LQH31HZR75J03# [MURATA]

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型号：	LQH31HZR75J03#
厂家：	muRata
描述：
文件：	总9页 (文件大小：349K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Only

CHIP COIL（CHIP INDUCTORS）LQH31HZ□□□□03L

Murata Standard Reference Specification【AEC-Q200】

Spec No.JELF243A-9122E-01

P.1/9

1. Scope

This reference specification applies to Chip coil (Chip Inductors) LQH31HZ series for automotive Electronics based on

AEC-Q200 except for Power train and Safety.

2. Part Numbering

(ex) LQ

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W)

54N

and

L:Taping

Characteristics

3. Rating

・Operating Temperature Range.

-40 to + 85°C

・Storage Temperature Range.

-40 to + 85°C

Resistance

(Ω)

Self Resonant

Frequency

(MHz min)

Rated

Current

(mA)

Inductance

Customer

Part Number

MURATA

Part Number

(min)

ESD Rank

1C: 2kV

(nH)

Tolerance

K:±10%

LQH31HZ54NK03L

LQH31HZ95NK03L

LQH31HZR14J03L

LQH31HZR14K03L

LQH31HZR21J03L

LQH31HZR21K03L

LQH31HZR29J03L

LQH31HZR29K03L

LQH31HZR39J03L

LQH31HZR39K03L

LQH31HZR50J03L

LQH31HZR50K03L

LQH31HZR61J03L

LQH31HZR61K03L

LQH31HZR75J03L

LQH31HZR75K03L

LQH31HZR88J03L

LQH31HZR88K03L

0.035±30%

0.047±30%

800

650

920

790

145

215

290

390

500

610

750

880

0.061±30%

0.11±30%

0.17±30%

0.26±30%

0.44±30%

0.48±30%

0.79±30%

0.86±30%

500

430

360

300

270

240

220

200

700

520

420

330

260

250

190

180

J:±5%

K:±10%

4. Testing Conditions

《Unless otherwise specified》

Temperature : Ordinary Temperature / 15°C to 35°C

Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)

《In case of doubt》

Temperature

Humidity

: 20°C± 2°C

: 60%(RH) to 70%(RH)

Atmospheric Pressure : 86kPa to 106 kPa

5. Appearance and Dimensions

2.3±0.2

1.6±0.2

■Unit Mass (Typical value)

3.2±0.3

0.029 g

1.6±0.2

 No Marking.

0.7 0.7

min min

0.7

min

(in mm)

MURATA MFG.CO., LTD

Reference Only

Spec No.JELF243A-9122E-01

P.2/9

6. Electrical Performance

No.

Item

Specification

Test Method

Measuring Equipment :

KEYSIGHT E4991A or equivalent

Measuring Frequency : 1MHz

6.1 Inductance

Inductance shall meet item 3.

Measuring Method:See P.8

<Electrical Performance:

Measuring Method of Inductance>

6.2

Q shall meet item 3.

Measuring Equipment :

KEYSIGHT 4191A or equivalent

Measuring Frequency : 100MHz

6.3 DC

Resistance

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment : Digital multi meter

6.4 Self Resonant

Frequency(S.R.F)

Measuring Equipment :

KEYSIGHT E4991A or equivalent

6.5 Rated Current

Self temperature rise shall be

limited to 20 °C max.

The rated Current is applied.

Inductance Change : within ± 10 %

7. AEC-Q200 Requirement

7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)

AEC-Q200 Rev.D issued June. 1 2010

AEC-Q200

Murata Specification / Deviation

Stress

Test Method

High

Temperature

Exposure

1000hours at 85 deg C

Set for 24hours at room

temperature, then measured.

Meet Table A after testing.

Table A

Appearance

No damage

Within ±5%

Within ±20%

Inductance change (at 100MHz)

Q change

Temperature Cycling 1000cycles

-40 deg C to + 85deg C

Meet Table A after testing.

Set for 24hours at room

temperature,then

measured.

Biased Humidity

Operational Life

1000hours at 85 deg C, 85%RH Meet Table A after testing.

unpowered..

Apply 85 deg C 1000 hours

Set for 24hours at room

Meet Table A after testing.

temperature, then measured

External Visual

Visual inspection

No abnormalities

No defects

10 Physical Dimension Meet ITEM 5

（Style and Dimensions）

12 Resistance

to Solvents

Per

MIL-STD-202

Method 215

Not Applicable

13 Mechanical Shock Per MIL-STD-202

Method 213

Meet Table A after testing.

Condition C

100g’s/6ms/Half sine

MURATA MFG.CO., LTD

Reference Only

Spec No.JELF243A-9122E-01

P.3/9

AEC-Q200

Murata Specification / Deviation

Stress

Test Method

5g's for 20 minutes,

14 Vibration

Meet Table A after testing.

12cycles eah of 3 orientations

Test from 10-2000Hz.

12cycles each of 3 orientations

15 Resistance

No-heating

Meet Table A after testing.

to Soldering Heat

Solder temperature

260C+/-5 deg C

Immersion time 10s

17 ESD

Per AEC-Q200-002

ESD Rank: Refer to Item 3. Rating.

No defects

18 Solderbility

Per J-STD-002

Method b : Not Applicable

95% of the terminations is to be soldered.

(Except exposed wire)

19 Electrical

Measured : Inductance

Per UL-94

No defects

Characterization

20 Flammability

21 Board Flex

Not Applicable

Epoxy-PCB(1.6mm)

Deflection 2mm(min)

60s minimum holding time

Murata deviation request: 30s

Meet Table B after testing.

Table B

Appearance

No damage

Within ±10％

DC resistance change

22 Terminal Strength Per AEC-Q200-006

A force of 17.7N for 60s

No defect

Murata deviation request: 10N for 5s

8. Specification of Packaging

8.1 Appearance and Dimensions of plastic tape

+0.1

_※Lead-in / out wire



1.5

-0

1.75±0.1

0.2

(

)

The packing directions of the chip coil

※

in taping are unified with the in/out

positions of the lead wire.

4.0±0.1

2.0±0.05

1.9±0.1

2.0±0.1

(in mm)

Direction of feed

Dimension of the Cavity is measured at the bottom side.

(1) Packing quantity (standard quantity)

2,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

MURATA MFG.CO., LTD

Reference Only

Spec No.JELF243A-9122E-01

P.4/9

8.3 Pull Strength

Plastic tape

10N min.

Cover tape

8.4 Peeling off force of cover tape

165 to 180 degree

Cover tape

Plastic tape

Speed of Peeling off

300mm / min

0.2N to 0.7N

(minimum value is typical)

Peeling off force

8.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

8.6 Marking for reel

Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･

1) <Expression of Inspection No.>

□□ OOOO 

(1) (2) (3

)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

Third, Fourth digit : Day

: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

(3) Serial No.

2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

8.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,

Quantity, etc ･･･

8.8. Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

186



Above Outer Case size is typical. It depends on a quantity

of an order

MURATA MFG.CO., LTD

Reference Only

Spec No.JELF243A-9122E-01

P.5/9

Caution

9.1 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1)Aircraft equipment

(6)Transportation equipment (trains, ships, etc.)

(7)Traffic signal equipment

(8)Disaster prevention / crime prevention equipment

(9)Data-processing equipment

(10)Applications of similar complexity and /or reliability

requirements to the applications listed in the above

(2)Aerospace equipment

(3)Undersea equipment

(4)Power plant control equipment

(5)Medical equipment

9.2 Precautions on rating

Do not use the products in excess of their rated current. Doing so may cause the product to generate heat, resulting in

short circuit between wires, wire breakage, or melted solder, which may cause dropping of parts.

9.3 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by

the abnormal function or the failure of our product.

9.4 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur

dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the

previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration

due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.

10. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

10.1 Land pattern designing

Recommended land patterns for flow and reflow soldering are as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended pattern. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Chip Coil

Land

Solder resist

1.0

4.5

1.5

(in mm)

10.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 200μm to 300μm

Solder

Other flux (except above) Please contact us for details, then use.

MURATA MFG.CO., LTD

Reference Only

Spec No.JELF243A-9122E-01

P.6/9

10.3 Flow soldering / Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product surface is

limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature

difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the

deterioration of product quality.

Soldering profile

(1)Flow soldering profile

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard Profile

Limit Profile

Pre-heating

Heating

150°C、60s min.

250°C、4s～6s

265°C±3°C、5s

Cycle of flow

2 times

(2)Reflow soldering profile

Temp.

(℃)

260℃

230℃

245℃±3℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150～180°C 、90s±30s

above 220°C、30s～60s above 230°C、60s max.

Heating

Peak temperature

Cycle of reflow

245±3°C

2 times

260°C,10s

2 times

MURATA MFG.CO., LTD

Reference Only

Spec No.JELF243A-9122E-01

P.7/9

10.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

ø 3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the products due to the thermal shock.

10.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

1/3T≦t≦T

Recommendable

T: Lower flange thickness

10.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Electrode

Products shall be located in the sideways

direction (Length:a

mechanical stress.

<b) to the

(Good example)

Poor example）

Electrode

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

D 1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Seam

Electrode

Slit

Electrode

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Recommended

Screw Hole

MURATA MFG.CO., LTD

Reference Only

Spec No.JELF243A-9122E-01

P.8/9

10.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for alcohol type cleaner.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon

at the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

1. Alternative cleaner

Frequency : 28kHz to 40kHz

Time : 5 min max.

・

Isopropyl alcohol (IPA)

2. Aqueous agent

・

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in

order to remove the cleaner.

(5) Other cleaning

Please contact us.

10.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or

operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis

under some operating condition may cause corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on

your board.

10.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to

the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core

10.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to

the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw

to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

10.11 Storage and Handing Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature

Humidity

-10 °C to 40 °C

15 % to 85 % relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases

such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the

breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

11.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD

Reference Only

Spec No.JELF243A-9122E-01

P.9/9

(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.

V₁

I₁

V₂

I ₂

Test Head

Test fixture

Product

(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.

V₁

I ₁

V₂

I ₂

Zm=

，

Zx=

(3) Thus,the relation between Zx and Zm is following;

Zm-β

where, α= D / A =1

β= B / D =Zsm-(1-Yom Zsm)Zss

Zx=

1-ZmΓ

Γ= C / A =Yom

Zsm : measured impedance of short chip

Zssa: residual impedance of short chip (0.771nH)

Yom: measured admittance when opening the fixture

(4) Lx and Qx shall be calculated with the following equation.

Im(Zx)

Re(Zx)

Lx : Inductance of chip coil

Qx : Q of chip coil

Lx=

Qx =

2πf

: Measuring frequency

MURATA MFG.CO., LTD

LQH31HZR75J03# [MURATA]

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