KR355LD72J104KH01# [MURATA]

民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备];


型号：	KR355LD72J104KH01#
厂家：	muRata
描述：	民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备] 医疗医疗器械
文件：	总21页 (文件大小：1023K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Specification

High Effective Capacitance & High Allowable Ripple Current Metal Terminal Type Multilayer

Ceramic Capacitors for General Purpose/KR3 Series

Product specifications in this catalog are as of Dec. 2022, and are subject to change or

obsolescence without notice.

Please consult the approval sheet before ordering.Please read rating and Cautions first.

Reference only

Caution

Storage and Operation Conditions

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

1-1. Store the capacitors in the following conditions:Room Temperature of +5°C to +40°C and a Relative Humidity

of 20% to 70%.

(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity

conditions during storage may affect solderability and packaging performance. Therefore, please maintain

the storage temperature and humidity. Use the product within six months after delivery, as prolonged storage

may cause oxidation of the electrodes.

(2) Please confirm solderability before using after six months. Store the capacitors without opening the original bag.

Even if the storage period is short, do not exceed the specified atmospheric conditions.

1-2. Corrosive gas can react with the termination(external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas

(e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and electrical

performance may deteriorate. Do not store capacitors under direct sunlight or in high humidity conditions.

Rating

1. Temperature Dependent Characteristics

1. The electrical characteristics of a capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes.

The following actions are recommended in order to ensure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature. When you use a high dielectric constant type

capacitor in a circuit that needs a tight (narrow) capacitance tolerance (e.g., a time-constant circuit),

please carefully consider the temperature characteristics, and carefully confirm the various characteristics

in actual use conditions and the actual system.

2. Measurement of Capacitance

1. Measure capacitance with the voltage and frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.

3. Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.

Typical Voltage Applied to the DC Capacitor

DC Voltage

DC Voltage+AC

AC Voltage

Pulse Voltage

(E: Maximum possible applied voltage.)

1-2. Influence of over voltage

Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown

of the internal dielectric layers. The time duration until breakdown depends on the applied voltage

and the ambient temperature.

2. Use a safety standard certified capacitor in a power supply input circuit (AC filter), as it is also necessary

to consider the withstand voltage and impulse withstand voltage defined for each device.

EGKRC01A

1 / 20

Reference only

Caution

4. Type of Applied Voltage and Self-heating Temperature

1. Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the continuous

application of an AC voltage or pulse voltage. When a DC rated voltage product is used in an AC voltage circuit or a

pulse voltage circuit, the AC current or pulse current will flow into the capacitor; therefore check the self-heating condition.

Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits of the

operating temperature, including the rise in temperature due to self-heating. When the capacitor is used with a

high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.

1-1. The load should be contained to the level such that when measuring at atmospheric temperature of 25䉝, the product's

self-heating remains below 20䉝 and the surface temperature of the capacitor in the actual circuit remains within the

maximum operating temperature.

1-2. The load should be contained so that the self-heating of the capacitor body remains below 20°C, when measuring

at an ambient temperature of 25°C. In addition, use a K thermocouple of φ0.1mm with less heat capacity when

measuring, and measure in a condition where there is no effect from the radiant heat of other components or air flow

caused by convection. Excessive generation of heat may cause deterioration of the characteristics and reliability of the

capacitor. (Absolutely do not perform measurements while the cooling fan is operating, as an accurate measurement

may not be performed.)

5. DC Voltage and AC Voltage Characteristics

1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied.

Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage (see figure).

Please confirm the following in order to secure the capacitance.

(1) Determine whether the capacitance change caused by the applied voltage is within the allowed range.

(2) In the DC voltage characteristics, the rate of capacitance change becomes larger as voltage increases, even if the

applied voltage is below the rated voltage. When a high dielectric constant type capacitor is used in a circuit that

requires a tight (narrow) capacitance tolerance (e.g., a time constant circuit), please carefully consider the voltage

characteristics, and confirm the various characteristics in actual operating conditions in an actual system.

2. The capacitance values of high dielectric constant type capacitors changes depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.

6. Capacitance Aging

1. The high dielectric constant type capacitors have the characteristic in which the capacitance value decreases with the

passage of time. When you use high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance

tolerance (e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors, such as their

aging, voltage, and temperature characteristics. In addition, check capacitors using your actual appliances at the intended

environment and operating conditions.

7. Vibration and Shock

1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.

Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to being dropped may cause damage or a crack in the dielectric material of the capacitor.

Do not use a dropped capacitor because the quality and reliability may be deteriorated.

Crack

Floor

3. When printed circuit boards are piled up or handled, the corner of another printed circuit board should not be allowed

to hit the capacitor, in order to avoid a crack or other damage to the capacitor.

EGKRC01A

2 / 20

Reference only

Caution

Soldering and Mounting

1. Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing

or bending the printed circuit board.

1-1. Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.

[Component Direction]

Locate chip horizontal to the direction in which stress acts.

[Chip Mounting Close to Board Separation Point]

It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all

of the following three measures; however, implement as many measures as possible to reduce stress.

Contents of Measures

(1) Turn the mounting direction of the component parallel

(1) to the board separation surface.

Stress Level

A>D

Perforation

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away

(3) from the board separation surface.

A>B

Slit

A>C

[Mounting Capacitors Near Screw Holes]

When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.

Screw Hole Recommended

2. Information before Mounting

1. Do not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the solderability of capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7. The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.

3. Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum

to prevent them from any bending damage or cracking. Please take into account the following precautions and

recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.

EGKRC01A

3 / 20

Reference only

Caution

2. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving

moving smoothly. This imposes greater force upon the chip during mounting, causing cracked chips. Also, the locating

claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips.

The suction nozzle and the locating claw must be maintained, checked, and replaced periodically.

4-1. Reflow Soldering

[Standard Conditions for Reflow Soldering]

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes deformation

inside the components. In order to prevent mechanical damage

to the components, preheating is required for both the

components and the PCB. Preheating conditions are shown

in table 1. It is required to keep the temperature differential

between the solder and the components surface (ΔT)

as small as possible.

Reflow

Temperature (Υ)

Soldering

Peak Temperature

Gradual

Cooling

220Υ(200Υ)

Δ㹒

190Υ(170Υ)

170Υ(150Υ)

150Υ(130Υ)

Preheating

2. Solderability of tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of tin

is used. Please confirm the solderability of tin plated

termination chips before use.

Time

60 to 120 seconds 30 to 60 seconds

Temperature

Incase of Lead Free Solder

( ): In case of Pb-Sn Solder

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT) between

the component and the solvent within the range shown in table 1.

Vapor Reflow

Temperature (Υ)

Soldering

Peak Temperature

Gradual

Cooling

Table 1

Δ㹒

190Υ(170Υ)

170Υ(150Υ)

Part Number

K䕕䕕21 / K䕕䕕31

K䕕䕕55

Temperature Differential

ΔT䍺190°C

150Υ(130Υ)

Preheating

ΔT䍺130°C

Recommended Conditions

Pb-Sn Solder

Time

60 to 120 seconds 20 seconds max.

Lead Free

Solder

Reflow

Vapor Reflow

230 to 240°C

Peak Temperature 230 to 250°C

240 to 260°C

Air or N2

[Allowable Reflow Soldering Temperature and Time]

280

Saturated vapor

of inactive solvent

Atmosphere

Air

Pb-Sn Solder: Sn-37Pb

270

260

250

Lead Free Solder: Sn-3.0Ag-0.5Cu

240

230

220

120

Soldering Time (sec.)

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

4. Optimum Solder Amount for Reflow Soldering

4-1. If solder paste is excessive, solder between a chip and a

metal terminal melts. This causes the chip to move and

come off.

The level of

the bottom of the chip

0.3 mm min. and

4-2. If solder paste is too little, it causes a lack of adhesive

strength on the metal terminal and the capacitor comes off.

4-3. Please make sure that solder is smoothly applied higher

than 0.3mm and lower than the level of the bottom of the

chip.

lower than the level of

the bottom of the chip

In section

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to the PCB.

4-2. Flow Soldering

1. Do not apply flow soldering.

EGKRC01A

4 / 20

Reference only

Caution

4-3. Correction of Soldered Portion

1. For the shape of the soldering iron tip, refer to the figure

on the right.

2. Regarding the type of solder, use a wire diameter of

φ0.5mm or less (rosin core wire solder).

3. Apply the tip of the soldering iron against the lower end

of the metal terminal.

(1) In order to prevent cracking caused by sudden heating

of the ceramic device, do not touch the ceramic base

directly.

(2) In order to prevent deviations and dislocating of the

chip, do not touch the junction of the chip and the metal

terminal, and the metal portion on the outside directly.

4. The amount of solder for corrections by soldering iron,

should be lower than the level of the bottom of the chip.

The level of

the bottom of the chip

Solder amount

In section

5. Washing

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken

solder joints. Take note not to vibrate PCBs.

6. Electrical Test on Printed Circuit Board

1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a capacitor after

mounting on the printed circuit board.

1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc. The thrusting force of the test probe can

flex the PCB, resulting in cracked chips or open solder joints. Provide backup pins on the back side of the PCB

to prevent warping or flexing. Install backup pins as close to the capacitor as possible.

1-2. Avoid vibration of the board by shock when a test-probe contacts a printed circuit board.

[Not Recommended]

[Recommended]

Backup Pin

Peeling

Test-probe

7. Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that causes bending

or twisting the board.

1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack. Cracked capacitors may cause

deterioration of the insulation resistance, and result in a short. Avoid this type of stress to a capacitor.

[Bending]

[Twisting]

EGKRC01A

5 / 20

Reference only

Caution

2. Check the cropping method for the printed circuit board in advance.

2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disk separator, router type separator,

etc.) to prevent the mechanical stress that can occur to the board.

Board Separation Apparatus

Hand Separation

Nipper Separation

Board Separation Method

(1) Board Separation Jig

(2) Disk Separator

(3) Router Type Separator

Level of stress on board

Recommended

High

Medium

Low

· Board handling

Hand and nipper separation

apply a high level of stress.

Use another method.

· Board handling

· Board bending direction

· Layout of capacitors

· Layout of slits

Notes

· Design of V groove

· Arrangement of blades

· Controlling blade life

Board handling

* When a board separation jig or disk separator is used, if the following precautions are not observed,

a large board deflection stress will occur and the capacitors may crack. Use router type separator if at all possible.

(1) Example of a suitable jig

[In the case of Single-side Mounting]

An outline of the board separation jig is shown as follows. Recommended example: Stress on the component

mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards

the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the

capacitors increases due to large stress being applied to the component mounting position, if the portion away

from the jig is held and bent in the direction opposite the side where the capacitors are mounted.

Recommended

Not Recommended

[Outline of Jig]

[In the case of Double-sided Mounting]

Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the

above method. Therefore, implement the following measures to prevent stress from being applied to the components.

(Measures)

ձ Consider introducing a router type separator. If it is difficult to introduce a router type separator, implement

the following measures. (Refer to item 1. Mounting Position)

ղ Mount the components at a right angle to the board separation surface.

ճ When mounting components near the board separation point, add slits in the separation position

near the component.

մ Keep the mounting position of the components away from the board separation point.

(2) Example of a Disk Separator

An outline of a disk separator is shown as follows. As shown in the Principle of Operation, the top blade and bottom

blade are aligned with the V-grooves on the printed circuit board to separate the board. In the following case, board

deflection stress will be applied and cause cracks in the capacitors.

ձ When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom, left-right

or front-rear directions

ղ The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned

top-bottom IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of

the V groove with consideration about strength of material of the printed circuit board.

[Outline of Machine]

[Principle of Operation]

[Cross-section Diagram]

EGKRC01A

6 / 20

Reference only

Caution

Not Recommended

Left-right Misalignment

Recommended

Top-bottom Misalignment

Front-rear Misalignment

Top Blade

Bottom Blade

Not Recommended

Example of Recommended

V-groove Design

Left-right Misalignment

Low-Angle

Depth too Shallow

Depth too Deep

(3) Example of Router Type Separator

The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the

cutting process, stress on the board can be suppressed during board separation. When attaching or removing

boards to/from the router type separator, carefully handle the boards to prevent bending.

[Outline Drawing]

Router

8. Assembly

1. Handling

If a board mounted with capacitors is held with one hand, the board may bend. Firmly hold the edges of the board with

both hands when handling. If a board mounted with capacitors is dropped, cracks may occur in the capacitors.

Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.

2. Attachment of Other Components

2-1. Mounting of Other Components

Pay attention to the following items, when mounting other

components on the back side of the board after capacitors

have been mounted on the opposite side. When the bottom

dead point of the suction nozzle is set too low, board deflection

stress may be applied to the capacitors on the back side

Suction Nozzle

(bottom side), and cracks may occur in the capacitors.

䞉 After the board is straightened, set the bottom dead point

of the nozzle on the upper surface of the board.

䞉 Periodically check and adjust the bottom dead point.

2-2. Inserting Components with Leads into Boards

When inserting components (transformers, IC, etc.) into boards,

bending the board may cause cracks in the capacitors or

cracks in the solder. Pay attention to the following.

࣭

Increase the size of the holes to insert the leads, to reduce

the stress on the board during insertion.

࣭

Fix the board with backup pins or a dedicated jig before

Component with Leads

insertion.

࣭

Support below the board so that the board does not bend.

When using multiple backup pins on the board, periodically

confirm that there is no difference in the height of each

backup pin.

EGKRC01A

7 / 20

Reference only

Caution

2-3. Attaching/Removing Sockets

When the board itself is a connector, the board may bend when

a socket is attached or removed. Plan the work so that the board

does not bend when a socket is attached or removed.

Socket

2-4. Tightening Screws

The board may be bent, when tightening screws, etc. during the

attachment of the board to a shield or chassis.

Pay attention to the following items before performing the work.

࣭

Plan the work to prevent the board from bending.

࣭

Use a torque screwdriver, to prevent over-tightening of the

screws.

Screwdriver

࣭

The board may bend after mounting by reflow soldering, etc.

Please note, as stress may be applied to the chips by forcibly

flattening the board when tightening the screws.

Other

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.

1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not

expose a capacitor to a conductive liquid, including any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will operate is under the specified conditions. Do not use

the equipment under the following environments.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to ozone, ultraviolet rays, or radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas, etc.)

(5) Any vibrations or mechanical shocks exceeding the specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.

2. Other

2-1. In an Emergency

(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment. If the

equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.

(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be

caused by the capacitor's high temperature.

2-2. Disposal of Waste

When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate

licenses.

2-3. Circuit Design

(1) Addition of Fail Safe Function

Capacitors that are cracked by dropping or bending of the board may cause deterioration of the insulation

resistance, and result in a short. If the circuit being used may cause an electrical shock, smoke or fire when

a capacitor is shorted, be sure to install fail-safe functions, such as a fuse, to prevent secondary accidents.

(2) Capacitors used to prevent electromagnetic interference in the primary AC side circuit, or as a

connection/insulation, must be a safety standard certified product, or satisfy the contents stipulated

in the Electrical Appliance and Material Safety Law. Install a fuse for each line in case of a short.

(3) The KR3, KRM, KC3, KCM series are not safety standard certified products.

2-4. Remarks

Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.

The above notices are for standard applications and conditions. Contact us when the products are used

in special mounting conditions. Select optimum conditions for operation as they determine the reliability of

the product after assembly. The data herein are given in typical values, not guaranteed ratings.

3. Limitation of applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party’s life, body or property.

(1) Aircraft equipment

(5) Medical equipment

(2) Aerospace equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(3) Undersea equipment

(4) Power plant control equipment

(7) Traffic signal equipment

(8) Disaster prevention/crime prevention equipment

(9) Data-processing equipment exerting influence on public

(10) Application of similar complexity and/or reliability requirements to the applications listed in the above.

EGKRC01A

8 / 20

Reference only

Notice

Rating

1. Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1. Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with

a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider

the temperature distribution in equipment and the seasonal temperature variable factor.

1-2. Consider the self-heating factor of the capacitor. The surface temperature of the capacitor shall be the upper

operating temperature or less when including the self-heating factors.

2. Atmosphere Surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion

of the terminations and the penetration of moisture into the capacitor.

1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject

to moisture condensation.

1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal

electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents

for long periods of time.

3. Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates at specific frequencies

and noise may be generated. Moreover, when the mechanical vibration or shock is added to the capacitor, noise may occur.

Soldering and Mounting

1. PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly

on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these tresses and cause chip cracking. When designing substrates,

take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height.

1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is

different depending on PCB material and structure. When the thermal expansion coefficient greatly differs between

the board used for mounting and the chip, it will cause cracking of the chip due to the thermal expansion and

contraction. When small size capacitors of 1005 size or less are mounted on a single-layered glass epoxy board,

it will also cause cracking of the chip for the same reason.

Pattern Forms

Prohibited

Correct

Chassis

Solder Resist

Solder(ground)

Placing Close to Chassis

Electrode Pattern

Lead Wire

Solder Resist

Placing

of Chip Components

and Leaded Components

Soldering Iron

Lead Wire

Solder Resist

Placing

of Leaded Components

after Chip Component

Solder Resist

Lateral Mounting

EGKRC01A

9 / 20

Reference only

Notice

2. Land Dimensions

2-1. Chip capacitors can be cracked due to the stress of PCB

bending, etc. if the land area is larger than needed and

has an excess amount of solder. Please refer to the land

dimensions in the following table for reflow soldering.

Please confirm the suitable land dimension by evaluating

of the actual SET / PCB.

Unit䠖㼙㼙

Dimensions

Chip (L×W)

Part Number

K䕕䕕21

K䕕䕕31

K䕕䕕55

2.0×1.25

3.2×1.6

5.7×5.0

1.0 to 1.2

2.2 to 2.4

2.6

0.6 to 0.7

0.8 to 0.9

2.7

0.8 to 1.1

1.0 to 1.4

5.6

3. Board Design

When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size

and material of the board.

Relationship with amount of strain to the board thickness, length, width, etc.]

3PL

Relationship between load and strain

ε=

2Ewh²

ε㸸Strain on center of board (μst)

L㸸Distance between supporting points (mm)

㸸Board width (mm)

㸸Board thickness (mm)

㸸Elastic modulus of board (N/m²=Pa)

㸸Deflection (mm)

㸸Load (N)

When the load is constant, the following relationship can be established.

· As the distance between the supporting points (L) increases,the amount of strain also increases.

→Reduce the distance between the supporting points.

· As the elastic modulus (E) decreases, the amount of strain increases.

→Increase the elastic modulus.

As the board width (w) decreases, the amount of strain increases.

→Increase the width of the board.

As the board thickness (h) decreases, the amount of strain increases.

→Increase the thickness of the board.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.

4. Washing

1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality, and select the

solvent for cleaning.

2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of electrical

characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or insufficient) may result in deterioration of the performance of the capacitors.

5. Coating

1. A crack may be cause in the capacitor due to the stress of the thermal contraction of the resin during curing process. The

stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction. The difference

in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor may cause the

destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration of insulation

resistance or dielectric breakdown. Select a resin for which the thermal expansion coefficient is as close to that of the

capacitor as possible. A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic. Using hygroscopic resins under high humidity conditions may cause

the deterioration of the insulation resistance of a capacitor. An epoxy resin can be used as a less hygroscopic resin.

EGKRC01A

10 / 20

Reference only

Notice

Other

1. Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

1-1. The capacitors shall be protected against excessive temperature, humidity, and mechanical force during

transportation.

(1) Climatic condition

࣭

low air temperature : -40䉝

࣭

change of temperature air/air : -25䉝/+25䉝

࣭

low air pressure : 30kPa

࣭

change of air pressure : 6kPa/min.

(2) Mechanical condition

Transportation shall be done in such a way that the boxes are not deformed and forced are not directly passed

on to the inner packaging.

1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.

(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur

in the ceramic body of the capacitor.

(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface

of the capacitor, the capacitor may crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was applied by dropping, etc. A capacitor dropped accidentally

during processing may be damaged.

2. Characteristics Evaluation in the Actual System

1. Evaluate the capacitor in the actual system, to confirm that there is no problem with the performance and specification

values in a finished product before using.

2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic

capacitors, the capacitance may change depending on the operating conditions in the actual system. Therefore,

be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity, which will affect

the capacitance value of the capacitor.

3. In addition, voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in the actual

system. Evaluate the surge resistance in the actual system as required.

Note

1. Please make sure that your product has been evaluated in view of your specifications with our product being mounted

to your product.

2. You are requested not to use our product deviating from this specification.

EGKRC01A

11 / 20

Reference only

1. Application

This specification is applied to High Effective Capacitance & High Allowable Ripple Current Metal

Terminal Type Multilayer Ceramic Capacitors for General Electronics equipment KR3 series.

Do not use these products in any automotive power train or safety equipment including battery

chargers for electric vehicles and plug-in hybrids.

2. Rating

2-1. Operating temperature range

-55 to +125°C

2-2. Part name configuration

ex.) KR3 55

Series Chip Dimension Temperature Rated Capacitance Capacitance Individual Package

225

H01

Dimension

(T) Characteristics Voltage

Tolerance Specification

(LW)

•Chip Dimension (LW)

Code

Chip Dimension (mm)

5.7

5.0

•Dimension (T)

Code

Dimension (mm)

2.8

3.7

4.8

6.4

Please refer to [Part number list] on the dimensions of metal terminal product.

•Temperature Characteristics

Code

Temperature Characteristics

X7T

Please confirm detailed specification on [Specification and test methods].

•Rated Voltage

Code

Rated Voltage

DC250V

DC450V

DC630V

•Capacitance

The first two digits denote significant figures ; the last digit denotes the multiplier of 10 in pF.

Ex.) In case 225.

2210⁵= 2200000pF(=2.2F)

•Capacitance Tolerance

Please refer to [Part number list].

•Individual Specification

Murata’s control code

Please refer to  Part number list .

•Package

Code

Package

330mm reel Plastic taping

ETKR35501B

12 / 20

Reference only

3. Part number list

Unit : mm

Dimension(mm)

Cap.

tol.

(%)

Pack

Chip

Cap.

(F)

Rated

Volt.

(V)

T.C.

Customer Part Number

Murata Part Number

qty.

type

(pcs)

6.1

±0.4

5.3

±0.2

2.8

±0.2 ±0.2

1.2

X7T

250

450

0.47

0.56

0.68

1.0

±10

±20

±10

±20

KR355LD72E474KH01K

KR355LD72E564KH01K

KR355LD72E684KH01K

KR355QD72E105KH01K

KR355TD72E155MH01K

KR355WD72E225MH01K

KR355LD72W224KH01K

KR355LD72W334KH01K

KR355LD72W474KH01K

KR355QD72W564KH01K

KR355TD72W684MH01K

KR355TD72W105MH01K

KR355WD72W125MH01K

2000

1000

500

6.1

5.3

±0.2

2.8

±0.2 ±0.2

1.2

±0.4

6.1

5.3

±0.2

2.8

±0.2 ±0.2

1.2

±0.4

6.1

5.3

±0.2

3.7

±0.2 ±0.2

1.2

±0.4

6.1

5.3

±0.2

4.8

±0.2 ±0.2

1.2

1.5

±0.4

6.1

5.3

±0.2

6.4

±0.3 ±0.2

1.2

2.2

±0.4

6.1

5.3

±0.2

2.8

±0.2 ±0.2

1.2

0.22

0.33

0.47

0.56

0.68

1.0

2000

1000

500

±0.4

6.1

5.3

±0.2

2.8

±0.2 ±0.2

1.2

±0.4

6.1

5.3

±0.2

2.8

±0.2 ±0.2

1.2

±0.4

6.1

5.3

±0.2

3.7

±0.2 ±0.2

1.2

±0.4

6.1

5.3

±0.2

4.8

±0.2 ±0.2

1.2

±0.4

6.1

5.3

±0.2

4.8

±0.2 ±0.2

1.2

±0.4

6.1

5.3

±0.2

6.4

±0.3 ±0.2

1.2

±0.4

ETKR35501B

13 / 20

Reference only

Unit : mm

Dimension(mm)

Rated

Volt.

(V)

Cap.

tol.

(%)

Pack

Chip

Cap.

(F)

T.C.

Customer Part Number

Murata Part Number

qty.

type

(pcs)

6.1

±0.4

5.3

±0.2

2.8

±0.2 ±0.2

1.2

X7T

630

0.10

0.15

0.22

0.27

0.47

0.56

±10

±20

KR355LD72J104KH01K

KR355LD72J154KH01K

KR355QD72J224KH01K

KR355QD72J274KH01K

KR355WD72J474MH01K

KR355WD72J564MH01K

2000

1000

500

6.1

5.3

±0.2

2.8

±0.2 ± 0.2

1.2

±0.4

6.1

5.3

±0.2

3.7

±0.2 ±0.2

1.2

±0.4

6.1

5.3

±0.2

3.7

±0.2 ±0.2

1.2

±0.4

6.1

5.3

±0.2

6.4

±0.3 ±0.2

1.2

±0.4

6.1

±0.4

5.3

±0.2

6.4

±0.3 ±0.2

1.2

500

ETKR35501B

14 / 20

Reference only

4. Specifications and test methods

No.

Item

Operating temperature

Appearance

Specifications

-55 to +125°C

No defects or abnormalities

Within the specified dimension.

No defects or abnormalities.

Test method

Visual inspection.

Dimensions

Using calipers and micrometers.

Dielectric strength

No failure should be observed when voltage in

the table is applied between the

terminations for 1 to 5 s, provided the

charge/discharge current is less than 50mA.

Rated Voltage

Test Voltage

DC250V

DC450V

DC630V

200% of the rated voltage

150% of the rated voltage

120% of the rated voltage

Insulation resistance(I.R.)

More than 10,000 M or

100 MF

(Whichever is smaller)

The insulation resistance should be

measured with DC500±50V(DC250±25V in

case of rated voltage: DC250V, DC450V) and

within 60±5 s of charging.

Capacitance

Within the specified tolerance.

0.01 max.

Capacitance should be measured at the

frequency of 1±0.2kHz and a voltage of

AC1.0±0.2V(r.m.s.).

Dissipation Factor (D.F.)

D.F. should be measured at the frequency of

1±0.2kHz and a voltage of

AC1.0±0.2V(r.m.s.).

Capacitance

Temperature Characteristics

Within +22/-33%

The capacitance measurement should be

made at each step specified in the table.

•Pretreatment

(Temp.Range:-55 to +125°C)

Perform the heat treatment at 150+0/-10°C

for 60±5 min and then let sit for 24±2 h at

room condition*.

Step

Min. Operating Temp.

Max. Operating Temp.

Temp.(C)

252

3

2

Vibration

resistance

Appearance No defects or abnormalities.

Capacitance Within the specified tolerance.

Solder the capacitor to the Test Jig A (glass

epoxy board) shown in “Complement of test

method”.

The capacitor should be subjected to a

simple harmonic motion having a total

amplitude of 1.5mm, the frequency being

varied uniformly between the approximate

limits of 10 and 55Hz .

D.F.

Pass the item No.7.

The frequency range, from 10 to 55Hz and

return to 10Hz, should be traversed in

approximately 1 min.

This motion should be applied for a period of

2 h in each of 3 mutually perpendicular

directions (total of 6 h).

10 Solderability of

termination

The metal surface is soldered well.

Reflow Soldering : Peak 260+0/-5C

The area of soldering 230C min., 20 to 40 s

Let sit for 24±2 h at room condition*, then

measure.

•Pretreatment

Perform the heat treatment at 150+0/-10°C

for 60±5 min and then let sit for 24±2 h at

room condition*.

260+0/-5°C

300°C

20 to 40 s

230°C

min.

200°C

100°C

180°C

150°C

60 to 120 s

* "room condition" Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

ESKR35501A

15 / 20

Reference only

No.

Item

Specifications

Appearance No marking defects.

Capacitance Within ±10%

change

Test method

Reflow Soldering

･See Item 10 Solderability of termination

11 Resistance to

soldering heat

D.F.

Pass the item No.7.

Pass the item No.5.

Pass the item No.4.

In a soldering iron case

Temp. of solder : 350±10C

Solder time : 4+1/-0 s

Let sit for 24±2 h at room condition*, then

measure.

I.R.

Dielectric

strength

Please refer to ｢

Caution 4-3. Correction

of Soldered Portion｣

12 Adhesive strength

of termination

No removal of the terminations

or other defects should occur.

Solder the capacitor to the Test Jig A (glass

epoxy board) shown in “Complement of Test

method”.

Then apply 10N force in the direction of the

arrow.

10N ,10±1 s

Glass Epoxy Board

13 Deflection

No marking defects.

Solder the capacitor to the Test Jig B(glass

epoxy board) shown in “Complement of test

method”.

Then apply the force in the direction shown in

“Test Method of Deflection” of “Complement

of test method”.

･Flexure : 5mm

･Hold time : 5 s

Termination not to be broken or

loosened.

A static load

of 10N using

a pressure

Strength of metal terminal

Pressure

jig

Pressure

jig should be

applied to the

center in the

direction of the

arrow and held

for 10 s.

15 Temperature

cycle

Appearance No marking defects.

Capacitance Within ±7.5%

change

Fix the capacitor to the supporting Test Jig A

(glass epoxy board) shown in “Complement

of test method”.

Perform the 100 cycles according to the 4

heat treatments listed the following table.

D.F.

Pass the item No.7.

Pass the item No.5.

Pass the item No.4.

I.R.

Dielectric

Step

Temp.

(°C)

Time

(min)

30±3

2 to 3

30±3

2 to 3

strength

Min. Operating Temp. ±3

Room Temp.

Max. Operating Temp. ±2

Room Temp.

Let sit for 24±2 h at room condition*, then

measure.

•Pretreatment

Perform the heat treatment at 150+0/-10°C

for 60±5 min and then let sit for 24±2 h at

room condition*.

16 Humidity

(Steady state)

Appearance No marking defects.

Capacitance Within ±12.5%

change

Sit the capacitor at 40±2°C and relative

humidity 90 to 95% for 500+24/-0 h.

Remove and let sit for 24±2 h at room

condition*, then measure.

D.F.

I.R.

0.02 max.

•Pretreatment

More than 1,000 M or

Perform the heat treatment at 150+0/-10°C

for 60±5 min and then let sit for 24±2 h at

room condition*.

10 MF

(Whichever is smaller)

Pass the item No.4.

Dielectric

strength

* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

ESKR35501A

16 / 20

Reference only

No.

17 Life

Item

Specifications

Appearance No marking defects.

Capacitance Within ±12.5%

Test method

Apply voltage as in the table for 1000+48/-0 h

at maximum operating temperature±3°C.

Remove and let sit for 24±2 h at room

condition*, then measure.

change

D.F.

I.R.

0.02 max.

More than 1,000 M or

Rated Voltage

DC250V

DC450V

Applied Voltage

10 MF

150% of the rated voltage

130% of the rated voltage

120% of the rated voltage

(Whichever is smaller)

Pass the item No.4.

Dielectric

strength

DC630V

The charge/discharge current is less than

50mA.

•Pretreatment

Apply test voltage for 60±5 min at test

temperature.

* “room condition” Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa

ESKR35501A

17 / 20

Reference only

Complement of Test Method

Test Jig

The test jig should be Jig A or Jig B as described in “Specifications and Test methods”.

The specimen should be soldered by the conditions as described below.

Soldering Method : Reflow soldering

Thickness of Metal-mask : 200µm

Solder : Sn-3.0Ag-0.5Cu

(1) Test Jig A

Dimension (mm)

2.6

8.0

5.6

Solder resist

Baked electrode or copper foil

Material : Glass Epoxy Board

Thickness : 1.6mm

Thickness of copper foil : 0.035mm

(2) Test Jig B

Dimension (mm)

2.6

8.0

5.6

1.0

(4.5)

1.6

100

Copper foil

Solder resist

(unit : mm)

Material : Glass Epoxy Board

Thickness of copper foil : 0.035mm

ESKR35501A

18 / 20

Reference only

5. Packing (Taping is standard packing method)

(1) Appearance of taping

(a) Plastic Tape

Cover Tape (Thickness: Around 60µm) is put on capacitor on Base Tape (Blister carrier Tape).

(b) The sprocket holes are to the right as the Tape is pulled toward the user.

(2) Packed capacitors

Capacitor

(3) Dimensions of Tape

(a) Height dimension code : L, Q, R, T

2.0±0.05

φ1.5+0.1/-0

8.0±0.1

0.4±0.1

4.0±0.1

•

C max.

Nominal value

Part Number

K□□55L

5.5

6.4

4.1

K□□55Q

K□□55R

K□□55T

5.5

6.4

5.8

(Unit : mm)

(b) Height dimension code : V, W

2.0±0.1

φ1.5+0.1/-0

12.0±0.1

4.0±0.1

0.4±0.1

•

C max.

Nominal value

Part Number

K□□55V

5.7

6.7

7.4

K□□55W

(Unit : mm)

EKTK5503

19 / 20

Reference only

(4) Dimensions of Reel

(a) Height dimension code : L, Q, R, T

17.5±1.5

2.0±0.5

φ21±0.8

330±2.0

φ13±0.2

13.5±1.0

21.5±1.0

(Unit : mm)

(b) Height dimension code : V, W

2.0±0.5

φ21±0.8

330±2.0

φ13±0.2

17.5±1.0

(Unit : mm)

(5) Part of the leader and part of the empty tape should be attached to the end of the tape as follows.

Vacant section : 160 min.

210 min.

Capacitors mounting unit

Vacant section : 190 min.

Direction of feed

(Unit : mm)

(6) The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of

5 pitches.

(7) Missing capacitors number within 0.1% of the number per reel or 1pc, whichever is greater, and not

continuous

(8) The top tape or cover tape and bottom tape should not protrude beyond the edges of the tape and

should not cover sprocket holes.

(9) Cumulative tolerance of sprocket holes, 10 pitches : ±0.3mm.

(10) Peeling off force : 0.1 to 0.6N in the direction shown on the follows.

165 to 180°

Top Tape or Cover Tape

Base Tape

EKTK5503

20 / 20

KR355LD72J104KH01# [MURATA]

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