LQH32MN560J23# [MURATA]

;


型号：	LQH32MN560J23#
厂家：	muRata
描述：
文件：	总9页 (文件大小：361K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Onl

SpecNo.JELF243A-0163C-01

P1/10

CHIP COIL（CHIP INDUCTORS）LQH32MN□□□□23L REFERENCE SPECIFICATION

1. Scope

This reference specification applies to LQH32MN Series, Chip coil (Chip Inductors).

2. Part Numbering

(ex)

1R0

Applications Category Inductance Tolerance Features

and

Product ID

Structure Dimension

Electrode Packaging

(L×W)

L:Taping

Characteristics

3. Rating

・Operating Temperature Range

・Storage Temperature Range.

-40 to +85°C

Self

Inductance

Resistance

( max)

Rated

Customer

MURATA

(min.)

Resonant

Current

Frequency

(mA)

Tolerance

Part Number

(H)

(%)

(MHz min)

LQH32MN1R0M23L

LQH32MN1R2M23L

LQH32MN1R5K23L

LQH32MN1R8K23L

LQH32MN2R2K23L

LQH32MN2R7K23L

LQH32MN3R3K23L

LQH32MN3R9K23L

LQH32MN4R7K23L

LQH32MN5R6K23L

LQH32MN6R8K23L

LQH32MN8R2K23L

LQH32MN100K23L

LQH32MN100J23L

LQH32MN120K23L

LQH32MN120J23L

LQH32MN150K23L

LQH32MN150J23L

LQH32MN180K23L

LQH32MN180J23L

LQH32MN220K23L

LQH32MN220J23L

LQH32MN270K23L

LQH32MN270J23L

LQH32MN330K23L

LQH32MN330J23L

LQH32MN390K23L

LQH32MN390J23L

LQH32MN470K23L

LQH32MN470J23L

LQH32MN560K23L

LQH32MN560J23L

LQH32MN680K23L

LQH32MN680J23L

LQH32MN820K23L

LQH32MN820J23L

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

0.5

0.6

445

M:±20

100

425

400

390

370

320

300

290

270

250

240

225

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.5

1.6

K:±10

1.8

2.0

2.2

2.5

2.8

3.1

3.5

3.9

4.3

4.9

5.5

6.2

190

180

170

165

150

125

115

110

100

K:±10

J:± 5

9.0

8.5

MURATA MFG.CO., LTD

Reference Onl

Inductance

SpecNo.JELF243A-0163C-01

P2/10

Self

Rated

Customer

Part Number

MURATA

Resonant

Frequency

(MHz min)

Resistance

Current

(mA)

Tolerance

(%)

Part Number

(min.)

(H)

( max)

LQH32MN101K23L

LQH32MN101J23L

LQH32MN121K23L

LQH32MN121J23L

LQH32MN151K23L

LQH32MN151J23L

LQH32MN181K23L

LQH32MN181J23L

LQH32MN221K23L

LQH32MN221J23L

LQH32MN271K23L

LQH32MN271J23L

LQH32MN331K23L

LQH32MN331J23L

LQH32MN391K23L

LQH32MN391J23L

LQH32MN471K23L

LQH32MN471J23L

LQH32MN561K23L

LQH32MN561J23L

100

7.0

8.0

7.5

7.0

6.0

5.5

120

150

180

220

270

330

390

470

560

9.3

10.2

11.8

12.5

13.0

22.0

25.0

28.0

K:±10

J:± 5

5.0

4. Testing Conditions

Unless otherwise specified

Temperature : Ordinary Temperature (15 to 35°C)

In case of doubt

Temperature : 20 ± 2°C

Humidity

: Ordinary Humidity

(25 to 85 %(RH))

2.5±0.2

Humidity

: 60 to 70 %(RH)

Atmospheric Pressure : 86 to 106 kPa

5. Appearance and Dimensions

2.5±0.2

3.2±0.3

■Unit Mass (Typical value)

0.060g

No marking.

※

(in mm)

0.9

±0.3

1.3

±0.2

0.9

±0.3

MURATA MFG.CO., LTD

Reference Onl

SpecNo.JELF243A-0163C-01

P3/10

6. Electrical Performance

No.

Item

Specification

Test Method

6.1 Inductance

Inductance shall meet item 3.

Measuring Equipment : KEYSIGHT 4192A or equivalent

Measuring Frequency : 1MHz / 1.0 to 390 μH

1kH / 470 to 560 μH

6.2

Q shall meet item 3.

Measuring Equipment : KEYSIGHT 4192A or equivalent

Measuring Frequency : 1MHz / 1.0 to 82μH

796kHz / 100 to 560μH

6.3 DC Resistance

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment : Digital multi meter

6.4 Self Resonant

Frequency(S.R.F)

Measuring Equipment : KEYSIGHT 4291A or equivalent

6.5 Rated Current

Self temperature rise shall be limited to The rated current is applied.

20°C max.

Inductance Change : within ± 10%

6.6 Temperature

Characteristics

Temperature Coefficient

220 to 1400 PPM/°C

Temperature coefficient on the basis of step 3 shall meet

specification after tested as follows.It shall be subjected to

the condition of Table 1, and its inductanse shall be

measured at each step after reaching the thermal

equilibrium and be calculated.

Table 1

Step1 / +20±2°C

Step2 / -25±2°C

Step3 / +20±2°C

Step4 / +85±2°C

Step5 / +20±2°C

7. Mechanical Performance

No.

Item

Specification

Test Method

Substrate : Glass-epoxy substrate

7.1 Shear Test

Chip coil shall not be damaged.

Applied Direction

Chip Coil

Substrate

Force : 10N

Hold Duration : 5±1s

7.2 Bending Test

Chip coil shall not be damaged.

Substrate : Glass-epoxy substrate

(100  40  1.6mm)

Speed of Applying Force : 1mm / s

Deflection : 2mm

Hold Duration : 30 s

Pressure jig

R340

Deflection

Product

(in mm)

7.3 Vibration

Oscillation Frequency : 10 to 55 to 10Hz for 1 minute

Total Amplitude : 1.5mm

Testing Time : A period of 2 hours in each of

3 mutually perpendicular directions.

(Total 6 hours)

MURATA MFG.CO., LTD

Reference Onl

SpecNo.JELF243A-0163C-01

No. Item

P4/10

Specification

Test Method

Flux : Ethanol solution of rosin, 25(wt)%

(Immersed for 5s to 10s)

7.4 Solderability

The wetting area of the electrode shall

be at least 90% covered with new solder

coating.

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating : 150±10°C / 60 to 90seconds

Solder Temperature : 240±5°C

Immersion Time : 3±1 s

7.5 Resistance to

Soldering Heat

Appearance: No damage

Inductance Change: within ± 5%

Flux : Ethanol solution of rosin, 25(wt)%

(Immersed for 5s to 10s)

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating : 150±10°C / 60 to 90seconds

Solder Temperature : 270±5°C

Immersion Time : 10±1 s

Then measured after exposure in the room condition

for 24±2 hours.

8. Environmental Performance (It shall be soldered on the substrate.)

No.

Item

Specification

Test Method

Temperature : 85±2°C

Time : 1000h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

8.1 Heat Resistance

8.2 Cold Resistance

8.3 Humidity

Appearance:No damage

Inductance Change : within ±5%

Q-factor Change : within ±20%

Temperature : -40±2°C

Time : 1000h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

Temperature : 40±2°C

Humidity : 90 to 95%(RH)

Time : 1000h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

8.4 Temperature

Cycle

1 cycle :

1 step : -40±2°C / 30±3 min

2 step : Ordinary temp. / 10 to 15 min

3 step : +85±2°C / 30±3 min

4 step : Ordinary temp. / 10 to 15 min

Total of 10 cycles

Then measured after exposure in the room condition

for 24±2 hours.

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

+0.1

Lead-in/out wire

※



1.5

-0

0.2

(

)

The packing directions of the chip coil

※

in taping are unified with the in/out

positions of the lead wire.

Dimension of the Cavity is measured

at the bottom side.

4.0±0.1

(in mm)

2.1±0.1

2.9±0.2

2.0±0.05

Direction of feed

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0163C-01

P5/10

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

2,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and are not

continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Embossed carrier tape

10N min.

5N min.

Cover tape

9.4 Peeling off force of cover tape

165 to 180 degree

Cover tape

Plastic tape

Speed of Peeling off

300mm/min

0.2 to 0.7N

(minimum value is typical)

Peeling off force

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･

1) <Expression of Inspection No.>

□□OOOO 

(1) (2) (3

)

(1) Factory Code

(2) Date

First digit

Second digit

: Year / Last digit of year

: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

Third, Fourth digit : Day

(3) Serial No.

2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,

Quantity, etc ･･･

MURATA MFG.CO., LTD

Reference Onl

SpecNo.JELF243A-0163C-01

P6/10

9.8. Specification of Outer Case

Outer Case Dimensions(mm)

Label

Standard Reel Quantity

in Outer Case (Reel)

186



Above Outer Case size is typical. It depends on a quantity of an order.

10.

Caution

10.1 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability for

the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and /or reliability requirements

to the applications listed in the above

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

10.2 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.],

chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas

environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc.

We will not bear any responsibility for use under these environments.

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Recommended land patterns for flow and reflow soldering are as follows:

These have been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability

may be affected, or result to "position shift" in soldering process.

Flow Soldering

Reflow Soldering 

5.5

Chip Coil

Land

Solder Resist

1.0 1.3 1.0

1.3

(in mm)

 Applicable to flow soldering.

11.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 200μm to 300μm

Solder

Other flux (except above) Please contact us for details, then use.

MURATA MFG.CO., LTD

Reference Onl

SpecNo.JELF243A-0163C-01

11.3 Flow soldering conditions / Reflow soldering conditions

P7/10

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to

100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of

product quality.

Soldering profile

(1)Flow soldering profile

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard Profile

Limit Profile

Pre-heating

Heating

150°C、60s min.

250°C、4s～6s

265°C±3°C、5s

Cycle of flow

2 times

1 time

(2)Reflow soldering profile

Temp.

(℃)

260℃

230℃

245℃±3℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150～180°C 、90s±30s

Heating

above 220°C、30s～60s

245±3°C

above 230°C、60s max.

260°C,10s

Peak temperature

Cycle of reflow

2 times

1 time

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0163C-01

P8/10

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on

the products due to the thermal shock.

11.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

1/3T≦t≦T

Recommendable

(T: Lower flange thickness)

11.6 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways direction

(Length: a b) to the mechanical stress.



Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

D 1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

Seam

1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Slit



Length:a b

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Recommended

Screw Hole

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-0163C-01

P9/10

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted

products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

1. Alternative cleaner

Frequency : 28kHz to 40kHz

Time : 5 minutes max.

・Isopropyl alcohol (IPA)

2. Aqueous agent

・PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to

remove the cleaner.

(5) Other cleaning

Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition

etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition

may cause corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board.

11.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to

the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

11.11 Storage and Handling Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature : -10 ~ 40°C

Humidity

: 15 to 85% relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas

or acid, or it may cause oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and

the breaking of winding wire caused by the collision between the products.

・

Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

・

12. Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your

product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering

MURATA MFG.CO., LTD

LQH32MN560J23# [MURATA]

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