LQH3ERN270G01_技术文档

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

CHIP COILS

for General Use Magnetic Shielded Type LQH3ER Series

LQH3ER Series

■ Features

The LQH3ER series consists of magnetically shielded chip

+0.3

-0.2

+0.3

3.5

inductors. Its tight inductance tolerance of +-2%

3.2

-0.2

enables no adjustment of circuit. The shielding

structure eliminates external interference and

facilitates high mounting density.

(in mm)

0.7min 0.7min 0.7min

Inductance

Rated Current Max. of DC resistance

Q

(min.)

Self Resonance Frequency

Part Number

(µH)

(mA)

(ohm)

(MHz)

LQH3ERN1R0G01

LQH3ERN1R2G01

LQH3ERN1R5G01

LQH3ERN1R8G01

LQH3ERN2R2G01

LQH3ERN2R7G01

LQH3ERN3R3G01

LQH3ERN3R9G01

LQH3ERN4R7G01

LQH3ERN5R6G01

LQH3ERN6R8G01

LQH3ERN8R2G01

LQH3ERN100G01

LQH3ERN120G01

LQH3ERN150G01

LQH3ERN180G01

LQH3ERN220G01

LQH3ERN270G01

LQH3ERN330G01

LQH3ERN390G01

LQH3ERN470G01

LQH3ERN560G01

LQH3ERN680G01

LQH3ERN820G01

LQH3ERN101G01

LQH3ERN1R0J01

LQH3ERN1R2J01

LQH3ERN1R5J01

LQH3ERN1R8J01

LQH3ERN2R2J01

LQH3ERN2R7J01

LQH3ERN3R3J01

LQH3ERN3R9J01

LQH3ERN4R7J01

LQH3ERN5R6J01

LQH3ERN6R8J01

1 ±2%

1.2 ±2%

1.5 ±2%

1.8 ±2%

2.2 ±2%

2.7 ±2%

3.3 ±2%

3.9 ±2%

4.7 ±2%

5.6 ±2%

6.8 ±2%

8.2 ±2%

10 ±2%

12 ±2%

15 ±2%

18 ±2%

22 ±2%

27 ±2%

33 ±2%

39 ±2%

47 ±2%

56 ±2%

68 ±2%

82 ±2%

100 ±2%

1 ±5%

70

50

30

15

10

70

50

30

0.247

0.286

0.338

0.364

0.429

0.507

0.559

0.585

0.676

0.728

0.806

0.897

1.222

1.43

60 at 7.96MHz

70 at 2.52MHz

80 at 2.52MHz

60 at 7.96MHz

120 min.

100 min.

80 min.

70 min.

60 min.

8

55 min.

50 min.

45 min.

40 min.

37 min.

35 min.

32 min.

30 min.

27 min.

1.56

25 min.

1.69

23 min.

1.95

20 min.

2.21

18 min.

3.12

16 min.

3.38

15 min.

3.9

14 min.

4.29

13 min.

6.89

12 min.

7.54

11 min.

8.58

10 min.

0.247

0.286

0.338

0.364

0.429

0.507

0.559

0.585

0.676

0.728

0.806

120 min.

100 min.

80 min.

1.2 ±5%

1.5 ±5%

1.8 ±5%

2.2 ±5%

2.7 ±5%

3.3 ±5%

3.9 ±5%

4.7 ±5%

5.6 ±5%

6.8 ±5%

70 min.

60 min.

55 min.

50 min.

45 min.

40 min.

37 min.

35 min.

Continued on the following page.

29

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Continued from the preceding page.

Inductance

Rated Current Max. of DC resistance

Q

(min.)

Self Resonance Frequency

Part Number

(µH)

(mA)

(ohm)

(MHz)

LQH3ERN8R2J01

LQH3ERN100J01

LQH3ERN120J01

LQH3ERN150J01

LQH3ERN180J01

LQH3ERN220J01

LQH3ERN270J01

LQH3ERN330J01

LQH3ERN390J01

LQH3ERN470J01

LQH3ERN560J01

LQH3ERN680J01

LQH3ERN820J01

LQH3ERN101J01

8.2 ±5%

10 ±5%

12 ±5%

15 ±5%

18 ±5%

22 ±5%

27 ±5%

33 ±5%

39 ±5%

47 ±5%

56 ±5%

68 ±5%

82 ±5%

100 ±5%

30

15

10

0.897

1.222

1.43

1.56

1.69

1.95

2.21

3.12

3.38

3.9

60 at 7.96MHz

70 at 2.52MHz

80 at 2.52MHz

32 min.

30 min.

27 min.

25 min.

23 min.

20 min.

18 min.

16 min.

15 min.

14 min.

13 min.

12 min.

11 min.

10 min.

4.29

6.89

7.54

8.58

Min. of Operating Temp. : -25°C to 85°C

■ Q-Frequency Characteristics

■ Inductance-Current Characteristics

500

120

100µH

100

10µH

1.0µH

80

100µH

100

60

40

47µH

Q

50

22µH

8

20

0

10µH

10

4.7µH

5

0.1

0.5

1

5

10

50

100

Frequency (MHz)

2.2µH

1.0µH

1

5

10

50

100

500 1000

Current (mA)

■ Coupling Coefficient

10

8

6

4

2

1mm

0

1

5

10

Inductance (µH)

50

100

30

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

The structure of the "Global Part Numbers" that will be adopted from June 2001 and the meaning of each code are described herein.

If you have any questions about details, inquire at your usual Murata sales office or distributor.

o Part Numbering

(

)

Chip Coils (SMD)

(Global Part Number) LQ

H

32

M

N

331

K

2

1 L

q

w

e

r

t

y

u

i o !0

qProduct ID

tCategory

Product ID

Code

Category

LQ

Chip Coils

N

Standard Type

wStructure

yInductance

Expressed by three figures. The unit is micro-henry (µH). The first

and second figures are significant digits, and the third figure

expresses the number of zero which follow the two figures. If

there is a decimal point, it is expressed by capital letter "R". In

this case, all figures are significant digits. If inductance is less

than 0.1µH, the inductance code is expressed by combination of

two figures are capital letter "N", and the unit of inductance is

nano-henry (nH).

Code

G

Structure

Monolithic Type (Air-core Coil)

Winding Type (Ferrite Core)

Monolithic (Ferriet Core)

Film Type

H

M

P

W

Winding Type (Air-core Coil)

Capital letter "N" indicates the unit of "nH", and also expresses a

decimal point. In this case, all figure are significant digits.

eDimension (LgW)

Code

03

Dimension (LgW)

0.60g0.30mm

1.00g0.50mm

1.60g0.80mm

2.00g1.25mm

2.00g1.50mm

3.20g1.60mm

3.20g2.50mm

3.50g3.20mm

3.30g3.30mm

4.50g3.20mm

5.70g5.00mm

6.30g6.30mm

uInductance Tolerance

15

Code

B

Inductance Tolerance

18

±0.1nH

±0.2nH

±0.5nH

±2%

21

C

2B

31

D

G

32

H

±3%

3E

3K

43

J

±5%

K

±10%

±20%

±30%

±0.3nH

M

N

55

66

S

rApplications and Characteristics

iFeatures

Expressed by a figure from "0" to "2".

Code

H

Series

Applications and Characteristics

Monolithic Air-core

Ex.)

LQG

Code

Fetures

N

for Resonant Circuit

0

Standard Type

for Choke

(Low-current DC Power Supplies)

D

LQM

oElectrode

F

M

T

for Choke (DC Power Supplies)

Film Type

Code

Electrode

Solder Plating

Sputtering

0

1

2

LQP

Film Type (Low DC Resistance Type)

High Q Type (UFH-SHF)

A

H

N

M

Sn Plating

LQW

High Q Type (VHF-UHF)

!Pakaging

for Resonant Circuit

for Resonant Circuit (Coating Type)

Code

Pakaging

K

L

B

J

Plastic Taping (ø330mm Reel)

Plastic Taping (ø180mm Reel)

Bulk

for Resonant Circuit

(Magnetically Shielded Type)

R

LQH

D

C

S

H

for Choke

for Choke (Coating Type)

Paper Taping (ø330mm Reel)

Paper Taping (ø180mm Reel)

for Choke (Magnetically Shielded Type)

for High-frequency Resonant Circuit

D

2

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Monolithic And Film Type Notice(Soldering and Mounting)

1. STANDARD LAND DIMENSIONS

A high Q value is achieved when the PCB electrode land

pattern is designed so that it does not project beyond the

chip coil electrode.

Land Pattern

Solder Resist

c

b

Part Number

LQG15H

a

b

c

0.5-0.6

0.6-0.8

1.4-1.5

1.8-2.2

2.2-2.6

1.8-2.0

3.0-4.0

4.2-5.2

0.8-0.9

1.4-1.5

0.4

LQG18H

0.6-0.8

Flow

LQM18N

0.7

Reflow

LQM21N/21D/21F

LQM31F

1.0

1.2

2.0

LQP03T

0.2-0.3

0.5-0.6

0.2-0.3

0.4

LQP15M

in mm

2. STANDARD SOLDERING CONDITIONS

1) Soldering method

Allowable Flow Soldering Temperature and Time

Chip coils can be flow or reflow soldered.

Please contact Murata regarding other soldering

methods.

Solder : H60A

280

260

240

The volume of solder can cause minor fluctuations in

inductance value. Therefore, carefully control the amount

of solder when soldering the LQG15H/18H, LQP03T and

LQP15M series.

220

LQM18N

LQM21N/21D/21F

LQM31F

2) Soldering Temperature and Time

200

Solder whithin the temperature and time combinations

indicated by the slanted lines in the following graphs. If

soldering is repeated, please note that the allowed time

is the accumulated time.

180

0

10

20

30

Time (sec.)

Allowable Reflow Soldering Temperature and Time

Solder : Use H60A,H63A(JIS Z 3282) or equivalent.

Use solder paste equivalent to H60A for

LQP03T/15M and LQG15H/18H.

Solder : H60A

LQG18H

280

12

260

Flux : Use rosin-based flux, but not strongly acidic flux.

(with chlorine content exceeding 0.2wt%)

Do not use water-soluble flux.

240

220

LQM21N/21D/21F

LQP03T/15M

LQG15H, LQM18N

LQM31F

200

180

0

20

40

60

80

100

Time (sec.)

Continued on the following page.

42

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Monolithic And Film Type Notice(Soldering and Mounting)

Continued from the preceding page.

3) Standard Soldering Conditions

Flow Solder

Gradual cooling

(in air)

Preheating (in air) Soldering

240°C

200

100

0

One minute min.

3sec.max.

Reflow Solder

Gradual cooling

(in air)

Preheating (in air) Soldering

230°C

200

100

0

One minute min.

10sec.max.*

LQG15H/18H,LQP03T/15M : 20sec.max

4) Reworking with Soldering Iron

Preheating at 150°C for 1 minute is required. Do not

directry touch the ceramic element with the tip of the

soldering iron. The reworking soldering conditions are as

follows.

Soldering iron power output

: 30W Max.

Temperature of soldering iron tip : 280°C

Diameter of soldering iron end : 3.0mm Max.

Soldering time

: within 3 second

3. MOUNTING INSTRUCTIONS

1) Land Pattern Dimensions

Solder Resist

Land

Large lands reduce Q of the mounted chip. Also, large

protruding land areas (bordered by lines having

dimensions 'c' and 'd' shown bellow) cause floating and

electrode cracks.

c

d

12

2) Magnetic Coupling

Magnetic Coupling

Since some chip coils are constructed like an open

magnetic circuit, narrow spacing between coils may

cause magnetic coupling.

The LQG and LQM series have a magnetically shielded

structure. The structure makes their coupling coefficient

smaller than that of conventional chip coils.

Continued on the following page.

43

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Monolithic And Film Type Notice(Soldering and Mounting)

Continued from the preceding page.

3) PCB Warping

Arrange chip coils to minimize stress caused by PCB

warping.

The arrangement shown in Fig.2 is more effective in

preventing stress than that shown in Fig.1.

Fig.2

Fig.1

4) Amount of Solder Paste

Excessive solder causes electrode corrosion, while

insufficient solder causes low electrode bonding strength.

Adjust the amount of solder paste so that solder is

applied as shown in the right.

LQP/LQG/LQM

Standard thickness of solder paste : 100 to 150µm

5) Amount of Adhesive

If too much adhesive is applied, then it may overflow into

the land or termination areas and yield poor solderabillity.

In contrast, if insufficient adhesive is applied, or if the

adhesive is not sufficiently hardened, then the chip may

become detached during flow soldering. Apply the

Typical Application Amount (in:mg)

MR-8153RA NF-3000 UVS-50R-2

0.05-0.06 0.06-0.07 0.06-0.07

adhesive in accordance with the following conditions.

Part Number

LQM18N

LQM21N/21D/21F 0.15-0.20 0.20-0.25 0.20-0.25

LQM31F 0.20-0.25 0.25-0.30 0.25-0.30

12

44

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Winding Type Notice(Soldering and Mounting)

1. STANDARD LAND DIMENSIONS

A high Q value is achieved when the PCB electrode land

pattern is designed so that it does not project beyond the

chip coil electrode.

Land Pattern

Solder Resist

a

2.5min.

2.0 min. (LQW15A/18A)

Part Number

LQH31M/31C/31H

LQW31H

a

b

c

d

1.5

4.5

1.75

1.0

LQW2BH

1.2

3.0

1.1

0.8

LQW18A

0.7-1.0 1.8-2.0 0.6-0.7 0.6-0.8

LQW15A

0.65

1.2

0.35

0.50

in mm

If mounted at 2.5 (2.0) mm intervals as indicated in the diagram,

attention should be paid to potential magnetic coupling effects when

using the coil as a resonator.

LQH43M

LQH43N

LQH43C

Land Pattern

Solder Resist

7.5

1.5 1.5 1.5

in mm

Continued on the following page.

12

45

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Winding Type Notice(Soldering and Mounting)

Continued from the preceding page.

2. STANDARD SOLDERING CONDITIONS

1) Soldering method

Allowable Flow Soldering Temperature and Time

Chip coils can be flow or reflow soldered.

Please contact Murata regarding other soldering

methods.

Solder : H60A

280

260

240

Reflow soldering should be applied for LQW15A/18A.

2) Soldering Temperature and Time

Solder whithin the temperature and time combinations

indicated by the slanted lines in the following graphs. If

soldering is repeated, please note that the allowed time

is the accumulated time.

220

200

180

LQW2BH

LQH31M/31C/31H

LQH43M/43N/43C

LQW31H

0

10

20

30

Solder : Use H60A,H63A(JIS Z 3282) or equivalent.

Flux : Use rosin-based flux, but not strongly acidic flux.

(with chlorine content exceeding 0.2wt%)

Do not use water-soluble flux.

Time (sec.)

Allowable Reflow Soldering Temperature and Time

Solder : H60A

280

260

240

220

LQW2BH/31H

LQH31H

LQH43N

LQW18A

LQW15A

LQH31M/31C

LQH43M/43C

200

180

0

10

20

30

40

50

60

Time (sec.)

3) Standard Soldering Conditions

Flow Solder

Gradual cooling

(in air)

Preheating (in air) Soldering

240°C

200

100

0

One minute min.

3sec.max.

12

Reflow Solder

Gradual cooling

(in air)

Preheating (in air) Soldering

230°C

200

100

0

One minute min.

10sec.max.

Continued on the following page.

46

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Winding Type Notice(Soldering and Mounting)

Continued from the preceding page.

4) Reworking with Soldering Iron

Preheating at 150°C for 1 minute is required. Do not

directry touch the ceramic element with the tip of the

soldering iron. The reworking soldering conditions are as

follows.

Soldering iron power output

: 30W Max.

Temperature of soldering iron tip : 280°C

Diameter of soldering iron end : 3.0mm Max.

Soldering time

: within 3 second

3. MOUNTING INSTRUCTIONS

1) Land Pattern Dimensions

Solder Resist

Land

Large lands reduce Q of the mounted chip. Also, large

protruding land areas (bordered by lines having

dimensions 'c' and 'd' shown bellow) cause floating and

electrode cracks.

c

d

2) Magnetic Coupling

Magnetic Coupling

Since some chip coils are constructed like an open

magnetic circuit, narrow spacing between coils may

cause magnetic coupling.

The LQH series have a magnetically shielded structure.

The structure makes their coupling coefficient smaller

than that of conventional chip coils.

3) PCB Warping

Arrange chip coils to minimize stress caused by PCB

warping.

The arrangement shown in Fig.2 is more effective in

preventing stress than that shown in Fig.1.

Fig.2

Fig.1

4) Amount of Solder Paste

Excessive solder causes electrode corrosion, while

insufficient solder causes low electrode bonding strength.

Adjust the amount of solder paste so that solder is

applied as shown in the right.

12

LQH_C/H/M/N

LQW_H

LQW_A

Standard thickness of solder paste: 200µm to 300µm

(LQW15A/18A : 100 to 150µm)

Continued on the following page.

47

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Winding Type Notice(Soldering and Mounting)

Continued from the preceding page.

5) Amount of Adhesive

If too much adhesive is applied, then it may overflow into

the land or termination areas and yield poor solderabillity.

In contrast, if insufficient adhesive is applied, or if the

adhesive is not sufficiently hardened, then the chip may

become detached during flow soldering. Apply the

adhesive in accordance with the following conditions.

Typical Application Amount (in:mg)

MR-8153RA NF-3000 UVS-50R-2

Part Number

LQW2BH

0.16-0.18 0.20-0.25 0.21-0.23

LQH31M/31C/31H

LQW31H

0.18-0.20 0.20-0.25 0.20-0.25

LQH43M(N)

LQH43C

0.45-0.50 0.60-0.80 0.60-0.80

12

48

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Winding And Mgnetic Shielded Type Notice(Soldering and Mounting)

1. STANDARD LAND DIMENSIONS

A high Q value is achieved when the PCB electrode land

pattern is designed so that it does not project beyond the

chip coil electrode.

LQH32M_11/32C_11

LQH3ER

Land Pattern

Solder Resist

5.5

1.0 1.0 1.0

LQH32M_21/32C_21/32C_51

LQH3KS

5.5

1.0 1.3 1.0

in mm

2. STANDARD SOLDERING CONDITIONS

1) Soldering method

Allowable Flow Soldering Temperature and Time

Chip coils can be flow or reflow soldered.

Please contact Murata regarding other soldering

methods.

Solder : H60A

280

260

Reflow soldering should be applied for LQH3ER/3KS.

240

2) Soldering Temperature and Time

LQH32M/32C

Solder whithin the temperature and time combinations

indicated by the slanted lines in the following graphs. If

soldering is repeated, please note that the allowed time

is the accumulated time.

220

200

180

0

10

20

30

Solder : Use H60A,H63A(JIS Z 3282) or equivalent.

Flux : Use rosin-based flux, but not strongly acidic flux.

(with chlorine content exceeding 0.2wt%)

Do not use water-soluble flux.

Time (sec.)

Allowable Reflow Soldering Temperature and Time

Solder : H60A

12

280

260

240

220

LQH32M/32C

LQH3ER/3KS

200

180

0

10

20

30

40

50

60

Time (sec.)

Continued on the following page.

49

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Winding And Mgnetic Shielded Type Notice(Soldering and Mounting)

Continued from the preceding page.

3) Standard Soldering Conditions

Flow Solder

Gradual cooling

Preheating (in air) Soldering

(in air)

240°C

200

100

0

One minute min.

3sec.max.

Reflow Solder

Gradual cooling

(in air)

Preheating (in air) Soldering

230°C

200

100

0

One minute min.

10sec.max.

4) Reworking with Soldering Iron

Preheating at 150°C for 1 minute is required. Do not

directry touch the ceramic element with the tip of the

soldering iron. The reworking soldering conditions are as

follows.

Soldering iron power output

: 30W Max.

Temperature of soldering iron tip : 280°C

Diameter of soldering iron end : 3.0mm Max.

Soldering time

: within 3 second

3. MOUNTING INSTRUCTIONS

1) Land Pattern Dimensions

Solder Resist

Land

Large lands reduce Q of the mounted chip. Also, large

protruding land areas (bordered by lines having

dimensions 'c' and 'd' shown bellow) cause floating and

electrode cracks.

c

d

12

2) Magnetic Coupling

Magnetic Coupling

Since some chip coils are constructed like an open

magnetic circuit, narrow spacing between coils may

cause magnetic coupling.

The LQH_R/S series have a magnetically shielded

structure. The structure makes their coupling coefficient

smaller than that of conventional chip coils. In particular,

the LQH3ER series has a very small coupling coefficient.

Continued on the following page.

50

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Winding And Mgnetic Shielded Type Notice(Soldering and Mounting)

Continued from the preceding page.

3) PCB Warping

Arrange chip coils to minimize stress caused by PCB

warping.

The arrangement shown in Fig.2 is more effective in

preventing stress than that shown in Fig.1.

Fig.2

Fig.1

4) Amount of Solder Paste

Excessive solder causes electrode corrosion, while

insufficient solder causes low electrode bonding strength.

Adjust the amount of solder paste so that solder is

applied as shown in the right.

LQH_C/D/H/M/N

LQH_R/S

Standard thickness of solder paste: 200µm to 300µm

5) Amount of Adhesive

If too much adhesive is applied, then it may overflow into

the land or termination areas and yield poor solderabillity.

In contrast, if insufficient adhesive is applied, or if the

adhesive is not sufficiently hardened, then the chip may

become detached during flow soldering. Apply the

adhesive in accordance with the following conditions.

Typical Application Amount (in:mg)

MR-8153RA NF-3000 UVS-50R-2

0.20-0.23 0.27-0.35 0.27-0.35

Part Number

LQH32M/32C

12

51

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Larege-current Type Notice(Soldering and Mounting)

1. STANDARD LAND DIMENSIONS

A high Q value is achieved when the PCB electrode land

LQH55D

LQH66S

pattern is designed so that it does not project beyond the

chip coil electrode.

Land Pattern

Solder Resist

8.0

2.0

3.0

in mm

2. STANDARD SOLDERING CONDITIONS

1) Soldering method

Allowable Reflow Soldering Temperature and Time

Reflow soldering should be applied for LQH55D/66S.

Solder : H60A

280

2) Soldering Temperature and Time

260

Solder whithin the temperature and time combinations

indicated by the slanted lines in the following graphs. If

soldering is repeated, please note that the allowed time

is the accumulated time.

LQH66S

240

220

200

Solder : Use H60A,H63A(JIS Z 3282) or equivalent.

Flux : Use rosin-based flux, but not strongly acidic flux.

(with chlorine content exceeding 0.2wt%)

Do not use water-soluble flux.

LQH55D

180

0

20

40

60

80

100

Time (sec.)

3) Standard Soldering Conditions

Reflow Solder

Gradual cooling

(in air)

Preheating (in air) Soldering

230°C

200

100

0

One minute min.

10sec.max.

12

4) Reworking with Soldering Iron

Preheating at 150°C for 1 minute is required. Do not

directry touch the ceramic element with the tip of the

soldering iron. The reworking soldering conditions are as

follows.

Soldering iron power output

: 30W Max.

Temperature of soldering iron tip : 280°C

Diameter of soldering iron end : 3.0mm Max.

Soldering time

: within 3 second

Continued on the following page.

52

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Larege-current Type Notice(Soldering and Mounting)

Continued from the preceding page.

3. MOUNTING INSTRUCTIONS

1) Land Pattern Dimensions

Solder Resist

Land

Large lands reduce Q of the mounted chip. Also, large

protruding land areas (bordered by lines having

dimensions 'c' and 'd' shown bellow) cause floating and

electrode cracks.

c

d

2) Magnetic Coupling

Magnetic Coupling

Since some chip coils are constructed like an open

magnetic circuit, narrow spacing between coils may

cause magnetic coupling.

The LQH_S series have a magnetically shielded structure.

The structure makes their coupling coefficient smaller

than that of conventional chip coils.

3) PCB Warping

Arrange chip coils to minimize stress caused by PCB

warping.

The arrangement shown in Fig.2 is more effective in

preventing stress than that shown in Fig.1.

Fig.2

Fig.1

4) Amount of Solder Paste

Excessive solder causes electrode corrosion, while

insufficient solder causes low electrode bonding strength.

Adjust the amount of solder paste so that solder is

applied as shown bellow

LQH_D

LQH_S

Standard thickness of solder paste: 200µm to 300µm

12

53

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Notice

■ Notice (Storage and Operating Conditions)

< OPERATING ENVIRONMENT >

Do not use products in chemical atmosphere such as

chlorine gas, acid or sulfide gas.

Humidity : 30 to 70% (relative humidity)

Do not subject products to rapid changes in

temperature and humidity.

< STORAGE REQUIREMENTS >

1. Storage Period

Do not store them in chemical atmosphere such as

one containing sulfurous acid gas or alkaline gas.

This will prevent electrode oxidation which causes

poor solderability and possible corrosion of coils.

b) Do not store products in bulk packaging to prevent

collision among coils which causes core chipping

and wire breakage.

Products should be used within 12 months reckon

from the date of our out-going inspection.

Solderability should be verified if this period is

exceeded. (LQH3ER/3KS series should be used within

6 months.)

2. Storage conditions

c) Store products on pallets to protect from humidity,

dust, etc.

a) Store products in a warehouse in compliance with

the following conditions :

d) Avoid heat shock, vibration, direct sunlight, etc.

Temperature : -10 to 40C.

■ Notice (Soldering and Mounting)

< CLEANING >

• HCFC-225

The following conditions should be observed when

cleaning chip coils.

b) Aqueous cleaning agents

• Surface active agent ( Clean Thru 750H )

• High grade alcohol ( Pine Alpha ST-100S )

• Hydrocarbon ( Techno Cleaner 335 )

• Alkaline Saponifier ( Aqua Cleaner 240 -cleaner

should be diluted to 20% using deionized water. )

LQH_R/S series : Aqueous agents should not be used

because they may cause quality deterioration.

LQH series : Surface active agent and high grade

alcohol can be used.

1. Cleaning Temperature : 60C. max. (40C. max. for

CFC alternatives and alcohol cleaning agents)

2. Ultrasonic

Output : 20W/l max.

Duration : 5 minutes max.

Frequency : 28kHz to 40kHz

Care should be taken not to cause resonance of

the PCB and mounted products.

3. Cleaning agent

4. Ensure that flux residue is completely removed.

Component should be thoroughly dried after aqueous

agents have been removed with deionized water.

For additional cleaning methods, please contact

Murata.

The following cleaning agents have been tested on

individual components. Evaluation in complete

assembly should be done prior to production.

a) CFC alternatives and alcohol cleaning agents

• Isopropyl alcohol ( IPA )

12

54

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Notice

■ Notice (Handling)

This item is designed to have sufficient strength,

but handle with care not to make it chipped or

broken due to its ceramic structure.

substance and so on.

LQM series

• There is possibility that the inductance value

LQW_A series

change due to magnetism. Do not use a magnet or

tweezers with magnetism when chip coil are

handled. ( The tip of the tweezers should be

molded with resin or pottery.)

• Sharp material, such as tweezers, shall not touch

to the winding portion to prevent the breaking of wire.

• Do not give excessive Mechanical shock should not be

applied to the products mounted on the board to prevent

thebreaking of the core.

< HANDLING >

1. Avoid applying excessive stress to products to

prevent damage.

• In some mounting machines,when picking up

components,support pin pushes up the components

from the bottom of base tape. In this case,please

remove the support pin. The support pin may damage

the components and break wire.

2. Do not touch winding with sharp objects such as

tweezers to prevent wire breakage.

3. Do not apply excessive force to products

mounted on boards to prevent core breakage.

< TRANSPORTATIONS >

LQH_C/D/H/M/N, LQW_H series

• Sharp material, such as tweezers, shall not touch

to the winding portion to prevent the breaking of wire.

• Do not give excessive Mechanical shock should

not be applied to the products mounted on the

board to prevent thebreaking of the core.

LQP series

Do not apply excessive vibration or mechanical

shock to products.

< RESIN COATING >

When coating products with resin, the relatively

high resin curing stress may change inductance

values.

• The pattern of the chip coil is covered with the

protection film. But the handling the chip coil

shall be taken care so that the chip coil would

not be damaged with the pick-up nozzle, the sharp

For exterior coating, select resin carefully so that

electrical and mechanical performance of the product

is not affected.

12

55

This is the PDF file of catalog No.O05E-6

Packaging

O05E6.pdf 01.5.9

Minimum Quantity and 8mm Width Taping Dimension

<Paper>

1

+0.1

φ1.5

0.2

-0

4.0±0.1

2.0±0.1

4.0±0.1

a

c

Direction of feed

LQW2BH

1 : 0.3

Paper Tape

Dimensions (in mm)

Minimum QTY. (pcs.)

Part Number

a

b

c

φ180mm reel φ330mm reel

Bulk

1000

-

LQM21NN (0.1-2.2µH)

LQM21DN (1-10µH)

LQM21FN (1-2.2µH)

LQG18H

1.45

2.25

1.1

4000

10000

1.0

1.1

1.05

1.00

1.85

1.80

LQM18N

0.95

LQW18A

Plastic Tape

Dimensions (in mm)

Minimum QTY. (pcs.)

Part Number

a

b

c

φ180mm reel φ330mm reel

Bulk

LQM21NN (2.7-4.7µH)

LQM21DN (22-47µH)

LQM21FN (4.7-47µH)

LQM31F

1.45

2.25

1.3

4000

10000

1000

1.9

3.5

3.6

2.3

1.3

2.0

3000

LQH31M/31C/31H, LQW31H

LQW2BH

1.75

2000

7500

-

2.1

1.7

LQH32M/LQH32C

LQH32CN_51

2.9

3.6

(in mm)

Continued on the following page.

12

56

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Packaging

Continued from the preceding page.

Minimum Quantity and 8mm Width Taping Dimension

2.0±0.05

+0.1

-0

2.0±0.05

4.0±0.1

ø1.5

c

a

Direction of feed

Paper Tape

Dimensions (in mm)

Minimum QTY. (pcs.)

Part Number

a

b

c

φ180mm reel φ330mm reel

Bulk

1000

-

0.62

0.38

1.12

0.68

50000

LQG15H

LQP03T

LQP15M

LQW15A

1.0

0.8

10000

-

0.70

1.20

500

(in mm)

Minimum Quantity and 12mm Width Plastic Taping Dimension

2.0±0.1

d

4.0±0.1

+0.1

-0

8.0±0.1

φ1.5

a

c

Direction of feed

Dimensions (in mm)

Minimum QTY. (pcs.)

Part Number

a

b

c

d

φ180mm reel φ330mm reel

3.9

3.7

1.9

1000

-

LQH3ER, LQH3KS

LQH43M(N)

LQH43C

0.3

2500

3.6

4.9

2.7

500

-

1500

-

5.4

6.7

6.1

6.7

5.0

5.6

LQH55D

0.4

350

LQH66S

12

(in mm)

57

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Design Kits

oEKLM12UB (High-frequency Winding Type)

No.

1

Part Number

LQW2BHN3N3D01

LQW2BHN6N8D01

LQW2BHN8N2D01

LQW2BHN10NJ01

LQW2BHN12NJ01

LQW2BHN15NJ01

LQW2BHN18NJ01

LQW2BHN22NJ01

LQW2BHN27NJ01

LQW2BHN33NJ01

LQW2BHN39NJ01

LQW2BHN47NJ01

LQW2BHN56NJ01

LQW2BHN68NJ01

LQW2BHN82NJ01

LQW2BHNR10J01

LQW2BHNR12J01

LQW2BHNR15J01

LQW2BHNR18J01

LQW2BHNR22J01

LQW2BHNR27K01

LQW2BHNR33K01

LQW2BHNR39K01

LQW2BHNR47K01

LQW2BHN2N7D11

LQW2BHN3N1D11

LQW2BHN3N3D11

LQW2BHN5N6D11

LQW2BHN6N8D11

LQW2BHN8N6D11

LQW2BHN10NJ11

LQW2BHN12NK11

LQW2BHN15NK11

LQW2BHN18NK11

LQW2BHN21NK11

LQW2BHN27NK11

Quantiy (pcs.)

Inductance (nH)

Inductance Tolerance

T0.5nH

T5%

Rated Current (mA)

20

3.3

6.8

8.2

10

910

680

2

630

3

1320

680

4

12

T5%

5

15

T5%

630

6

18

T5%

690

7

22

T5%

720

8

27

T5%

540

9

33

T5%

570

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

39

T5%

730

47

T5%

450

56

T5%

430

68

T5%

460

82

T5%

320

100

120

150

180

220

270

330

390

470

2.7

3.1

3.3

5.6

6.8

8.6

10

T5%

350

T5%

320

T5%

390

T5%

250

T5%

240

T10%

T0.5nH

T5%

190

180

170

160

1900

1800

1700

1500

1400

1300

1320

1100

1000

950

12

T10%

15

18.8

21

27

900

58

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Design Kits

oEKLM13UB (High-frequency Monolithic Type)

No.

1

Part Number

LQG18HN1N2S00

LQG18HN1N5S00

LQG18HN1N8S00

LQG18HN2N2S00

LQG18HN2N7S00

LQG18HN3N3S00

LQG18HN3N9S00

LQG18HN4N7S00

LQG18HN5N6S00

LQG18HN6N8J00

LQG18HN8N2J00

LQG18HN10NJ00

LQG18HN12NJ00

LQG18HN15NJ00

LQG18HN18NJ00

LQG18HN22NJ00

LQG18HN27NJ00

LQG18HN33NJ00

LQG18HN39NJ00

LQG18HN47NJ00

LQG18HN56NJ00

LQG18HN68NJ00

LQG18HN82NJ00

LQG18HNR10J00

Quantiy (pcs.)

Inductance (nH)

Inductance Tolerance

T0.3nH

T5%

Rated Current (mA)

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

300

20

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

T5%

12

T5%

15

T5%

18

T5%

22

T5%

27

T5%

33

T5%

39

T5%

47

T5%

56

T5%

68

T5%

82

T5%

100

T5%

oEKLM14UC (High-frequency Flim Type)

No.

1

Part Number

LQP15MN1N0B00

LQP15MN1N1B00

LQP15MN1N2B00

LQP15MN1N3B00

LQP15MN1N5B00

LQP15MN1N6B00

LQP15MN1N8B00

LQP15MN2N0B00

LQP15MN2N2B00

LQP15MN2N4B00

LQP15MN2N7B00

LQP15MN3N0B00

LQP15MN3N3B00

LQP15MN3N6B00

LQP15MN3N9B00

LQP15MN4N3B00

LQP15MN4N7B00

LQP15MN5N1B00

LQP15MN5N6B00

LQP15MN6N2B00

LQP15MN6N8B00

LQP15MN7N5B00

LQP15MN8N2B00

LQP15MN9N1B00

Quantiy (pcs.)

Inductance (nH)

Inductance Tolerance

T0.1nH

Rated Current (mA)

1.0

1.1

1.2

1.3

1.5

1.6

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

400

390

280

220

280

220

190

170

160

140

130

110

100

20

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

Continued on the following page.

59

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Design Kits

Continued from the preceding page.

No.

25

26

27

28

29

30

31

Part Number

LQP15MN10NG00

LQP15MN12NG00

LQP15MN15NG00

LQP15MN18NG00

LQP15MN22NG00

LQP15MN27NG00

LQP15MN33NG00

Quantiy (pcs.)

Inductance (nH)

Inductance Tolerance

Rated Current (mA)

20

10

12

15

18

22

27

33

T2%

100

90

80

70

60

oEKLM15UB (High-frequency Monolithic Type)

No.

1

Part Number

LQG15HN1N2S00

LQG15HN1N5S00

LQG15HN1N8S00

LQG15HN2N2S00

LQG15HN2N7S00

LQG15HN3N3S00

LQG15HN3N9S00

LQG15HN4N7S00

LQG15HN5N6S00

LQG15HN6N8J00

LQG15HN8N2J00

LQG15HN10NJ00

LQG15HN12NJ00

LQG15HN15NJ00

LQG15HN18NJ00

LQG15HN22NJ00

LQG15HN27NJ00

LQG15HN33NJ00

Quantiy (pcs.)

Inductance (nH)

Inductance Tolerance

T0.3nH

T5%

Rated Current (mA)

20

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

200

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

T5%

12

T5%

15

T5%

18

T5%

22

T5%

27

T5%

33

T5%

oEKLM16UB (High-frequency Winding Type)

No.

1

Part Number

LQW18AN3N6C00

LQW18AN3N9C00

LQW18AN4N3C00

LQW18AN5N6C00

LQW18AN6N2C00

LQW18AN6N8C00

LQW18AN10NG00

LQW18AN11NG00

LQW18AN12NG00

LQW18AN13NG00

LQW18AN15NG00

LQW18AN16NG00

LQW18AN18NG00

LQW18AN20NG00

LQW18AN22NG00

LQW18AN24NG00

LQW18AN27NG00

LQW18AN30NG00

LQW18AN33NG00

LQW18AN36NG00

Quantiy (pcs.)

Inductance (nH)

Inductance Tolerance

T0.2nH

T2%

Rated Current (mA)

20

3.6

3.9

4.3

5.6

6.2

6.8

10

11

12

13

15

16

18

20

22

24

27

30

33

36

850

750

650

600

550

500

440

420

400

2

3

4

5

6

7

T2%

8

T2%

9

T2%

10

11

12

13

14

15

16

17

18

19

20

T2%

Continued on the following page.

60

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Design Kits

Continued from the preceding page.

No.

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

Part Number

LQW18AN39NG00

LQW18AN43NG00

LQW18AN47NG00

LQW18AN51NG00

LQW18AN56NG00

LQW18AN62NG00

LQW18AN68NG00

LQW18AN72NG00

LQW18AN75NG00

LQW18AN82NG00

LQW18AN91NG00

LQW18ANR10G00

LQW18ANR11G00

LQW18ANR12G00

LQW18ANR13G00

LQW18ANR15G00

LQW18ANR16G00

LQW18ANR18G00

LQW18ANR20G00

LQW18ANR22G00

Quantiy (pcs.)

Inductance (nH)

Inductance Tolerance

T2%

Rated Current (mA)

20

39

43

400

380

370

360

280

340

270

250

230

220

200

180

170

160

150

140

120

T2%

47

T2%

51

T2%

56

T2%

62

T2%

68

T2%

72

T2%

75

T2%

82

T2%

91

T2%

100

110

120

130

150

160

180

200

220

T2%

oEKLM17UB (High-frequency Winding Type)

No.

1

Part Number

LQW18AN2N2D00

LQW18AN3N6D00

LQW18AN3N9D00

LQW18AN4N3D00

LQW18AN4N7D00

LQW18AN5N6D00

LQW18AN6N2D00

LQW18AN6N8D00

LQW18AN7N5D00

LQW18AN8N2D00

LQW18AN8N7D00

LQW18AN9N1D00

LQW18AN9N5D00

LQW18AN10NJ00

LQW18AN11NJ00

LQW18AN12NJ00

LQW18AN13NJ00

LQW18AN15NJ00

LQW18AN16NJ00

LQW18AN18NJ00

LQW18AN20NJ00

LQW18AN22NJ00

LQW18AN24NJ00

LQW18AN27NJ00

LQW18AN30NJ00

LQW18AN33NJ00

LQW18AN36NJ00

LQW18AN39NJ00

LQW18AN43NJ00

LQW18AN47NJ00

Quantiy (pcs.)

Inductance (nH)

Inductance Tolerance

T0.5nH

T5%

Rated Current (mA)

2.2

3.6

3.9

4.3

4.7

5.6

6.2

6.8

7.5

8.2

8.7

9.1

9.5

10

700

850

750

650

600

550

500

440

420

400

380

20

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

11

T5%

12

T5%

13

T5%

15

T5%

16

T5%

18

T5%

20

T5%

22

T5%

24

T5%

27

T5%

30

T5%

33

T5%

36

T5%

39

T5%

43

T5%

47

T5%

Continued on the following page.

61

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Design Kits

Continued from the preceding page.

No.

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

Part Number

LQW18AN51NJ00

LQW18AN56NJ00

LQW18AN62NJ00

LQW18AN68NJ00

LQW18AN72NJ00

LQW18AN75NJ00

LQW18AN82NJ00

LQW18AN91NJ00

LQW18ANR10J00

LQW18ANR11J00

LQW18ANR12J00

LQW18ANR13J00

LQW18ANR15J00

LQW18ANR16J00

LQW18ANR18J00

LQW18ANR20J00

LQW18ANR22J00

Quantiy (pcs.)

Inductance (nH)

Inductance Tolerance

Rated Current (mA)

20

51

56

T5%

370

360

280

340

270

250

230

220

200

180

170

160

150

140

120

62

68

72

75

82

91

100

110

120

130

150

160

180

200

220

oEKLM21UB (for General Use/ for Choke Monolithic Type)

No.

1

Part Number

LQM21NNR10K10

LQM21NNR12K10

LQM21NNR15K10

LQM21NNR18K10

LQM21NNR22K10

LQM21NNR27K10

LQM21NNR33K10

LQM21NNR39K10

LQM21NNR47K10

LQM21NNR56K10

LQM21NNR68K10

LQM21NNR82K10

LQM21NN1R0K10

LQM21NN1R2K10

LQM21NN1R5K10

LQM21NN1R8K10

LQM21NN2R2K10

LQM21NN2R7K10

LQM21NN3R3K10

LQM21NN3R9K10

LQM21NN4R7K10

LQM21DN1R0N00

LQM21DN2R2N00

LQM21DN4R7N00

LQM21DN100N00

LQM21DN220N00

LQM21DN470N00

LQM21FN1R0N00

LQM21FN2R2N00

LQM21FN4R7N00

LQM21FN100N00

LQM21FN220N00

LQM21FN470N00

Quantiy (pcs.)

Inductance (nH)

0.1

Inductance Tolerance (% )

Rated Current (mA)

T10

T30

250

200

150

50

20

0.12

0.15

0.18

0.22

0.27

0.33

0.39

0.47

0.56

0.68

0.82

1.0

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

50

1.2

50

1.5

50

1.8

30

2.2

30

2.7

30

3.3

30

3.9

30

4.7

60

1.0

40

2.2

30

4.7

15

10

13

22

7

47

220

150

80

1.0

2.2

4.7

60

10

13

22

7

47

62

This is the PDF file of catalog No.O05E-6

O05E6.pdf 01.5.9

Information

1. Land Area and Q-F Characteristics

PCB : Ag-Pb printed land formed on 0.6mm-thick alumina plate

Solder : H60A

Soldering : Reflow soldering

Solder layer : Sections shown by oblique lines in figure

LQH32MN680K21

100

A : Characteristic of coil itself

80

60

40

B :

C :

Characteristic of chip mounted on land

A

1

1.3

5.5

Characteristic of chip mounted on land

B

Q

2.5 2.5

1

(in mm)

C

20

0

10k

50k

100k

500k

Frequency (Hz)

1M

5M

2. Coupling coefficient versus Coil-to-coil Spacing

LQH32M Series

14

Coil-to-coil Spacing

12

10

8

6

4

330µH

1µH

2

0

1

2

3

4

5

6

Coil-to-coil Spacing (mm)

63


型号：	LQH3ERN270G01
厂家：	muRata
描述：	General Purpose Inductor, 27uH, 2%, 1 Element, Ferrite-Core, SMD
文件：	总25页 (文件大小：306K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LQH3ERN270G01 [MURATA]

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