LBEE5HY1MW [MURATA]
W-LANBluetooth Combo Module Data Sheet;
| 型号： | LBEE5HY1MW |
| 厂家： | 
muRata |
| 描述： | W-LANBluetooth Combo Module Data Sheet 局域网 |
| 文件： | 总62页 (文件大小：2334K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary Specification Number : SP-HY1MW-O
W-LAN+Bluetooth Combo Module Data Sheet
Cypress Chipset
for 802.11a/b/g/n/ac + Bluetooth 5.0
Tentative P/N : LBEE5HY1MW-TEMP
Preliminary
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Preliminary Specification Number: SP-HY1MW-O
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The revision history of the product specification
Revised No. Revised Date
Note
-
A
2016.10.03
2017.04.26
Initial Release
Changed BT version
1.SCOPE
2.KEY FEATURE
10.7.DC/RF Characteristics for Bluetooth
10.8. DC/RF Characteristics for Bluetooth（LE）
2. Key Feature : Changed IC vendor name
4. Operating condition : corrected
8. Digital I/O Requirements : Added
10.Electrical characteristics : Corrected
12. Reference Circuit : Added
B
C
2017.05.19
2017.08.02
Modify Bluetooth Specification Version
D
E
F
2017.08.04
2017.08.17
2017.09.04
10. Finalize WLAN TBD Spec value
12. Corrected Reference circuit
10.2.1. Low Rate Condition for IEEE802.11g - 2.4GHz
Corrected Power Levels
G
2018.01.10
4. Operating condition : Changed VBAT min voltage
10.Electrical characteristic : Changed output power setting
10.Electrical characteristic : Updated
10.Electrical characteristic : Corrected
3. Certification information : Added
H
I
J
2018.04.17
2018.04.23
2018.06.13
APPENDIX : Added
K
L
2018.11.29
2018.12.28
Modify Bluetooth Specification Version : 4.2 to 5.0
Revised
12.
REFERENCE
CIRCUIT/14.5.
Soldering
conditions/14.6. Cleaning
M
N
2019.02.28
2019.05.16
Corrected 3.2 Europe certification information
3.2 Bluetooth® Qualification: Added
16. PRECONDITION TO USE OUR PRODUCTS: Updated
Appendix : Added User manual for Japan certification
5.OPERATING CONDITION : uploaded Temperature Range to
“-30~85”
O
2020.03.19
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TABLE OF CONTENTS
1. SCOPE..................................................................................................................................................... 4
2. KEY FEATURE ...................................................................................................................................... 4
2.1. Block Diagram.......................................................................................................................... 4
2.2. Ordering Information............................................................................................................... 4
2.3. RoHS Compliance..................................................................................................................... 4
3. Certification Information ....................................................................................................................... 5
3.1. Radio Certification ................................................................................................................... 5
USA/Canada ........................................................................................................................................ 5
Europe.................................................................................................................................................. 5
Japan.................................................................................................................................................... 5
3.2. Bluetooth® Qualification.......................................................................................................... 5
4. ABSOLUTE MAXIMUM RATINGS...................................................................................................... 5
5. OPERATING CONDITION ................................................................................................................... 5
6. External LPO Signal Requirement ....................................................................................................... 5
7. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS................................................. 6
7.1. Dimensions ............................................................................................................................... 6
7.2. Pin Layout................................................................................................................................. 7
7.3. Module PIN Descriptions......................................................................................................... 8
8. POWER ON SEQUENCE .................................................................................................................... 10
8.1. Power On Sequence for WLAN ON and BT ON .................................................................. 10
8.2. Power On Sequence for WLAN ON and BT Off................................................................... 10
8.3. Power On Sequence for WLAN OFF and BT ON..................................................................11
8.4. Power On Sequence for WLAN OFF and BT OFF................................................................11
9. Digital I/O Requirements..................................................................................................................... 12
10.
10.1.
10.2.
10.2.1.
INTERFACE TIMING AND AC CHARACTERISTICS ................................................................. 13
Bluetooth UART Timing .................................................................................................... 13
Bluetooth PCM Interface Timing ...................................................................................... 13
Short Frame Sync, Master Mode ............................................................................... 13
Short Frame Sync, Slave Mode .................................................................................. 14
Long Frame Sync, Master Mode ................................................................................ 14
Long Frame Sync, Slave Mode................................................................................... 15
Short Frame Sync, Burst Mode.................................................................................. 16
Long Frame Sync, Burst Mode................................................................................... 17
I2S Timing ........................................................................................................................... 18
I2S Transmitter Timing............................................................................................... 19
I2S Receiver Timing..................................................................................................... 19
WLAN SDIO Timing .......................................................................................................... 20
SDIO Default Mode Timing........................................................................................ 20
SDIO High-Speed Mode Timing................................................................................. 21
SDIO BUS Timing Specifications in SDR Modes ..................................................... 21
SDIO Timing Specifications in DDR50 Mode............................................................ 24
10.2.2.
10.2.3.
10.2.4.
10.2.5.
10.2.6.
10.3.
10.3.1.
10.3.2.
10.5.
10.5.1.
10.5.2.
10.5.3.
10.5.4.
11.
ELECTRICAL CHARACTERISTICS.............................................................................................. 26
11.1.
DC/RF Characteristics for IEEE802.11b - 2.4GHz .......................................................... 26
High Rate Condition for IEEE802.11b – 2.4GHz...................................................... 26
Low Rate Condition for IEEE802.11b – 2.4GHz....................................................... 27
DC/RF Characteristics for IEEE802.11g - 2.4GHz .......................................................... 28
High Rate Condition for IEEE802.11g – 2.4GHz...................................................... 28
Low Rate Condition for IEEE802.11g – 2.4GHz....................................................... 29
DC/RF Characteristics for IEEE802.11n - 2.4GHz.......................................................... 30
High Rate Condition for IEEE802.11n – 2.4GHz ..................................................... 30
Low Rate Condition for IEEE802.11n – 2.4GHz....................................................... 31
DC/RF Characteristics for IEEE802.11a - 5GHz ............................................................. 32
High Rate Condition for IEEE802.11a – 5GHz......................................................... 32
Low Rate Condition for IEEE802.11a – 5GHz.......................................................... 33
11.1.1.
11.1.2.
11.2.
11.2.1.
11.2.2.
11.3.
11.3.1.
11.3.2.
11.4.
11.4.1.
11.4.2.
Preliminary
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11.5.
11.5.1.
11.5.2.
11.6.
11.6.1.
11.6.2.
11.7.
DC/RF Characteristics for IEEE802.11n(HT 40MHz) - 5GHz........................................ 34
High Rate Condition for IEEE802.11n(HT 40MHz) – 5GHz ................................... 34
Low Rate Condition for IEEE802.11n(HT 40MHz) – 5GHz..................................... 35
DC/RF Characteristics for IEEE802.11ac (VHT 80MHz)-5GHz..................................... 36
High Rate Condition for IEEE802.11ac(VHT 80MHz) – 5GHz ............................... 36
Low Rate Condition for IEEE802.11ac(VHT 80MHz) – 5GHz................................. 37
DC/RF Characteristics for Bluetooth................................................................................ 38
DC/RF Characteristics for Bluetooth（LE）.................................................................... 39
11.8.
12.
13.
14.
15.
LAND PATTERN (TOP VIEW)........................................................................................................ 40
REFERENCE CIRCUIT................................................................................................................... 41
TAPE AND REEL PACKING........................................................................................................... 42
NOTICE............................................................................................................................................. 45
15.1.
15.2.
Storage Conditions: ............................................................................................................ 45
Handling Conditions: ......................................................................................................... 45
Standard PCB Design (Land Pattern and Dimensions):................................................. 45
Notice for Chip Placer: ....................................................................................................... 45
Soldering Conditions: ......................................................................................................... 46
Cleaning: ............................................................................................................................. 46
Operational Environment Conditions:.............................................................................. 46
Input Power Capacity:........................................................................................................ 47
15.3.
15.4.
15.5.
15.6.
15.7.
15.8.
16.
PRECONDITION TO USE OUR PRODUCTS ............................................................................... 48
Please be aware that an important notice concerning availability, standard warranty and use in critical
applications of Murata products and disclaimers thereto appears at the end of this specification sheet.
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1. SCOPE
This specification is applied to the IEEE802.11a/b/g/n/ac W-LAN + Bluetooth 5.0 combo module.
2. KEY FEATURE
- Cypress CYW43455 inside
- Compliant with IEEE802.11a/b/g/n/ac
- Compliant with Bluetooth specification v5.0
- SAW filter inside
- SDIO interface for W-LAN
- Interface support for Bluetooth is Host Controller Interface (HCI)
- Surface mount type 7.9 x 7.3 mm (Typical), H = 1.1 mm (Max)
- Weight : 0.15g
- MSL : 3
2.1.
Block Diagram
LC network
For DCDC
Sleep Clock
CYW43455
5G Tx(WLAN)
5G Rx(WLAN)
VBAT
VIO
DIPLEX
SAW
SDIO
UART
PCM
I2S
2.4G Tx(WLAN/BT)
2.4G Rx(WLAN/BT)
Maching
Type1MW
Ref Clock:37.4MHz
2.2.
2.3.
Ordering Information
Ordering Part Number
LBEE5HY1MW-TEMP
LBEE5HY1MW-TEMP-D
Description
In case of sample order
EVK
RoHS Compliance
This module is compliant with the RoHS directive.
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3. Certification Information
3.1. Radio Certification
USA/Canada
FCC ID : VPYLBEE5HY1MW
IC : 772C-LBEE5HY1MW
*Please follow user/installation manual of Appendix
Country Code: US/0
Europe
EN300328/301893 v2.1.1, EN300440 v2.2.0 conducted test report is prepared.
Country Code: DE/0
Japan
Japanese type certification is prepared.
001-P01220
Country Code: JP/0
*Please follow user manual of Appendix
The each country code are defined by Murata Blob file.
Please ask your contact person from Murata.
3.2. Bluetooth® Qualification
QDID: 118271
4. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature
VBAT
Supply Voltage
VIO
min.
-40
0
max.
85
5.0
3.9
Unit
deg.C
V
V
0
* Stresses in excess of the absolute ratings may cause permanent damage. Functional operation
is not implied under these conditions. Exposure to absolute ratings for extended periods of time
may adversely affect reliability. No damage assuming only one parameter is set at limit at a time
with all other parameters are set within operating condition.
5. OPERATING CONDITION
Parameter
min.
-30
3.2
typ.
25
-
max.
+85
4.2
unit
deg.C
V
Operating Temperature*1
VBAT
Supply Voltage
VIO 1.8V/3.3V
1.62
-
3.63
V
*1 Functionality is guaranteed but specifications require derating at extreme temperatures.
6. External LPO Signal Requirement
Parameter
Nominal input frequency
Frequency accuracy
Duty cycle
External LPO Clock
Unit
kHz
ppm
%
32.768
+/-200
30-70
Input signal amplitude
Signal type
200 - 3300
Square-wave or sine-wave
mVp-p
-
> 100k
< 5
ohm
pF
Input impedance*a
Clock jitter (during initial start-up)
<10,000
ppm
a)When power is applied or switch off.
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7. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS
7.1.
Dimensions
<TOP VIEW>
<BOTTOM VIEW>
L
e6
a3 e7
a4 e8
e9
A
(27)
(38)
b3
c3
(26)
(39)
e5
c2
e4
B
(61)
(66)
(68)
SS1234567
1MW
(71)
(70)
(72)
W
e3
D
(69)
e10
c4
C
m2
(1)
c1
b2
e11
(58)
(53)
m1
(13)
(52)
(12)
Conformal shield
<SIDE VIEW>
e2
e1
a2
a1 b1
T
Marking
Meaning
A
B
C
D
Murata Logo
Inspection Number
Module Type
Pin 1 Marking
(unit : mm)
Dimensions
1.1 max.
1.0 +/- 0.1
0.275 +/- 0.1
1.0 +/- 0.1
0.25 +/- 0.1
0.3 +/- 0.1
0.575 +/- 0.1
0.55 +/- 0.1
0.5 +/- 0.1
Mark
L
a1
a4
b3
c3
e2
e5
e8
e11
Dimensions
7.9 +/- 0.1
0.5 +/- 0.1
0.25 +/- 0.1
0.3 +/- 0.1
0.5 +/- 0.1
0.275 +/- 0.1
0.4 +/- 0.1
0.25 +/- 0.1
0.65 +/- 0.1
Mark
W
a2
b1
c1
Dimensions
7.3 +/- 0.1
0.25 +/- 0.1
0.3 +/- 0.1
0.25 +/- 0.1
0.5 +/- 0.1
0.25 +/- 0.1
0.7 +/- 0.1
0.3 +/- 0.1
0.5 +/- 0.1
Mark
T
a3
b2
c2
e1
e4
e7
e10
m2
c4
e3
e6
e9
m1
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7.2.
Pin Layout
Top View
(38)
(27)
(26
(39)
(66)
(61)
(72)
(69)
(71)
(70)
(68)
(53)
(59)
(58)
(13)
(52)
(1)
(12)
Pin
No.
Pin
No.
Pin
No.
Pin
No.
Description
Description
Description
Description
1
2
3
4
5
6
7
8
9
GPIO_6
19
GND
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
I2S_CLK
55 GND
GPIO_0
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
SDIO_CLK
GND
I2S_WS
56 GND
GPIO_3
GND
57 JTAG_SEL
58 GND
GPIO_5
VBAT_LDO
VBAT_SR
SR_PVSS
VIN_LDO
SR_PVSS
SR_PVSS
SR_VLX
BT_DEV_WAKE
BT_HOST_WAKE
I2S_DI
GPIO_1
59 GND
GPIO_4
60 GND
GPIO_2
NC
61 GND
BT_REG_ON
WL_REG_ON
GND
62 BT_GPIO_4
63 BT_GPIO_3
64 BT_GPIO_2
65 BT_GPIO_5
66 GND
BT_UART_RXD
BT_UART_TXD
BT_UART_RTS_N
BT_UART_CTS_N
GND
10 GND
11 VIO
GND
12 GND
LPO_IN
13 GND
GPIO_7
67 GND
14 SDIO_DATA0
15 SDIO_CMD
16 SDIO_DATA1
17 SDIO_DATA2
18 SDIO_DATA3
BT_PCM_IN
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_CLK
I2S_DO
ANT
68 GND
GND
69 GND
GND
70 GND
GND
71 GND
NC
72 GND
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7.3.
Module PIN Descriptions
Connection to
IC pin name
No.
Pin name
Type
System
Description
1
2
3
4
5
6
7
GPIO_6
GPIO_0
GPIO_3
GPIO_5
GPIO_1
GPIO_4
GPIO_2
I/O
I/O
I/O
I/O
I/O
I/O
I/O
WL
WL
WL
WL
WL
WL
WL
GPIO_6
GPIO_0
GPIO_3
GPIO_5
GPIO_1
GPIO_4
GPIO_2
Programmable GPIO Pin
Programmable GPIO Pin
Programmable GPIO Pin
Programmable GPIO Pin
Programmable GPIO Pin
Programmable GPIO Pin
Programmable GPIO Pin
Used by PMU to power up or power down the internal
CYW43455 regulators used by the BT section. Also,
when deasserted, this pin holds the BT section in reset.
This pin has an internal 200k ohm pull-down resistor that
is enabled by default. It can be disabled through
programming.
8
9
BT_REG_ON
WL_REG_ON
I
I
BT
BT_REG_ON
Used by PMU to power up or power down the internal
CYW43455 regulators used by the WLAN section. Also,
when deasserted, this pin holds the WLAN section in
reset. This pin has an internal 200k ohm pull-down
resistor that is enabled by default. It can be disabled
through programming.
WL
WL_REG_ON
10
11
GND
VIO
-
I
-
-
-
-
VDDIO,
VDDIO_SD,
BT_VDDO
Supply for PMU, BT, WLAN, SDIO.
12
13
14
15
16
17
18
19
20
21
GND
-
-
-
-
-
GND
-
-
-
SDIO_DATA0
SDIO_CMD
SDIO_DATA1
SDIO_DATA2
SDIO_DATA3
GND
I/O
I/O
I/O
I/O
I/O
-
WL
WL
WL
WL
WL
-
SDIO_DATA0
SDIO_CMD
SDIO_DATA1
SDIO_DATA2
SDIO_DATA3
-
SDIO data line 0
SDIO command line
SDIO data line 1
SDIO data line 2
SDIO data line 3
-
SDIO_CLK
GND
I
WL
-
SDIO_CLK
-
SDIO clock input
-
-
22
23
VBAT_LDO
VBAT_SR
I
I
-
-
LDO_VDDBAT5V
SR_VDDBAT5V
Power supply
Power supply
24
25
26
27
28
29
30
SR_PVSS
VIN_LDO
-
I
-
-
-
Connect to GND
LDO input
LDO_VDD1P5
SR_PVSS
-
-
-
Connect to GND
SR_VLX
GND
O
-
-
-
-
SR_VLX
-
CBuck switching regulator output.
-
LPO_IN
I
LPO_IN
External Sleep clock input(32.768kHz)
Strapping option for SDIO I/F voltage
1=1.8V (NC)
0=3.3V (Pull down with 10k ohm resister)
31
32
GPIO_7
I/O
I
WL
BT
GPIO_7
BT_PCM_IN
BT_PCM_IN
PCM data input or SLIMbus transport sensing.
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PCM sync; can be master(output) or slave(input), or
SLIMbus data.
33
BT_PCM_SYNC
I/O
BT
BT_PCM_SYNC
34
35
BT_PCM_OUT
BT_PCM_CLK
O
BT
BT
BT_PCM_OUT
BT_PCM_CLK
PCM data output
PCM or SLIMbus clock; can be master(output) or
slave(input).
I/O
36
37
38
39
40
I2S_DO
I/O
I/O
I/O
-
BT
BT
BT
-
BT_I2S_DO
BT_I2S_CLK
BT_I2S_WS
-
I2S data output
I2S_CLK
I2S_WS
I2S clock, can be master (output) or slave (input).
I2S WS; can be master (output) or slave (input).
GND
-
BT_DEV_WAKE
I
BT
BT_DEV_WAKE
Bluetooth DEV_WAKE
BT_HOST_WA
KE
41
O
BT
BT_HOST_WAKE
Bluetooth HOST_WAKE
42
43
44
I2S_DI
NC
I/O
BT
BT_I2S_DI
I2S data input
-
-
-
-
-
-
-
-
GND
UART serial input. Serial data input for the HCI UART
interface.
UART serial output. Serial data output for the HCI UART
interface.
UART request – to - send. Active - low request - to-send
signal for the HCI UART interface.
UART clear – to - send. Active - low clear – to - send
signal for the HCI UART interface.
45
46
47
48
BT_UART_RXD
BT_UART_TXD
I
BT
BT
BT
BT
BT_ UART_RXD
BT_ UART_TXD
O
O
I
BT_UART_RTS
_N
BT_UART_CTS
_N
BT_ UART_RTS_N
BT_ UART_CTS_N
49
50
51
52
53
54
55
56
GND
ANT
GND
GND
GND
NC
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
I/O
-
-
-
-
-
-
GND
GND
JTAG select. This pin must be connected to ground if
the JTAG/SWD interface is not used. It must be high to
select SWD OR JTAG. When JTAG_SEL=1:
･GPIO_2 is TCK/SWCLK
57
JTAG_SEL
I/O
-
JTAG_SEL
･GPIO_3 is TMS/SWDIO
･GPIO_4 is TDIO
･GPIO_5 is TDO
･GPIO_6 is TRST_L
58
59
GND
-
-
-
-
-
-
GND
-
-
60
GND
-
-
-
-
61
GND
-
-
-
-
62
BT_GPIO_4
BT_GPIO_3
BT_GPIO_2
BT_GPIO_5
GND
I/O
I/O
I/O
I/O
-
BT
BT
BT
BT
-
BT_GPIO_4
BT_GPIO_3
BT_GPIO_2
BT_GPIO_5
-
Bluetooth general-purpose I/O.
Bluetooth general-purpose I/O.
Bluetooth general-purpose I/O.
Bluetooth general-purpose I/O.
-
63
64
65
66-72
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8. POWER ON SEQUENCE
-VBAT should not rise 10%-90%faster than 40 microsecond.
-VBAT should be up before or at the same time as VIO. VIO should NOT be present first or be held high
before VBAT is high.
8.1.
Power On Sequence for WLAN ON and BT ON
32.768kHz Sleep Clock
90% of VH
VBAT
VIO
~2 Sleep cycle
WL_REG_ON
BT_REG_ON
8.2.
Power On Sequence for WLAN ON and BT Off
32.768kHz Sleep Clock
90% of VH
VBAT
VIO
~2 Sleep cycle
WL_REG_ON
BT_REG_ON
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8.3.
Power On Sequence for WLAN OFF and BT ON
32.768kHz Sleep Clock
90% of VH
VBAT
VIO
~2 Sleep cycle
WL_REG_ON
BT_REG_ON
8.4.
Power On Sequence for WLAN OFF and BT OFF
32.768kHz Sleep Clock
VBAT
VIO
WL_REG_ON
BT_REG_ON
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9. Digital I/O Requirements
Digital I/O Pins
Sym
min.
typ.
max.
unit
For VIO=1.8V:
Input high voltage
Input low voltage
Output high voltage@2mA
Output low voltage@2mA
For VIO=3.3V:
VIH
VIL
VOH
VOL
0.65xVIO
-
-
-
-
-
0.35xVIO
-
V
V
V
V
-
VIO-0.45
-
0.45
Input high voltage
Input low voltage
Output high voltage@2mA
Output low voltage@2mA
VIH
VIL
VOH
VOL
2.00
-
VIO-0.4
-
-
-
-
-
-
V
V
V
V
0.80
-
0.40
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10.INTERFACE TIMING AND AC CHARACTERISTICS
10.1. Bluetooth UART Timing
BT_UART_CTS_N
BT_UART_TXD
Midpoint of STOP bit
2
1
Midpoint of STOP bit
BT_UART_RXD
3
BT_UART_RTS_N
Reference Description
Min
Typ
Max Unit
Delay time, BT_UART_CTS_N low to BT_UART_TXD valid
Setup time, BT_UART_CTS_N high before midpoint of stop bit
Delay time, midpoint of stop bit to BT_UART_RTS_N high
1
2
3
-
-
-
-
-
-
1.5
0.5
0.5
Bit periods
Bit periods
Bit periods
10.2. Bluetooth PCM Interface Timing
10.2.1. Short Frame Sync, Master Mode
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
Reference
Description
Min
-
41
41
0
0
8
8
0
Typ
Max
12
-
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
PCM bit clock frequency
1
2
3
4
5
6
7
8
-
-
-
-
-
-
-
-
PCM bit clock High
PCM bit clock Low
BT_PCM_SYNC delay
BT_PCM_OUT delay
BT_PCM_IN setup
BT_PCM_IN hold
-
25
25
-
-
25
Delay from rising edge of BT_PCM_CLK during last bit period to
BT_PCM_OUT becoming high impedance
Preliminary
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10.2.2. Short Frame Sync, Slave Mode
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
Reference
Description
Min
-
41
41
8
8
0
8
8
Typ
Max
12
-
-
-
-
25
-
-
25
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
PCM bit clock frequency
1
2
3
4
5
6
7
8
9
-
-
-
-
-
-
-
-
-
PCM bit clock High
PCM bit clock Low
BT_PCM_SYNC setup
BT_PCM_SYNC hold
BT_PCM_OUT delay
BT_PCM_IN setup
BT_PCM_IN hold
Delay from rising edge of BT_PCM_CLK during last bit period to
BT_PCM_OUT becoming high impedance
0
ns
10.2.3. Long Frame Sync, Master Mode
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
Reference
Description
Min
-
41
41
0
0
8
8
0
Typ
Max
12
-
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
PCM bit clock frequency
1
2
3
4
5
6
7
8
-
-
-
-
-
-
-
-
PCM bit clock High
PCM bit clock Low
BT_PCM_SYNC delay
BT_PCM_OUT delay
BT_PCM_IN setup
BT_PCM_IN hold
-
25
25
-
-
25
Delay from rising edge of BT_PCM_CLK during last bit period to
BT_PCM_OUT becoming high impedance
Preliminary
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10.2.4. Long Frame Sync, Slave Mode
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
Reference
Description
Min
-
41
41
8
8
0
8
8
Typ
Max
12
-
-
-
-
25
-
-
25
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
PCM bit clock frequency
1
2
3
4
5
6
7
8
9
-
-
-
-
-
-
-
-
-
PCM bit clock High
PCM bit clock Low
BT_PCM_SYNC setup
BT_PCM_SYNC hold
BT_PCM_OUT delay
BT_PCM_IN setup
BT_PCM_IN hold
Delay from rising edge of BT_PCM_CLK during last bit period to
BT_PCM_OUT becoming high impedance
0
ns
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10.2.5. Short Frame Sync, Burst Mode
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_IN
Reference
Description
Min
-
20.8
20.8
8
8
8
8
Typ
Max
24
-
-
-
-
-
-
Unit
MHz
ns
ns
ns
ns
ns
ns
PCM bit clock frequency
1
2
3
4
5
6
7
-
-
-
-
-
-
-
PCM bit clock Low
PCM bit clock High
BT_PCM_SYNC setup
BT_PCM_SYNC hold
BT_PCM_IN setup
BT_PCM_IN hold
Preliminary
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10.2.6. Long Frame Sync, Burst Mode
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_IN
Reference
Description
Min
-
20.8
20.8
8
8
8
8
Typ
Max
24
-
-
-
-
-
-
Unit
MHz
ns
ns
ns
ns
ns
ns
PCM bit clock frequency
1
2
3
4
5
6
7
-
-
-
-
-
-
-
PCM bit clock Low
PCM bit clock High
BT_PCM_SYNC setup
BT_PCM_SYNC hold
BT_PCM_IN setup
BT_PCM_IN hold
Preliminary
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10.3. I2S Timing
Transmitter
Lower Limit Upper Limit
Min Max
Clock Period T Ttr
Receiver
Upper Limit
Lower Limit
Min
-
Max
-
Min
Max
Min
Max Notes
-
Ttr
-
-
-
a
Master Mode: Clock generated by transmitter or receiver
HIGH tHC
LOW tLC
0.35Ttr
0.35Ttr
-
-
-
-
-
-
0.35Ttr
0.35Ttr
-
-
-
-
-
-
b
b
Slave Mode: Clock accepted by transmitter or receiver
HIGH hTC
LOW tLC
-
-
-
0.35Ttr
0.35Ttr
-
-
-
-
-
-
-
-
-
0.35Ttr
0.35Ttr
-
-
-
-
-
-
-
c
c
d
Rise time tRC
Transmitter
Delay tdtr
Hold time thtr
Receiver
0.15Ttr
-
0
-
-
-
-
0.8T
-
-
-
-
-
-
-
-
-
e
d
Setup time tsr
Hold time thr
-
-
-
-
-
-
-
-
-
-
0.2Tr
0
-
-
-
-
f
f
a. The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver have to be able
to handle the data transfer rate.
b. At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space ratio.
For this reason, tHC and tLC are specified with respect to T.
c. In slave mode, the transmitter and receiver need a clock signal with minimum HIGH and LOW periods so that they
can detect the signal. So long as the minimum periods are greater than 0.35Tr, any clock that meets the
requirements can be used.
d. Because the delay(tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter driven by a
slow clock edge can result in tdtr not exceeding tRC which means thtr becomes zero or negative. Therefore, the
transmitter has to guarantee that thtr is greater than or equal to zero, so long as the clock rise-time tRC is not more
than tRCmax, where tRCmax is not less than 0.15Ttr.
e. To allow data to be clocked out on a falling edge, the delay is specified with respect to the rising edge of the clock
signal and T, always giving the receiver sufficient setup time.
f. The data setup and hold time must not be less than the specified receiver setup and hold time.
Preliminary
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10.3.1. I2S Transmitter Timing
10.3.2. I2S Receiver Timing
Preliminary
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10.5. WLAN SDIO Timing
10.5.1. SDIO Default Mode Timing
fPP
tWL
tWH
CLK
SDIO_
tTHL
tTLH
tIH
tISU
Input
Output
tODLY
(max)
tODLY
(min)
SDIO Bus Timing(a) parameters (default Mode)
Parameter
Symbol
Min
Typ
Max
25
400
-
-
10
10
Unit
MHz
kHz
ns
ns
ns
ns
SDIO CLK (All values are referred to minimum VIH and maximum VIL(b)
Frequency-Data Transfer Mode
fPP
0
0
-
-
-
-
-
-
Frequency-Identification Mode
Clock Low Time
fOD
tWL
tWH
tTLH
tTHL
10
10
-
Clock High Time
Clock Rise Time
Clock low Time
-
Inputs: CMD, DAT (referenced to CLK)
Input Setup Time
tISU
tIH
5
5
-
-
-
-
ns
ns
Input Hold Time
Outputs: CMD, DAT (referenced to CLK)
Output Delay time-Data Transfer Mode
tODLY
tODLY
0
0
-
-
14
50
ns
ns
Output Delay time-Identification Mode
(a). Timing is based on CL < 40pF load on CMD and Data.
(b). Min (Vih) = 0.7*VIO and max (Vil) = 0.2*VIO.
Preliminary
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10.5.2. SDIO High-Speed Mode Timing
fPP
tWL
tWH
50% VDD
CLK
SDIO_
tTHL
tTLH
tIH
tISU
Input
Output
tODLY
tOH
SDIO Bus Timing(a) parameters (High-Speed Mode)
Symbol Min
Parameter
Typ
Max
Unit
MHz
SDIO CLK (All values are referred to minimum VIH and maximum VIL(b)
Frequency-Data Transfer Mode
fPP
fOD
tWL
tWH
tTLH
tTHL
0
0
7
7
-
-
-
-
-
-
-
50
400
-
-
3
3
Frequency-Identification Mode
Clock Low Time
kHz
ns
ns
ns
ns
Clock High Time
Clock Rise Time
Clock low Time
-
Inputs: CMD, DAT (referenced to CLK)
Input Setup Time
tISU
tIH
6
2
-
-
-
-
ns
ns
Input Hold Time
Outputs: CMD, DAT (referenced to CLK)
Output Delay time-Data Transfer Mode
Output Hold time
tODLY
tOH
CL
-
2.5
-
-
-
-
14
-
40
ns
ns
pF
Total System Capacitance (each line)
(a). Timing is based on CL < 40pF load on CMD and Data.
(b). Min (Vih) = 0.7*VIO and max (Vil) = 0.2*VIO
10.5.3. SDIO BUS Timing Specifications in SDR Modes
Clock Timing
tCLK
SDIO_CLK
tCR
tCF
tCR
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SDIO Bus Clock Timing Parameters (SDR Modes)
Parameter
Symbol
tCLK
Min
40
20
Max
Unit
ns
ns
Comments
-
-
-
-
SDR12 mode
SDR25 mode
SDR50 mode
SDR104 mode
-
10
ns
4.8
ns
tCR,tCF<2.00ns(max)@100MHz,cCARD=10pF
tCR,tCF<0.96ns(max)@208MHz,cCARD=10pF
tCR,tCF
-
-
0.2 x
tCLK
-
ns
%
Clock duty
cycle
30
70
-
Card Input Timing
SDIO_CLK
tIS
tIH
CMD input
DAT[3:0] input
SDIO Bus Input Timing Parameters ( SDR Modes)
Symbol
Min
Max
Unit
Comments
SDR104 Mode
tIS
1.4
0.8
-
-
ns
ns
cCARD = 10pF,VCT = 0.975V
cCARD = 5pF,VCT = 0.975V
tIH
SDR50 Mode
tIS
tIH
3.0
0.8
-
-
ns
ns
cCARD = 10pF,VCT = 0.975V
cCARD = 5pF,VCT = 0.975V
Preliminary
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Card Output Timing
SDIO Bus Ouput Timing ( SDR Modes up to 100MHz)
tCLK
SDIO_CLK
tOH
tODLY
CMD input
DAT[3:0] input
SDIO Bus Ouput Timing Parameters ( SDR Modes up to 100MHz)
Symbol
tODLY
tODLY
tOH
Min
-
Max
7.5
14.0
-
Unit
ns
Comments
tCLK ≧ 10ns CL = 30pF using driver type B for SDR50
tCLK ≧ 20ns CL = 40pF using for SDR12,SDR25
Hold time at the tODLY(min) CL = 15pF
-
ns
1.5
ns
SDIO Bus Ouput Timing ( SDR Modes 100MHz to 208MHz)
tCLK
SDIO_CLK
tOP
tODW
CMD input
DAT[3:0]
SDIO Bus Ouput Timing Parameters ( SDR Modes 100MHz to 208MHz)
Symbol
tOP
Min
0
Max
Unit
UI
Comments
2
+1550
-
Card output phase
ΔtOP
tODW
-350
0.60
ps
Delay variation due to temp change after tuning
tODW = 2.88ns @208MHz
UI
Preliminary
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･ Δtop=+1550ps for junction temperature of Δtop=90℃ during operation.
･ Δtop=-350ps for junction temperature of Δtop=-20℃ during operation.
･ Δtop=+2600ps for junction temperature of Δtop=-20℃ to +125℃ during operation
Δtop Consideration for Variable Data Window (SDR 104 Mode)
10.5.4. SDIO Timing Specifications in DDR50 Mode
SDIO Clock Timing (DDR50 Mode)
SDIO Bus Clock Timing Parameters ( DDR50 Mode)
Parameter
Symbol
tCLK
Min
20
Max
-
Unit
ns
Comments
-
DDr50 mode
-
tCR, tCF<4.00ns(max)@50MHz,
cCard=10pF
tCR, tCF
-
-
0.2 x tCLK
55
ns
%
Clock duty
cycle
45
-
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SDIO Data Timing (DDR50 Mode)
SDIO Bus Timing parameters (DDR50 Mode)
Parameter
Symbol
Min
Max
Unit
Comments
Input CMD
Input setup time
Input hold time
Output CMD
tISU
tIH
6
0.8
-
-
ns
ns
Ccard<10pF (1 card)
Ccard<10pF (1 card)
Output delay time
Output hold time
Input DAT
tODLY
tOH
-
13.7
-
ns
ns
Ccard<30pF (1 card)
Ccard<15pF (1 card)
1.5
Input setup time
Input hold time
Output DAT
tISU2x
tIH2x
3
0.8
-
-
ns
ns
Ccard<10pF (1 card)
Ccard<10pF (1 card)
Output delay time
Output hold time
tODLY2x
tOH2x
-
7.5
-
ns
ns
Ccard<25pF (1 card)
Ccard<15pF (1 card)
1.5
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11.ELECTRICAL CHARACTERISTICS
11.1. DC/RF Characteristics for IEEE802.11b - 2.4GHz
Specification
Mode
IEEE802.11b
DSSS / CCK
Frequency
Data rate
2400 - 2483.5MHz
1, 2, 5.5, 11Mbps
11.1.1. High Rate Condition for IEEE802.11b – 2.4GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=17dBm, 11Mbps.
Items
- DC Characteristics -
Contents
Typ.
Min.
-
Max.
420
Unit
mA
1. DC current
1) Tx mode
(1024byte, 20usec interval)*2
2) Rx mode
- Tx Characteristics *2 -
-
-
-
80
Max.
19.5
mA
Unit
dBm
Min.
14.5
Typ.
17
2. Output Power
3. Spectrum Mask Margin
1) 1st side lobes(-30dBr)
2) 2nd side lobes(-50dBr)
4. Power-on/off ramp
5. RF Carrier Suppression
6. Modulation Accuracy
7. Frequency tolerance
8. Spurious Emissions (BW=100kHz)
1) 30-1000MHz
0
0
-
15
-
-20
-
-
-
-
-
-
-
dB
dB
Usec
dB
%
ppm
2.0
-
35
20
-
-
-
-
-
-
-
-36
-30
-47
-47
Max.
-76
-
dBm
dBm
dBm
dBm
Unit
2) 1000-12750MHz
3) 1800-1900MHz
4) 5150-5300MHz
-
- Rx Characteristics -
Min.
-
-10
35
Typ.
-
-
9. Minimum Input Level (FER< 8%)
10. Maximum Input Level (FER< 8%)
11. Adjacent Channel Rejection
(FER< 8%)
dBm
dBm
-
-
dB
*2: Defined when output power setting is 17dBm at Murata module antenna pad
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11.1.2. Low Rate Condition for IEEE802.11b – 2.4GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=17dBm, 1Mbps.
Items
- DC Characteristics -
Contents
Typ.
Min.
-
Max.
430
Unit
mA
2. DC current
2) Tx mode
(1024byte, 20usec interval)*3
2) Rx mode
- Tx Characteristics *3 -
-
-
-
80
Max.
19.5
mA
Unit
dBm
Min.
14.5
Typ.
17
2. Output Power
3. Spectrum Mask Margin
1) 1st side lobes(-30dBr)
2) 2nd side lobes(-50dBr)
4. Power-on/off ramp
5. RF Carrier Suppression
6. Modulation Accuracy
7. Frequency tolerance
8. Spurious Emissions (BW=100kHz)
1) 30-1000MHz
0
0
-
15
-
-20
-
-
-
-
-
-
-
dB
dB
Usec
dB
%
ppm
2.0
-
35
20
-
-
-
-
-
-
-
-36
-30
-47
-47
Max.
-76
-
dBm
dBm
dBm
dBm
Unit
2) 1000-12750MHz
3) 1800-1900MHz
4) 5150-5300MHz
-
- Rx Characteristics -
Min.
-
-4
35
Typ.
-
-
9. Minimum Input Level (FER< 8%)
10. Maximum Input Level (FER< 8%)
11. Adjacent Channel Rejection
(FER< 8%)
dBm
dBm
-
-
dB
*3: Defined when output power setting is 17dBm at Murata module antenna pad
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11.2. DC/RF Characteristics for IEEE802.11g - 2.4GHz
Specification
Mode
IEEE802.11g
OFDM
Frequency
Data rate
2400 - 2483.5MHz
6, 9, 12, 18, 24, 36, 48, 54Mbps
11.2.1. High Rate Condition for IEEE802.11g – 2.4GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=13dBm, 54Mbps.
Items
Contents
- DC Characteristics -
Min.
Typ.
Max.
Unit
mA
1. DC current
1) Tx mode
(1024byte, 20usec interval)*4
2) Rx mode
- Tx Characteristics*4 -
-
-
370
-
-
80
Max.
15.5
mA
unit
dBm
Min.
10.5
Typ.
13.0
2. Output Power
3. Spectrum Mask Margin
1) 9MHz to 11MHz (0~ -20dBr)
2) 11MHz to 20MHz (-20~ -28dBr)
3) 20MHz to 30MHz (-28~ -40dBr)
4) 30MHz to 33MHz (-40dBr)
4. Constellation Error (EVM)
5. Frequency tolerance
0
0
0
0
-
-
-
-
-
-
-
-
-
dB
dB
dB
dB
dB
-
-25
20
-20
ppm
6. Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
2) 1GHz to 12.75GHz (BW=100kHz)
3) 1.8GHz to 1.9GHz (BW=100kHz)
4) 5.15GHz to 5.3GHz (BW=100kHz)
- Rx Characteristics -
7. Minimum Input Level (PER < 10%)
8. Maximum Input Level (PER < 10%)
9. Adjacent Channel Rejection
(PER < 10%)
-
-
-
-
-
-
-
-
-36
-30
-47
-47
Max.
-65
-
dBm
dBm
dBm
dBm
Unit
Min.
-
-20
Typ.
-
-
dBm
dBm
-1
-
-
dB
*4: Defined when output power setting is 13dBm at Murata module antenna pad
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11.2.2. Low Rate Condition for IEEE802.11g – 2.4GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=16dBm, 6Mbps.
Items
Contents
- DC Characteristics -
Min.
Typ.
Max.
Unit
mA
1. DC current
2) Tx mode
(1024byte, 20usec interval)*5
2) Rx mode
- Tx Characteristics*5 -
-
-
420
-
80
Max.
18.5
mA
unit
dBm
-
Min.
13.5
Typ.
16.0
2. Output Power
3. Spectrum Mask Margin
1) 9MHz to 11MHz (0~ -20dBr)
2) 11MHz to 20MHz (-20~ -28dBr)
3) 20MHz to 30MHz (-28~ -40dBr)
4) 30MHz to 33MHz (-40dBr)
4. Constellation Error (EVM)
5. Frequency tolerance
0
0
0
0
-
-
-
-
-
-
-
-
-
-
-5
20
dB
dB
dB
dB
dB
-20
ppm
6. Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
2) 1GHz to 12.75GHz (BW=100kHz)
3) 1.8GHz to 1.9GHz (BW=100kHz)
4) 5.15GHz to 5.3GHz (BW=100kHz)
- Rx Characteristics -
7. Minimum Input Level (PER < 10%)
8. Maximum Input Level (PER < 10%)
9. Adjacent Channel Rejection
(PER < 10%)
-
-
-
-
-
-
-
-
-36
-30
-47
-47
Max.
-82
-
dBm
dBm
dBm
dBm
Unit
Min.
-
-20
Typ.
-
-
dBm
dBm
16
-
-
dB
*5: Defined when output power setting is 16dBm at Murata module antenna pad
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11.3. DC/RF Characteristics for IEEE802.11n - 2.4GHz
Specification
Mode
IEEE802.11n
OFDM
Frequency
Data rate
2400 - 2483.5MHz
6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
11.3.1. High Rate Condition for IEEE802.11n – 2.4GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=12dBm, 65Mbps(MCS7).
Items
Contents
- DC Characteristics -
Min.
Typ.
Max.
Unit
mA
1. DC current
3) Tx mode
(1024byte, 20usec interval)*6
2) Rx mode
- Tx Characteristics*6 -
-
-
360
-
80
Max.
14.5
mA
unit
dBm
-
Min.
9.5
Typ.
12.0
2. Output Power
3. Spectrum Mask Margin
1) 9MHz to 11MHz (0~ -20dBr)
2) 11MHz to 20MHz (-20~ -28dBr)
3) 20MHz to 30MHz (-28~ -45dBr)
4) 30MHz to 33MHz (-45dBr)
4. Constellation Error (EVM)
5. Frequency tolerance
0
0
0
0
-
-
-
-
-
-
-
-
-
dB
dB
dB
dB
dB
-
-27
20
-20
ppm
6. Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
2) 1GHz to 12.75GHz (BW=100kHz)
3) 1.8GHz to 1.9GHz (BW=100kHz)
4) 5.15GHz to 5.3GHz (BW=100kHz)
- Rx Characteristics -
7. Minimum Input Level (PER < 10%)
8. Maximum Input Level (PER < 10%)
9. Adjacent Channel Rejection
(PER < 10%)
-
-
-
-
-
-
-
-
-36
-30
-47
-47
Max.
-64
-
dBm
dBm
dBm
dBm
Unit
Min.
-
-20
Typ.
-
-
dBm
dBm
-2
-
-
dB
*6: Defined when output power setting is 12dBm at Murata module antenna pad
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11.3.2. Low Rate Condition for IEEE802.11n – 2.4GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=14dBm, 6.5Mbps(MCS0).
Items
Contents
- DC Characteristics -
Min.
Typ.
Max.
Unit
mA
1. DC current
4) Tx mode
(1024byte, 20usec interval)*7
2) Rx mode
- Tx Characteristics*7 -
-
-
410
-
80
Max.
16.5
mA
unit
dBm
-
Min.
11.5
Typ.
14.0
2. Output Power
3. Spectrum Mask Margin
1) 9MHz to 11MHz (0~ -20dBr)
2) 11MHz to 20MHz (-20~ -28dBr)
3) 20MHz to 30MHz (-28~ -45dBr)
4) 30MHz to 33MHz (-45dBr)
4. Constellation Error (EVM)
5. Frequency tolerance
0
0
0
0
-
-
-
-
-
-
-
-
-
-
-5
20
dB
dB
dB
dB
dB
-20
ppm
6. Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
2) 1GHz to 12.75GHz (BW=100kHz)
3) 1.8GHz to 1.9GHz (BW=100kHz)
4) 5.15GHz to 5.3GHz (BW=100kHz)
- Rx Characteristics -
7. Minimum Input Level (PER < 10%)
8. Maximum Input Level (PER < 10%)
9. Adjacent Channel Rejection
(PER < 10%)
-
-
-
-
-
-
-
-
-36
-30
-47
-47
Max.
-82
-
dBm
dBm
dBm
dBm
Unit
Min.
-
-20
Typ.
-
-
dBm
dBm
16
-
-
dB
*7: Defined when output power setting is 14dBm at Murata module antenna pad
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11.4.
DC/RF Characteristics for IEEE802.11a - 5GHz
Specification
Mode
IEEE802.11a
OFDM
Frequency
Data rate
5180 - 5825MHz
6, 9, 12, 18, 24, 36, 48, 54Mbps
11.4.1. High Rate Condition for IEEE802.11a – 5GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=13dBm, 54Mbps.
Items
Contents
- DC Characteristics -
Min.
Typ.
Max.
Unit
mA
1. DC current
5) Tx mode
(1024byte, 20usec interval)*8
2) Rx mode
- Tx Characteristics*8 -
-
-
330
-
100
Max.
15.0
mA
unit
dBm
-
Min.
11.0
Typ.
13.0
2. Output Power
3. Spectrum Mask Margin
1) 9MHz to 11MHz (0~ -20dBr)
2) 11MHz to 20MHz (-20~ -28dBr)
3) 20MHz to 30MHz (-28~ -40dBr)
4) 30MHz to 33MHz (-40dBr)
4. Constellation Error (EVM)
5. Frequency tolerance
0
0
0
0
-
-
-
-
-
-
-
-
-
dB
dB
dB
dB
dB
-
-25
20
-20
ppm
6. Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
2) 1GHz to 12.75GHz (BW=100kHz)
3) 1.8GHz to 1.9GHz (BW=100kHz)
4) 5.15GHz to 5.3GHz (BW=100kHz)
- Rx Characteristics -
7. Minimum Input Level (PER < 10%)
8. Maximum Input Level (PER < 10%)
9. Adjacent Channel Rejection
(PER < 10%)
-
-
-
-
-
-
-
-
-36
-30
-47
-47
Max.
-65
-
dBm
dBm
dBm
dBm
Unit
Min.
-
-30
Typ.
-
-
dBm
dBm
-1
-
-
dB
*8: Defined when output power setting is 13dBm at Murata module antenna pad
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11.4.2. Low Rate Condition for IEEE802.11a – 5GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=15dBm, 6Mbps.
Items
Contents
- DC Characteristics -
Min.
Typ.
Max.
Unit
mA
1. DC current
1) Tx mode
(1024byte, 20usec interval)*9
2) Rx mode
- Tx Characteristics*9 -
-
-
360
-
100
Max.
17.0
mA
unit
dBm
-
Min.
13.0
Typ.
15.0
2. Output Power
3. Spectrum Mask Margin
1) 9MHz to 11MHz (0~ -20dBr)
2) 11MHz to 20MHz (-20~ -28dBr)
3) 20MHz to 30MHz (-28~ -40dBr)
4) 30MHz to 33MHz (-40dBr)
4. Constellation Error (EVM)
5. Frequency tolerance
0
0
0
0
-
-
-
-
-
-
-
-
-
-
-5
20
dB
dB
dB
dB
dB
-20
ppm
6. Outband Spurious Emissions
1) 30MHz to 1GHz (BW=100kHz)
2) 1GHz to 12.75GHz (BW=100kHz)
3) 1.8GHz to 1.9GHz (BW=100kHz)
4) 5.15GHz to 5.3GHz (BW=100kHz)
- Rx Characteristics -
7. Minimum Input Level (PER < 10%)
8. Maximum Input Level (PER < 10%)
9. Adjacent Channel Rejection
(PER < 10%)
-
-
-
-
-
-
-
-
-36
-30
-47
-47
Max.
-82
-
dBm
dBm
dBm
dBm
Unit
Min.
-
-30
Typ.
-
-
dBm
dBm
16
-
-
dB
*9: Defined when output power setting is 15dBm at Murata module antenna pad
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11.5.
DC/RF Characteristics for IEEE802.11n(HT 40MHz) - 5GHz
Specification
Mode
IEEE802.11n(HT40)
OFDM
Frequency
Data rate
5190 - 5795MHz
13.5, 27, 40.5, 54, 81, 108, 121.5, 135Mbps
11.5.1. High Rate Condition for IEEE802.11n(HT 40MHz) – 5GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=13dBm, 135Mbps(MCS7).
Items
Contents
- DC Characteristics -
min.
typ.
max.
unit
mA
1. DC current
1) Tx mode
(1024byte, 20usec interval)*10
2) Rx mode
- Tx Characteristics*10 -
-
-
310
-
-
110
max.
15.0
mA
unit
dBm
min.
11.0
typ.
13.0
2. Output Power
3. Spectrum Mask margin
1) 19MHz to 21MHz (0~ -20dBr)
2) 21MHz to 40MHz (-20~ -28dBr)
3) 40MHz to 60MHz (-28~ -45dBr)
4) 60MHz to 80MHz (-45dBr)
4. Constellation Error (EVM)
5.Frequency tolerance
0
0
0
0
-
-20
min.
-
-
-
-
-
-
-
-
-
dB
dB
dB
dB
dB
ppm
unit
dBm
dBm
-
-27
20
max.
-61
-
- Rx Characteristics -
typ.
-
-
6. Minimum Input Level (PER < 10%)
7. Maximum Input Level (PER < 10%)
7. Adjacent Channel Rejection
(PER < 10%)
-30
-2
-
-
dB
*10: Defined when output power setting is 13.0dBm at Murata module antenna pad
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11.5.2. Low Rate Condition for IEEE802.11n(HT 40MHz) – 5GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=15dBm, 13.5Mbps(MCS0).
Items
Contents
- DC Characteristics -
min.
typ.
max.
unit
mA
1. DC current
2) Tx mode
(1024byte, 20usec interval)*11
2) Rx mode
- Tx Characteristics*11 -
-
-
370
-
-
110
max.
17.0
mA
unit
dBm
min.
13.0
typ.
15.0
2. Output Power
3. Spectrum Mask margin
1) 19MHz to 21MHz (0~ -20dBr)
2) 21MHz to 40MHz (-20~ -28dBr)
3) 40MHz to 60MHz (-28~ -45dBr)
4) 60MHz to 80MHz (-45dBr)
4. Constellation Error (EVM)
5.Frequency tolerance
0
0
0
0
-
-20
min.
-
-
-
-
-
-
-
-
-
-
-5
20
max.
-79
-
dB
dB
dB
dB
dB
ppm
unit
dBm
dBm
- Rx Characteristics -
typ.
-
-
6. Minimum Input Level (PER < 10%)
7. Maximum Input Level (PER < 10%)
8. Adjacent Channel Rejection
(PER < 10%)
-30
16
-
-
dB
*11: Defined when output power setting is 15.0dBm at Murata module antenna pad
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11.6. DC/RF Characteristics for IEEE802.11ac (VHT 80MHz)-5GHz
Specification
Mode
IEEE802.11ac(VHT80)
OFDM
Frequency
Data rate
5210 - 5775MHz
29.3,58.5,87.8,117,175.5,234,263.3,292.5,351,390Mbps
11.6.1. High Rate Condition for IEEE802.11ac(VHT 80MHz) – 5GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=10dBm, 390Mbps(MCS9).
- DC Characteristics -
1. DC current
1) Tx mode
(1024byte, 20usec interval)*12
2) Rx mode
- Tx Characteristics*12 -
min.
typ.
max.
unit
mA
-
-
340
-
-
130
max.
12.0
mA
unit
dBm
min.
8.0
typ.
10.0
2. Output Power
3. Spectrum Mask margin
1) 39MHz to 41MHz (0~ -20dBr)
2) 41MHz to 80MHz (-20~ -28dBr)
3) 80MHz to 120MHz (-28~ -40dBr)
4) 120MHz to 140MHz (-40dBr)
4. Constellation Error (EVM)
5.Frequency tolerance
0
0
0
0
-
-20
min.
-
-
-
-
-
-
-
-
-
dB
dB
dB
dB
dB
ppm
unit
dBm
dBm
-
-32
20
max.
-51
-
- Rx Characteristics -
typ.
-
-
6. Minimum Input Level (PER < 10%)
7. Maximum Input Level (PER < 10%)
8. Adjacent Channel Rejection
(PER < 10%)
-30
-9
-
-
dB
*12: Defined when output power setting is 10dBm at Murata module antenna pad
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11.6.2. Low Rate Condition for IEEE802.11ac(VHT 80MHz) – 5GHz
Normal Condition : 25deg.C, VBAT=3.3V. Output power setting=12dBm, 29.3Mbps(MCS0).
- DC Characteristics -
1. DC current
2) Tx mode
(1024byte, 20usec interval)*13
2) Rx mode
- Tx Characteristics*13 -
min.
typ.
max.
unit
mA
-
-
380
-
-
130
max.
14.0
mA
unit
dBm
min.
10.0
typ.
12.0
2. Output Power
3. Spectrum Mask margin
1) 39MHz to 41MHz (0~ -20dBr)
2) 41MHz to 80MHz (-20~ -28dBr)
3) 80MHz to 120MHz (-28~ -40dBr)
4) 120MHz to 140MHz (-40dBr)
4. Constellation Error (EVM)
5.Frequency tolerance
0
0
0
0
-
-20
min.
-
-
-
-
-
-
-
-
-
-
-5
20
max.
-76
-
dB
dB
dB
dB
dB
ppm
unit
dBm
dBm
- Rx Characteristics -
typ.
-
-
6. Minimum Input Level (PER < 10%)
7. Maximum Input Level (PER < 10%)
8. Adjacent Channel Rejection
(PER < 10%)
-30
16
-
-
dB
*13: Defined when output power setting is 12dBm at Murata module antenna pad
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11.7. DC/RF Characteristics for Bluetooth
Normal conditions : 25 deg.C, VBAT = 3.3V
Items
Contents
Bluetooth specification (power class)
Channel frequency (spacing)
Version 5.0 (Class1)
2402 to 2480 MHz (1MHz)
Transmitter
Output Power
Min.
Typ.
Max.
10.5
6.0
2483.5
1
Unit
dBm
dBm
MHz
MHz
BDR
EDR
3.0
-1.5
2400
-
Frequency range
20dB bandwidth
-
Modulation characteristics
(a) Modulation Δf1avg
(b) Modulation Δf2max
(c) Modulation Δf2avg / Δf1avg
Carrier Frequency Drift
(a) 1slot
140
115
0.8
-
-
175
-
-
kHz
kHz
-25
-40
-20
-
-
-
+25
+40
+20
kHz
kHz
(b) 3slot / 5slot
(c) Maximum drift rate
kHz/50u
s
EDR Relative Power
-4
-
+1
dB
EDR Carrier Frequency Stability and Modulation Accuracy
(a) ωi
(b) ωi+ωo
(c) ωo
(d) RMS DEVM (π/4 DQPSK)
(e) Peak DEVM (π/4 DQPSK)
(f) 99% DEVM (π/4 DQPSK)
(g) RMS DEVM (8DPSK)
(h) Peak DEVM (8DPSK)
(i) 99% DEVM (8DPSK)
-75
-75
-10
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
+75
+75
+10
20
35
30
13
25
20
kHz
kHz
kHz
%
%
%
%
%
%
Spurious Emissions (BW=100kHz)
-
-
-
-
-
-
-
-
-36
-30
-47
-47
Max.
-80
-
dBm
dBm
dBm
dBm
Unit
dBm
dBm
(a) 10MHz≦f<2387MHz
(b) 2387MHz≦f<2400MHz
(c) 2483.5MHz<f≦2496.5MHz
(d) 2496.5MHz<f≦8GHz
Receiver
Sensitivity (BER<0.1%)
Maximum Input Level (BER<0.1%)
EDR Sensitivity (BER<0.007%)
(a) 8DPSK
Min.
-
-20
Typ.
-
-
-
-
-77
dBm
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11.8.
DC/RF Characteristics for Bluetooth（LE）
Normal conditions : 25 deg.C, VBAT = 3.3V
Items
Bluetooth specification (power class)
Channel frequency (spacing)
Number of RF Channel
Item / Condition
Center Frequency
Channel Spacing
Number of RF channel
Output power
Contents
Version 5.0 (LE)
2402 to 2480 MHz (2MHz)
40
Min.
2402
-
Typ.
Max.
Unit
MHz
MHz
-
-
2
40
-
2480
-
-
-
1.5
9.0
dBm
Modulation Characteristics
1) Δf1avg
2) Δf2max (at 99.9%)
225
185
0.8
-
-
-
275
-
-
kHz
kHz
-
3) Δf2avg / Δf1avg
Carrier frequency offset and drift
1) Frequency offset
2) Frequency drift
-150
-
-
-
-
-
-
-
-
150
50
20
-70
-
65.4
kHz
kHz
kHz
dBm
dBm
%
3) Drift rate
Receiver sensitivity (PER < 30.8%)
Maximum input signal level (PER < 30.8%)
PER Report Integrity (-30dBm input)
-
-10
50
Note
The above mentioned values have been obtained according to our own measuring methods and may
very depend on the circuit, in which the component is actually incorporated. Therefore, you are kindly
requested to test the performance of the component actually in your set.
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12.LAND PATTERN (TOP VIEW)
0.7
1.0 0.575 0.25 0.25 0.30
0.3
0.5
0.4
1.0
0.3
0.25
0.25
0.55
0.5
0.65
0.275
0.275
0.25 0.25
0.5 0.3
* To avoid the short-circuit between the side shielding and a solder on the module land after the reflow,
please locate the module land at 0.2mm away from module outline as above figure.
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13.REFERENCE CIRCUIT
A
B
C
D
E
F
G
H
(*1) LQM18PN2R2M recommanded.
(*2) Strapping option of SDIO interface voltage
R101:Open SDIO interface voltage=1.8V
R101:10kohm SDIO interface voltage=3.3V
1
2
3
4
5
1
2
3
4
5
Strap Option
(*3) Put matching component's land near the ANT terminals.
(*4) Arrange SDIO lines with 50 ohm and put siries-R,
shunt-C parts to reject the noise if needed.
GPIO_7
R101
10k
10 to 100k ohm pull-ups are required on the four DATA
lines and the CMD line. This requirement must be met
during all operating states by using external pull-up
pull-ups. This module does not have internal pull-ups on
(*2)
these lines. Please confirm the performance on your board.
L101
(*1)
2.2uH
C101
4.7uF
VBAT
39
40
41
42
43
44
45
46
47
48
49
50
51
52
26
25
24
23
22
21
20
19
18
17
16
15
14
13
GND
SR_PVSS
VIN_LDO
SR_PVSS
BT_DEV_WAKE
BT_HOST_WAKE
I2S_DI
BT_DEV_WAKE
BT_HOST_WAKE
I2S_DI
C102 4.7uF
VBAT_SR
VBAT_LDO
GND
NC
GND
C103
4.7uF
BT_UART_RXD
BT_UART_TXD
BT_UART_RTS
BT_UART_CTS
BT_UART_RXD
BT_UART_TXD
BT_UART_RTS_N
BT_UART_CTS_N
GND
SDIO_CLK
GND
Type1MW
SDIO_CLK
SDIO_DATA3
SDIO_DATA2
SDIO_DATA1
SDIO_CMD
SDIO_DATA0
GND
SDIO_DATA3
SDIO_DATA2
SDIO_DATA1
SDIO_CMD
ANT
(*4)
ANT
(*3)
GND
SDIO_DATA0
GND
C104
0.1uF
VIO
A
B
C
D
E
F
G
H
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14.TAPE AND REEL PACKING
(1) Dimensions of Tape (Plastic tape)
2.0±0.1
1.5+0.1/-0.0
0.3±0.05
4.0±0.1
1.5±0.1
7.7±0.05
feeding direction
12.0±0.1
1.5±0.1
(2) Dimensions of Reel
17.5
2±0.5
Φ 13±2
22.5 max.
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(3) Taping Diagrams
[1] Feeding Hole :
As specified in (1)
[2] Hole for chip
[3] Cover tape
[4] Base tape
:
:
:
As specified in (1)
62 um in thickness
As specified in (1)
[3]
[1]
[2]
[3]
[4]
Feeding Hole
Feeding Direction
Chip
(4) Leader and Tail tape
Tail tape
(No components)
Components
No components
Leader tape
(Cover tape alone)
40 to 200 mm
160 mm min.
230 mm min.
Feeding direction
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-The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
-The cover tape and base tape are not adhered at no components area for 250 mm min.
-Tear off strength against pulling of cover tape: 5 N min.
-Packaging unit: 1,000 pcs/ reel
- Material: Base tape: Plastic
Reel : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
- Peeling of force: 1.1 N max. in the direction of peeling as shown below.
1.1 N max.
165 to 180 °
Cover tape
Base tape
- PACKAGE (Humidity proof packing)
Label
Desiccant
Humidity
Indicator
タ
Label
Anti-humidity
Plastic Bag
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.
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15. NOTICE
15.1.
Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be
used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
15.2.
Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solder ability and
destroy by static electrical charge.
15.3.
Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of
products may vary depending on the pattern drawing method, grounding method, land dimensions,
land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to
verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
15.4.
Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
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15.5.
Soldering Conditions:
The recommendation conditions of soldering are as in the following figure.
Soldering must be carried out by the above mentioned conditions to prevent products from damage.
Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other
soldering conditions.
Reflow soldering standard conditions (Example)
Within 10s
250 deg.C
Tpeak-5deg.C
220 deg.C
Cooling down
Slowly
180 deg.C
150 deg.C
Pre-heating
Within 120s
time(s)
Within 60s
Please use the reflow within 3 times.
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
15.6.
Cleaning:
Since this Product is Moisture Sensitive, any cleaning is not recommended. If any cleaning process is
done the customer is responsible for any issues or failures caused by the cleaning process.
15.7.
Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the
similar conditions to the above-mentioned. However, if products are used under the following
circumstances, it may damage products and leakage of electricity and abnormal temperature may
occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- Dusty place.
- Direct sunlight place.
- Water splashing place.
- Humid place where water condenses.
- Freezing place.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
As it might be a cause of degradation or destruction to apply static electricity to products, do not apply
static electricity or excessive voltage while assembling and measuring.
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15.8.
Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity
range.
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16. PRECONDITION TO USE OUR PRODUCTS
PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the
specifications of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that
our product is used for the purpose, under the condition and in the environment specified in this specification. You are
requested not to use our product deviating from the condition and the environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications
provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such
products, which are caused under the conditions other than those specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY
ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
You agree that you will use any and all software or program code (including but not limited to hcd, firmware, nvram, and
blob) we may provide or to be embedded into our product (“Software”) provided that you use the Software bundled with
our product. YOU AGREE THAT THE SOFTWARE SHALL BE PROVIDED TO YOU “AS- IS” BASIS, MURATA MAKES
NO REPRESENTATIONS OR WARRANTIES THAT THE SOFTWARE IS ERROR-FREE OR WILL OPERATE
WITHOUT INTERRUPTION. AND MORE, MURATA MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY
KIND WHETHER EXPRESS OR IMPLIED WITH RESPECT TO THE SOFTWARE. MURATA EXPRESSLY DISCLAIM
ANY AND ALL WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE
NOR THE WARRANTY OF TITLE OR NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.
You shall indemnify and hold harmless us, our affiliates and our licensor from and against any and all claims,
costs, expenses and liabilities (including attorney’s fees), which arise in connection with the using the
Software.
The product shall not be used in any application listed below which requires especially high reliability for the prevention
of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that,
if you use our products in such applications, we will not be responsible for any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,
DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY
FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS AND THE SOFTWARE IN SUCH APPLICATIONS.
- Aircraft equipment.
- Aerospace equipment
- Undersea equipment.
- Power plant control equipment - Medical equipment.
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our
product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by
the regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right,
copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in
which our products or services are used. Information provided by us regarding third-party products or services does not
constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such
information may require a license from a third party under the patents or other intellectual property of the third party, or a
license from us under our patents or other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose of developing of
mass-destruction weapons and the purpose of military use.
Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",
etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials
and/or components from our suppliers.
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your
company and that you understand and accept the validity of the contents herein. When you are not able to return the
signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or
approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer
acknowledges that engineering samples may deviate from specifications and may contain defects due to their
development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability
for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the
product to be sold by you,
-deviation or lapse in function of engineering sample,
-improper use of engineering samples.
We disclaim any liability for consequential and incidental damages.
If you can’t agree the above contents, you should inquire our sales.
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APPENDIX
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1MW Installation Manual
FCC ID of this product is as follows.
FCC ID: VPYLBEE5HY1MW
IC No. of this product is as follows.
IC: 772C-LBEE5HY1MW
Contents
1. Theory of Operation-Channel List
2. Antenna
1. Theory of Operation-Channel List
Theory of Operation-Software Security and Channel List
Frequency of operation
Scan
Ad-hoc mode
2.4GHz
W52
11b/g/n (HT20)
BT
2412-2462MHz
2402-2480MHz
2402-2480MHz
5180-5240MHz
5190-5230MHz
5210MHz
Active
N/A
Yes
N/A
N/A
Yes
Yes
Yes
No
BLE
N/A
11a/n/ac ((V)HT20)
11n/ac ((V)HT40)
11ac (VHT80)
11a/n/ac ((V)HT20)
11n/ac ((V)HT40)
11ac (VHT80)
11a/n/ac ((V)HT20)
11n/ac ((V)HT40)
11ac (VHT80)
11a/n/ac ((V)HT20)
11n/ac ((V)HT40)
11ac (VHT80)
Active
Active
Active
Passive
Passive
Passive
Passive
Passive
Passive
Active
Active
Active
W53
5260-5320MHz
5270-5310MHz
5290MHz
No
No
W56
5500-5720MHz *
5510-5710MHz *
5530-5690MHz *
5745-5825MHz
5755-5795MHz
5775MHz
No
No
No
W58
Yes
Yes
Yes
* The frequency band 5600MHz-5640MHz (11a/n/ac 20M band), 5590MHz-5630MHz (11n/ac 40M
band) and 5610MHz (11ac 80M band) is restricted in ISED.
Notes: End users cannot modify the software because F/W & driver are installed in device.
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2. Antenna
■Please perform the antenna design that followed the specifications of the antenna.
■About the signal line between an antenna and a module
It is a 50-ohm line design.
Fine tuning of return loss etc. can be performed using a matching network.
However, it is required to check "Class1 change" and "Class2 change" which the authorities define
then.
The concrete contents of a check are the following three points.
１）It is the same type as the antenna type of antenna specifications.
２）An antenna gain is lower than a gain given in antenna specifications.
３）The emission level is not getting worse.
■50-ohm line(microstrip line length)
Antenna
Antenna type
Monopole pattern antenna
50-ohm feed line length
We test it at 0mm as a representative
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LBEE5HY1MW User Manual for FCC
■Regarding FCC modular approval of LBEE5HY1MW
Model Name: LBEE5HY1MW
FCC ID: VPYLBEE5HY1MW
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
Since this module is not sold to general end users directly, there is no user manual of module.
For the details about this module, please refer to the specification sheet of module.
This module should be installed in the host device according to the interface specification (installation
procedure).
● The following information must be indicated on the host device of this module.
Contains Transmitter Module FCC ID: VPYLBEE5HY1MW
or
Contains FCC ID: VPYLBEE5HY1MW
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
*If it cannot be described on the host product, it must be listed on both the host product manual and on
the host product package or removable label.
●The following statements must be described on the user manual of the host device of this module;
FCC CAUTION
Changes or modifications not expressly approved by the party responsible for compliance could void
the user’s authority to operate the equipment.
Compliance with FCC requirement 15.407(c)
Data transmission is always initiated by software, which is the passed down through the MAC, through
the digital and analog baseband, and finally to the RF chip. Several special packets are initiated by the
MAC. These are the only ways the digital baseband portion will turn on the RF transmitter, which it then
turns off at the end of the packet. Therefore, the transmitter will be on only while one of the
aforementioned packets is being transmitted. In other words, this device automatically discontinue
transmission in case of either absence of information to transmit or operational failure.
Frequency Tolerance: ±20 ppm
This transmitter must not be co-located or operated in conjunction with any other antenna or
transmitter.
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●When installing it in a mobile equipment. Please describe the following warning to the manual.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment
and meets the FCC radio frequency (RF) Exposure Guidelines. This equipment should be installed and
operated keeping the radiator at least 20cm or more away from person’s body.
●When installing it in a portable equipment. Please describe the following warning to the manual.
The available scientific evidence does not show that any health problems are associated with using low
power wireless devices. There is no proof, however, that these low power wireless devices are
absolutely safe. Low power Wireless devices emit low levels of radio frequency energy (RF) in the
microwave range while being used. Whereas high levels of RF can produce health effects (by heating
tissue), exposure of low-level RF that does not produce heating effects causes no known adverse
health effects. Many studies of low-level RF exposures have not found any biological effects. Some
studies have suggested that some biological effects might occur, but such findings have not been
confirmed by additional research. LBEE5HY1MW has been tested and found to comply with FCC
radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency
(RF) Exposure Guidelines.
It is necessary to take a SAR test with your set mounting this module (except to use only Bluetooth
V5.0 (BDR/EDR/LE)).
Class II permissive change application is necessary using the SAR report. Please contact Murata.
Note)
Portable equipment: Equipment for which the spaces between human body and antenna are used
within 20cm.
Mobile equipment: Equipment used at position in which the spaces between human body and antenna
exceeded 20cm.
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LBEE5HY1MW User Manual for ISED
PMN: LBEE5HY1MW
HVIN: LBEE5HY1MW
IC Number: 772C-LBEE5HY1MW
Since this module is not sold to general end users directly, there is no user manual of module.
For the details about this module, please refer to the specification sheet of module.
This module should be installed in the host device according to the interface specification (installation
procedure).
● The following information must be indicated on the host device of this module.
Contains IC: 772C-LBEE5HY1MW
●The following statements must be described on the user manual of the host device of this module;
This device complies with Industry Canada’s applicable licence-exempt RSSs. Operation is subject to
the following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts
de licence. L’exploitation est autorisée aux deux conditions suivantes:
1) l’appareil ne doit pas produire de brouillage;
2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d’en compromettre le fonctionnement.
*If it is difficult to describe this statement on the host product due to the size, please describe in the
User's manual.
●In case of the final product which can be carried around to outdoor.
The following indication is necessary to the final product.
When the AP function is used in W52;
At the time of a channel setting of W52, please indicate “for indoor use only”. During connecting,
please show the channel number which connects.
And please indicate that the end user may find out "for indoor use only channel".
When the STA function is used in channel 52, 54, 58, at the time of the channel 52 or 54 or 58 setting,
please indicate “for indoor use only channel”.
During connecting, please show the channel number which connects.
And please indicate that the end user may find out "for indoor use only channel".
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If the antenna of the end product is removed, please describe the follow warning on the manual of the
end product which contains this module.
This radio transmitter (IC Number: 772C-LBEE5HY1MW) identify the device by certification number or
model number if Category II) has been approved by Industry Canada to operate with the antenna types
listed below with the maximum permissible gain indicated. Antenna types not included in this list,
having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with
this device.
: 2.4GHz
: 5GHz
Monopole Gain: +0.1 dBi
Monopole Gain: -0.4 dBi
Le présent émetteur radio (IC Number: 772C-LBEE5HY1MW) a été approuvé par Industrie Canada
pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal.
Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué,
sont strictement interdits pour l'exploitation de l'émetteur.
Type d’antenne
: 2.4GHz
: 5GHz
Monopole Gain: +0.1 dBi
Monopole Gain: -0.4 dBi
●If the final product use the following frequency, please note that there is a limit.
For indoor use only (5150-5250MHz band and channel 52, 54, 58)
Pour usage intérieur seulement (5150-5250MHz band and channel 52, 54, 58)
●The following statements must be described on the user manual of the host device of this module;
Data transmission is always initiated by software, which is the passed down through the MAC, through
the digital and analog baseband, and finally to the RF chip. Several special packets are initiated by the
MAC. These are the only ways the digital baseband portion will turn on the RF transmitter, which it then
turns off at the end of the packet. Therefore, the transmitter will be on only while one of the
aforementioned packets is being transmitted. In other words, this device automatically discontinue
transmission in case of either absence of information to transmit or operational failure.
La transmission des données est toujours initiée par le logiciel, puis les données sont transmises par
l'intermédiaire du MAC, par la bande de base numérique et analogique et, enfin, à la puce RF.
Plusieurs paquets spéciaux sont initiés par le MAC. Ce sont les seuls moyens pour qu'une partie de la
bande de base numérique active l'émetteur RF, puis désactive celui-ci à la fin du paquet. En
conséquence, l'émetteur reste uniquement activé lors de la transmission d'un des paquets
susmentionnés. En d'autres termes, ce dispositif interrompt automatiquement toute transmission en
cas d'absence d'information à transmettre ou de défaillance.
*If it is difficult to describe this statement on the host product due to the size, please describe in the
User's manual.
●When installing it in a mobile equipment. Please describe the following warning to the manual.
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment and
meets RSS-102 of the IC radio frequency (RF) Exposure rules. This equipment should be installed and
operated keeping the radiator at least 20cm or more away from person’s body.
Cet équipement est conforme aux limites d’exposition aux rayonnements énoncées pour un
environnement non contrôlé et respecte les règles d’exposition aux fréquences radioélectriques (RF)
CNR-102 de l’IC. Cet équipement doit être installé et utilisé en gardant une distance de 20 cm ou plus
entre le radiateur et le corps humain.
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●Antenna
Please refer to the Antenna Specification or please contact Murata for the detail designation of how to
design the Antenna trace.
Model name LBEE5HY1MW
•
•
•
•
Antenna Model Name
Antenna type
Antenna manufacture
Antenna gain
:
:
:
:
Type1MW-Antenna
Monopole pattern antenna
Murata Manufacturing Co.,Ltd.
+0.1 dBi @2442MHz
- 0.4 dBi @5150MHz
•
Frequency
:
2400-2483.5MHz, 5150-5850MHz
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Tuning
for
Tuning for Matching circuit
5GHz-1
Attenuator circuit
2GHz
Shunt 1: None, Series 1: 1.4nH, Shunt 2:
None,
Shunt 3: None, Series 2: 0ohm, Shunt 4:270ohm
None
Shunt 5: 270ohm, Series 3: 20ohm, Shunt 6:
0ohm
0ohm
*1005 size component is applied to attenuator circuit
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[dBi]
ZX-plane
hor. ver.
[dB]
LINEAR
POLARIZATION
XY-plane
YZ-plane
Total
Efficiency
hor.
ver.
-4.0
-7.7
-3.7
-7.3
-3.6
-7.1
hor.
ver.
-18.5
-24.0
-17.0
-22.9
-16.5
-22.8
MAX.
-3.8
-8.1
-3.6
-7.9
-3.3
-7.8
-0.1
-5.1
0.1
-6.0
-13.3
-5.5
-1.2
-3.6
-0.8
-3.3
-0.6
-3.1
2400 MHz
2442 MHz
2484 MHz
AVE.
MAX.
AVE.
MAX.
AVE.
-4.3
-3.9
-3.8
-4.7
0.0
-13.0
-5.5
-4.6
-12.8
XYplane
[dBi]
YZ plane
[dBi]
ZX plane
[dBi]
0
0
0
5
0
5
0
5
0
-5
-5
-5
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
90
90
270
90
270
270
horizontal
vertical
horizontal
vertical
horizontal
180
180
180
vertical
HOR.
VER.
HOR.
VER.
HOR.
VER.
MAX
AVE
MAX
AVE
MAX
AVE
-3.6
-7.9
-3.7
-7.3
0.1
-4.7
-17.0
-22.9
-5.5
-13.0
-0.8
-3.3
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[dBi]
ZX-plane
hor. ver.
[dB]
LINEAR
POLARIZATION
XY-plane
YZ-plane
Total
Efficiency
hor.
ver.
-6.1
-9.6
-4.9
-8.6
-4.0
-8.0
hor.
ver.
-10.3
-18.3
-10.8
-19.0
-10.7
-18.4
MAX.
-3.0
-8.1
-2.4
-7.6
-1.8
-7.6
-0.4
-6.1
-0.6
-5.7
-1.3
-6.2
-1.6
-8.9
-0.7
-9.0
-0.9
-8.6
-1.2
-8.6
-2.9
5150 MHz
5500 MHz
5850 MHz
AVE.
MAX.
AVE.
MAX.
AVE.
-5.6
-5.2
-5.4
-10.0
-5.1
-11.8
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LBEE5HY1MW User Manual for Japan
■Regarding Japan Certificate of Construction Type of LBEE5HY1MW
R 001-P01220
W52/W53 は屋内使用限定
This module is a product that has been authorized construction design certification based on the
following Certificate of Construction Type.
[(Warning) In the 5 GHz frequency band, three types of 5.2 GHz / 5.3 GHz / 5.6 GHz bands (W52 /
W53 / W56) can be used.
Outdoor use of the 5.2 GHz / 5.3 GHz band wireless LAN (W52 / W53) is prohibited by the
Certificate of Construction Type. ]
W53 / W56 for STA function only.
●It is recommended to describe the following contents in the end product or user manual.
・[This product has built-in specified radio equipment which received construction design
certification (certification number: 001-P01220) based on the Certificate of Construction.]
・[The W52 / W53 in the 5 GHz band is prohibited from outdoor use under the Japanese
Certificate of Construction Type.]
Preliminary
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