LQH32NH1R8J23# [MURATA]

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型号：	LQH32NH1R8J23#
厂家：	muRata
描述：
文件：	总9页 (文件大小：343K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Only

CHIP COIL（CHIP INDUCTORS）LQH32NH□□□□23L

Murata Standard Reference Specification【AEC-Q200】

SpecNo.JELF243A-9146E-01

P1/9

1. Scope

This reference specification applies to Wire Wound Chip Coil (Chip Inductors) LQH32NH Series for Automotive Electronics

based on AEC-Q200.

2. Part Numbering

(ex)

1R0

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W)

and

L:Taping

Characteristics

3. Rating

・Operating Temperature Range.

-40 to +125°C

・Storage Temperature Range.

-40 to +125°C

Self

Inductance

DC Resistance

Rated

Current

(mA)

Customer’s

Part Number

MURATA

Part Number

Resonant

Frequency

(MHz min.)

ESD

5A : 8kV

Tolerance

Tolerance (min.)

(%)

(H)

()

(%)

LQH32NH1R0M23L

LQH32NH1R2J23L

LQH32NH1R5J23L

LQH32NH1R8J23L

LQH32NH2R2J23L

LQH32NH2R7J23L

LQH32NH3R3J23L

LQH32NH3R9J23L

LQH32NH4R7J23L

LQH32NH5R6J23L

LQH32NH6R8J23L

LQH32NH8R2J23L

LQH32NH100J23L

LQH32NH120J23L

LQH32NH150J23L

LQH32NH180J23L

LQH32NH220J23L

LQH32NH270J23L

LQH32NH330J23L

LQH32NH390J23L

LQH32NH470J23L

LQH32NH560J23L

LQH32NH680J23L

LQH32NH820J23L

LQH32NH101J23L

LQH32NH121J23L

LQH32NH151J23L

LQH32NH181J23L

LQH32NH221J23L

LQH32NH271J23L

LQH32NH331J23L

LQH32NH391J23L

LQH32NH471J23L

LQH32NH561J23L

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

M:±20

0.06

0.07

0.08

0.09

0.097

0.15

0.20

0.14

0.21

0.32

0.36

0.40

0.34

0.50

0.64

0.74

1.00

1.14

1.27

1.46

2.00

2.25

3.25

3.65

4.20

4.85

7.60

8.45

9.70

11.0

12.4

14.1

14.6

100

780

720

675

635

610

495

425

510

420

335

315

300

325

270

235

220

190

175

170

155

130

125

100

± 20

J:± 5

100

120

150

180

220

270

330

390

470

560

8.0

6.0

5.5

5.0

4.0

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-9146E-01

P2/9

4. Testing Conditions

《Unless otherwise specified》

Temperature : Ordinary Temperature (15 to 35°C)

Humidity : Ordinary Humidity (25 to 85 %(RH))

《In case of doubt》

Temperature

Humidity

: 20 ± 2°C

: 60 to 70 %(RH)

Atmospheric Pressure : 86 to 106 kPa

5. Appearance and Dimensions (No marking)

No Marking.

(in mm)

■Unit Mass (Typical value)

0.060 g

6. Electrical Performance

No. Item

6.1 Inductance

Specification

Test Method

Inductance shall meet item 3.

Measuring Equipment：KEYSIGHT 4192A or equivalent

Measuring Frequency：1MHz / 1.0 to 390μH

1kHz / 470 to 560μH

6.2

Measuring Equipment：KEYSIGHT 4192A or equivalent

Measuring Frequency：1MHz / 1.0 to 82μH

796kHz / 100 to 560μH

6.2 DC Resistance

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment：Digital multi meter

Measuring Equipment：KEYSIGHT E4991A or equivalent

The rated current is applied.

6.3 Self Resonant

Frequency(S.R.F)

6.4 Rated Current

Self temperaturer rise shall be

limited to 20°C max.

Inductance Change：within ± 10%

7. AEC-Q200 Requirement

7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)

AEC-Q200 Rev.D issued June. 1 2010

AEC-Q200

Murata Specification / Deviation

Stress

Test Method

High

Temperature

Exposure

1000hours at 125 deg C

Set for 24hours at room temperature,

then measured.

Meet Table A after testing.

Table A

Appearance

No damage

Inductance change Within ±5%

Temperature Cycling 1000cycles

-40 deg C to + 125deg C

Meet Table A after testing.

Set for 24hours at room

temperature,then

measured.

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-9146E-01

P3/9

AEC-Q200

Murata Specification / Deviation

Stress

Test Method

Biased Humidity

1000hours at 85 deg C, 85%RH

unpowered..

Meet Table A after testing.

Operational Life

Apply 125 deg C 1000 hours

Set for 24hours at room temperature,

then measured

External Visual

Visual inspection

No abnormalities

10 Physical Dimension

Meet ITEM 5 (Style and Dimensions) No defects

12 Resistance to

Solvents

Per

MIL-STD-202

Method 215

Not Applicable

13 Mechanical Shock

14 Vibration

Per MIL-STD-202

Method 213

100g’s/6ms/Half sine

Meet Table A after testing.

5g's for 20 minutes,

12cycles eah of 3 orientations

Test from 10-2000Hz.

12cycles each of 3 orientations

15 Resistance

to Soldering Heat

No-heating

Meet Table A after testing.

Solder temperature

260C+/-5 deg C

Immersion time 10s

17 ESD

Per AEC-Q200-002

Per J-STD-002

ESD Rank: Refer to Item 3. Rating.

No defects

18 Solderbility

Method B : Not Applicable

95% of the terminations is to be soldered.

(Except exposed wire)

19 Electrical

Measured : Inductance

Per UL-94

No defects

Characterization

20 Flammability

21 Board Flex

Not Applicable

Epoxy-PCB(1.6mm)

Murata deviation request: 5s

Deflection 2mm(min)

60s minimum holding time

Meet Table B after testing.

Table B

Appearance

No damage

Within ±10%

DC resistance change

22 Terminal Strength

Per AEC-Q200-006

No defects

A force of 17.7N for 60s

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-9146E-01

P4/9

8. Specification of Packaging

8.1 Appearance and Dimensions of plastic tape

1.5^+0.1

Lead-in/out wire

※



-0

0.2

(

)

The packing directions of the chip coil

※

in taping are unified with the in/out

positions of the lead wire.

4.0±0.1

2.1±0.1

(in mm)

2.9±0.2

Dimension of the Cavity is measured at the bottom side.

8.2 Specification of Taping

2.0±0.05

Direction of feed

(1) Packing quantity (standard quantity)

2,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are

not continuous. The specified quantity per reel is kept.

8.3 Pull Strength

Embossed carrier tape

10N min.

5N min.

Cover tape

8.4 Peeling off force of cover tape

165 to 180 degree

Speed of Peeling off

300mm/min

Cover tape

Plastic tape

0.2 to 0.7N

(minimum value is typical)

Peeling off force

8.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-9146E-01

P5/9

8.6 Marking for reel

Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･

1) <Expression of Inspection No.>

□□ OOOO 

(1) (2) (3)

(1) Factory Code

(2) Date

First digit

Second digit

: Year / Last digit of year

: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

Third, Fourth digit : Day

(3) Serial No.

2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

8.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2) ,

Quantity, etc ･･･

8.8 Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity in

Outer Case (Reel)

Label

186

Above Outer Case size is typical. It depends on a quantity

of an order.

Caution

9.1 Caution(Rating)

Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and

short/open circuit of the product or falling off the product may be occurred.

9.2 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused

by the abnormal function or the failure of our product.

9.3 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

9.4 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur

dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the

previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration

due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-9146E-01

P6/9

10. Notice

This product is designed for solder mounting. (Reflow soldering only)

Please consult us in advance for applying other mounting method such as conductive adhesive.

10.1 Land pattern designing (Reflow Soldering)

Recommended land pattern for reflow soldering is as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Reflow Soldering

Solder Resist

5.5

Chip Coil

(in mm)

1.0 1.3 1.0

Land

10.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 100μm to 150μm

Solder

Other flux (except above) Please contact us for details, then use.

10.3 Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited

to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is

limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration

of product quality.

Reflow soldering profile

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

150～180°C 、90s±30s

above 220°C、30s～60s above 230°C、60s max.

Limit Profile

Pre-heating

Heating

Peak temperature

Cycle of reflow

245±3°C

2 times

260°C,10s

2time

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-9146E-01

P7/9

10.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3 (+1,-0)s

2 times

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

Note：Do not directly touch the products with the tip of the soldering iron in order to prevent

the crack on the products due to the thermal shock.

10.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

1/3T

≦t≦T

Recommendable

(T: Lower flange thickness)

10.6 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways direction to the mechanical stress.

Electrode

(Good example)

(Poor example)

Electrode

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of measures

(1) Turn the mounting direction of the component parallel to the

board separation surface.

Stress level

A > D^*1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > B

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

Perforation

Electrode

Slit

Electrode

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-9146E-01

P8/9

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

Recommended

Screw Hole

10.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon

at the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 minutes max.

1. Alternative cleaner

・Isopropyl alcohol (IPA)

2. Aqueous agent

・PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in

order to remove the cleaner.

(5) Other cleaning

Please contact us.

10.8 Attention regarding product's heat generation

Please pay special attention to the product’s heat generation such as beyond Operating Temperature range,

mounting product in close proximity to other products that radiate heat and beyond the rated current.

10.9 Resin coating (moistureproof coating)

Do not make any resin coating.

The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open

circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition

etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating

condition may cause corrosion of wire of coil, leading to open circuit.

10.10 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to

the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

10.11 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG.CO., LTD

Reference Only

SpecNo.JELF243A-9146E-01

P9/9

10.12 Storage and Handling Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature : -10 ~ 40°C

Humidity

: 15 to 85% relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,

chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and

the breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

11. Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD

LQH32NH1R8J23# [MURATA]

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