LQH43NZ390J03# [MURATA]

;
LQH43NZ390J03#
型号: LQH43NZ390J03#
厂家: muRata    muRata
描述:

文件: 总10页 (文件大小:266K)
中文:  中文翻译
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Reference Only  
CHIP COILCHIP INDUCTORSLQH43NZ□□□□03L  
Spec No. JELF243A-9125D-01  
P.1/10  
Murata Standard Reference SpecificationAEC-Q200】  
1.Scope  
This reference specification applies to LQH43NZ series, Chip coil (Chip Inductors) for automotive Electronics based on  
AEC-Q200 except for Power train and Safety.  
2.Part Numbering  
(ex) LQ  
Product ID Structure Dimension Applications  
H
43  
N
Z
1R0  
M
0
3
L
Category Inductance Tolerance Features Electrode Packaging  
(L×W)  
and  
L:Taping  
Characteristics  
3.Rating  
Operating Temperature Range.  
–40 °C to +105 °C  
Storage Temperature Range.  
–40 °C to +105 °C  
Self  
Inductance  
DC  
Resistance  
(max)  
1:Rated  
Current  
(mA)  
Customer’s  
MURATA  
Q
(min.)  
Resonant  
Frequency  
(MHz min)  
ESD  
Tolerance  
Part Number  
Part Number  
1C : 1kV  
(H)  
(%)  
LQH43NZ1R0M03L  
LQH43NZ1R2M03L  
LQH43NZ1R5M03L  
LQH43NZ1R8M03L  
LQH43NZ2R2M03L  
LQH43NZ2R7M03L  
LQH43NZ3R3M03L  
LQH43NZ3R9M03L  
LQH43NZ4R7M03L  
LQH43NZ4R7K03L  
LQH43NZ5R6M03L  
LQH43NZ5R6K03L  
LQH43NZ6R8M03L  
LQH43NZ6R8K03L  
LQH43NZ8R2M03L  
LQH43NZ8R2K03L  
LQH43NZ100K03L  
LQH43NZ100J03L  
LQH43NZ120K03L  
LQH43NZ120J03L  
LQH43NZ150K03L  
LQH43NZ150J03L  
LQH43NZ180K03L  
LQH43NZ180J03L  
LQH43NZ220K03L  
LQH43NZ220J03L  
LQH43NZ270K03L  
LQH43NZ270J03L  
LQH43NZ330K03L  
LQH43NZ330J03L  
LQH43NZ390K03L  
LQH43NZ390J03L  
1.0  
120  
100  
85  
0.20  
0.30  
1.2  
1.5  
1.8  
75  
M:±20  
2.2  
20  
62  
2.7  
3.3  
3.9  
0.32  
0.35  
0.38  
53  
500  
47  
41  
4.7  
0.40  
0.47  
0.50  
38  
33  
31  
27  
23  
21  
19  
17  
15  
14  
12  
5.6  
M:±20  
K:±10  
6.8  
30  
450  
8.2  
10  
12  
15  
0.56  
1C  
400  
380  
360  
340  
320  
300  
270  
0.62  
0.73  
0.82  
0.94  
1.1  
18  
K:±10  
J:± 5  
22  
35  
27  
33  
1.2  
39  
1.4  
11  
240  
MURATA MFG.CO., LTD  
Reference Only  
Inductance  
Spec No. JELF243A-9125D-01  
P.2/10  
ESD  
Self  
DC  
1:Rated  
Current  
(mA)  
Customer’s  
Part Number  
MURATA  
Q
Resonant  
Frequency  
(MHz min)  
Resistance  
Tolerance  
Part Number  
(min.)  
1C : 1kV  
(H)  
(max)  
(%)  
LQH43NZ470K03L  
LQH43NZ470J03L  
LQH43NZ560K03L  
LQH43NZ560J03L  
LQH43NZ680K03L  
LQH43NZ680J03L  
LQH43NZ820K03L  
LQH43NZ820J03L  
LQH43NZ101K03L  
LQH43NZ101J03L  
LQH43NZ121K03L  
LQH43NZ121J03L  
LQH43NZ151K03L  
LQH43NZ151J03L  
LQH43NZ181K03L  
LQH43NZ181J03L  
LQH43NZ221K03L  
LQH43NZ221J03L  
LQH43NZ271K03L  
LQH43NZ271J03L  
LQH43NZ331K03L  
LQH43NZ331J03L  
LQH43NZ391K03L  
LQH43NZ391J03L  
LQH43NZ471K03L  
LQH43NZ471J03L  
LQH43NZ561K03L  
LQH43NZ561J03L  
LQH43NZ681K03L  
LQH43NZ681J03L  
LQH43NZ821K03L  
LQH43NZ821J03L  
LQH43NZ102K03L  
LQH43NZ102J03L  
LQH43NZ122K03L  
LQH43NZ122J03L  
LQH43NZ152K03L  
LQH43NZ152J03L  
LQH43NZ182K03L  
LQH43NZ182J03L  
LQH43NZ222K03L  
LQH43NZ222J03L  
LQH43NZ242K03L  
LQH43NZ242J03L  
47  
56  
1.5  
1.7  
10  
220  
200  
180  
170  
160  
150  
130  
120  
110  
100  
95  
9.3  
8.4  
7.5  
6.8  
6.2  
5.5  
5.0  
4.5  
4.0  
3.6  
3.3  
3.0  
2.7  
2.5  
2.2  
2.0  
1.8  
1.6  
1.5  
1.3  
1.2  
35  
68  
1.9  
82  
2.2  
100  
120  
150  
180  
220  
270  
330  
390  
470  
560  
680  
820  
1000  
1200  
1500  
1800  
2200  
2400  
2.5  
3.0  
3.7  
4.5  
5.4  
6.8  
8.2  
K:±10  
J:± 5  
1C  
9.7  
90  
11.8  
14.5  
17.0  
20.5  
25.0  
30.0  
37.0  
45.0  
50.0  
53  
80  
40  
70  
65  
60  
50  
45  
40  
35  
30  
25  
*1:When applied Rated current to the Products , self temperature rise shall be limited to 20 °C max and Inductance  
will be within ±10% of initial Inductance value.  
MURATA MFG.CO., LTD  
Reference Only  
Spec No. JELF243A-9125D-01  
P.3/10  
4. Testing Conditions  
Unless otherwise specified》  
Temperature : Ordinary Temperature / 15°C to 35°C  
Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)  
In case of doubt》  
Temperature  
Humidity  
: 20 ± 2°C  
: 60%(RH) to 70%(RH)  
Atmospheric Pressure : 86kPa to 106 kPa  
5.Appearance and Dimensions (No marking)  
LQH43N (without coating) Type  
3.6±0.2  
3.2±0.2  
A
3.2±0.2  
4.5±0.3  
A: 3.5max.  
Unit Mass (Typical value)  
0.13g  
No Marking.  
(in mm)  
1.0 min. 1.0 min. 1.0 min.  
6. Electrical Performance  
No.  
Item  
Specification  
Test Method  
Measuring Equipment:  
KEYSIGHT 4192A or equivalent  
Measuring Frequency:  
6.1 Inductance  
Inductance shall meet item 3.  
1MHz / 1.0 to 390μH  
1kHz / 470 to 2400μH  
6.2  
Q
Measuring Equipment:  
KEYSIGHT 4192A or equivalent  
Measuring Frequency:  
1MHz / 1.0 to 82μH  
796kHz / 100 to 820μH  
252kHz / 1000 to 2400 μH  
6.3 DC Resistance  
DC Resistance shall meet item 3.  
S.R.F shall meet item 3.  
Measuring Equipment:Digital multi meter  
6.4 Self Resonant  
Frequency(S.R.F)  
Measuring Equipment:  
KEYSIGHT E4991A or equivalent  
6.5 Rated Current  
Self temperaturer rise shall be limited The rated current is applied.  
to 20°C max.  
Inductance Change : within ± 10%  
MURATA MFG.CO., LTD  
Reference Only  
Spec No. JELF243A-9125D-01  
P.4/10  
7. AEC-Q200 Requirement  
7.1 Performance (based on Table 5 for Magnetics(Inductors / Transformer)  
AEC-Q200 Rev.D issued June. 1 2010  
AEC-Q200  
Murata Specification / Deviation  
Meet Table A after testing.  
No  
Stress  
Test Method  
3
High  
1000hours at 105 deg C  
Set for 24hours at room  
temperature, then measured.  
Temperature  
Exposure  
Table A  
Appearance  
No damage  
Within ±5%  
Within ±20%  
Inductance change  
Q change  
4
Temperature  
Cycling  
1000cycles  
Meet Table A after testing.  
-40 deg C to + 105deg C  
Set for 24hours at room  
temperature,then  
measured.  
7
8
Biased Humidity  
Operational Life  
1000hours at 85 deg C, 85%RH Meet Table A after testing.  
unpowered..  
Apply 105 deg C 1000 hours  
Set for 24hours at room  
Meet Table A after testing.  
temperature, then measured  
9
External Visual  
Visual inspection  
No abnormalities  
No defects  
10 Physical Dimension Meet ITEM 5  
(Style and Dimensions)  
12 Resistance  
to Solvents  
Per  
MIL-STD-202  
Method 215  
Not Applicable  
13 Mechanical Shock Per MIL-STD-202  
Method 213  
Meet Table A after testing.  
Meet Table A after testing.  
100g’s/6ms/Half sine  
14 Vibration  
5g's for 20 minutes,  
12cycles eah of 3 orientations  
Test from 10-2000Hz.  
12cycles each of 3 orientations  
15 Resistance  
No-heating  
Meet Table A after testing.  
to Soldering Heat  
Solder temperature  
260C+/-5 deg C  
Immersion time 10s  
17 ESD  
Per AEC-Q200-002  
Meet Item 3 (Rating)  
No defects  
18 Solderbility  
Per J-STD-002  
Method B : Not Applicable  
95% of the terminations is to be soldered.  
(Except exposed wire)  
19 Electrical  
Measured : Inductance  
No defects  
Characterization  
MURATA MFG.CO., LTD  
Reference Onl  
Spec No. JELF243A-9125D-01  
P.5/10  
AEC-Q200  
Murata Specification / Deviation  
No  
Stress  
Test Method  
Per UL-94  
20 Flammability  
Not Applicable  
21 Board Flex  
Epoxy-PCB(1.6mm)  
Deflection 2mm(min)  
60s minimum holding time  
Murata deviation request: 5s  
Meet Table B after testing.  
Table B  
Appearance  
No damage  
Within ±10%  
DC resistance change  
22 Terminal Strength Per AEC-Q200-006  
A force of 17.7N for 60s  
No defects  
8. Specification of Packaging  
8.1 Appearance and Dimensions of plastic tape  
1.5+0.1  
Lead-in/out wire  
-0  
(0.3)  
0305  
The packing directions of the chip coil  
in taping are unified with the in/out  
positions of the lead wire.  
4.0±0.1  
8.0±0.1  
2.7±0.2  
3.6  
3.6±0.1  
2.0±0.05  
Direction of feed  
Dimension of the Cavity is measured at the bottom side.  
8.2 Specification of Taping  
(1) Packing quantity (standard quantity)  
500 pcs / reel  
(2) Packing Method  
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.  
(3) Sprocket hole  
The sprocket holes are to the right as the tape is pulled toward the user.  
(4) Spliced point  
Plastic tape and Cover tape has no spliced point.  
(5) Missing components number  
Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and are  
not continuous. The specified quantity per reel is kept.  
8.3 Pull Strength  
Plastic tape  
Cover tape  
10N min.  
5N min.  
8.4 Peeling off force of cover tape  
165 to 180 degree  
F
Cover tape  
Plastic tape  
Speed of Peeling off  
300mm / min  
0.2N to 0.7N  
(minimum value is typical)  
Peeling off force  
MURATA MFG.CO., LTD  
Reference Only  
Spec No. JELF243A-9125D-01  
P.6/10  
8.5 Dimensions of Leader-tape, Trailer and Reel  
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.  
Trailer : 160 min.  
Leader  
190 min  
Empty tape Cover tape  
2.0±0.5  
210 min  
Label  
13.0±0.2  
60±1  
0
21.0±0.8  
13.0±10  
17.0±1.4  
Direction of feed  
180± 0  
(in mm)  
3
8.6 Marking for reel  
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・  
1) <Expression of Inspection No.>  
□□ OOOO   
(1) (2) (3)  
(1) Factory Code  
(2) Date  
First digit  
: Year / Last digit of year  
Second digit  
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D  
Third, Fourth digit : Day  
(3) Serial No.  
2) « Expression of RoHS marking »  
ROHS – Y ()  
(1) (2)  
(1) RoHS regulation conformity  
(2) MURATA classification number  
8.7 Marking for Outside package (corrugated paper box)  
Customer name, Purchasing order number, Customer part number, MURATA part number,  
RoHS marking (2) ,Quantity, etc ・・・  
8.8 Specification of Outer Case  
Outer Case Dimensions (mm)  
Standard Reel Quantity  
in Outer Case (Reel)  
Label  
W
D
H
H
186  
186  
93  
5
Above Outer Case size is typical. It depends on a quantity  
of an order  
D
W
9.  
Caution  
9.1 Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high reliability  
for the prevention of defects which might directly cause damage to the third party's life, body or property.  
(1) Aircraft equipment  
(6) Disaster prevention / crime prevention equipment  
(7) Traffic signal equipment  
(8) Transportation equipment (trains, ships, etc.)  
(9) Applications of similar complexity and /or reliability  
requirements to the applications listed in the above  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Power plant control equipment  
(5) Medical equipment  
MURATA MFG.CO., LTD  
Reference Only  
Spec No. JELF243A-9125D-01  
P.7/10  
9.2 Precautions on rating  
Do not use the products in excess of their rated current. Doing so may cause the product to generate heat, resulting in  
short circuit between wires, wire breakage, or melted solder, which may cause dropping of parts.  
9.3 Fail-safe  
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by  
the abnormal function or the failure of our product.  
9.4 Corrosive gas  
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur  
dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the  
previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration  
due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.  
10. Notice  
This product is designed for solder mounting.  
Please consult us in advance for applying other mounting method such as conductive adhesive.  
10.1 Land pattern designing  
Recommended land patterns for reflow soldering are as follows:  
It has been designed for Electric characteristics and solderability.  
Please follow the recommended pattern. Otherwise, their performance which includes electrical performance or  
solderability may be affected, or result to "position shift" in soldering process.  
Reflow Soldering   
4.5  
0.3  
1.2  
(in mm)  
1.5  
1.5  
7.5  
1.5  
10.2 Flux, Solder  
Use rosin-based flux.  
Flux  
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).  
Don’t use water-soluble flux.  
Use Sn-3.0Ag-0.5Cu solder  
Standard thickness of solder paste : 200μm to 300μm  
Solder  
Other flux (except above) Please contact us for details, then use.  
MURATA MFG.CO., LTD  
Reference Onl  
Spec No. JELF243A-9125D-01  
P.8/10  
10.3 Reflow soldering conditions  
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to  
150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is  
limited to 100°C max.  
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.  
Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of  
product quality.  
Reflow soldering profile  
Temp.  
(℃)  
260℃  
230℃  
Limit Profile  
245℃±3℃  
220℃  
180  
150  
Standard Profile  
30s~60s  
60s max.  
90s±30s  
Time.(s)  
Standard Profile  
Limit Profile  
Pre-heating  
150180°C 90s±30s  
above 220°C30s60s above 230°C60s max.  
Heating  
Peak temperature  
Cycle of reflow  
245±3°C  
2 times  
260°C,10s  
2time  
10.4 Reworking with soldering iron.  
The following conditions must be strictly followed when using a soldering iron.  
Pre-heating  
150°C,1 min  
350°C max.  
80W max.  
φ3mm max.  
3(+1,-0)s  
Tip temperature  
Soldering iron output  
Tip diameter  
Soldering time  
Times  
2 times  
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the  
products due to the thermal shock.  
10.5 Solder Volume  
Solder shall be used not to be exceeded the upper limits as shown below.  
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.  
Exceeding solder volume may cause the failure of mechanical or electrical performance.  
Upper Limit  
1/3TtT  
T: Lower flange thickness  
Recommendable  
T
t
MURATA MFG.CO., LTD  
Reference Only  
Spec No. JELF243A-9125D-01  
P.9/10  
10.6 Product’s location  
The following shall be considered when designing and laying out P.C.B.'s.  
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.  
Products direction]  
a
Products shall be located in the sideways  
direction (Length:a<b) to the mechanical  
stress.  
b
Poor example  
Good example  
(2) Components location on P.C.B. separation.  
It is effective to implement the following measures, to reduce stress in separating the board.  
It is best to implement all of the following three measures; however, implement as many measures  
as possible to reduce stress.  
Contents of Measures  
Stress Level  
(1) Turn the mounting direction of the component parallel to  
the board separation surface.  
A
A
A
>
>
>
D *1  
B
(2) Add slits in the board separation part.  
(3) Keep the mounting position of the component away from  
the board separation surface.  
C
C
B
Seam  
*1 A > D is valid when stress is added vertically to  
the perforation as with Hand Separation.  
If a Cutting Disc is used, stress will be diagonal to  
the PCB, therefore A > D is invalid.  
D
A
a
b
Slit  
Length:a b  
(3) Mounting Components Near Screw Holes  
When a component is mounted near a screw hole,  
it may be affected by the board deflection that occurs  
during the tightening of the screw. Mount the component  
in a position as far away from the screw holes as possible.  
Recommended  
Screw Hole  
10.7 Cleaning Conditions  
Products shall be cleaned on the following conditions.  
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for alcohol type cleaner.)  
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at  
the mounted products and P.C.B.  
Power : 20 W / l max.  
(3) Cleaner  
Frequency : 28kHz to 40kHz  
Time : 5 min max.  
1. Alternative cleaner  
Isopropyl alcohol (IPA)  
2. Aqueous agent  
PINE ALPHA ST-100S  
(4) There shall be no residual flux and residual cleaner after cleaning.  
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in  
order to remove the cleaner.  
(5) Other cleaning  
Please contact us.  
10.8 Resin coating  
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.  
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or  
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis  
under some operating condition may cause corrosion of wire of coil, leading to open circuit.  
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.  
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on  
your board.  
MURATA MFG.CO., LTD  
Reference Onl  
Spec No. JELF243A-9125D-01  
P.10/10  
10.9 Caution for use  
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the  
winding portion to prevent the breaking of wire.  
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core  
10.10 Handling of a substrate  
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the  
substrate when cropping the substrate, inserting and removing a coNZector from the substrate or tightening screw to  
the substrate.  
Excessive mechanical stress may cause cracking in the product.  
Bending  
Twisting  
10.11 Storage and Handing Requirements  
(1) Storage period  
Use the products within 12 months after delivered.  
Solderability should be checked if this period is exceeded.  
(2) Storage conditions  
Products should be stored in the warehouse on the following conditions.  
Temperature  
Humidity  
:
-10 °C to 40 °C  
:
15 % to 85 % relative humidity No rapid change on temperature and humidity  
The electrode of the products is coated with solder. Don't keep products in corrosive gases  
such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in  
poor solderability.  
Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking  
of winding wire caused by the collision between the products.  
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.  
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.  
(3) Handling Condition  
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.  
11.  
Note  
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted  
to your product.  
(2) You are requested not to use our product deviating from the reference specifications.  
(3) The contents of this reference specification are subject to change without advance notice. Please approve our  
product specifications or transact the approval sheet for product specifications before ordering  
MURATA MFG.CO., LTD  

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VISHAY

SI9130CG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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SI9130LG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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VISHAY

SI9130_11

Pin-Programmable Dual Controller - Portable PCs

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VISHAY

SI9137

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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