LLM215R71C473MA11# [MURATA]

民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备];


型号：	LLM215R71C473MA11#
厂家：	muRata
描述：	民用设备,工业设备,移动设备,植入式以外的医疗器械设备 [GHTF A/B/C],汽车[信息娱乐 / 舒适设备] 医疗医疗器械
文件：	总21页 (文件大小：526K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Only Reflow Soldering

LOW ESL CHIP MONOLITHIC CERAMIC CAPACITOR FOR GENERAL

LLM215R71C473MA11_ (0805, X7R, 47000pF, 16Vdc)

_: packaging code

Reference Sheet

1.Scope

This product specification is applied to Low ESL Chip Monolithic Ceramic Capacitor used for General Electronic equipment.

This product is applied for Only Reflow Soldering.

ꢀꢀ

2.MURATA Part NO. System

(Ex.)

LLM

473

A11

(8)Packaging

Code

(2)T

Dimensions

(3)Temperature

Characteristics

(4)DC Rated

Voltage

(5)Nominal (6)Capacitance

(7)Murata’s

Control Code

(1)L/W

Dimensions

Tolerance

Capacitance

3. Type & Dimensions

(Unit:mm)

(1)-1 L

(1)-2 W

(2) T

0.5+0.05/-0.1

2.0±0.1

1.25±0.1

0.5±0.05

4.Rated value

(3) Temperature Characteristics

(Public STD Code):X7R(EIA)

Specifications and Test

Methods

(4)

DC Rated

Voltage

(6)

(5) Nominal

Capacitance

Tolerance

(Operationg

Temp. Range)

Temp. coeff

orꢀCap. Change

Temp. Range

(Ref.Temp.)

-55 to 125 °C

(25 °C)

16 Vdc

47000 pF

±20 %

-15 to 15 %

-55 to 125 °C

5.Package

mark

(8) Packaging

Packaging Unit

f180mm Reel

EMBOSSED W8P4

f330mm Reel

4000 pcs./Reel

10000 pcs./Reel

EMBOSSED W8P4

Product specifications in this catalog are as of Jan.30,2013,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

LLM215R71C473MA11-01

■SPECIFICATIONS AND TEST METHODS

Specification

R7 / C7：－55℃ to ＋125℃

Item

Test Method

Operating

Temperature Range

Rated Voltage

See the previous pages.

The rated voltage is defined as the maximum voltage which may be

applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, V^P-Por V^O-P

whichever is larger, should be maintained within the rated

voltage range.

Appearance

No defects or abnormalities.

Within the specified dimensions.

No defects or abnormalities.

Visual inspection.

Using calipers.

Dimension

Dielectric Strength

No failure shall be observed when 250% of the rated voltage is

applied between the terminations for 1 to 5 seconds, provided the

charge/discharge current is less than 50mA.

Insulation

More than 10,000MΩ or 500Ω･F.

The insulation resistance shall be measured with a DC voltage

not exceeding the rated voltage at 25℃ and 75%RH max. and

within 2 minutes of charging.

Resistance

(whichever is smaller)

Capacitance

Within the specified tolerance.

The capacitance/D.F. shall be measured at 25℃ at the

frequency and voltage shown in the table.

Dissipation Factor

(D.F.)

W.V.:25Vmin. ;0.025 max.

W.V.:16V/10V;0.035 max.

W.V.:6.3V/4V;0.05 max.

Capacitance

Frequency

1±0.1kHz

Voltage

*1 C≦10μF

1.0±0.2Vrms

*1 For LLA185 C7 0G 334/474, the capacitance should be measured

using a voltage of 0.5+/-0.1Vrms instead of 1.0+/-0.2Vrms.

The capacitance change shall be measured after 5 min. at

each specified temperature stage.

Capacitance

Temperature

Characteristics

Temp.Range Reference

Char.

Cap.Change

Step

Temperature(C)

25±2

(

℃

)

Temp.

-55 to +125

25℃

Within ±15%

Within ±22%

-55±3

-55 to +125

25℃

25±2

125±3

25±2

The ranges of capacitance change compared with the 25℃ value

over the temperature ranges shown in the table shall be within

the specified ranges.

10 Adhesive Strength of

Termination

No removal of the terminations or other defect

should occur.

Solder the capacitor to the test jig (glass epoxy board) using a

eutectic solder. Then apply 5N force in parallel with the test

jig for 10±1 sec. The soldering shall be done either with an

iron or using the reflow method and shall be conducted with

care so that the soldering is uniform and free of defects such as

heat shock.

11 Vibration

Resistance

Appearance No defects or abnormalities.

Capacitance Within the specified tolerance.

Solder the capacitor to the test jig (glass epoxy board) in the same

manner and under the same conditions as (10). The capacitor shall

be subjected to a simple harmonic motion having a total amplitude

of 1.5mm, the frequency being varied uniformly between the approximate

limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return

to 10Hz, shall be traversed in approximately 1 minute.

D.F.

W.V.:25Vmin. ;0.025 max.

W.V.:16V/10V;0.035 max.

W.V.:6.3V/4V;0.05 max.

This motion shall be applied for a period of 2 hours in each 3 mutually

perpendicular directions (total of 6 hours).

12 Solderability

of Termination

75% of the terminations is to be soldered evenly Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

and continuously.

rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at

80 to 120℃ for 10 to 30 seconds. After preheating, immerse in

eutectic solder solution for 2±0.5 seconds at 230±5℃,or

Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5℃.

JEMCAS-00670A

■SPECIFICATIONS AND TEST METHODS

Specification

Appearance No marking defects.

Item

Test Method

13 Temperature

Cycle

Fix the capacitor to the supporting jig in the same manner and under

the same conditions as (10). Perform the five cycles according to the

four heat treatments listed in the following table. Let sit for 24±2

hours at room temperature, then measure.

Capacitance Within ±7.5%

Change

Step

Min.

Operating

Temp.＋0/-3

D.F.

W.V.:25Vmin. ;0.025 max.

Max.

Operating

Temp.+3/-0

Room

Temp.

Room

Temp.

W.V.:16V/10V;0.035 max.

W.V.:6.3V/4V;0.05 max.

Temp.(℃)

Time(min.)

30±3

2 to 3

30±3

2 to 3

I.R.

More than 10,000MΩ or 500Ω･F.

(whichever is smaller)

No failure

・Initial measurement

Dielectric

Strength

Perform a heat treatment at 150+0/-10°C for one houg and then let sit

for 24±2 hours at room temperature.

Perform the initial measurement.

14 Humidity

Appearance No marking defects.

Sit the capacitor at 40±2℃ and 90 to 95% humidity for 500±12

hours. Remove and let sit for 24±2 hours at room temperature,

then measure.

(Steady State)

Capacitance Within ±12.5%

Change

D.F.

I.R.

W.V.:10Vmin. ;0.05 max.

W.V.:6.3V/4V;0.075 max.

More than 1,000MΩ or 50Ω･F.

(whichever is smaller)

15 Humidity Load Appearance No marking defects.

Apply the rated voltage at 40±2℃ and 90 to 95% humidity

for 500±12 hours. Remove and let sit for 24±2 hours at room

temperature, then measure. The charge/discharge current

is less than 50mA.

Capacitance Within ±12.5%

Change

ꢀ

D.F.

I.R.

W.V.:10Vmin. ;0.05 max.

W.V.:6.3V/4V;0.075 max.

More than 500MΩ or 25Ω･F.

ꢀ

(whichever is smaller)

16 High

Temperature

Appearance No marking defects.

Apply 200% of the rated voltage for 1000±12 hours at the

maximum operating temperature ±3℃. Let sit for 24±2 hours at

room temperature,then measure.

Load

Capacitance Within ±12.5%

Change

The charge/discharge current is less than 50mA.

・Initial measurement

D.F.

I.R.

W.V.:10Vmin. ;0.05 max.

W.V.:6.3V/4V;0.075 max.

Apply 200% of the rated DC voltage for one hour at the

maximum operating temperature ±3℃. Remove and let

sit for 24±2 hours at room temperature. Perform initial

measurement.

More than 1,000MΩ or 50Ω･F.

(whichever is smaller)

JEMCAS-00670A

Package

LLM Type

1.Tape Carrier Packaging(Packaging Code:L/K)

1.1 Minimum Quantity(pcs./reel)

f180mm reel

f 330mm reel

Plastic Tape

Code : K

10000

Type

Plastic Tape

Code : L

4000

LLM21

LLM31

4000

10000

1.2 Dimensions of Tape

(in mm)

4.0±0.1

2.0±0.1

0.2±0.1

＋０．１

φ1.5

－０

2.5max

Code

LLM21

1.45±0.2

2.25±0.2

LLM31

1.9±0.2

3.5±0.2

JEMCAP-01913

Package

LLM Type

Fig 1 Package Chip

(in mm)

Chip

Fig2 Dimension of Reel

2.0±0.5

φ21±0.8

10±1.5

16.5 max

Fig3 Taping Diagram

Top Tape : Thickness 0.05

Feeding Hole : As specified in 1.2

Hole for Chip : As specified in 1.2

Base Tape : As specified in 1.2

JEMCAP-01913

Package

LLM Type

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.

(The sprocket holes are to the right as the tape is pulled toward the user.)

1.4 Part of the leader and part of the vacant section are attached as follows.

(in mm)

Tail vacant Section

Chip-mounting Unit Leader vacant Section

Leader Unit

(Top Tape only)

Direction

of Feed

160 min.

190 min.

210 min.

1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm

1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.

1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.

1.8 There are no jointing for top tape and bottom tape.

1.9 There are no fuzz in the cavity.

1.10 Break down force of top tape : 5N min.

1.11 Reel is made by resin and appeaser and dimension is shown in Fig 3.

There are possibly to change the material and dimension due to some impairment.

1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.

165 to 180°

Top Tape

1.13 Label that show the customer parts number, our parts number, our company name, inspection

number and quantity, will be put in outside of reel.

JEMCAP-01913

^!Caution

■ Limitation of use

Please contact our sales representatives or product engineers before using our products for the applications

listed below which require of our products for other applications than specified in this product.

ꢀꢀꢀ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment

ꢀꢀꢀ⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment

ꢀꢀꢀ⑧Disaster prevention / crime prevention equipment

⑨Data-processing equipment

ꢀꢀꢀ⑩Application of similar complexity and/or requirements to the applications listed in the above

■

Storage and

Operation condition

1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.

1-1. Store capacitors in the following conditions: Temperature of +5℃to +40℃and a Relative Humidity

of 20% to 70%.

(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity

conditions during storage may affect the solderability and the packaging performance

Please use product within six months of receipt.

(2) Please confirm solderability before using after six months.

Store the capacitors without opening the original bag.

Even if the storage period is short, do not exceed the specified atmospheric conditions.

1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result

in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,

hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).

1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused

by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and

electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity

conditions

JEMCAC-00641A

Caution

■Rating

1.Temperature Dependent Characteristics

1. The electrical characteristics of the capacitor can change with temperature.

1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature

changes.

The following actions are recommended in order to insure suitable capacitance values.

(1) Select a suitable capacitance for the operating temperature range.

(2) The capacitance may change within the rated temperature.

When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance

tolerance.

Example: a time constant circuit., please carefully consider the characteristics of these capacitors,

such as their aging, voltage, and temperature characteristics.

And check capacitors using your actual appliances at the intended environment and operating conditions.

□Typical temperature characteristics Char.R6 (X5R) □Typical temperature characteristics Char.R7 (X7R)

-5

-10

-15

-20

-75

-50

-25

100

Temperature (℃)

□Typical temperature characteristics Char.F5 (Y5V)

-20

-40

-60

-80

-100

-50

-25

100

Temperature (℃)

2.Measurement of Capacitance

1. Measure capacitance with the voltage and the frequency specified in the product specifications.

1-1. The output voltage of the measuring equipment may decrease when capacitance is high occasionally.

Please confirm whether a prescribed measured voltage is impressed to the capacitor.

1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage

applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

JEMCAC-00641A

Caution

3.Applied Voltage

1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications.

1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.

(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the

rated DC voltage.

When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the

rated DC voltage.

(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the

rated DC voltage.

Typical voltage applied to the DC capacitor

DC voltage

DC voltage+AC

AC voltage

Pulse voltage

（E：Maximum possible applied voltage.）

1-2. Influence of overvoltage

Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the

breakdown of the internal dielectric layers .

The time duration until breakdown depends on the applied voltage and the ambient temperature.

4. Applied Voltage and Self-heating Temperature

1. When the capacitor is used in a high-frequency voltage, pulse voltage, application,

be sure to take into account self-heating may be caused by resistant factors of the capacitor.

1-1. The load should be contained to the level such that when measuring at atomospheric temperature

of 25℃,the product's self-heating remains below 20℃ and surface temperature of the capacitor in the

actual circuit remains wiyhin the maximum operating temperature.

JEMCAC-00641A

Caution

5. DC Voltage and AC Voltage Characteristic

1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC

voltage applied.

Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.

1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure)

Please confirm the following in order to secure the capacitance.

(1) Whether the capacitance change caused by the

applied voltage is within the range allowed or not.

□DC voltage characteristics

(2) In the DC voltage characteristics, the rate of capacitance

change becomes larger as voltage increases.

-20

Even if the applied voltage is below the rated voltage.

When a high dielectric constant type capacitorꢀis in a

circuit that needs a tight (narrow) capacitance tolerance.

Example: a time constant circuit., please carefully

consider the characteristics of these capacitors, such as

their aging, voltage, and temperature characteristics.

And check capacitors using your actual appliances at the

intended environment and operating conditions.

-40

-60

-80

-100

DC Voltage (VDC)

2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.

Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.

□AC voltage characteristics

-10

-20

-30

-40

-50

-60

0.0

0.5

1.0

1.5

2.0

2.5

AC Voltage (Vr.ms.)

6. Capacitance Aging

1. The high dielectric constant type capacitors have the characteristic

in which the capacitance value decreases with passage of time.

When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance

tolerance. Example: a time constant circuit., please carefully consider the characteristics of these capacitors,

such as their aging, voltage, and temperature characteristics.

And check capacitors using your actual appliances at the intended environment and operating conditions.

JEMCAC-00641A

Caution

7.Vibration and Shock

1. The capacitors mechanical actress (vibration and shock) shall be specified for the use environment.

Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.

Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.

2. Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor.

Do not use a fallen capacitor because the quality and reliability may be deteriorated.

Crack

Floor

3. When printed circuit boards are piled up or handled, the corners of another printed circuit board

should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor.

Mounting printed circuit board

Crack

■Soldering and Mounting

1.Mounting Position

1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during

flexing or bending the printed circuit board.

1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing

or bending of the board.

ꢀ[Component Direction]

Locate chip

horizontal to the

direction in

which stress

acts

ꢀ[Chip Mounting Close to Board Separation Point]

Perforation

Chip arrangement

Worst A-C-(B~D) Best

Slit

ꢀ

JEMCAC-00641A

Caution

2.Information before mounting

1. Do Not re-use capacitors that were removed from the equipment.

2. Confirm capacitance characteristics under actual applied voltage.

3. Confirm the mechanical stress under actual process and equipment use.

4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.

5. Prior to use, confirm the Solderability for the capacitors that were in long-term storage.

6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.

7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.

Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.

3.Maintenance of the Mounting (pick and place) Machine

1. Make sure that the following excessive forces are not applied to the capacitors.

1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept

to a minimum to prevent them from any bending damage or cracking. Please take into account the

following precautions and recommendations for use in your process.

(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.

(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.

Suction Nozzle

ꢀ[Incorrect]

Deflection

Board

Board Guide

ꢀ[Correct]

Support Pin

2. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent

the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,

causing cracked chips. Also the locating claw, when worn out, imposes uneven forces on the chip

when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,

checked and replaced periodically.

JEMCAC-00641A

Caution

4-1.Reflow Soldering

1. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

[Standard Conditions for Reflow Soldering]

Infrared Reflow

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both the components and the PCB board.

Preheating conditions are shown in table 1. It is required to

keep the temperature differential between the solder and

the components surface (ΔT) as small as possible.

Temperature(℃)

Soldering

Peak Temperature

Gradual

Cooling

200℃

170℃

150℃

130℃

Preheating

2. Solderability of Tin plating termination chips might be

deteriorated when a low temperature soldering profile where

the peak solder temperature is below the melting point of

Tin is used. Please confirm the Solderability of Tin plated

termination chips before use.

Time

30-60 seconds

60-120 seconds

Vapor Reflow

Temperature(℃)

3. When components are immersed in solvent after mounting,

be sure to maintain the temperature difference (ΔT)

between the component and the solvent within the range

shown in the table 1.

Soldering

Gradual

Peak Temperature

Cooling

170℃

150℃

130℃

Preheating

Table 1

Part Number

Temperature Differential

Time

60-120 seconds

20 seconds

LLM21/LLM31

ΔT≦130℃

[Allowable Soldering Temperature and Time]

280

270

Recommended Conditions

Pb-Sn Solder

260

250

240

230

220

Lead Free Solder

Infrared Reflow

Vapor Reflow

230～240℃

Air

Peak Temperature

Atmosphere

230～250℃

240～260℃

Air

Air or N2

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

Soldering Time(sec.)

120

4. Optimum Solder Amount for Reflow Soldering

4-1. Overly thick application of solder paste results in

a excessive solder fillet height.

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause

the chips to crack.

4-2. Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in

chips breaking loose from the PCB.

0.2mm min.

4-3. Make sure the solder has been applied smoothly

to the end surface to a height of 0.2mm min.

in section

Inverting the PCB

Make sure not to impose any abnormal mechanical shocks to the PCB.

JEMCAC-00641A

Caution

4-4.Leaded Component Insertion

1. If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted,

chips may crack and solder joints may break.

Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warpi

5.Washing

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate,

resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs.

6.Electrical Test on Printed Circuit Board

1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a

capacitor after mounting on the printed circuit board.

1-1. Avoid bending printed circuit board by the pressure of a test pin, etc.

The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder joints.

Provide support pins on the back side of the PCB to prevent warping or flexing.

1-2. Avoid vibration of the board by shock when a test pin contacts a printed circuit board.

□Not recommended

□Recommended

←Peeling

←Support pin

←Test-pin

JEMCAC-00641A

Caution

7.Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is

caused by bending or twisting the board.

1-1. In cropping the board, the stress as shown right may cause the capacitor to crack.

Try not to apply this type of stress to a capacitor.

Bending

Twisting

2. Check of the cropping method for the printed circuit board in advance.

2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus to prevent the

mechanical stress which can occur to the board.

(1) Example of a suitable jig

Recommended example: the board should be pushed as close to the near the cropping jig as possible

and from the back side of board in order to minimize the compressive stress applied to capacitor.

Not recommended example* when the board is pushed at a point far from the cropping jig and from

the front side of board as below, the capacitor may form a crack caused by the tensile stress applied

to capacitor.

Recommended

Not recommended

Direction of

load

Outline of jig

Direction of

load

Printed circuit

board

Load point

V-groove

Components

Printed circuit

board

Printed circuit

board

Load point

Components

Board cropping jig

(2) Example of a suitable machine

An outline of a printed circuit board cropping machine is shown as follows. Along the lines with the

V-grooves on printed circuit board, the top and bottom blades are aligned to one another when

cropping the board.

The misalignment of the position between top and bottom blades may cause the capacitor to crack.

Outline of machine

Top blade

Principle of operation

Top blade

Cross-section diagram

Printed circuit board

Bottom blade

Printed circuit board

V-groove

Not recommended

Top-bottom misalignment Left-right misalignment Front-rear misalignment

Recommended

Top blade

Bottom blade

JEMCAC-00641A

Caution

■Others

1. Under Operation of Equipment

1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of

a electric shock.

1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).

Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.

1-3. Confirm the environment in which the equipment will operation is under the specified conditions.

Do not use the equipment under the following environment.

(1) Being spattered with water or oil.

(2) Being exposed to direct sunlight.

(3) Being exposed to Ozone, ultraviolet rays or radiation.

(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)

(5) Any vibrations or mechanical shocks exceeding the specified limits.

(6) Moisture condensing environments.

1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.

2. Others

2-1. In an Emergency

(1) If the equipment should generate smoke, fire or smell, immediately turn off or unplug the equipment.

If the equipment is not turned off or unplugged, the hazards may be worsened by supplying

continuous power.

(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be

caused by the capacitors high temperature.

2-2. Disposal of waste

When capacitors are disposed, they must be burned or buried by the industrial waste vender with

the appropriate licenses.

2-3. Circuit Design

LLM Series capacitors in this specification are not safety recognized products.

2-4. Remarks

Failure to follow the cautions may result, worst case, in a short circuit and smoking when

the product is used.

The above notices are for standard applications and conditions. Contact us when the products are

used in special mounting conditions.

Select optimum conditions for operation as they determine the reliability of the product after assembly.

The data herein are given in typical values, not guaranteed ratings.

JEMCAC-00641A

Notice

■Rating

1.Operating Temperature

1. The operating temperature limit depends on the capacitor.

1-1.Do not apply temperatures exceeding the upper operating temperature.

It is necessary to select a capacitor with a suitable rated temperature which will cover the operating

temperature range.

Also it is necessary to consider the temperature distribution in equipment and the seasonal temperature

variable factor.

1-2.Consider the self-heating of the capacitor

The surface temperature of the capacitor shall be the upper operating temperature or less when

including the self-heating factors.

2.Atmosphere surroundings (gaseous and liquid)

1. Restriction on the operating environment of capacitors.

1-1. The capacitor, when used in the above, unsuitable, operating environments may deteriorate

ꢀdue to the corrosion of the terminations and the penetration of moisture into the capacitor.

1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are

subject to moisture condensation.

1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of

ꢀꢀterminal electrodes may result in breakdown when the capacitor is exposed to corrosive or

volatile gases or solvents for long periods of time.

3.Piezo-electric Phenomenon

1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates

at specific frequencies and noise may be generated.

Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.

JEMCAC-00641A

Notice

■Soldering and Mounting

1.PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted

directly on the substrate.

They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates,

take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet

height.

1-2. It is possible for the chip to crack by the expansion and shrinkage of a metal board. Please

Pattern Forms

Prohibited

Correct

Chassis

Solder Resist

Solder (ground)

Placing Close to Chassis

Electrode Pattern

Lead Wire

Solder Resist

Placing of Chip

Components

and Leaded Components

Lead Wire

Soldering Iron

Solder Resist

Placing of Leaded

Components

after Chip Component

Solder Resist

Lateral Mounting

JEMCAC-00641A

Notice

2. Land Dimensions

2-1. Chip capacitor can be cracked due to the stress of PCB

bending / etc if the land area is larger than needed and has

an excess amount of solder.

Chip Capacitor

Please refer to the land dimensions in table 1 for reflow

soldering.

Please confirm the suitable land dimension by evaluating of the actual SET / PCB.

Table 1 Reflow Soldering Method

Dimensions

b, b'

c, c'

0.3

Part Number

LLM21

0.6～0.8

1.0

(0.3～0.5)

2.0～2.6

3.2～3.6

1.3～1.8

1.6～2.0

1.4～1.6

2.6

0.5

LLM31

(0.3～0.5)

0.4

0.8

(in mm)

b=(c-e)/2, b'=(d-f)/2

JEMCAC-00641A

Notice

2.Washing

1. Please evaluate a capacitor by actual cleaning equipment and condition surely

for confirming the quality and select the applicable solvent.

2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of

electrical characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.

3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the

performance of the capacitors.

3.Coating

1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during

ꢀcuring process.

The stress is affected by the amount of resin and curing contraction.

Select a resin with small curing contraction.

The difference in the thermal expansion coefficient between a coating resin or a molding resin and

capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and

lead to the deterioration of insulation resistance or dielectric breakdown.

Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.

A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic.

Using hygroscopic resins under high humidity conditions may cause the deterioration of the

insulation resistance of a capacitor.

An epoxy resin can be used as a less hygroscopic resin.

■Others

1.Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force

during transportation.

(1) Climatic condition

－low air temperature：－40℃

－change of temperature air/air：－25℃/＋25℃

－low air pressure：30 kPa

－change of air pressure：6 kPa/min

(2) Mechanical condition

Transportation shall be done in such a way that the boxes are not deformed and forces are not directly

passed on to the inner packaging.

1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.

(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may

occur in the ceramic body of the capacitor.

(2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the

surface of capacitor, the capacitor may crack and short-circuit.

1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.

The capacitor dropped accidentally during processing may be damaged.

JEMCAC-00641A

NOTE

1.Please make sure that your product has been evaluated in view of your specifications with our

product being mounted to your product.

2.Your are requested not to use our product deviating from this product specification.

3.We consider it not appropriate to include any terms and conditions with regard to the business

transaction in the product specifications, drawings or other technical documents. Therefore,

if your technical documents as above include such terms and conditions such as warranty clause,

product liability clause, or intellectual property infringement liability clause, they will be deemed to

be invalid.

JEMCAC-00641A

LLM215R71C473MA11# [MURATA]

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