LQH32NH100J23# [MURATA]
;型号: | LQH32NH100J23# |
厂家: | muRata |
描述: | |
文件: | 总9页 (文件大小:343K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Reference Only
CHIP COIL(CHIP INDUCTORS)LQH32NH□□□□23L
Murata Standard Reference Specification【AEC-Q200】
SpecNo.JELF243A-9146E-01
P1/9
1. Scope
This reference specification applies to Wire Wound Chip Coil (Chip Inductors) LQH32NH Series for Automotive Electronics
based on AEC-Q200.
2. Part Numbering
(ex)
LQ
H
32
N
H
1R0
M
2
3
L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
L:Taping
Characteristics
3. Rating
・Operating Temperature Range.
-40 to +125°C
・Storage Temperature Range.
-40 to +125°C
Self
Inductance
DC Resistance
Rated
Current
(mA)
Customer’s
Part Number
MURATA
Part Number
Q
Resonant
Frequency
(MHz min.)
ESD
5A : 8kV
Tolerance
Tolerance (min.)
(%)
(H)
()
(%)
LQH32NH1R0M23L
LQH32NH1R2J23L
LQH32NH1R5J23L
LQH32NH1R8J23L
LQH32NH2R2J23L
LQH32NH2R7J23L
LQH32NH3R3J23L
LQH32NH3R9J23L
LQH32NH4R7J23L
LQH32NH5R6J23L
LQH32NH6R8J23L
LQH32NH8R2J23L
LQH32NH100J23L
LQH32NH120J23L
LQH32NH150J23L
LQH32NH180J23L
LQH32NH220J23L
LQH32NH270J23L
LQH32NH330J23L
LQH32NH390J23L
LQH32NH470J23L
LQH32NH560J23L
LQH32NH680J23L
LQH32NH820J23L
LQH32NH101J23L
LQH32NH121J23L
LQH32NH151J23L
LQH32NH181J23L
LQH32NH221J23L
LQH32NH271J23L
LQH32NH331J23L
LQH32NH391J23L
LQH32NH471J23L
LQH32NH561J23L
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
M:±20
0.06
0.07
0.08
0.09
0.097
0.15
0.20
0.14
0.21
0.32
0.36
0.40
0.34
0.50
0.50
0.64
0.74
1.00
1.14
1.27
1.46
2.00
2.25
3.25
3.65
4.20
4.85
7.60
8.45
9.70
11.0
12.4
14.1
14.6
100
90
85
80
75
70
65
60
55
50
45
40
35
30
780
720
675
635
610
495
425
510
420
335
315
300
325
25
12
270
15
35
25
18
235
220
190
175
170
155
130
125
100
95
22
± 20
5A
27
J:± 5
20
33
39
16
15
13
12
11
47
56
68
82
40
100
120
150
180
220
270
330
390
470
560
10
85
8.0
6.0
5.5
80
60
55
50
45
5.0
4.0
50
40
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-9146E-01
P2/9
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature (15 to 35°C)
Humidity : Ordinary Humidity (25 to 85 %(RH))
《In case of doubt》
Temperature
Humidity
: 20 ± 2°C
: 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
5. Appearance and Dimensions (No marking)
No Marking.
(in mm)
■Unit Mass (Typical value)
0.060 g
6. Electrical Performance
No. Item
6.1 Inductance
Specification
Test Method
Inductance shall meet item 3.
Measuring Equipment:KEYSIGHT 4192A or equivalent
Measuring Frequency:1MHz / 1.0 to 390μH
1kHz / 470 to 560μH
6.2
Q
Measuring Equipment:KEYSIGHT 4192A or equivalent
Measuring Frequency:1MHz / 1.0 to 82μH
796kHz / 100 to 560μH
6.2 DC Resistance
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
Measuring Equipment:Digital multi meter
Measuring Equipment:KEYSIGHT E4991A or equivalent
The rated current is applied.
6.3 Self Resonant
Frequency(S.R.F)
6.4 Rated Current
Self temperaturer rise shall be
limited to 20°C max.
Inductance Change:within ± 10%
7. AEC-Q200 Requirement
7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
Murata Specification / Deviation
No
Stress
Test Method
3
High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room temperature,
then measured.
Meet Table A after testing.
Table A
Appearance
No damage
Inductance change Within ±5%
4
Temperature Cycling 1000cycles
-40 deg C to + 125deg C
Meet Table A after testing.
Set for 24hours at room
temperature,then
measured.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-9146E-01
P3/9
AEC-Q200
Murata Specification / Deviation
No
Stress
Test Method
7
Biased Humidity
1000hours at 85 deg C, 85%RH
unpowered..
Meet Table A after testing.
Meet Table A after testing.
8
Operational Life
Apply 125 deg C 1000 hours
Set for 24hours at room temperature,
then measured
9
External Visual
Visual inspection
No abnormalities
10 Physical Dimension
Meet ITEM 5 (Style and Dimensions) No defects
12 Resistance to
Solvents
Per
MIL-STD-202
Method 215
Not Applicable
13 Mechanical Shock
14 Vibration
Per MIL-STD-202
Method 213
100g’s/6ms/Half sine
Meet Table A after testing.
Meet Table A after testing.
5g's for 20 minutes,
12cycles eah of 3 orientations
Test from 10-2000Hz.
12cycles each of 3 orientations
15 Resistance
to Soldering Heat
No-heating
Meet Table A after testing.
Solder temperature
260C+/-5 deg C
Immersion time 10s
17 ESD
Per AEC-Q200-002
Per J-STD-002
ESD Rank: Refer to Item 3. Rating.
No defects
18 Solderbility
Method B : Not Applicable
95% of the terminations is to be soldered.
(Except exposed wire)
19 Electrical
Measured : Inductance
Per UL-94
No defects
Characterization
20 Flammability
21 Board Flex
Not Applicable
Epoxy-PCB(1.6mm)
Murata deviation request: 5s
Deflection 2mm(min)
60s minimum holding time
Meet Table B after testing.
Table B
Appearance
No damage
Within ±10%
DC resistance change
22 Terminal Strength
Per AEC-Q200-006
No defects
A force of 17.7N for 60s
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-9146E-01
P4/9
8. Specification of Packaging
8.1 Appearance and Dimensions of plastic tape
1.5+0.1
Lead-in/out wire
※
-0
0.2
(
)
The packing directions of the chip coil
※
in taping are unified with the in/out
positions of the lead wire.
4.0±0.1
4.0±0.1
2.1±0.1
(in mm)
2.9±0.2
Dimension of the Cavity is measured at the bottom side.
8.2 Specification of Taping
2.0±0.05
Direction of feed
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
8.3 Pull Strength
Embossed carrier tape
10N min.
5N min.
Cover tape
8.4 Peeling off force of cover tape
165 to 180 degree
F
Speed of Peeling off
300mm/min
Cover tape
Plastic tape
0.2 to 0.7N
(minimum value is typical)
Peeling off force
8.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-9146E-01
P5/9
8.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.>
□□ OOOO
(1) (2) (3)
(1) Factory Code
(2) Date
First digit
Second digit
: Year / Last digit of year
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
8.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,
Quantity, etc ・・・
8.8 Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity in
Outer Case (Reel)
Label
W
D
H
186
186
93
5
H
Above Outer Case size is typical. It depends on a quantity
of an order.
D
W
9.
Caution
9.1 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
9.2 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused
by the abnormal function or the failure of our product.
9.3 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
9.4 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the
previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration
due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-9146E-01
P6/9
10. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
10.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Reflow Soldering
Solder Resist
5.5
Chip Coil
(in mm)
1.0 1.3 1.0
Land
10.2 Flux, Solder
・Use rosin-based flux.
Flux
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 100μm to 150μm
Solder
Other flux (except above) Please contact us for details, then use.
10.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited
to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time.(s)
Standard Profile
150~180°C 、90s±30s
above 220°C、30s~60s above 230°C、60s max.
Limit Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
245±3°C
2 times
260°C,10s
2time
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-9146E-01
P7/9
10.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
350°C max.
80W max.
φ3mm max.
3 (+1,-0)s
2 times
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Times
Note:Do not directly touch the products with the tip of the soldering iron in order to prevent
the crack on the products due to the thermal shock.
10.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
1/3T
≦t≦T
Recommendable
(T: Lower flange thickness)
T
t
10.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction to the mechanical stress.
Electrode
(Good example)
(Poor example)
Electrode
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of measures
(1) Turn the mounting direction of the component parallel to the
board separation surface.
Stress level
A > D*1
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the
board separation surface.
A > B
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
C
Perforation
B
Electrode
D
A
Slit
Electrode
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-9146E-01
P8/9
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
Recommended
Screw Hole
10.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
1. Alternative cleaner
・Isopropyl alcohol (IPA)
2. Aqueous agent
・PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
10.8 Attention regarding product's heat generation
Please pay special attention to the product’s heat generation such as beyond Operating Temperature range,
mounting product in close proximity to other products that radiate heat and beyond the rated current.
10.9 Resin coating (moistureproof coating)
Do not make any resin coating.
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open
circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition
etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating
condition may cause corrosion of wire of coil, leading to open circuit.
10.10 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to
the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
10.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-9146E-01
P9/9
10.12 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and
the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
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