LQB18NNR27K10# [MURATA]

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型号：	LQB18NNR27K10#
厂家：	muRata
描述：
文件：	总9页 (文件大小：229K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec. No. JELF243B-0034C-01

P.1/9

LQB18 Series Reference Specification

1. Scope

This reference specification applies to LQB18N series, Chip Coil.

2. Part Numbering

(ex.)

R22

(6)

(7)

(10)

(1)

(2)

(3) (4) (5)

(8) (9)

(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Category (5)Applications and Characteristics

(6)Inductance (7)Tolerance (8)Features (9)Electrode (10)Packaging (D:Taping / *B:Bulk)

*Bulk packing also available.

3. Rating

DC Resistance

(Ω max.)

Self

Rated

Current

(mA)

Inductance

Customer

Part Number

MURATA

Part Number

(min.)

Resonant

Frequency

(MHz min.)

Initial

Values

After

Values

(nH) Tolerance

Testing

LQB18NNR22J10D

LQB18NNR22K10D

LQB18NNR22M10D

LQB18NNR22N10D

LQB18NNR27J10D

LQB18NNR27K10D

LQB18NNR27M10D

LQB18NNR27N10D

LQB18NNR33J10D

LQB18NNR33K10D

LQB18NNR33M10D

LQB18NNR33N10D

LQB18NNR39J10D

LQB18NNR39K10D

LQB18NNR39M10D

LQB18NNR39N10D

LQB18NNR47J10D

LQB18NNR47K10D

LQB18NNR47M10D

LQB18NNR47N10D

LQB18NNR56J10D

LQB18NNR56K10D

LQB18NNR56M10D

LQB18NNR56N10D

J：±5%

K：±10%

220

450

400

300

0.37

0.47

0.55

0.68

0.95

M：±20%

N：±30%

J：±5%

K：±10%

M：±20%

N：±30%

J：±5%

K：±10%

M：±20%

N：±30%

J：±5%

270

330

390

470

560

0.45

0.58

0.85

K：±10%

M：±20%

N：±30%

J：±5%

K：±10%

M：±20%

N：±30%

J：±5%

K：±10%

M：±20%

N：±30%

• Operating Temperature : -55°C to +125°C

• Storage Temperature : -55°C to +125°C

4. Style and Dimensions

MURATA MFG.CO., LTD.

Spec. No. JELF243B-0034C-01

1.6 ± 0.15

P.2/9

0.8 ± 0.15

0.4 ± 0.2

■ Unit Mass (Typical value)

: Electrode

0.005g

(in : mm)

5. Marking

No marking.

6. Standard Testing Conditions

< Unless otherwise specified >

Temperature : Ordinary Temp. (15 °C to 35 °C )

< In case of doubt >

Temperature : 20°C±2 °C

Humidity : Ordinary Humidity (25%(RH) to 85%(RH))

Humidity : 60%(RH) to 70%(RH)

Atmospheric pressure : 86kPa to 106kPa

7. Specifications

7-1. Electrical Performance

No. Item Specification

Meet item 3.

Test Method

7-1-1 Inductance

7-1-2 Q

Measuring Frequency : 25MHz

Measuring Equipment : Agilent 4291A or the equivalent

Test Fixture : Agilent 16192A or the equivalent

7-1-3 SRF

7-1-4 DC

Meet item 3.

Measuring Equipment : Digital multi meter

Resistance

Rated

Current

Self temperature rise shall be The rated current is applied.

limited to 25°C max.

7-1-5

MURATA MFG.CO., LTD.

Spec. No. JELF243B-0034C-01

P.3/9

7-2. Mechanical Performance

No.

Item

Specification

Test Method

7-2-1 Appearance Meet item 4.

Visual Inspection and measured with Slide Calipers.

and

Dimensions

7-2-2 Bonding

Strength

Meet Table 1.

It shall be soldered on the substrate.

Applying Force (F) : 6.8N

Table 1

Applying Time : 5s±1s

Applied direction: Parallel to substrate

Appearance No damage

Side view

Ｆ

Meet item 3.

Resistance

Ｆ

R0.5

Substrate

7-2-3 Bending

Strength

It shall be soldered on the substrate.

Subsatrate: Glass-epoxy 100mm×40mm×1.6mm

Deflection : 1.0mm

Speed of Applying Force : 0.5mm/s

Keeping Time : 30s

Pressure jig

R340

Deflection

Product

45mm

It shall be soldered on the substrate.

7-2-4 Vibration

Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min

Total Amplitude : 1.5mm

Testing Time : A period of 2 hours in each of 3 mutually

perpendicular directions. (Total 6h)

7-2-5 Resistance

to Soldering

Heat

Pre-Heating : 150°C±10°C, 60s～90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 270°C±5°C

Immersion Time : 10s±0.5s

Immersion and emersion rates : 25mm/s

Then measured after exposure in the room condition for 48h±4h.

Products shall be no failure It shall be dropped on concrete or steel board.

7-2-6 Drop

after tested.

Method : free fall

Height : 75cm

Attitude from which the product is dropped : 3 direction

The number of times : 3 times for each direction (Total 9 times)

Flux : Ethanol solution of rosin, 25(wt)%

7-2-7 Solderability The electrodes shall be at

least 95% covered with new Pre-Heating : 150°C±10°C, 60s～90s

solder coating.

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 240°C±5°C

Immersion Time : 3s±1s

Immersion and emersion rates : 25mm/s

MURATA MFG.CO., LTD.

Spec. No. JELF243B-0034C-01

P.4/9

7-3. Environmental Performance

It shall be soldered on the substrate.

No.

Item

Specification

Test Method

7-3-1 Temperature Meet Table 1.

Cycle

1 cycle:

1 step: -55°C (+0°C, -3°C) / 30min±3min

2 step: Ordinary temp. / 10min to 15min

3 step: +125°C (+3°C, -0°C) / 30min±3min

4 step: Ordinary temp. / 10min to 15min

Total of 100 cycles

Then measured after exposure in the room condition for 48h±4h.

Temperature : 40°C±2°C

Humidity : 90%(RH) to 95%(RH)

Time : 1000h (+48h, -0h)

Then measured after exposure in the room condition for 48h±4h.

Temperature : 125°C±3°C

7-3-2 Humidity

7-3-3 Heat Life

Applying Current : Rated Current

Time : 1000h (+48h, -0h)

Then measured after exposure in the room condition for 48h±4h.

Temperature : -55°C±2°C

Time : 1000h (+48h, -0h)

7-3-4 Cold

Resistance

Then measured after exposure in the room condition for 48h±4h.

8. Specification of Packaging

8-1. Appearance and Dimensions (8mm-wide paper tape 4mm-pitch)

2.0±0.05

1.5 ^+0.1

4.0±0.1

-0

1.05±0.1

1.1max.

Direction of feed

(in mm)

(1) Taping

Products shall be packaged in the cavity of the base tape continuously and sealed by top tape and

bottom tape.

(2) Sprocket hole: The sprocket holes are to the right as the tape is pulled toward the user.

(3) Spliced point:The base tape and top tape have no spliced point

(4) Cavity:There shall not be burr in the cavity.

(5) Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are

not continuous. The specified quantity per reel is kept.

8-2. Tape Strength

(1) Pull Strength

Top tape

Bottom tape

5N min.

Top tape

165 to 180 degree

(2) Peeling off force of Top tape

0.1N to 0.6N (Minimum value is typical.)

*Speed of Peeling off: 300mm/ min

Bottom tape

Base tape

MURATA MFG.CO., LTD.

Spec. No. JELF243B-0034C-01

P.5/9

8-3. Taping Condition

(1) Standard quantity per reel: 4000pcs. / reel

(2) There shall be leader-tape (top tape and empty tape ) and trailer- tape (empty tape) as follows.

(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for

more than 5 pitch.

(4) Marking for reel

The following items shall be marked on a label and the label is stuck on the reel.

(Customer part number, MURATA part number, Inspection number (∗1), RoHS marking (∗2), Quantity, etc)

∗1) « Expression of Inspection No. »

□□ OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

Third, Fourth digit : Day

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D

(3) Serial No.

∗2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

(5) Outside package

These reels shall be packed in the corrugated cardboard package and the following items shall be marked

on a label and the label is stuck on the box.

(Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS

marking (∗2), Quantity, etc)

(6) Dimensions of reel and taping (leader-tape, trailer-tape)

Trailer

160 min.

Leader

2.0±0.5

Label

190 min.

210 min.

Empty tape

Top tape

13.0±0.2

60⁺¹

Direction of feed

21.0±0.8

-0

9.0

13.0±1.4

180 ⁺⁰

-3

(in mm)

8-4. Specification of Outer Case

Outer Case Dimensions

(mm)

Label

Standard Reel Quantity

in Outer Case (Reel)

186

∗ Above Outer Case size is typical. It depends on a quantity

of an order.

MURATA MFG.CO., LTD.

Spec. No. JELF243B-0034C-01

P.6/9

9. ！ Caution

9-1. Limitation of Applications

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or

property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements

(5) Medical equipment to the applications listed in the above

(6) Transportation equipment (vehicles, trains, ships, etc.)

10. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

10-1. Land pattern designing

• Standard land dimensions

Chip Coil

Soldering

Flow

Reflow

2.2 to 2.6

1.8 to 2.0

0.7

Solder Resist

Pattern

(in mm)

10-2. Soldering Conditions

Products can be applied to reflow and flow soldering.

(1) Flux, Solder

Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )

Do not use water-soluble flux.

Flux

Use Sn-3.0Ag-0.5Cu solder

Standard thickness of solder paste : 100 µm to 200 μm

Solder

(2) Soldering conditions

• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is

limited to 150°C max. Also cooling into solvent after soldering should be in such a way that the temperature

difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the

deterioration of product quality.

MURATA MFG.CO., LTD.

Spec. No. JELF243B-0034C-01

P.7/9

(3) soldering profile

• Flow soldering profile

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard Profile

Limit Profile

Pre-heating

Heating

150°C, 60s min.

265°C ±3°C, 5s max.

2 times

250°C, 4s～6s

Cycle of flow

2 times

• Reflow soldering profile

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150°C～180°C, 90s ± 30s

Heating

above 220°C, 30s～60s above 230°C, 60s max.

Peak temperature

Cycle of reflow

245°C ± 3°C

2 times

260°C, 10s

2 times

10-3. Reworking with soldering iron

• Pre-heating: 150°C, 1 min

• Soldering iron output: 80W max.

• Tip diameter: φ3mm max.

• Times : 2times max.

• Tip temperature: 350°C max.

• Soldering time : 3(+1, -0) seconds.

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the

ferrite material due to the thermal shock.

10-4. Solder Volume

Solder shall be used not to be exceeded as shown below.

Upper Limit

Recommendable

1/3T≦t≦T

(T: Chip thickness)

Accordingly increasing the solder volume, the mechanical stress to product is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

MURATA MFG.CO., LTD.

Spec. No. JELF243B-0034C-01

P.8/9

10-5. Attention regarding P.C.B. bending

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

Products shall be located in the sideways

direction (Length: a<b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

(2)Products location on P.C.B. separation.

Seam

Products (A, B, C, D) shall be located carefully so

that products are not subject to the mechanical

stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A>C>B ≅ D.

Slit

Length:a b

10-6. Mounting density

Add special attention to radiating heat of products when mounting the inductor near the products with

heating.

The excessive heat by other products may cause deterioration at joint of this product with substrate.

10-7. Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the Insulation

Resistance of the Ferrite material and / or corrosion of Inner Electrode may result from the use.

(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

10-8. Resin coating

The inductance value may change and/or it may affect on the product's performance due to high cure-stress

of resin to be used for coating / molding products. So please pay your careful attention when you select resin.

In prior to use, please make the reliability evaluation with the product mounted in your application set.

10-9. Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon

at the mounted products and P.C.B.

Power: 20W/ max. Frequency: 28kHz to 40kHz Time: 5 min max.

(3) Cleaner

1. Alternative cleaner

•Isopropyl alcohol (IPA)

2. Aqueous agent

•PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water

in order to remove the cleaner.

(5) Other cleaning

Please contact us.

10-10. Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or

twisting to the substrate when cropping the substrate, inserting and removing a connector from the

substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG.CO., LTD.

Spec. No. JELF243B-0034C-01

P.9/9

10-11. Storage Conditions

(1) Storage period

Use the products within 6 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

• Products should be stored in the warehouse on the following conditions.

Temperature : -10°C to 40°C

Humidity

: 15% to 85% relative humidity

No rapid change on temperature and humidity

• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of

electrode, resulting in poor solderability.

• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

• Products should be stored under the airtight packaged condition.

(3) Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical

shock.

11. △Notes

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

MURATA MFG.CO., LTD.

LQB18NNR27K10# [MURATA]

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