LQH32PHR47NNCL [MURATA]

General Purpose Inductor,;


型号：	LQH32PHR47NNCL
厂家：	muRata
描述：	General Purpose Inductor, 测试射频感应器电感器
文件：	总8页 (文件大小：223K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec No.JELF243A-9135D-01

P1/8

Reference Only

CHIP COIL（CHIP INDUCTORS）LQH32PH□□□□NCL SPECIFICATION

Murata Standard Reference Specification【AEC-Q200】

1.Scope

This reference specification applies to LQH32PH_NCL Series, Chip coil (Chip Inductors) automotive Electronics based

on AEC-Q200.

2.Part Numbering

(ex)

1R0

Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Other Packaging

(L×W)

and

(T)

L:Taping

Characteristics

3.Rating

Operating Temperature Range.

(Ambient temperature; Self-temperature rise is not included)

(Product temperature; Self- temperature rise is included)

-40 to +105°C

-40 to +125°C

Storage Temperature Range.

-40 to +125°C

∗3 Rated Current(mA)

Inductance

Self

∗2 (Based on

Resistance

(Ω)

∗1

Customer

Part Number

MURATA

Part Number

Resonant

Frequency

(MHz min)

ESD

5A: 8kV

Temperature rise)

(Based on

Inductance

change)

Ambient

Tolerance

(μH)

temperature temperature

(%)

85℃

105℃

LQH32PHR47NNCL

LQH32PH1R0NNCL

LQH32PH1R5NNCL

LQH32PH2R2NNCL

LQH32PH3R3NNCL

LQH32PH4R7NNCL

LQH32PH6R8NNCL

LQH32PH100MNCL

LQH32PH150MNCL

LQH32PH220MNCL

0.47

1.0

1.5

2.2

3.3

4.7

6.8

0.024±20%

0.036±20%

0.053±20%

0.064±20%

0.100±20%

0.155±20%

0.220±20%

0.295±20%

0.475±20%

0.685±20%

100

4400

3000

2600

2000

1900

1600

1300

1000

800

2900

1490

2500

2100

1850

1550

1200

1100

900

1380

1110

910

800

610

550

450

330

270

N:±30

M:±20

700

650

550

∗1: When applied Rated current to the Products,Inductance will be within ±30% of nominal Inductance value.

∗2: When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited

to 40°C max.

∗3: Keep the temperature (ambient temperature plus self-generation of heat) under 125°C

4. Testing Conditions

《Unless otherwise specified》

Temperature : Ordinary Temperature (15 to 35°C)

Humidity : Ordinary Humidity (25 to 85 % (RH))

《In case of doubt》

Temperature

Humidity

: 20 ± 2°C

: 60 to 70 % (RH)

Atmospheric Pressure : 86 to 106 kPa

MURATA MFG.CO., LTD

Spec No.JELF243A-9135D-01

P2/8

Reference Only

5.Appearance and Dimensions

2.7±0.2

2.5±0.2

Ａ

2.5±0.2

■Unit Mass（Typical value）

0.044ｇ

Ａ:2.8max.

3.2±0.3

※

No marking.

(in mm)

0.9±0.31.3±0.2 0.9±0.3

6.Electrical Performance

No.

Item

Specification

Test Method

6.1 Inductance

Inductance shall meet item 3.

Measuring Equipment : KEYSIGHT 4192A or equivalent

Measuring Frequency: 1MHz

6.2 DC Resistance

DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter

S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT E4991A or equivalent

6.3 Self Resonant

Frequency(S.R.F)

7. AEC-Q200 Requirement

7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)

AEC-Q200 Rev.D issued June. 1 2010

AEC-Q200

Murata Specification / Deviation

Stress

Test Method

High

Temperature

Exposure

1000hours at 125 deg C

Set for 24hours at room

temperature, then measured.

Meet Table A after testing.

Table A

Appearance

No damage

Within ±10%

Inductance Change (at 1MHz)

DC Resistance Change

Temperature Cycling 1000cycles

-40 deg C to + 125deg C

Meet Table A after testing.

Set for 24hours at room

temperature,then

measured.

Biased Humidity

Operational Life

1000hours at 85 deg C, 85%RH

unpowered..

Meet Table A after testing.

Apply Rated Current 85 deg C

1000 hours

Set for 24hours at room

temperature, then measured

External Visual

Visual inspection

No abnormalities

No defects

10 Physical Dimension

Meet ITEM 5

(Style and Dimensions)

MURATA MFG.CO., LTD

Spec No.JELF243A-9135D-01

P3/8

Reference Only

AEC-Q200

Murata Specification / Deviation

Stress

Test Method

12 Resistance

to Solvents

Per

MIL-STD-202

Method 215

Not Applicable

13 Mechanical Shock

14 Vibration

Per MIL-STD-202

Method 213

Condition C

Meet Table A after testing.

100g’s/6ms/Half sine

5g's for 20 minutes,

Meet Table A after testing.

12cycles eah of 3 orientations

Test from 10-2000Hz.

15 Resistance

to Soldering Heat

No-heating

Pre-heating: 150 to 180C /90±30s

Meet Table A after testing.

Solder temperature

260C+/-5 deg C

Immersion time 10s

17 ESD

Per AEC-Q200-002

ESD Rank:

Appearance: No damage

Refer to Item 3. Rating

18 Solderbility

Per J-STD-002

Method b : Not Applicable

95% of the terminations is to be soldered.

(Except exposed wire)

19 Electrical

Measured : Inductance

Per UL-94

No defects

Characterization

20 Flammability

21 Board Flex

Not Applicable

Epoxy-PCB(1.6mm)

Holding time: 5s

Deflection 2mm(min)

60s minimum holding time

Meet Table A after testing.

22 Terminal Strength

Per AEC-Q200-006

No defects

A force of 17.7N for 60s

8. Specification of Packaging

8.1 Appearance and Dimensions of plastic tape

+0.1

Lead-in/out wire

※

1.5

-0

(

)

0.2

The packing directions of the chip coil

※

in taping are unified with the in/out

positions of the lead wire.

Dimension of the Cavity is measured

at the bottom side.

(in mm)

4.0±0.1

2.0±0.05

4.0±0.1

1.7±0.2

2.9±0.2

Direction of feed

MURATA MFG.CO., LTD

Spec No.JELF243A-9135D-01

P4/8

Reference Only

8.2 Specification of Taping

(1) Packing quantity (standard quantity)

2,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are

not continuous. The specified quantity per reel is kept.

8.3 Pull Strength

Embossed carrier tape

10N min.

5N min.

Cover tape

8.4 Peeling off force of cover tape

165 to 180 degree

Speed of Peeling off

300mm/min

0.2 to 0.7N

(minimum value is typical)

Cover tape

Plastic tape

Peeling off force

8.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

Trailer

2.0±0.5

: 160 min.

Leader

190 min

Empty tape

210 min

Label

Cover tape

13.0±0.2

60±

21.0±0.8

Direction of feed

9±

13±1.4

(in mm)

180

8.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･

∗1) <Expression of Inspection No.>

□□OOOO ×××

(3)

(1)

(2)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

8.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS marking (∗2) ,Quantity, etc ･･･

MURATA MFG.CO., LTD

Spec No.JELF243A-9135D-01

P5/8

Reference Only

8.8. Specification of Outer Case

Outer Case Dimensions(mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

186

∗Above Outer Case size is typical. It depends on a quantity

of an order.

Caution

9.1Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Disaster prevention / crime prevention equipment

(7) Traffic signal equipment

(8) Transportation equipment (trains, ships, etc.)

(9) Applications of similar complexity and /or reliability requirements

to the applications listed in the above

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

9.2 Caution(Rating)

Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and

short/open circuit of the product or falling off the product may be occurred.

9.3 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused

by the abnormal function or the failure of our product.

10. Notice

This product is designed for solder mounting. (Reflow soldering only)

Please consult us in advance for applying other mounting method such as conductive adhesive.

10.1 Land pattern designing (Reflow Soldering)

Recommended land pattern for reflow soldering is as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Land

2.0

3.8

Chip Coil

Solder Resist

(in mm)

1.3

10.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 100μm to 150μm

Solder

Other flux (except above) Please contact us for details, then use.

MURATA MFG.CO., LTD

Spec No.JELF243A-9135D-01

P6/8

Reference Only

10.3 soldering conditions (Reflow)

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is

limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration

of product quality.

Temp.

(℃)

260℃

230℃

245℃±3℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max

90s±30s

Time(s)

Standard Profile

150～180°C 、90s±30s

above 220°C、30s～60s above 230°C、60s max.

Limit Profile

Pre-heating

Heating

Peak temperature

Cycle of reflow

245±3°C

2 times

260°C,10s

2 times

10.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3 (+1,-0)s

2 times

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

Note :Do not directly touch the products with the tip of the soldering iron in order to prevent

the crack on the products due to the thermal shock.

10.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Uppre Limit

1/3T≦ t ≦T

(T: Lower flange thickness)

Recommendable

Ｔ

MURATA MFG.CO., LTD

Spec No.JELF243A-9135D-01

P7/8

Reference Only

10.6 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a<b) to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

D ∗1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

Seam

∗1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Slit

Length:a b

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Recommended

Screw Hole

10.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 minutes max.

1. Alternative cleaner

・Isopropyl alcohol (IPA)

2. Aqueous agent

・PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in

order to remove the cleaner.

(5) Other cleaning

Please contact us.

10.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin,

or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine

by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention when you select resin in case of coating/molding the products with

the resin.Prior to use the coating resin, please make sure no reliability issue is observed by evaluating

products mounted on your board.

MURATA MFG.CO., LTD

Spec No.JELF243A-9135D-01

P8/8

Reference Only

10.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched

to the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

10.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to

the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw

to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

10.11 Storage and Handling Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature : -10 ~ 40°C

Humidity

: 15 to 85% relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,

chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and

the breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

11.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD

LQH32PHR47NNCL [MURATA]

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