LQH2HPN2R2MJR# [MURATA]

;


型号：	LQH2HPN2R2MJR#
厂家：	muRata
描述：
文件：	总9页 (文件大小：396K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec No.: JELF243A_0119K-01

P1/9

CHIP COILS (CHIP INDUCTORS) LQH2HPN□□□□JR□ REFERENCE SPECIFICATION

1. Scope

This reference specification applies to chip coils (chip inductors) LQH2HPN_JR series for general electronic equipment.

2. Part Numbering

(Ex.)

220

Product ID Structure Dimension Application and Category Inductance Tolerance Dimension Other

Packaging

L: ø180 taping

*B: bulk

(L × W)

*B: Bulk packing is also available.

3. Part Number and Rating

characteristic

(T)

Operating temperature range (ambient temperature not including self-temperature rise)

(product temperature including self-temperature rise)

Storage temperature range

-40°C to +105°C

-40°C to +125°C

-40°C to +105°C

Rated current

(mA)^*3

Inductance

resistance

(Ω)

Self-resonant

frequency

(MHz min.)

Based on temperature

rise^*2

Customer

Part number

Murata

Part number

Nominal

value

(μH)

Based on

inductance

change^*1

Tolerance

(%)

Ambient

temperature temperature

85°C

2750

2400

2070

1810

1650

1420

1290

1000

830

105°C

1650

1440

1240

1080

990

LQH2HPNR47NJRL

LQH2HPN1R0NJRL

LQH2HPN1R2NJRL

LQH2HPN1R5NJRL

LQH2HPN2R2MJRL

LQH2HPN3R3MJRL

LQH2HPN4R7MJRL

LQH2HPN6R8MJRL

LQH2HPN100MJRL

LQH2HPN150MJRL

LQH2HPN220MJRL

0.47

1.0

1.2

1.5

2.2

3.3

4.7

6.8

N: ±30

0.031±20%

0.048±20%

0.055±20%

0.075±20%

190

120

100

3500

2600

2450

2200

1700

1450

1230

1050

830

M: ±20 0.092±20%

M: ±20

0.13±20%

0.17±20%

0.26±20%

0.38±20%

0.55±20%

0.84±20%

850

770

600

490

690

710

420

530

540

320

*1 When rated current is applied to the products, inductance will be within ±30% of initial inductance value range.

*2 When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C max

(ambient temperature 85°C max).

When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 20°C max

(ambient temperature 85°C to 105°C).

*3 Keep the temperature (ambient temperature plus self-generation of heat) under 125°C.

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

MURATA MFG CO., LTD

Spec No.: JELF243A_0119K-01

P2/9

5. Appearance and Dimensions

Unit mass (typical value): 0.023 g

6. Marking

No marking.

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

7.1 Inductance

Measuring equipment: Keysight 4192A or the

equivalent

Measuring frequency: 1 MHz

7.2 DC resistance

Meet chapter 3 ratings.

Measuring equipment: digital multimeter

7.3 Self-resonant

frequency

Measuring equipment: Keysight E4991A or the

equivalent

8. Mechanical Performance

No.

Item

Specification

Test method

8.1 Shear test

No significant mechanical damage or no Test substrate: glass-epoxy substrate

sign of electrode peeling off shall be

observed.

Force application direction:

Applying force: 5 N

Holding time: 5 s±1 s

MURATA MFG CO., LTD

Spec No.: JELF243A_0119K-01

No. Item

P3/9

Specification

Test method

8.2 Bending test

No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40

sign of electrode peeling off shall be

observed.

mm × 0.8 mm)

Pressurizing speed: 0.5 mm/s

Deflection: 2 mm

Holding time: 5 s

8.3 Vibration

Appearance shall have no significant

mechanical damage.

Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for

approx. 20 min

Total amplitude: total amplitude of 1.5 mm or

acceleration amplitude of 98 m/s², whichever is smaller

Test time: 3 directions perpendicular to each other, 2 h

for each direction (6 h in total)

8.4 Solderability

90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin content

be covered with new solder seamlessly. of 25(wt)% for 5 s to 10 s

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 240°C±5°C

Immersion time: 3 s±1 s

8.5 Resistance to

soldering heat

Appearance: No significant mechanical

damage shall be observed.

Flux: immersed in ethanol solution with a rosin content

of 25(wt)% for 5 s to 10 s

Inductance change rate: within ±20%

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 270°C±5°C

Immersion time: 10 s±1 s

Post-treatment: left at a room condition for 24 h±2 h

9. Environmental Performance

The product is soldered on a substrate for test.

No.

Item

Specification

Test method

9.1 Heat resistance

9.2 Cold resistance

9.3 Humidity

Appearance: No significant mechanical

damage shall be observed.

Inductance change rate: within ±10%

DC resistance change rate: within ±10%

Temperature: 105°C±2°C

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

Appearance: No significant mechanical

damage shall be observed.

Inductance change rate: within ±10%

DC resistance change rate: within ±10%

Temperature: -40°C±2°C

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

Appearance: No significant mechanical

damage shall be observed.

Inductance change rate: within ±10%

Temperature: 85°C±2°C

Humidity: 80% (RH) to 85% (RH)

Test time: 1000 h (+48 h, -0 h)

DC resistance change rate: within ±10% Post-treatment: left at a room condition for 24 h±2 h

9.4 Temperature cycle Appearance: No significant mechanical

damage shall be observed.

Single cycle conditions:

Step 1: -40°C±2°C/30 min±3 min

Inductance change rate: within ±10%

DC resistance change rate: within ±10%

Step 2: ordinary temperature/10 min to 15 min

Step 3: +105°C±2°C/30 min±3 min

Step 4: ordinary temperature/10 min to 15 min

Number of testing: 100 cycles

Post-treatment: left at a room condition for 24 h±2 h

MURATA MFG CO., LTD

Spec No.: JELF243A_0119K-01

P4/9

10. Specification of Packaging

10.1 Appearance and dimensions of tape (8 mm width/plastic tape)

2.3±0.1

2.8±0.1

1.3±0.1

(0.25)

(in mm)

* The dimensions of the cavity are measured at its bottom.

10.2 Taping specifications

Packing quantity

2000 pcs/reel

(Standard quantity)

Packing method

Feed hole position

Joint

The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.

The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.

The plastic tape and the cover tape are seamless.

Number of missing

products

Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

Break down force of plastic tape

Break down force of cover tape

10 N min.

5 N min.

10.4 Peeling off force of cover tape

Speed of peeling off

300 mm/min

Peeling off force

0.2 N to 0.7 N (The lower limit is for typical value.)

Cover tape

165 to 180 degree

Plastic tape

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

MURATA MFG CO., LTD

Spec No.: JELF243A_0119K-01

P5/9

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

10.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

186

* Above outer box size is typical. It depends on a

quantity of an order.

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea

equipment

(4) Power plant

control equipment

(5) Medical equipment

(6) Transportation equipment (vehicles, (7) Traffic signal

trains, ships, etc.) equipment

(8) Disaster/crime

prevention

equipment

(9) Data-processing

equipment

(10) Applications of similar complexity and/or reliability

requirements to the applications listed in the above

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

11.4 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,

etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated

corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of

product electrode, etc. We will not bear any responsibility for use under these environments.

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other

mounting method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and

the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

MURATA MFG CO., LTD

Spec No.: JELF243A_0119K-01

P6/9

12.1 Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering.

The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land

dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional

shift. If you use other land pattern, consider it adequately.

(in mm)

12.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

100°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

MURATA MFG CO., LTD

Spec No.: JELF243A_0119K-01

P7/9

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction to the mechanical stress.

Electrode

(Good example)

(Poor example)

Electrode

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

Perforation

Electrode

Slit

Electrode

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

MURATA MFG CO., LTD

Spec No.: JELF243A_0119K-01

P8/9

Recommended

Screw Hole

12.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

12.8 Cleaning

The product shall be cleaned under the following conditions.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in

mounted products and the PCB.

Item

Power

Requirement

20 W/L max.

Time

5 min max.

Frequency

(3) Cleaner

28 kHz to 40 kHz

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water

adequately and completely dry it so that no cleaner is left.

* For other cleaning, consult our technical department.

12.9 Storage and transportation

Storage period

Use the product within 12 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.

The recommended temperature range is -10°C to +40°C. The recommended relative humidity

range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the

electrode, resulting in poor solderability or corrosion of the coil wire of the product.

• Do not keep products in bulk packaging. Doing so may cause collision between the products or

between the products and other products, resulting in core chipping or wire breakage.

• Do not place the products directly on the floor; they should be placed on a palette so that they are

not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

12.10 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some

operating condition may cause corrosion of wire of coil, leading to wire breakage.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your

board.

MURATA MFG CO., LTD

Spec No.: JELF243A_0119K-01

P9/9

12.11 Handling of product

• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the

winding portion to prevent the breaking of wire.

• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

13.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our

product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG CO., LTD

LQH2HPN2R2MJR# [MURATA]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E