KCM55R5C3A223JDL1# [MURATA]

汽车[动力总成 / 安全设备],汽车[信息娱乐 / 舒适设备],植入式以外的医疗器械设备 [GHTF A/B/C];


型号：	KCM55R5C3A223JDL1#
厂家：	muRata
描述：	汽车[动力总成 / 安全设备],汽车[信息娱乐 / 舒适设备],植入式以外的医疗器械设备 [GHTF A/B/C] 医疗医疗器械
文件：	总20页 (文件大小：1846K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Specification

Metal Terminal Type Multilayer Ceramic Capacitors

for Automotive in accordance with AEC-Q200

KCM Series [Temp. Char.:C0G, Rat. Vol.: DC630V,DC1000V]

Product specifications in this catalog are as of Dec.2020, and are subject to change or

obsolescence without notice.

Please consult the approval sheet before ordering.Please read rating and Cautions first.

Reference only

Caution

■Storage and Operation Conditions

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

1-1. Store the capacitors in the following conditions:Room Temperature of +5°C to +40°C and a Relative Humidity

of 20% to 70%.

(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity

conditions during storage may affect solderability and packaging performance. Therefore, please maintain

the storage temperature and humidity. Use the product within six months after delivery, as prolonged storage

oxidation of the electrodes.

(2) Please confirm solderability before using after six months. Store the capacitors without opening the original bag.

Even if the storage period is short, do not exceed the specified atmospheric conditions.

1-2. Corrosive gas can react with the termination(external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas

(e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and electrical

performance may deteriorate. Do not store capacitors under direct sunlight or in high humidity conditions.

■Rating

1. Temperature Dependent Characteristics

1. The electrical characteristics of a capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes.

The following actions are recommended in order to ensure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature. When you use a high dielectric constant type

capacitor in a circuit that needs a tight (narrow) capacitance tolerance (e.g., a time-constant circuit),

please carefully consider the temperature characteristics, and carefully confirm the various characteristics

in actual use conditions and the actual system.

2. Measurement of Capacitance

1. Measure capacitance with the voltage and frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.

3. Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.

Typical Voltage Applied to the DC Capacitor

DC Voltage

DC Voltage+AC

AC Voltage

Pulse Voltage

(E: Maximum possible applied voltage.)

1-2. Influence of over voltage

Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown

of the internal dielectric layers. The time duration until breakdown depends on the applied voltage

and the ambient temperature.

2. Use a safety standard certified capacitor in a power supply input circuit (AC filter), as it is also necessary

to consider the withstand voltage and impulse withstand voltage defined for each device.

1/19

EGKRC03C

Reference only

Caution

4. Type of Applied Voltage and Self-heating Temperature

1. Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the continuous

application of an AC voltage or pulse voltage. When a DC rated voltage product is used in an AC voltage circuit or a

pulse voltage circuit, the AC current or pulse current will flow into the capacitor; therefore check the self-heating condition.

Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits of the

operating temperature, including the rise in temperature due to self-heating. When the capacitor is used with a

high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.

Since the self-heating is low in the low loss series, the allowable voltage becomes extremely high compared to

the common X7R(R7) characteristics. However, when a load with self-heating of 20°C is applied at the rated voltage, the

allowable voltage may be exceeded. When the capacitor is used in a high-frequency voltage circuit of 1kHz or more, the

frequency of the applied voltage should be less than 1MHz sine wave to limit the voltage load so that the load remains

within the derating load so that the load remains within the derating shown in the following figure. In the case of non-sine

wave, high-frequency components exceeding the fundamental frequency may be included. In such a case, please contact us.

[Sine-wave frequency VS allowable voltage]

The surface temperature of the capacitor (including self-heating)：105℃

Rated Voltage：DC1000V

Rated Voltage：DC630V

5. DC Voltage and AC Voltage Characteristics

1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied.

Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage (see figure).

Please confirm the following in order to secure the capacitance.

(1) Determine whether the capacitance change caused by the applied voltage is within the allowed range.

(2) In the DC voltage characteristics, the rate of capacitance change becomes larger as voltage increases, even if the

applied voltage is below the rated voltage. When a high dielectric constant type capacitor is used in a circuit that

requires a tight (narrow) capacitance tolerance (e.g., a time constant circuit), please carefully consider the voltage

characteristics, and confirm the various characteristics in actual operating conditions in an actual system.

2. The capacitance values of high dielectric constant type capacitors changes depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.

6. Capacitance Aging

1. The high dielectric constant type capacitors have the characteristic in which the capacitance value decreases with the

passage of time. When you use high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance

tolerance (e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors, such as their

aging, voltage, and temperature characteristics. In addition, check capacitors using your actual appliances at the intended

environment and operating conditions.

7. Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its condition, and any

and any generation of resonance. Please mount the capacitor so as not to

generate resonance, and do not allow any impact on the terminals.

Crack

Floor

2. Mechanical shock due to being dropped may cause damage or

a crack in the dielectric material of the capacitor.

Do not use a dropped capacitor because the quality and reliability may be deteriorated.

3. When printed circuit boards are piled up or handled,

the corner of another printed circuit board should not be allowed

to hit the capacitor, in order to avoid a crack or other damage to the capacitor.

2/19

EGKRC03C

Reference only

Caution

■Soldering and Mounting

1. Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing

or bending the printed circuit board.

1-1. Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.

[Component Direction]

Locate chip horizontal to the direction in which stress acts.

[Chip Mounting Close to Board Separation Point]

It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all

of the following three measures; however, implement as many measures as possible to reduce stress.

Contents of Measures

(1) Turn the mounting direction of the component parallel

(1) to the board separation surface.

Stress Level

A>D

Perforation

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away

(3) from the board separation surface.

A>B

Slit

A>C

[Mounting Capacitors Near Screw Holes]

When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.

Screw Hole Recommended

2. Information before Mounting

1. Do not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7. The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.

8. We have also produced a DVD which shows a summary of our opinions, regarding the precautions for mounting.

Please contact our sales representative to request the DVD.

3. Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum

to prevent them from any bending damage or cracking. Please take into account the following precautions and

recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.

3/19

EGKRC03C

Reference only

Caution

2. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving

moving smoothly. This imposes greater force upon the chip during mounting, causing cracked chips. Also, the locating

claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips.

The suction nozzle and the locating claw must be maintained, checked, and replaced periodically.

4-1. Reflow Soldering

[Standard Conditions for Reflow Soldering]

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes deformation

inside the components. In order to prevent mechanical damage

to the components, preheating is required for both the

components and the PCB. Preheating conditions are shown

in table 1. It is required to keep the temperature differential

between the solder and the components surface (ΔT) as small

as possible.

Reflow

Temperature (℃)

Soldering

Peak Temperature

Gradual

Cooling

220℃(200℃)

ΔＴ

190℃(170℃)

170℃(150℃)

150℃(130℃)

Preheating

2. Solderability of tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of tin

is used. Please confirm the solderability of tin plated

termination chips before use.

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT) between

the component and the solvent within the range shown in table 1.

Time

60 to 120 seconds 30 to 60 seconds

Temperature

Incase of Lead Free Solder

( ): In case of Pb-Sn Solder

Vapor Reflow

Temperature (℃)

Soldering

Peak Temperature

Gradual

Cooling

Table 1

ΔＴ

190℃(170℃)

170℃(150℃)

150℃(130℃)

Part Number

Temperature Differential

K□□55

ΔT≦130°C

Preheating

Recommended Conditions

Pb-Sn Solder

Time

60 to 120 seconds 20 seconds max.

Lead Free

Solder

Reflow

Vapor Reflow

230 to 240°C

Peak Temperature 230 to 250°C

240 to 260°C

Air or N2

[Allowable Reflow Soldering Temperature and Time]

280

Saturated vapor

of inactive solvent

Atmosphere

Air

Pb-Sn Solder: Sn-37Pb

270

260

250

Lead Free Solder: Sn-3.0Ag-0.5Cu

240

230

220

120

Soldering Time (sec.)

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

4. Optimum Solder Amount for Reflow Soldering

4-1. If solder paste is excessive, solder between a chip and a

metal terminal melts. This causes the chip to move and

come off.

4-2. If solder paste is too little, it causes a lack of adhesive

strength on the metal terminal and the capacitor comes off.

4-3. Please make sure that solder is smoothly applied higher

than 0.3mm and lower than the level of the bottom of the

chip.

0.3mm min.

In section

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to the PCB.

4-2. Flow Soldering

1. Do not apply flow soldering.

4/19

EGKRC03C

Reference only

Caution

4-3. Correction of Soldered Portion

1. For the shape of the soldering iron tip, refer to the figure

on the right.

2. Regarding the type of solder, use a wire diameter of

φ0.5mm or less (rosin core wire solder).

3. Apply the tip of the soldering iron against the lower end

of the metal terminal.

(1) In order to prevent cracking caused by sudden heating

of the ceramic device, do not touch the ceramic base

directly.

(2) In order to prevent deviations and dislocating of the

chip, do not touch the junction of the chip and the metal

terminal, and the metal portion on the outside directly.

4. The amount of solder for corrections by soldering iron,

should be lower than the height of the lower side of the chip.

Solder Amount

In section

5. Washing

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken

solder joints. Take note not to vibrate PCBs.

6. Electrical Test on Printed Circuit Board

1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a capacitor after

mounting on the printed circuit board.

1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc. The thrusting force of the test probe can

flex the PCB, resulting in cracked chips or open solder joints. Provide backup pins on the back side of the PCB

to prevent warping or flexing. Install backup pins as close to the capacitor as possible.

1-2. Avoid vibration of the board by shock when a test-probe contacts a printed circuit board.

[Not Recommended]

[Recommended]

Peeling

Backup Pin

Test-probe

7. Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that causes bending

or twisting the board.

1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack. Cracked capacitors may cause

deterioration of the insulation resistance, and result in a short. Avoid this type of stress to a capacitor.

[Bending]

[Twisting]

5/19

EGKRC03C

Reference only

Caution

2. Check the cropping method for the printed circuit board in advance.

2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disk separator, router type separator,

etc.) to prevent the mechanical stress that can occur to the board.

Board Separation Apparatus

Hand Separation

Nipper Separation

Board Separation Method

(1) Board Separation Jig

(2) Disk Separator

(3) Router Type Separator

Level of stress on board

Recommended

High

Medium

Low

△*

○

· Board handling

Hand and nipper separation

apply a high level of stress.

Use another method.

· Board handling

· Board bending direction

· Layout of capacitors

· Layout of slits

Notes

· Design of V groove

· Arrangement of blades

· Controlling blade life

Board handling

* When a board separation jig or disk separator is used, if the following precautions are not observed, a large board deflection stress will occur and the capacitors

may crack. Use router type separator if at all possible.

(1) Example of a suitable jig

[In the case of Single-side Mounting]

An outline of the board separation jig is shown as follows. Recommended example: Stress on the component

mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards

the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the

capacitors increases due to large stress being applied to the component mounting position, if the portion away

from the jig is held and bent in the direction opposite the side where the capacitors are mounted.

Recommended

Not Recommended

[Outline of Jig]

[In the case of Double-sided Mounting]

Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the

above method. Therefore, implement the following measures to prevent stress from being applied to the components.

(Measures)

① Consider introducing a router type separator. If it is difficult to introduce a router type separator, implement

the following measures. (Refer to item 1. Mounting Position)

② Mount the components at a right angle to the board separation surface.

③ When mounting components near the board separation point, add slits in the separation position

near the component.

④ Keep the mounting position of the components away from the board separation point.

(2) Example of a Disk Separator

An outline of a disk separator is shown as follows. As shown in the Principle of Operation, the top blade and bottom

blade are aligned with the V-grooves on the printed circuit board to separate the board. In the following case, board

deflection stress will be applied and cause cracks in the capacitors.

① When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom, left-right

or front-rear directions

② The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned

top-bottom IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of

the V groove with consideration about strength of material of the printed circuit board.

[Outline of Machine]

[Principle of Operation]

[Cross-section Diagram]

6/19

EGKRC03C

Reference only

Caution

Not Recommended

Left-right Misalignment

Recommended

Top-bottom Misalignment

Front-rear Misalignment

Top Blade

Bottom Blade

Not Recommended

Example of Recommended

V-groove Design

Left-right Misalignment

Low-Angle

Depth too Shallow

Depth too Deep

(3) Example of Router Type Separator

The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the

cutting process, stress on the board can be suppressed during board separation. When attaching or removing

boards to/from the router type separator, carefully handle the boards to prevent bending.

[Outline Drawing]

Router

8. Assembly

1. Handling

If a board mounted with capacitors is held with one hand, the board may bend. Firmly hold the edges of the board with

both hands when handling. If a board mounted with capacitors is dropped, cracks may occur in the capacitors.

Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.

2. Attachment of Other Components

2-1. Mounting of Other Components

Pay attention to the following items, when mounting other

components on the back side of the board after capacitors

have been mounted on the opposite side. When the bottom

dead point of the suction nozzle is set too low, board deflection

stress may be applied to the capacitors on the back side

Suction Nozzle

(bottom side), and cracks may occur in the capacitors.

・ After the board is straightened, set the bottom dead point

of the nozzle on the upper surface of the board.

・ Periodically check and adjust the bottom dead point.

2-2. Inserting Components with Leads into Boards

When inserting components (transformers, IC, etc.) into boards,

bending the board may cause cracks in the capacitors or

cracks in the solder. Pay attention to the following.

・ Increase the size of the holes to insert the leads, to reduce

the stress on the board during insertion.

・ Fix the board with backup pins or a dedicated jig before

Component with Leads

insertion.

・ Support below the board so that the board does not bend.

When using multiple backup pins on the board, periodically

confirm that there is no difference in the height of each

backup pin.

7/19

EGKRC03C

Reference only

Caution

2-3. Attaching/Removing Sockets

When the board itself is a connector, the board may bend when

a socket is attached or removed. Plan the work so that the board

does not bend when a socket is attached or removed.

Socket

2-4. Tightening Screws

The board may be bent, when tightening screws, etc. during the

attachment of the board to a shield or chassis.

Pay attention to the following items before performing the work.

・ Plan the work to prevent the board from bending.

・ Use a torque screwdriver, to prevent over-tightening of the

screws.

Screwdriver

・ The board may bend after mounting by reflow soldering, etc.

Please note, as stress may be applied to the chips by forcibly

flattening the board when tightening the screws.

■Other

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.

1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not

expose a capacitor to a conductive liquid, including any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will operate is under the specified conditions. Do not use

the equipment under the following environments.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to ozone, ultraviolet rays, or radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.)

(5) Any vibrations or mechanical shocks exceeding the specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.

2. Other

2-1. In an Emergency

(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment. If the

equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.

(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be

caused by the capacitor's high temperature.

2-2. Disposal of Waste

When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate

licenses.

2-3. Circuit Design

(1) Addition of Fail Safe Function

Capacitors that are cracked by dropping or bending of the board may cause deterioration of the insulation

resistance, and result in a short. If the circuit being used may cause an electrical shock, smoke or fire when

a capacitor is shorted, be sure to install fail-safe functions, such as a fuse, to prevent secondary accidents.

(2) Capacitors used to prevent electromagnetic interference in the primary AC side circuit, or as a

connection/insulation, must be a safety standard certified product, or satisfy the contents stipulated

in the Electrical Appliance and Material Safety Law. Install a fuse for each line in case of a short.

(3) The KR3, KRM, KC3, KCM series are not safety standard certified products.

2-4. Remarks

Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.

The above notices are for standard applications and conditions. Contact us when the products are used

in special mounting conditions. Select optimum conditions for operation as they determine the reliability of

the product after assembly. The data herein are given in typical values, not guaranteed ratings.

3. Limitation of applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party’s life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention/crime prevention equipment

(9) Data-processing equipment exerting influence on public

(10) Application of similar complexity and/or reliability requirements to the applications listed in the above.

8/19

EGKRC03C

Reference only

Notice

■Rating

1. Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1. Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with

a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider

the temperature distribution in equipment and the seasonal temperature variable factor.

1-2. Consider the self-heating factor of the capacitor. The surface temperature of the capacitor shall be the upper

operating temperature or less when including the self-heating factors.

2. Atmosphere Surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion

of the terminations and the penetration of moisture into the capacitor.

1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject

to moisture condensation.

1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal

electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents

for long periods of time.

3. Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates at specific

frequencies and noise may be generated. Moreover, when the mechanical vibration or shock is added to the capacitor,

noise may occur.

■Soldering and Mounting

1. PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly

on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these tresses and cause chip cracking. When designing substrates,

take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height.

1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is

different depending on PCB material and structure. When the thermal expansion coefficient greatly differs between

the board used for mounting and the chip, it will cause cracking of the chip due to the thermal expansion and

contraction. When small size capacitors of 1005 size or less are mounted on a single-layered glass epoxy board,

it will also cause cracking of the chip for the same reason.

Pattern Forms

Prohibited

Correct

Chassis

Solder Resist

Solder(ground)

Placing Close to Chassis

Electrode Pattern

Lead Wire

Solder Resist

Placing

of Chip Components

and Leaded Components

Soldering Iron

Lead Wire

Solder Resist

Placing

of Leaded Components

after Chip Component

Solder Resist

Lateral Mounting

9/19

EGKRC03C

Reference only

Notice

2. Land Dimensions

2-1. Chip capacitors can be cracked due to the stress of PCB

bending, etc. if the land area is larger than needed and

has an excess amount of solder. Please refer to the land

dimensions in the following table for reflow soldering.

Please confirm the suitable land dimension by evaluating

of the actual SET / PCB.

Unit：mm

Dimensions

Body size (L×W)

Part Number

K□□55□5C2J□□□JDL□□

6.1×5.1

3.2 to 4.0

2.0 to 2.4

5.5 to 5.7

3. Board Design

When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size

and material of the board.

Relationship with amount of strain to the board thickness, length, width, etc.]

3PL

Relationshipbetweenloadandstrain

ε=

2Ewh²

ε：Strain on center of board (μst)

L：Distance between supporting points (mm)

：Board width (mm)

：Board thickness (mm)

：Elastic modulus of board (N/m²=Pa)

：Deflection (mm)

：Load (N)

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,the amount of strain also increases.

→Reduce the distance between the supporting points.

· As the elastic modulus (E) decreases, the amount of strain increases.

→Increase the elastic modulus.

· As the board width (w) decreases, the amount of strain increases.

→Increase the width of the board.

· As the board thickness (h) decreases, the amount of strain increases.

→Increase the thickness of the board.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.

4. Washing

1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality, and select the

solvent for cleaning.

2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of electrical

characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or insufficient) may result in deterioration of the performance of the capacitors.

5. Coating

1. A crack may be cause in the capacitor due to the stress of the thermal contraction of the resin during curing process. The

stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction. The difference

in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor may cause the

destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration of insulation

resistance or dielectric breakdown. Select a resin for which the thermal expansion coefficient is as close to that of the

capacitor as possible. A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic. Using hygroscopic resins under high humidity conditions may cause

the deterioration of the insulation resistance of a capacitor. An epoxy resin can be used as a less hygroscopic resin.

10/19

EGKRC03C

Reference only

Notice

■Other

1. Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

1-1. The capacitors shall be protected against excessive temperature, humidity, and mechanical force during

transportation.

(1) Climatic condition

・ low air temperature : -40℃

・ change of temperature air/air : -25℃/+25℃

・ low air pressure : 30kPa

・ change of air pressure : 6kPa/min.

(2) Mechanical condition

Transportation shall be done in such a way that the boxes are not deformed and forced are not directly passed

on to the inner packaging.

1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.

(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur

in the ceramic body of the capacitor.

(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface

of the capacitor, the capacitor may crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was applied by dropping, etc. A capacitor dropped accidentally

during processing may be damaged.

2. Characteristics Evaluation in the Actual System

1. Evaluate the capacitor in the actual system, to confirm that there is no problem with the performance and specification

values in a finished product before using.

2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic

capacitors, the capacitance may change depending on the operating conditions in the actual system. Therefore,

be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity, which will affect

the capacitance value of the capacitor.

3. In addition, voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in the actual

system. Evaluate the surge resistance in the actual system as required.

Note

1. Please make sure that your product has been evaluated in view of your specifications with our product being mounted

to your product.

2. You are requested not to use our product deviating from this specification.

11/19

EGKRC03C

Reference only

1. Application

This specification is applied to Metal Terminal Type Multilayer Ceramic Capacitors KCM series

in accordance with AEC-Q200 requirements used for Automotive Electronics equipment.

2. Rating

2-1. Operating temperature range

-55 to +125°C

2-2. Part name configuration

ex.) KCM

Series

Chip

543

DL2

Height

Temperature Rated Capacitance Capacitance Individual Packing

dimension dimension characteristic voltage

tolerance specification style

(L×W)

•Chip dimension(L×W)

Code

Nominal Chip dimension (mm)

5.7

5.0

•Height dimension

Code

Dimension (mm)

2.8

3.6

4.8

6.2

Please refer to [Part number list] on the dimensions of metal terminal product.

•Temperature characteristic

Code

Temperature characteristic

C0G

Please confirm detailed specification on [Specification and test methods].

•Rated voltage

Code

Rated voltage

DC630V

DC1000V

•Capacitance

The first two digits denote significant figures ; the last digit denotes the multiplier of 10 in pF.

ex.) In case 543.

54 x10³= 54000pF

•Capacitance tolerance

Please refer to [Part number list].

•Individual specification

Murata’s control code

Please refer to [ Part number list ].

•Packing style

Code

Style

φ330mm reel Plastic taping

ETKCM5503A

12/19

Reference only

3. Part number list

Unit : mm

Rated Cap.

Volt. (pF)

(V)

Dimension(mm)

Cap.

tol.

(%)

Pack

Chip

T.C.

Customer Part Number

Murata Part Number

qty.

type

(pcs)

6.1 5.1 2.8 0.9

±0.4 ±0.3 ±0.3 ±0.2

C0G

630 15000

630 18000

630 22000

630 27000

630 30000

630 36000

630 44000

630 54000

±5

KCM55L5C2J153JDL1K

KCM55L5C2J183JDL1K

KCM55R5C2J223JDL1K

KCM55R5C2J273JDL1K

KCM55T5C2J303JDL1K

KCM55T5C2J363JDL1K

KCM55V5C2J443JDL2K

KCM55V5C2J543JDL2K

KCM55L5C3A153JDL1K

KCM55L5C3A183JDL1K

KCM55R5C3A223JDL1K

KCM55R5C3A273JDL1K

KCM55T5C3A303JDL1K

KCM55T5C3A363JDL1K

KCM55V5C3A443JDL2K

KCM55V5C3A543JDL2K

2000

1000

500

6.1 5.1 2.8 0.9

±0.4 ±0.3 ±0.3 ±0.2

6.1 5.1 3.6 0.9

±0.4 ±0.3 ±0.3 ±0.2

6.1 5.1 3.6 0.9

±0.4 ±0.3 ±0.3 ±0.2

6.1 5.1 4.8 0.9

±0.4 ±0.3 ±0.3 ±0.2

6.1 5.1 4.8 0.9

±0.4 ±0.3 ±0.3 ±0.2

6.1 5.1 6.2 0.9

±0.4 ±0.3 ±0.4 ±0.2

6.1 5.1 6.2 0.9

±0.4 ±0.3 ±0.4 ±0.2

500

6.1 5.1 2.8 0.9

±0.4 ±0.3 ±0.3 ±0.2

C0G 1000 15000

C0G 1000 18000

C0G 1000 22000

C0G 1000 27000

C0G 1000 30000

C0G 1000 36000

C0G 1000 44000

C0G 1000 54000

2000

1000

500

6.1 5.1 2.8 0.9

±0.4 ±0.3 ±0.3 ±0.2

6.1 5.1 3.6 0.9

±0.4 ±0.3 ±0.3 ±0.2

6.1 5.1 3.6 0.9

±0.4 ±0.3 ±0.3 ±0.2

6.1 5.1 4.8 0.9

±0.4 ±0.3 ±0.3 ±0.2

6.1 5.1 4.8 0.9

±0.4 ±0.3 ±0.3 ±0.2

6.1 5.1 6.2 0.9

±0.4 ±0.3 ±0.4 ±0.2

6.1 5.1 6.2 0.9

±0.4 ±0.3 ±0.4 ±0.2

500

ETKCM5503A

13/19

Reference only

4. AEC-Q200 Murata Standard Specifications and Test Methods

AEC-Q200

No.

Specifications

AEC-Q200 Test Method

Test Item

Pre-and Post-Stress

Electrical Test

High Temperature

Exposure (Storage)

The measured and observed

characteristics should satisfy the

specifications in the following table.

No marking defects

Set the capacitor for 1,000±12 h at 150±3°C. Let sit for 24±2 h at

room temperature, then measure.

Appearance

Capacitance

Change

Within ±2.5%

Q ≧ 500

I.R.

More than 10,000MΩ or 500MΩ・μF

(Whichever is smaller.)

Temperature Cycle

The measured and observed

characteristics should satisfy the

specifications in the following table.

No marking defects

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (18). Perform the 1,000 cycles

according to the four heat treatments listed in the following table.

Let sit for 24±2 h at *room condition, then measure.

Appearance

Capacitance

Change

Within ±2.5%

Step

Temp.

(°C)

Q ≧ 500

Room

Temp.

Room

Temp.

-55+0/-3

125+3/-0

I.R.

More than 10,000MΩ or 500MΩ・μF

(Whichever is smaller.)

Time

(min.)

15±3

Destructive

Physical Analysis

Biased Humidity (Humidity

Loading (DC))

No defects or abnormalities

Per EIA-469

The measured and observed

characteristics should satisfy the

specifications in the following table.

No marking defects

Apply the rated voltage and DC1.3+0.2-0V(add

100kΩ resistor) at 85±3°C and 80 to 85% humidity for

1,000±12 h.

Remove and let sit for 24±2 h at *room condition, then measure.

The charge/discharge current is less than 50mA.

Appearance

Capacitance

Change

Within ±3.0%

Q ≧ 200

I.R.

More than 1,000MΩ or 50MΩ・μF

(Whichever is smaller.)

Operational Life

The measured and observed

characteristics should satisfy the

specifications in the following table.

No marking defects

Apply voltage as in the table for 1000±12 h at 125±3°C.

Remove and let sit for 24±2 h at *room condition, then measure.

The charge/discharge current is less than 50mA.

Appearance

Rated Voltage

DC630V

Applied Voltage

120% of the rated voltage

110% of the rated voltage

Capacitance

Change

Within ±3.0%

DC1000V

Q ≧ 350

I.R.

More than 1,000MΩ or 50MΩ・μF

(Whichever is smaller.)

External Visual

Physical Dimension

Resistance

to Solvents

No defects or abnormalities

Within the specified dimensions

No marking defects

Visual inspection

Using calipers and micrometers.

Per MIL-STD-202 Method 215

Solvent 1 : 1 part (by volume) of isopropyl alcohol

3 parts (by volume) of mineral spirits

Solvent 2 : Terpene defluxer

Solvent 3 : 42 parts (by volume) of water

1part (by volume) of propylene glycol

monomethyl ether

Appearance

Capacitance

Within the specified torelance

Q ≧ 500

I.R.

More than 10,000MΩ or 500MΩ・μF

(Whichever is smaller.)

1 part (by volume) of monoethanolomine

* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

ESKCM5502A

14/19

Reference only

AEC-Q200

Test Item

No.

Specifications

AEC-Q200 Test Method

Mechanical

Appearance

Capacitance

No marking defects

Within the specified tolerance.

Three shocks in each direction should be applied along 3

mutually perpendicular axes of the test specimen (18 shocks).

The specified test pulse should be half sine and should have a

duration : 0.5ms, peak value : 1500G and velocity change :

4.7m/s.

Shock

Q ≧ 500

Vibration

Appearance

Capacitance

No defects or abnormalities

Within the specified tolerance.

Q ≧ 500

Solder the capacitor to the test jig (glass epoxy board) in the

same manner and under the same conditions as (18). The

capacitor should be subjected to a simple harmonic motion

having a total amplitude of 1.5mm, the frequency being varied

uniformly between the approximate limits of 10 and 2,000Hz.

The frequency range, from 10 to 2,000Hz and return to 10Hz,

should be traversed in approximately 20 min. This motion

should be applied for 12 items in each 3 mutually perpendicular

directions (total of 36 times).

Resistance to Soldering Heat

The measured and observed

characteristics should satisfy the

specifications in the following table.

No marking defects

Reflow Soldering : Peak 260+0/-5°C

The area of soldering 230°C min., 20 to 40 s

Let sit for 24±2 h at *room condition, then measure.

Appearance

Capacitance

Change

Within ±2.5%

Q ≧ 1,000

I.R.

More than 10,000MΩ or 500MΩ・μF

(Whichever is smaller.)

Thermal Shock

Appearance

The measured and observed

characteristics should satisfy the

specifications in the following table.

No marking defects

Within ±2.5%

Fix the capacitor to the supporting jig in the same manner and

under the same conditions as (18). Perform the 300 cycles

according to the two heat treatments listed in the following

table(Maximum transfer time is 20s.). Let sit for 24±2 h at *room

condition, then measure.

Capacitance

Change

Step

Q ≧ 500

Temp.

(°C)

I.R.

-55+0/-3

125+3/-0

More than 10,000MΩ or 500MΩ・μF

(Whichever is smaller.)

Time

(min.)

15±3

ESD

Appearance

Capacitance

No marking defects

Within the specified tolerance.

Q ≧ 500

Per AEC-Q200-002

I.R.

More than 10,000MΩ or 500MΩ・μF

(Whichever is smaller.)

* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

ESKCM5502A

15/19

Reference only

AEC-Q200

Test Item

No.

Specifications

AEC-Q200 Test Method

Solderability

95% of the terminations are to be soldered

evenly and continuously.

a) Preheat at 155°C for 4 h.

After the preheating, following test is done.

Reflow Soldering : Peak 260+0/-5°C

The area of soldering 230°C min., 20 to 40 s

Let sit for 24±2 h at *room condition, then measure.

b) Should be placed into steam aging for 8 h±15 min.

After the preheating, following test is done.

Reflow Soldering : Peak 260+0/-5°C

The area of soldering 230°C min., 20 to 40 s

Let sit for 24±2 h at *room condition, then measure.

Electrical

Characteriza

tion

Apperance

Capacitance

No defects or abnormalities

Within the specified tolerance

Q≧1,000

Visual inspection.

The capacitance/Q should be measured at 25°C at the

frequency and voltage shown in the table.

Nominal

capacitance

C>10µF

Measuring

frequency

120±24Hz

Measuring

volgate

AC0.5±0.1V(r.m.s.)

C≦10µF

1±0.2kHz

AC1.0±0.2V(r.m.s.)

More than 10,000MΩ or 500MΩ・μF

(Whichever is smaller.)

More than 100MΩ or 5MΩ・μF

(Whichever is smaller.)

No failure

The insulation resistance should be measured with DC500±50V

at 25 °C and 125 °C within 1 min. of charging.

I.R. 25 °C

I.R. 125°C

Dielectric

Strength

No failure should be observed when voltage in the table is

applied between the terminations for 1 to 5 s., provided the

charge/discharge current is less than 50mA.

Rated Voltage

DC630V

Test Voltage

150% of the

rated voltage

120% of the

rated voltage

DC1000V

* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

ESKCM5502A

16/19

Reference only

AEC-Q200

Test Item

No.

Specifications

AEC-Q200 Test Method

Board Flex

Appearance

Solder the capacitor on the test jig (glass epoxy board) shown

in Fig1 using solder. Then apply a force in the

No marking defects

Within ±5.0%

Capacitance

Change

direction shown in Fig 2 for 5±1 s. The soldering should be done

by the reflow method and should be conducted with care so that

the soldering is uniform and free of defects such as heat shock.

4.5

8.0

5.6

(in mm)

20 50

Pressurizing

speed:1.0mm/s

Pressurize

Flexure: 5mm

Capacitance meter

Fig.1

Fig.2

Terminal

Strength

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig.3 using solder. Then apply 18N force in parallel with the test

jig for 60 s.

The soldering should be done by the reflow method and should

be conducted with care so that the soldering is uniform and free

of defects such as heat shock.

Appearance

Capacitance

No marking defects

Within specified tolerance

Q ≧ 500

More than 10,000MΩ or 500 MΩ⋅µF

(Whichever is smaller)

I.R.

4.0

8.0

5.6

(in mm)

Fig.3

Beam Load Test

Destruction value should be exceed

following one.

Place the capacitor in the beam load fixture as in Fig 4.

Apply a force.

15N

0.6L

Fig.4

Speed supplied the Stress Load : 2.5mm / s

Capacitance

Temperature

Characteristics

Capacitance

Change

0±30 ppm/°C

(Temp.Range:+25 to +125°C)

0+30,-72 ppm/°C

(Temp.Range:-55 to +25°C)

Within ±0.5% or ±0.05 pF

(Whichever is larger.)

The capacitance change should be measured after 5 min. at

each specified temperature stage.

Step

Temperature(°C)

25±2

Min. Operating Temp. ±3

25±2

Capacitance

Drift

Max. Operating Temp. ±3

25±2

The ranges of capacitance change compared with the above

25°C value over the temperature ranges shown in the table

should be within the specified ranges.

ESKCM5502A

17/19

Reference only

5. Packing (Taping is standard packing method)

(1) Appearance of taping

(a) Plastic Tape

Cover Tape (Thickness: Around 60µm) is put on capacitor on Base Tape (Blister carrier Tape).

(b) The sprocket holes are to the right as the Tape is pulled toward the user.

(2) Packed capacitors

Capacitor

(3) Dimensions of Tape

(a) Height dimension code : L, Q, R, T

2.0±0.05

φ1.5+0.1/-0

8.0±0.1

0.4±0.1

4.0±0.1

•

C max.

Nominal value

Part Number

K□□55L

5.5

6.4

4.1

5.8

K□□55Q

K□□55R

K□□55T

(Unit : mm)

(b) Height dimension code : V, W

2.0±0.1

φ1.5+0.1/-0

12.0±0.1

4.0±0.1

0.4±0.1

•

C max.

Nominal value

Part Number

K□□55V

K□□55W

5.7

6.7

7.4

(Unit : mm)

EKTK5503

18/19

Reference only

(4) Dimensions of Reel

(a) Height dimension code : L, Q, R, T

17.5±1.5

2.0±0.5

φ21±0.8

330±2.0

φ13±0.2

13.5±1.0

21.5±1.0

(Unit : mm)

(b) Height dimension code : V, W

2.0±0.5

φ21±0.8

330±2.0

φ13±0.2

17.5±1.0

(Unit : mm)

(5) Part of the leader and part of the empty tape should be attached to the end of the tape as follows.

Vacant section : 160 min.

210 min.

Capacitors mounting unit

Vacant section : 190 min.

Direction of feed

(Unit : mm)

(6) The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of

5 pitches.

(7) Missing capacitors number within 0.1% of the number per reel or 1pc, whichever is greater, and not

continuous

(8) The top tape or cover tape and bottom tape should not protrude beyond the edges of the tape and

should not cover sprocket holes.

(9) Cumulative tolerance of sprocket holes, 10 pitches : ±0.3mm.

(10) Peeling off force : 0.1 to 0.6N in the direction shown on the follows.

165 to 180°

Top Tape or Cover Tape

Base Tape

EKTK5503

19/19

KCM55R5C3A223JDL1# [MURATA]

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SI9130_11

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