board may cause deterioration of the insulation

resistance, and result in a short. If the circuit being used may cause an electrical shock, smoke or fire when

a capacitor is shorted, be sure to install fail-safe functions, such as a fuse, to prevent secondary accidents.

(2) Capacitors used to prevent electromagnetic interference in the primary AC side circuit, or as a

connection/insulation, must be a safety standard certified product, or satisfy the contents stipulated

in the Electrical Appliance and Material Safety Law. Install a fuse for each line in case of a short.

(3) The KR3, KRM, KC3, KCM series are not safety standard certified products.

2-4. Remarks

Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.

The above notices are for standard applications and conditions. Contact us when the products are used

in special mounting conditions. Select optimum conditions for operation as they determine the reliability of

the product after assembly. The data herein are given in typical values, not guaranteed ratings.

3. Limitation of applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party’s life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention/crime prevention equipment

(9) Data-processing equipment exerting influence on public

(10) Application of similar complexity and/or reliability requirements to the applications listed in the above.

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Notice

■Rating

1. Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1. Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with

a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider

the temperature distribution in equipment and the seasonal temperature variable factor.

1-2. Consider the self-heating factor of the capacitor. The surface temperature of the capacitor shall be the upper

operating temperature or less when including the self-heating factors.

2. Atmosphere Surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion

of the terminations and the penetration of moisture into the capacitor.

1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject

to moisture condensation.

1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal

electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents

for long periods of time.

3. Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates at specific

frequencies and noise may be generated. Moreover, when the mechanical vibration or shock is added to the capacitor,

noise may occur.

■Soldering and Mounting

1. PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly

on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these tresses and cause chip cracking. When designing substrates,

take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height.

1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is

different depending on PCB material and structure. When the thermal expansion coefficient greatly differs between

the board used for mounting and the chip, it will cause cracking of the chip due to the thermal expansion and

contraction. When small size capacitors of 1005 size or less are mounted on a single-layered glass epoxy board,

it will also cause cracking of the chip for the same reason.

Pattern Forms

Prohibited

Correct

Chassis

Solder Resist

Solder(ground)

Placing Close to Chassis

Electrode Pattern

Lead Wire

Solder Resist

Placing

of Chip Components

and Leaded Components

Soldering Iron

Lead Wire

Solder Resist

Placing

of Leaded Components

after Chip Component

Solder Resist

Lateral Mounting

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Notice

2. Land Dimensions

2-1. Chip capacitors can be cracked due to the stress of PCB

bending, etc. if the land area is larger than needed and

has an excess amount of solder. Please refer to the land

dimensions in the following table for reflow soldering.

Please confirm the suitable land dimension by evaluating

of the actual SET / PCB.

Dimensions

Chip (L×W)

a

b

c

Part Number

K□□21

K□□31

K□□55

2.0×1.25

3.2×1.6

5.7×5.0

1.0 to 1.2

2.2 to 2.4

2.6

0.6 to 0.7

0.8 to 0.9

2.7

0.8 to 1.1

1.0 to 1.4

5.6

3. Board Design

When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size

and material of the board.

Relationship with amount of strain to the board thickness, length, width, etc.]

3PL

Relationshipbetweenloadandstrain

ε=

2Ewh²

ε：Strain on center of board (μst)

L：Distance between supporting points (mm)

P

Y

w

h

E

Y

P

：Board width (mm)

：Board thickness (mm)

：Elastic modulus of board (N/m²=Pa)

：Deflection (mm)

h

：Load (N)

w

L

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,the amount of strain also increases.

→Reduce the distance between the supporting points.

· As the elastic modulus (E) decreases, the amount of strain increases.

→Increase the elastic modulus.

· As the board width (w) decreases, the amount of strain increases.

→Increase the width of the board.

· As the board thickness (h) decreases, the amount of strain increases.

→Increase the thickness of the board.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.

4. Washing

1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality, and select the

solvent for cleaning.

2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of electrical

characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or insufficient) may result in deterioration of the performance of the capacitors.

5. Coating

1. A crack may be cause in the capacitor due to the stress of the thermal contraction of the resin during curing process. The

stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction. The difference

in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor may cause the

destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration of insulation

resistance or dielectric breakdown. Select a resin for which the thermal expansion coefficient is as close to that of the

capacitor as possible. A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic. Using hygroscopic resins under high humidity conditions may cause

the deterioration of the insulation resistance of a capacitor. An epoxy resin can be used as a less hygroscopic resin.

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Notice

■Other

1. Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

1-1. The capacitors shall be protected against excessive temperature, humidity, and mechanical force during

transportation.

(1) Climatic condition

・ low air temperature : -40℃

・ change of temperature air/air : -25℃/+25℃

・ low air pressure : 30kPa

・ change of air pressure : 6kPa/min.

(2) Mechanical condition

Transportation shall be done in such a way that the boxes are not deformed and forced are not directly passed

on to the inner packaging.

1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.

(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur

in the ceramic body of the capacitor.

(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface

of the capacitor, the capacitor may crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was applied by dropping, etc. A capacitor dropped accidentally

during processing may be damaged.

2. Characteristics Evaluation in the Actual System

1. Evaluate the capacitor in the actual system, to confirm that there is no problem with the performance and specification

values in a finished product before using.

2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic

capacitors, the capacitance may change depending on the operating conditions in the actual system. Therefore,

be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity, which will affect

the capacitance value of the capacitor.

3. In addition, voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in the actual

system. Evaluate the surge resistance in the actual system as required.

Note

1. Please make sure that your product has been evaluated in view of your specifications with our product being mounted

to your product.

2. You are requested not to use our product deviating from this specification.

11 / 22

EGKRC01

Reference only

1. Application

This specification is applied to Metal Terminal Type Multilayer Ceramic Capacitors KCM series

in accordance with AEC-Q200 requirements used for Automotive Electronics equipment.

2. Rating

2-1. Operating temperature range

-55 to +125°C

2A

2-2. Part name configuration

ex.) KCM

55

W

R7

156

M

H01

K

Series Chip

Height

Temperature Rated Capacitance Capacitance Individual Packing

dimension dimension characteristic voltage

tolerance specification style

(L×W)

•Chip dimension(L×W)

Code

Nominal Chip dimension (mm)

L

W

55

5.7

5.0

•Height dimension

Code

Dimension (mm)

L

Q

T

W

2.8

3.7

4.8

6.4

Please refer to [Part number list] on the dimensions of metal terminal product.

•Temperature characteristic

Code

Temperature characteristic

C7

R7

X7S

X7R

Please confirm detailed specification on [Specification and test methods].

•Rated voltage

Code

1E

Rated voltage

DC25V

YA

DC35V

1H

1J

DC50V

DC63V

2A

DC100V

•Capacitance

The first two digits denote significant figures ; the last digit denotes the multiplier of 10 in pF.

ex.) In case 156.

15 x 10⁶= 15000000pF(=15µF)

•Capacitance tolerance

Please refer to [Part number list].

•Individual specification

Murata’s control code

Please refer to [Part number list].

•Packing style

Code

K

Style

φ330mm reel Plastic taping

ETKCM5502C

12 / 22

Reference only

3. Part number list

Unit : mm

DC

Dimension(mm)

Cap.

tol.

(%)

Pack

Chip

Cap.

(µF)

Rated

Volt.

(V)

T.C.

Customer Part Number

Murata Part Number

qty.

type

L

W

T

e

(pcs)

6.1 5.3 2.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

X7R

X7S

X7R

25

35

15

22

33

47

68

47

100

10

15

17

22

33

47

±10

±20

±10

±20

±10

±20

KCM55LR71E156KH01K

KCM55QR71E226KH01K

KCM55QR71E336KH01K

KCM55TR71E336MH01K

KCM55WR71E476MH01K

KCM55WR71E686MH01K

KCM55QC71E476KH13K

KCM55WC71E107MH13K

KCM55LR7YA106KH01K

KCM55LR7YA156KH01K

KCM55QR7YA176KH01K

KCM55QR7YA226KH01K

KCM55TR7YA226MH01K

KCM55TR7YA336MH01K

KCM55WR7YA336MH01K

KCM55WR7YA476MH01K

1

2

1

2

1

2

2000

1000

500

6.1 5.3 3.7 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 3.7 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 4.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 6.4 1.2

±0.4 ±0.2 ±0.3 ±0.2

6.1 5.3 6.4 1.2

±0.4 ±0.2 ±0.3 ±0.2

500

6.1 5.3 3.7 1.2

±0.5 ±0.2 ±0.2 ±0.2

1000

500

6.1 5.3 6.4 1.2

±0.5 ±0.2 ±0.3 ±0.2

6.1 5.3 2.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

2000

1000

500

6.1 5.3 2.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 3.7 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 3.7 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 4.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 4.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 6.4 1.2

±0.4 ±0.2 ±0.3 ±0.2

6.1 5.3 6.4 1.2

±0.4 ±0.2 ±0.3 ±0.2

500

ETKCM5502C

13 / 22

Reference only

Unit : mm

Dimension(mm)

DC

Rated

Volt.

(V)

Cap.

tol.

(%)

Pack

Chip

Cap.

(µF)

T.C.

Customer Part Number

Murata Part Number

qty.

type

L

W

T

e

(pcs)

6.1 5.3 2.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

X7R

50

63

4.7

10

17

22

33

47

4.7

10

22

±10

±20

±10

±20

KCM55LR71H475KH01K

KCM55LR71H106KH01K

KCM55QR71H106KH01K

KCM55QR71H176KH01K

KCM55QR71H226KH13K

KCM55TR71H226MH01K

KCM55WR71H226MH01K

KCM55WR71H336MH01K

KCM55WR71H476MH13K

KCM55LR71J475KH01K

KCM55QR71J106KH01K

KCM55WR71J226MH01K

1

2

1

2

2000

1000

500

6.1 5.3 2.8 1.2

±0.4 ±0.2 ±0.2 ± 0.2

6.1 5.3 3.7 1.2

±0.4 ±0.2 ±0.2 ± 0.2

6.1 5.3 3.7 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 3.7 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 4.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 6.4 1.2

±0.4 ±0.2 ±0.3 ±0.2

6.1 5.3 6.4 1.2

±0.4 ±0.2 ±0.3 ±0.2

500

6.1 5.3 6.4 1.2

±0.4 ±0.2 ±0.3 ±0.2

500

6.1 5.3 2.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

2000

1000

500

6.1 5.3 3.7 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 6.4 1.2

±0.4 ±0.2 ±0.3 ±0.2

ETKCM5502C

14 / 22

Reference only

Unit : mm

Dimension(mm)

DC

Rated

Volt.

(V)

Cap.

tol.

(%)

Pack

Chip

Cap.

(µF)

T.C.

Customer Part Number

Murata Part Number

qty.

type

L

W

T

e

(pcs)

6.1 5.3 2.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

X7R

100

4.7

6.8

10

15

22

±10

±20

KCM55LR72A475KH01K

KCM55QR72A685KH01K

KCM55QR72A106KH01K

KCM55TR72A106MH01K

KCM55WR72A156MH01K

KCM55WR72A226MH01K

1

2

2000

1000

500

6.1 5.3 3.7 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 3.7 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 4.8 1.2

±0.4 ±0.2 ±0.2 ±0.2

6.1 5.3 6.4 1.2

±0.4 ±0.2 ±0.3 ±0.2

6.1 5.3 6.4 1.2

±0.4 ±0.2 ±0.3 ±0.2

500

ETKCM5502C

15 / 22

Reference only

4. AEC-Q200 Murata Standard Specifications and Test Methods

AEC-Q200

Test Item

Specifications

AEC-Q200 Test Method

No.

1

Pre-and Post-Stress

Electrical Test

-

2

High Temperature

Exposure (Storage)

The measured and observed characteristics should

satisfy the specifications in the following table.

Set the capacitor for 1,000±12 h at 150±3°C. Let sit for 24±2 h at

room temperature, then measure.

Appearance No marking defects

Capacitance

Change

D.F.

within ±15%

0.05 max.

I.R.

100 MΩ⋅µF or more

3

Temperature Cycle

The measured and observed characteristics should

satisfy the specifications in the following table.

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (19). Perform the 1,000 cycles

according to the four heat treatments listed in the following table.

Let sit for 24±2 h at *room condition, then measure.

Appearance No marking defects.

Capacitance

Change

D.F.

within ±7.5%

Step

1

2

3

4

0.025 max.

Temp.

(°C)

Room

Temp.

Room

Temp.

-55+0/-3

125+3/-0

I.R.

100 MΩ⋅µF or more

Time

(min.)

15±3

1

15±3

1

•Pretreatment

Perform the heat treatment at 150+0/-10°C for 60±5 min and

then let sit for 24±2 h at *room condition.

Per EIA-469

4

5

Destructive

Physical Analysis

No defects or abnormalities

Moisture Resistance

The measured and observed characteristics should

satisfy the specifications in the following table.

Apply the 24 h heat (25 to 65°C) and humidity (80 to 98%)

treatment shown below, 10 consecutive times.

Let sit for 24±2 h at *room condition, then measure.

Appearance No marking defects.

Capacitance

Change

D.F.

within ±7.5%

0.025 max.

I.R.

100 MΩ⋅µF or more

6

Biased Humidity

The measured and observed characteristics should

satisfy the specifications in the following table.

Apply the rated voltage and DC1.3+0.2/-0 V (add 100kΩ resistor)

at 85±3°C and 80 to 85% humidity for 1,000±12 h.

Remove and let sit for 24±2 h at *room condition, then measure.

The charge/discharge current is less than 50mA.

•Pretreatment

Appearance No marking defects

Capacitance

Change

D.F.

within ±15%

Perform the heat treatment at 150+0/-10°C for 60±5 min and

then let sit for 24±2 h at *room condition.

0.05 max.

I.R.

10 MΩ⋅µF or more

* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

ESKCM5501C

16 / 22

Reference only

AEC-Q200

Test Item

No.

7

Specifications

AEC-Q200 Test Method

Operational Life

The measured and observed characteristics should

satisfy the specifications in the following table.

Apply voltage as in the table for 1000±12 h at maximum operating

temperature ±3°C.

Let sit for 24±2 h at *room condition, then measure.

Appearance No marking defects

Rated

Voltage

DC25V

DC35V

Cap.

Cap. tol.

Capacitance within ±15%

Change

T.C.

Applied Voltage

D.F.

I.R.

0.05 max.

-

200% of the

rated voltage

10 MΩ⋅µF or more

except for

the following

22μF±10%

47μF±20%

X7R

X7S

DC50V

150% of the

rated voltage

DC63V

DC100V

DC25V

-

Relative humidity:50% max.

The charge/discharge current is less than 50mA.

•Pretreatment

Apply test voltage for 60±5 min at test temperature.

Remove and let sit for 24±2 h at *room condition.

8

9

External Visual

Physical Dimension

No defects or abnormalities

Visual inspection

Within the specified dimensions

Using calipers and micrometers.

Per MIL-STD-202 Method 215

Solvent 1 : 1 part (by volume) of isopropyl alcohol

3 parts (by volume) of mineral spirits

Solvent 2 : Terpene defluxer

Solvent 3 : 42 parts (by volume) of water

1part (by volume) of propylene glycol

Monomethyl ether

10 Resistance Appearance No marking defects

to Solvents

Capacitance Within the specified tolerance

D.F.

I.R.

0.025 max.

100 MΩ⋅µF or more

1 part (by volume) of monoethanolamine

11 Mechanical

Shock

Three shocks in each direction should be applied along 3

mutually perpendicular axes of the test specimen (18 shocks).

The specified test pulse should be Half-sine and should have a

duration :0.5ms, peak value:1,500g and velocity change: 4.7m/s.

Appearance No marking defects

Capacitance Within the specified tolerance

D.F.

0.025 max.

12 Vibration

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (19). The

capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 2,000Hz.

The frequency range, from 10 to 2,000Hz and return to 10Hz,

should be traversed in approximately 20 min. This motion

should be applied for 12 items in each 3 mutually perpendicular

directions (total of 36 times).

Appearance No defects or abnormalities

Capacitance Within the specified tolerance

D.F.

0.025 max.

Reflow Soldering : Peak 260+0/-5°C

The area of soldering 230°C min., 20 to 40 s

Let sit for 24±2 h at *room condition, then measure.

13 Resistance to

The measured and observed characteristics should

satisfy the specifications in the following table.

No marking defects

Soldering Heat

Appearance

•Pretreatment

Capacitance

Change

D.F.

within ±10%

Perform the heat treatment at 150+0/-10°C for 60±5 min. and then

let sit for 24±2 h at *room condition.

0.025 max.

I.R.

100 MΩ⋅µF or more

* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

ESKCM5501C

17 / 22

Reference only

AEC-Q200

Test Item

No.

Specifications

AEC-Q200 Test Method

14 Thermal Shock

The measured and observed characteristics should

satisfy the specifications in the following table.

No marking defects

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (19). Perform the 300 cycles

according to the two heat treatments listed in the following

table(Maximum transfer time is 20 s.). Let sit for 24±2 h at *room

condition, then measure.

Appearance

Capacitance

Change

within ±7.5%

Step

1

2

D.F.

0.025 max.

Temp.

(°C)

-55+0/-3

125+3/-0

I.R.

100 MΩ⋅µF or more

Time

(min.)

15±3

•Pretreatment

Perform the heat treatment at 150+0/-10°C for 60±5 min and

then let sit for 24±2 h at *room condition.

Per AEC-Q200-002

15 ESD

Appearance

Capacitance

No marking defects

Within the specified tolerance

D.F.

I.R.

0.025 max.

100 MΩ⋅µF or more

a) Preheat at 155°C for 4 h.

After the preheating, following test is done.

Reflow Soldering : Peak 260+0/-5°C

16 Solderability

95% of the terminations are to be soldered evenly and

continuously.

The area of soldering 230°C min., 20 to 40 s

Let sit for 24±2 h at *room condition, then measure.

b) Should be placed into steam aging for 8 h±15 min.

After the preheating, following test is done.

Reflow Soldering : Peak 260+0/-5°C

The area of soldering 230°C min., 20 to 40 s

Let sit for 24±2 h at *room condition, then measure.

17 Electrical Apperance

No defects or abnormalities

Visual inspection.

Characte-

Capacitance

rization

Within the specified tolerance

0.025 max.

The capacitance/D.F. should be measured at 25°C at the

frequency and voltage shown in the table.

D.F.

Nominal

capacitance

C＞10μF

Measuring

frequency

120±24Hz

1±0.2kHz

Measuring

volgate

AC0.5±0.1V(r.m.s.)

C≦10μF

AC1.0±0.2V(r.m.s.)

I.R. 25 °C

I.R. 125°C

100 MΩ⋅µF or more

The insulation resistance should be measured with a DC voltage

not exceeding the rated voltage at 25 °C and 125 °C within 2

min. of charging.

10 MΩ⋅µF or more

Dielectric

Strength

No failure

No failure should be observed when voltage in the table is

applied between the terminations for 1 to 5 s., provided the

charge/discharge current is less than 50mA.

Rated Voltage

DC25V, DC35V, DC50V, DC63V

DC100V

Test Voltage

250% of the rated voltage

200% of the rated voltage

* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

ESKCM5501C

18 / 22

Reference only

AEC-Q200

Test Item

No.

Specifications

AEC-Q200 Test Method

18 Board

Flex

Appearance

No marking defects

within ±10%

Solder the capacitor on the test jig (glass epoxy board) shown

in Fig1 using solder. Then apply a force in the direction shown in

Fig 2 for 5±1 s. The soldering should be done by the reflow

method and should be conducted with care so that the soldering

is uniform and free of defects such as heat shock.

Capacitance

Change

Type

a

b

c

K□□55

4.5

8.0

5.6

(in mm)

20 50

Pressurizing

speed:1.0mm/s

Pressurize

R4

Capacitance meter

45

Flexure: 5mm

Fig.2

Fig.1

19 Terminal Appearance

No marking defects

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig.3 using solder. Then apply 18N force in parallel with the test jig

for 60 s.

The soldering should be done by the reflow method and should be

conducted with care so that the soldering is uniform and free of

defects such as heat shock.

Strength

Capacitance

Within specified tolerance

D.F.

I.R.

0.025 max.

100 MΩ⋅µF or more

Type

a

b

c

K□□55

2.5

8.0

5.6

(in mm)

c

(t : 1.6mm)

Solder resist

Baked electrode or

copper foil

Fig.3

20 Beam Load Test

Destruction value should be exceed following one.

15N

Place the capacitor in the beam load fixture as in Fig 4.

Apply a force.

L

0.6L

Fig.4

Speed supplied the Stress Load : 2.5mm / s

21 Capacitance Capacitance Char. X7R : within ±15%

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Temperature Change

Characterist

-ics

(Temp.Range:-55 to +125°C)

Char. X7S : within ±22%

(Temp.Range:-55 to +125°C)

Step

Temperature(°C)

1

2

3

4

5

25±2

Min. Operating Temp. ±3

25±2

Max. Operating Temp. ±3

25±2

The ranges of capacitance change compared with the above

25°C value over the temperature ranges shown in the table

should be within the specified ranges.

•Pretreatment

Perform the heat treatment at 150+0/-10°C for 60±5 min and

then let sit for 24±2 h at *room condition.

Perform the initial measurement.

* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

ESKCM5501C

19 / 22

Reference only

Complement of Test Method

Test Jig

The test jig should be Jig A or Jig B as described in “Specifications and Test methods”.

The specimen should be soldered by the conditions as described below.

Soldering Method : Reflow soldering

Thickness of Metal-mask : 200µm

Solder : Sn-3.0Ag-0.5Cu

(1) Test Jig A

c

Dimension (mm)

a

b

c

2.6

8.0

5.6

Solder resist

Baked electrode or copper foil

•Material : Glass Epoxy Board

•Thickness : 1.6mm

•Thickness of copper foil : 0.035mm

(2) Test Jig B

a

Dimension (mm)

a

b

c

d

2.6

8.0

5.6

1.0

(φ4.5)

b

100

1.6

Copper foil

Solder resist

(unit : mm)

•Material : Glass Epoxy Board

•Thickness of copper foil : 0.035mm

ESKCM5501C

20 / 22

Reference only

5. Packing (Taping is standard packing method)

(1) Appearance of taping

(a) Plastic Tape

Cover Tape (Thickness: Around 60µm) is put on capacitor on Base Tape (Blister carrier Tape).

(b) The sprocket holes are to the right as the Tape is pulled toward the user.

(2) Packed capacitors

Capacitor

(3) Dimensions of Tape

(a) Height dimension code : L, Q, R, T

2.0±0.05

φ1.5+0.1/-0

8.0±0.1

0.4±0.1

4.0±0.1

•

C max.

A

Nominal value

Part Number

A

B

C

K□□55L

5.5

6.4

4.1

K□□55Q

K□□55R

K□□55T

5.5

6.4

5.8

(Unit : mm)

(b) Height dimension code : V, W

2.0±0.1

φ1.5+0.1/-0

12.0±0.1

4.0±0.1

0.4±0.1

•

C max.

A

Nominal value

Part Number

K□□55V

A

B

C

5.7

6.7

7.4

K□□55W

(Unit : mm)

EKTK5503

21 / 22

Reference only

(4) Dimensions of Reel

(a) Height dimension code : L, Q, R, T

17.5±1.5

2.0±0.5

φ21±0.8

330±2.0

φ13±0.2

13.5±1.0

21.5±1.0

(Unit : mm)

(b) Height dimension code : V, W

2.0±0.5

φ21±0.8

330±2.0

φ13±0.2

17.5±1.0

(Unit : mm)

(5) Part of the leader and part of the empty tape should be attached to the end of the tape as follows.

Vacant section : 160 min.

210 min.

Capacitors mounting unit

Vacant section : 190 min.

Direction of feed

(Unit : mm)

(6) The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of

5 pitches.

(7) Missing capacitors number within 0.1% of the number per reel or 1pc, whichever is greater, and not

continuous

(8) The top tape or cover tape and bottom tape should not protrude beyond the edges of the tape and

should not cover sprocket holes.

(9) Cumulative tolerance of sprocket holes, 10 pitches : ±0.3mm.

(10) Peeling off force : 0.1 to 0.6N in the direction shown on the follows.

165 to 180°

Top Tape or Cover Tape

Base Tape

EKTK5503

22 / 22


型号：	KCM55QR71H226KH13#
厂家：	muRata
描述：	汽车[动力总成 / 安全设备],汽车[信息娱乐 / 舒适设备],植入式以外的医疗器械设备 [GHTF A/B/C] 医疗医疗器械
文件：	总23页 (文件大小：1296K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

KCM55QR71H226KH13# [MURATA]

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