LQH43NN390K03# [MURATA]

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型号：	LQH43NN390K03#
厂家：	muRata
描述：
文件：	总9页 (文件大小：310K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec No JELF243A-0116A-01

P1/10

CHIP COIL（CHIP INDUCTORS）LQH43NN□□□□03L REFERNCE SPECIFICATION

1.Scope

This reference specification applies to LQH43NN Series, Chip coil (Chip Inductors).

2.Part Numbering

(ex) LQ

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W)

1R0

and

L:Taping

Characteristics

3.Rating

・Operating Temperature Range

・Storage Temperature Range

-40 to +105°C

Inductance

Self

*Rated

Current

(mA)

Resistance

( max)

Resonant

Frequency

(MHz min)

Customer’s

Part Number

MURATA

Part Number

(min.)

Tolerance

(H)

(%)

LQH43NN1R0M03L

LQH43NN1R2M03L

LQH43NN1R5M03L

LQH43NN1R8M03L

LQH43NN2R2M03L

LQH43NN2R7M03L

LQH43NN3R3M03L

LQH43NN3R9M03L

LQH43NN4R7M03L

LQH43NN4R7K03L

LQH43NN5R6M03L

LQH43NN5R6K03L

LQH43NN6R8M03L

LQH43NN6R8K03L

LQH43NN8R2M03L

LQH43NN8R2K03L

LQH43NN100K03L

LQH43NN100J03L

LQH43NN120K03L

LQH43NN120J03L

LQH43NN150K03L

LQH43NN150J03L

LQH43NN180K03L

LQH43NN180J03L

LQH43NN220K03L

LQH43NN220J03L

LQH43NN270K03L

LQH43NN270J03L

LQH43NN330K03L

LQH43NN330J03L

LQH43NN390K03L

LQH43NN390J03L

LQH43NN470K03L

LQH43NN470J03L

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

120

100

0.20

0.30

M:±20

0.32

0.35

0.38

500

4.7

5.6

6.8

8.2

0.40

0.47

0.50

M:±20

K:±10

450

0.56

400

380

360

340

0.62

0.73

0.82

K:±10

J:± 5

0.94

1.1

320

300

270

240

220

1.2

1.4

1.5

MURATA MFG.CO., LTD

SpecNo. JELF243A-0116A-01

P2/9

Inductance

Self

*Rated

Resonant

Frequency

(MHz min)

Customer’s

Part Number

MURATA

Current

(mA)

Resistance

( max)

Tolerance

Part Number

(min.)

(H)

(%)

LQH43NN560K03L

LQH43NN560J03L

LQH43NN680K03L

LQH43NN680J03L

LQH43NN820K03L

LQH43NN820J03L

LQH43NN101K03L

LQH43NN101J03L

LQH43NN121K03L

LQH43NN121J03L

LQH43NN151K03L

LQH43NN151J03L

LQH43NN181K03L

LQH43NN181J03L

LQH43NN221K03L

LQH43NN221J03L

LQH43NN271K03L

LQH43NN271J03L

LQH43NN331K03L

LQH43NN331J03L

LQH43NN391K03L

LQH43NN391J03L

LQH43NN471K03L

LQH43NN471J03L

LQH43NN561K03L

LQH43NN561J03L

LQH43NN681K03L

LQH43NN681J03L

LQH43NN821K03L

LQH43NN821J03L

LQH43NN102K03L

LQH43NN102J03L

LQH43NN122K03L

LQH43NN122J03L

LQH43NN152K03L

LQH43NN152J03L

1.7

1.9

9.3

8.4

7.5

6.8

6.2

5.5

5.0

4.5

4.0

3.6

3.3

3.0

2.7

2.5

2.2

2.0

1.8

1.6

1.5

1.3

200

180

170

160

150

130

120

110

100

2.2

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2.5

3.0

3.7

4.5

5.4

6.8

8.2

K:±10

J:± 5

9.7

11.8

14.5

17.0

20.5

25.0

30.0

37.0

45.0

50.0

LQH43NN182K03L

LQH43NN182J03L

LQH43NN222K03L

LQH43NN222J03L

LQH43NN242K03L

LQH43NN242J03L

2400

53.0

1.2

*When applied Rated current to the Products , self temperature rise shall be limited to 20°C max and Inductance

will be within ±10% of initial Inductance value.

MURATA MFG.CO., LTD

SpecNo. JELF243A-0116A-01

P3/9

4. Testing Conditions

Temperature : 20 ± 2°C

Humidity : 60 to 70 %(RH)

Temperature : Ordinary Temperature (15 to 35°C)

Humidity : Ordinary Humidity (25 to 85 %(RH))

Atmospheric Pressure : 86 to 106 kPa

5.Appearance and Dimensions (No marking)

3.6±0.2

3.2±0.2

4.5±0.3

A: 3.5max.

(in mm)

■Unit Mass (Typical value)

0.13g

1.0 min. 1.0 min. 1.0 min.

6.Electrical Performance

No.

Item

Specification

Test Method

Measuring Equipment:

Keysight 4192A or equivalent

Measuring Frequency:

1MHz／1.0 to 390μH

6.1 Inductance

Inductance shall meet item 3.

1kHz／470 to 2400μH

6.2

Measuring Equipment:

Keysight 4192A or equivalent

Measuring Frequency:

1MHz / 1.0 to 82μH

796kHz / 100 to 820μH

252kHz / 1000 to 2400 μH

Measuring Equipment:Digital multi meter

Measuring Equipment:

6.3 DC Resistance

6.4 Self Resonant

Frequency(S.R.F)

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Keysight 4991A or equivalent

6.5 Rated Current

Self temperaturer rise shall be limited The rated current is applied.

to 20°C max.

Inductance Change : within ± 10%

7.Mechanical Performance

No.

Item

Specification

Test Method

7.1 Shear Test

Chip coil shall not be damaged.

Substrate: Glass-epoxy substrate

Applied Direction :

Chip Coil

Force

Hold Duration: 5±1 s

Substrate: Glass-epoxy substrate

(100  40  1.6mm)

: 5N

Substrate

7.2 Bending Test

Speed of Applying Force: 1mm / s

Deflection: 2mm

Hold Duration: 5 s

Pressure jig

R230

Deflection

Product

(in mm)

MURATA MFG.CO., LTD

SpecNo. JELF243A-0116A-01

P4/9

No.

Item

Specification

Chip coil shall not be damaged.

Test Method

Oscillation Frequency:

10 to 55 to 10Hz for 1 minute

Total Amplitude: 1.5mm

Testing Time:

A period of 2 hours in each of 3 mutually

7.3 Vibration

perpendicular directions.

(Total 6 hours)

7.4 Solderability

The wetting area of the electrode shall

be at least 90% covered with new

solder coating.

Flux: Ethanol solution of rosin,25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150±10°C / 60 to 90seconds

Solder Temperature: 240±5°C

Immersion Time: 3±1 s

8.Environmental Performance (It shall be soldered on the substrate.)

No.

Item

Specification

Test Method

8.1 Heat Resistance

8.2 Cold Resistance

8.3 Humidity

Appearance:No damage

Inductance Change : within ±5%

Q-factor Change : within ±20%

Temperature: 105±2°C

Time: 1000±

hours

Then measured after exposure in the room

condition for 24±2 hours.

Temperature: -40±2°C

Time: 1000± ⁴⁸hours

Then measured after exposure in the room

condition for 24±2 hours.

Temperature: 85±2°C

Humidity: 80 to 85%(RH)

Time: 1000±

hours

Then measured after exposure in the room

condition for 24±2 hours.

8.4 Temperature

Cycle

1 cycle:

step 1 : -40±2°C / 30±3 min

step 2 : Ordinary temp. / 10 to 15 min

step 3 : +105±2°C / 30±3 min

step 4 : Ordinary temp. / 10 to 15 min

Total of 10 cycles

Then measured after exposure in the room

condition for 24±2 hours.

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

+0.1



1.5

-0

Lead-in/out wire

※

(00..33)±0.05

The packing directions of the chip coil

※

in taping are unified with the in/out

positions of the lead wire.

4.0±0.1

2.0±0.05

8.0±0.1

(in mm)

2.7±0.2

3.6

3.6±0.

Direction of feed

Dimension of the Cavity is measured at the bottom side.

MURATA MFG.CO., LTD

SpecNo. JELF243A-0116A-01

P5/9

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

500 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater,

and are not continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Embossed carrier tape

10N min.

5N min.

Cover tape

9.4 Peeling off force of cover tape

165 to 180 degree

Cover tape

Speed of Peeling off

Peeling off force

300mm/min

0.2 to 0.7N

(minimum value is typical)

Plastic tape

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

Trailer : 160 min.

Leader

190 min

Empty tape Cover tape

2.0±0.5

210 min

Label

13.0±0.2



60±¹



21.0±0.8



13.0±¹₀

17.0±1.4

Direction of feed

180± ⁰

(in mm)



9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･

1) <Expression of Inspection No.>

□□ OOOO 

(1)

(2)

(3)

(1) Factory Code

(2) Date

First digit

Second digit

: Year / Last digit of year

: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D

Third, Fourth digit : Day

(3) Serial No.

2) « Expression of RoHS marking »ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS marking (2) ,Quantity, etc ･･･

MURATA MFG.CO., LTD

SpecNo. JELF243A-0116A-01

P6/9

9.8. Specification of Outer Case

Outer Case Dimensions

(mm)

Standard Reel Quantity in Outer Case

(Reel)

Label

186

Above Outer Case size is typical. It depends on a quantity of an order

10.

Caution

10.1 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3)Undersea equipment

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(4)Power plant control equipment (10) Applications of similar complexity and /or reliability requirements

(5) Medical equipment to the applications listed in the above

(6) Transportation equipment (vehicles, trains, ships, etc.)

10.2 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur

dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the

previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration

due

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Recommended land patterns for reflow soldering are as follows:

These have been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Reflow Soldering

4.5

0.3

1.2

1.5

7.5

1.5

(in mm)

11.2 Flux, Solder

・Use rosin-based flux.

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion

Flux

value).

・ Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 200μm to 300μm

Solder

Other flux (except above) Please contact us for details, then use.

MURATA MFG.CO., LTD

SpecNo. JELF243A-0116A-01

P7/9

11.3 Soldering conditions (Reflow)

 Pre-heating should be in such a way that the temperature difference between solder and product surface

is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the

temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

 Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the

deterioration of product quality.

Soldering profile

Reflow soldering profile

Temp.

260℃

230℃

(℃)

245℃±3℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

Heating

150～180°C 、90s±30s

above 220°C、30s～60s above 230°C、60s max.

Peak temperature

Cycle of reflow

245±3°C

2 times

260°C,10s

2 time

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the

products due to the thermal shock.

11.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

Recommendable

1/3T≦t≦T

(T: Lower flange thickness)

MURATA MFG.CO., LTD

SpecNo. JELF243A-0116A-01

P8/9

11.6 Product's location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be locatedin the sideways

direction (Length:a b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

(2) Products location on P.C.B. separation

Products (A,B,C,D) shall be located carefully so

that products are not subject to the mechanical

stress due to warping the board.

Seam

Because they may be subjected the mechanical

Slit



Length:a b

stress in order of A

C B  D.

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W /l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 minutes max.

1. Alternative cleaner

･Isopropyl alcohol (IPA)

2. Aqueous agent

･PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in

order to remove the cleaner.

(5) Other cleaning

Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An

open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or

operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by

hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So,

please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products

mounted on your board.

11.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the

winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to

the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening

screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG.CO., LTD

SpecNo. JELF243A-0116A-01

P9/9

11.11 Storage and Handling Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

 Products should be stored in the warehouse on the following conditions.

Temperature : -10 ~ 40°C

Humidity

: 15 to 85% relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases such as

sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.

 Products should not be stored on bulk packaging condition to prevent the chipping of the core and the

breaking of winding wire caused by the collision between the products.

 Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

 Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical

shock.

12.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the agreed specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our

product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD

LQH43NN390K03# [MURATA]

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