LQH55DN221M03# [MURATA]

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型号：	LQH55DN221M03#
厂家：	muRata
描述：
文件：	总8页 (文件大小：234K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SpecNo.JELF243A-0045V-01

P1/8

Reference Only

CHIP COIL（CHIP INDUCTORS）LQH55DN□□□□03L REFERENCE SPECIFICATION

1.Scope

This reference specification applies to LQH55DN Series, Chip coil (Chip Inductors).

2.Part Numbering

(ex)

R12

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W)

and

L:Taping

Characteristics

3.Rating

・Operating Temperature Range

・Storage Temperature Range

-40 to +80°C

-40 to +85°C

Self

Inductance

Resistance

()

Rated

Current

(A)

Customer

MURATA

Resonant

Frequency

(MHz min)

Tolerance

(%)

Part Number

(H)

LQH55DNR12M03L

LQH55DNR27M03L

LQH55DNR47M03L

LQH55DN1R0M03L

LQH55DN1R5M03L

LQH55DN2R2M03L

LQH55DN3R3M03L

LQH55DN4R7M03L

LQH55DN6R8M03L

LQH55DN100M03L

LQH55DN150M03L

LQH55DN220M03L

LQH55DN330M03L

LQH55DN470M03L

LQH55DN680M03L

LQH55DN101M03L

LQH55DN151M03L

LQH55DN221M03L

LQH55DN331M03L

LQH55DN471M03L

LQH55DN681M03L

LQH55DN102M03L

LQH55DN222M03L

LQH55DN472M03L

LQH55DN103M03L

0.12

0.27

0.47

1.0

0.007±40%

0.010±40%

0.013±40%

0.019±40%

0.022±40%

0.029±40%

0.036±40%

0.041±40%

0.074±40%

0.093±40%

0.15 ±40%

0.19 ±40%

0.32 ±40%

0.40 ±40%

0.67 ±40%

0.86 ±40%

1.9 ±40%

2.4 ±40%

4.4 ±40%

5.4 ±40%

8.1 ±40%

10.3 ±40%

21.5 ±40%

43.6 ±40%

100 ±40%

450

300

200

150

110

6.0

5.3

4.8

4.0

1.5

3.7

2.2

3.2

3.3

2.9

4.7

2.7

6.8

2.0

1.7

1.4

1.2

±20

0.9

0.8

7.6

6.5

5.0

4.0

3.1

2.4

1.9

1.7

1.2

0.8

0.5

0.64

0.56

0.42

0.32

0.27

0.24

0.19

0.15

0.10

0.07

0.05

100

150

220

330

470

680

1000

2200

4700

10000



When applied Rated current to the Products , self temperature rise shall be limited to 40°C max and Inductance

will be within ±40% of initial Inductance value.

4.Testing Conditions

Temperature : Ordinary Temperature (15 to 35°C)

Humidity : Ordinary Humidity (25 to 85 % (RH))

Temperature

Humidity

: 20 ± 2°C

: 60 to 70 % (RH)

Atmospheric Pressure : 86 to 106 kPa

MURATA MFG.CO., LTD

SpecNo.JELF243A-0045V-01

P2/8

Reference Only

5.Appearance and Dimensions

5.0±0.3

■Unit Mass (Typical value)

0.48g

5.7±0.3

(in mm)

No marking.

※

1.3min. 1.7min.1.3min.

6.Electrical Performance

No.

Item

Specification

Test Method

Measuring Equipment :

KEYSIGHT 4194A or equivalent

Measuring Frequency :

6.1 Inductance

Inductance shall meet item 3.

1 MHz / 0.12μH to 68μH

100 kHz / 100μH to 680μH

10 kHz / 1000μH to 10000μH

6.2 DC Resistance

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment : Digital multi meter

6.3 Self Resonant

Frequency(S.R.F)

Measuring Equipment :

f  1 MHz : KEYSIGHT 4194A or equivalent

f  1 MHz : KEYSIGHT E4991A or equivalent

7.Mechanical Performance

No.

Item

Specification

Test Method

7.1 Shear Test

Chip coil shall not be damaged.

Substrate : Glass-epoxy substrate

Applied Direction :

Chip Coil

Substrate

Force : 10N

Hold Duration : 5±1 s

7.2 Bending Test

Chip coil shall not be damaged.

Substrate : Glass-epoxy substrate

(100  40  1.6mm)

Speed of Applying Force : 1mm / s

Deflection : 2mm

Hold Duration : 30 s

Pressure jig

R340

Deflection

Product

(in mm)

MURATA MFG.CO., LTD

SpecNo.JELF243A-0045V-01

No. Item

P3/8

Reference Only

Specification

Test Method

Oscillation Frequency :

10 to 55 to 10Hz for 1 minute

7.3 Vibration

Chip coil shall not be damaged.

Total Amplitude : 1.5mm

Testing Time :

A period of 2 hours in each of 3 mutually

perpendicular directions.

(Total 6 hours)

7.4 Solderability

The wetting area of the electrode hall

be at least 90% covered with new

solder coating.

Flux : Ethanol solution of rosin, 25(wt)%

(Immersed for 5s to 10s)

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating : 150±10°C / 60 to 90seconds

Solder Temperature : 240±5°C

Immersion Time : 3±1 s

7.5 Resistance to

Soldering Heat

Appearance : No damage

Inductance Change : within ± 5%

Flux : Ethanol solution of rosin, 25(wt)%

(Immersed for 5s to 10s)

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating : 150±10°C / 60 to 90seconds

Solder Temperature : 270±5°C

Immersion Time : 10±1 s

Then measured after exposure in the room

condition for 24±2 hours.

8.Environmental Performance (It shall be soldered on the substrate.)

No.

Item

Specification

Test Method

Temperature : 85±2°C

Time : 1000h (+48 h, -0 h)

Then measured after exposure in the room

condition for 24±2 hours.

8.1 Heat Resistance

8.2 Cold Resistance

8.3 Humidity

Appearance : No damage

Inductance Change : within ± 5 %

Rdc Change : within ± 5 %

Temperature : -40±2°C

Time : 1000h (+48 h, -0 h)

Then measured after exposure in the room

condition for 24±2 hours.

Temperature : 40±2°C

Humidity : 90 to 95%(RH)

Time : 1000h (+48 h, -0 h)

Then measured after exposure in the room

condition for 24±2 hours.

8.4 Temperature

Cycle

1 cycle :

step 1 : -40±2°C / 30±3 min

step 2 : Ordinary temp. / 10 to 15 min

step 3 : +85±2°C / 30±3 min

step 4 : Ordinary temp. / 10 to 15 min

Total of 10 cycles

Then measured after exposure in the room

condition for 24±2 hours.

MURATA MFG.CO., LTD

SpecNo.JELF243A-0045V-01

P4/8

Reference Only

9.Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

1.5^+0.1

Lead-in/out wire



-0

( 0.4 )

0.4±0.05

The packing directions of the chip coil

※

in taping are unified with the in/out

positions of the lead wire.

Dimension of the Cavity is measured

at the bottom side.

4.0±0.1

2.0±0.05

8.0±0.1

(in mm)

5.0±0.2

5.4±0.1

Direction of feed

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

350 pcs. / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Embossed carrier tape

10N min.

5N min.

Cover tape

9.4 Peeling off force of cover tape

165 to 180 degree

Cover tape

Plastic tape

Speed of Peeling off

300 mm / min

0.1 to 0.5N

(minimum value is typical)

Peeling off force

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

Trailer : 160 min.

Leader

2.0±0.5

190 min

Empty tape Cover tape

Label

210 min

13.0±0.2



60±¹₀



21.0±0.8

13.0±¹₀

17.0±1.4

Direction of feed

(in mm)



180± ⁰₃

MURATA MFG.CO., LTD

SpecNo.JELF243A-0045V-01

P5/8

Reference Only

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ･･･

1) <Expression of Inspection No.>

□□OOOO 

(1) (2) (3)

(1) Factory Code

(2) Date

First digit

Second digit

: Year / Last digit of year

: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

Third, Fourth digit : Day

(3) Serial No.

2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS marking (2) ,Quantity, etc ･･･

9.8 Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

186

Above Outer Case size is typical. It depends on a quantity of an order

10. Caution

10.1 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability for

the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and /or reliability requirements

to the applications listed in the above

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

10.2 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur

dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously

stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to

corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.

11.Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Recommended land pattern for reflow soldering is as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

8.0

(in mm)

3.0

2.0

3.0

MURATA MFG.CO., LTD

SpecNo.JELF243A-0045V-01

P6/8

Reference Only

11.2 Flux, Solder

・Use rosin-based flux.

Flux

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 200μm to 300μm

Solder

Other flux (except above) Please contact us for details, then use.

11.3 Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited

to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is

limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration

of product quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150～180°C 、90s±30s

Heating

above 220°C、30s～60s

above 230°C、60s max.

260°C, 10s

Peak temperature

Cycle of reflow

245±3°C

2 times

1 time

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Times

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the products due to the thermal shock.

11.5 Soldering Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

1/3T≦t≦T

(T: Lower flange thickness)

Recommendable

MURATA MFG.CO., LTD

SpecNo.JELF243A-0045V-01

P7/8

Reference Only

11.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a＜b) to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

D 1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

Seam

1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Slit



Length:a b

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Recommended

Screw Hole

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at

the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 minutes max.

1. Alternative cleaner

・Isopropyl alcohol (IPA)

2. Aqueous agent

・PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order

to remove the cleaner.

(5) Other cleaning

Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open

circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition

etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating

condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you

select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no

reliability issue is observed by evaluating products mounted on your board.

MURATA MFG.CO., LTD

SpecNo.JELF243A-0045V-01

P8/8

Reference Only

11.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to

the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

11.11 Storage and Handling Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature : -10 ~ 40°C

Humidity

: 15 to 85% relative humidity No rapid change on temperature and humidity

・The electrode of the products is coated with solder. Don't keep products in corrosive gases such as

sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking

of winding wire caused by the collision between the products.

・Products should be storedon the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

12.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD

LQH55DN221M03# [MURATA]

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