LQM18DH330M70# [MURATA]

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型号：	LQM18DH330M70#
厂家：	muRata
描述：
文件：	总10页 (文件大小：561K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec No.: JELF243B-9127C-01

P1/10

Chip Coil (Chip Inductors) LQM18DH□□□□70□ REFERENCE SPECIFICATION

Murata Standard Specification [AEC-Q200]

1. Scope

This reference specification applies to chip coils (chip inductors) LQM18DH□□□□70□ series for automotive electronics

based on AEC-Q200.

2. Part Numbering

(Ex.)

6R8

Product ID

Type

Dimension

(L × W)

Application and

characteristic

(H: for automotive

electronics)

Inductance Tolerance Category

Packaging

L: taping

*B: bulk

*B: Bulk packing is also available.

(The product sealed on the carrier tape is stored in a plastic bag.)

3. Part Number and Rating

Operating temperature range

Storage temperature range

-55°C to +150°C

Rated current^*

(mA)

Inductance

Self-resonant

frequency

(MHz min.)

Customer

Part number

Murata

Part number

DC resistance

ESD

rank

Based on temperature rise

Nominal

value

(μH)

Based on

inductance

change^*1

(Ω)

Tolerance

Ambient

temperature temperature

Ambient

(%)

125°C

330

150°C

LQM18DH6R8M70L

LQM18DH100M70L

LQM18DH150M70L

LQM18DH220M70L

LQM18DH330M70L

LQM18DH470M70L

6.8

±20

0.74±0.22

1.05±0.32

1.95±0.59

2.40±0.72

2.55±0.77

120

100

300

220

200

180

* As shown in the diagram below, derating is applied to the rated current based on the operating temperature.

ESD Rank

Maximum Withstand Voltage

6000 V (DC) to < 8000 V (DC)

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

MURATA MFG CO., LTD

Spec No.: JELF243B-9127C-01

P2/10

5. Appearance and Dimensions

■ Equivalent Circuit

■ Unit mass (typical value): 0.005 g

6. Marking

No marking.

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

7.1 Inductance

Measuring equipment: Keysight 4294A or the

equivalent

Measuring frequency: 1 MHz

7.2 DC resistance

Meet chapter 3 ratings.

Measuring equipment: digital multimeter

Measuring circuit:

Measure with the product set to terminal 2 and the

switch pressed (open between a and b). When setting

or removing the product, press the switch to short

between a and b

7.3 Self-resonant

frequency

Meet chapter 3 ratings.

Measuring equipment: Keysight E4294A or the

equivalent

7.4 Rated current

When rated current is applied to the

products, inductance will be within ±50%

of initial inductance value range.

Apply the rated current specified in chapter 3.

Temperature rise caused by self-

generated heat shall be limited to 40°C

max.

MURATA MFG CO., LTD

Spec No.: JELF243B-9127C-01

P3/10

8. Q200 Requirement

Performance(based on Table 5 for Magnetics Inductors/Transformer)

AEC-Q200 Rev.D issued June 1. 2010

AEC-Q200

Murata Specification / Deviation

Appearance: No damage

No.

Stress

Test Method

1000 h at 150°C

Set for 24 h at room condition, Inductance change rate: within ±50%

3 High temperature

exposure

then measured.

(Inductance value: 6.8 μH to 22 μH)

Inductance change rate: within +40 %, -60%

(Inductance value: 33 μH to 47 μH)

Appearance: No damage

4 Temperature cycling 1000 cycles

-55°C to +150°C

Inductance change rate: within ±50%

Set for 24 h at room condition,

then measured.

7 Biased humidity

8 Operational life

1000 h at 85°C, 85% (RH).

Unpowered.

Set for 24 h at room condition,

then measured.

Appearance: No damage

Inductance change rate: within ±50%

Apply 150°C 1000 h

Appearance: No damage

Set for 24 h at room condition, Inductance change rate: within ±50%

then measured.

(Inductance value: 6.8 μH to 22 μH)

Inductance change rate: within +40 %, -60%

(Inductance value: 33 μH to 47 μH)

No abnormalities

9 External visual

Visual inspection

10 Physical dimension

Meet chapter 5, "Appearance

and Dimensions".

Per MIL-STD-202

Method 215

No defects

12 Resistance to

solvents

Not applicable

13 Mechanical shock

Per MIL-STD-202

Method 213

Appearance: No damage

Inductance change rate: within ±50%

Condition C:

100 g's/6 ms/half sine

14 Vibration

5 g's for 20 min, 12 cycles each Appearance: No damage

of 3 orientations

Test from 10 Hz to 2000 Hz

No-heating

Inductance change rate: within ±30%

15 Resistance

Appearance: No damage

to Soldering Heat

Solder temperature

260°C±5°C

Immersion time 10 s

Inductance change rate: within ±30%

(Inductance value: 6.8 μH to 10 μH)

Inductance change rate: within +50 %

(Inductance value: 15 μH to 47 μH)

Deviation for AEC-Q200

Pre-heating: 150°C/60s

17 ESD

Per AEC-Q200-002

Per J-STD-002

ESD Rank: Refer to chapter 3, "Part Number and Rating".

Appearance: No damage

Inductance change rate: within ±50%

95% or more of the outer electrode shall be covered

with new solder seamlessly.

18 Solderability

Deviation for AEC-Q200

Method b: Not applicable

Pre-heating: 150°C/60s

No defects

19 Electrical

Characterization

20 Flammability

Measured: inductance

Per UL-94

Not applicable

21 Board Flex

Epoxy-PCB (1.6 mm)

Appearance:No damage

Deflection 2 mm (min.)

60 s minimum holding time

Inductance change rate: within ±30%

(Inductance value: 6.8 μH to 22 μH)

Inductance change rate: within ±50%

(Inductance value: 33 μH to 47 μH)

Appearance: No damagel

22 Terminal Strength

Per AEC-Q200-006

A force of 17.7 N for 60 s

MURATA MFG CO., LTD

Spec No.: JELF243B-9127C-01

P4/10

9. Specification of Packaging

9.1 Appearance and dimensions of tape (8 mm width/plastic tape)

(0.95)

(1.8)

1.0 max.

(0.30)

(in mm)

* The dimensions of the cavity are measured at its bottom.

9.2 Taping specifications

Packing quantity

4000 pcs/reel

(Standard quantity)

Packing method

Feed hole position

Joint

The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and

bottom tape when the cavities of the carrier tape are punched type).

The feed holes on the carrier tape are on the right side when the cover tape (top tape when the

cavities of the carrier tape are punched type) is pulled toward the user.

The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type)

are seamless.

Number of missing

products

Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater,

and are not continuous. The specified quantity per reel is kept.

9.3 Break down force of tape

Cover tape (or top tape)

5 N min.

Bottom tape (only when the cavities of the carrier tape are punched type)

9.4 Peeling off force of tape

Speed of peeling off

Peeling off force

300 mm/min

0.1 N to 0.7 N (The lower limit is for typical value.)

MURATA MFG CO., LTD

Spec No.: JELF243B-9127C-01

P5/10

9.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

9.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

()

(2) Murata classification number

(1)

(2)

9.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

9.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

186

* Above outer box size is typical. It depends on a

quantity of an order.

MURATA MFG CO., LTD

Spec No.: JELF243B-9127C-01

P6/10

10.

Caution

10.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (trains, ships, etc.)

(7) Traffic signal equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

(8) Disaster/crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and/or reliability requirements

to the applications listed in the above

10.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

10.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

10.4 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the

abnormal function or the failure of our product.

11. Precautions for Use

This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a

conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and

the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

11.1 Land dimensions

The following diagram shows the recommended land dimensions for flow and reflow soldering:

flow

0.8

2.5

0.7

reflow

0.7

2.0

0.7

(in mm)

land pattern

solder resist

11.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

MURATA MFG CO., LTD

Spec No.: JELF243B-9127C-01

P7/10

11.3 Soldering conditions (flow, reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

100°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

(1) Flow

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard profile

150°C/60 s min.

250°C/4 s to 6 s

2 times

Limit profile

Pre-heating

Heating

150°C/60 s min.

265°C±3°C/5 s

2 times

Number of flow cycles

(2) Reflow

Temp.

(℃)

260℃

230℃

245℃±3℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

Heating

Peak temperature

Number of reflow cycles

2 times

MURATA MFG CO., LTD

Spec No.: JELF243B-9127C-01

P8/10

11.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

60 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal

shock.

11.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

11.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

MURATA MFG CO., LTD

Spec No.: JELF243B-9127C-01

P9/10

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

11.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

12.8 Cleaning

When cleaning this product, observe the following conditions.

Any cleaning may cause deterioration in the quality of the product, so please check the quality of this product before use.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) When ultrasonic cleaning is used, under some cleaning conditions, the substrate could resonate and the substrate

vibrations could result in chip cracks, solder breakage, and other problems. Be sure to always perform a test cleaning

beforehand using an actual cleaning device, and then check the quality of the products.

(3) Cleaner

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner.

When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is

left.

* For other cleaning, please consult our technical department.

11.9 Storage and transportation

Storage period

Use the product within 6 months after delivery.

If you do not use the product for more than 6 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and

humidity. The recommended temperature range is -10°C to +40°C. The recommended relative

humidity range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the

poor solderability.

• Do not place the products directly on the floor; they should be placed on a palette so that they

are not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

• Do not keep products in bulk packaging. Bulk storage could result in collisions between the

products or between the products and other parts, resulting in chipping or wire breakage.

• Avoid storing the product by itself bare (i.e. exposed directly to air).

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

MURATA MFG CO., LTD

Spec No.: JELF243B-9127C-01

P10/10

11.10 Resin coating (including moisture-proof coating)

When the product is coated/molded with resin, its electrical characteristics may change.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc.

Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading

to wire breakage.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your

board.

11.11 Mounting conditions

Check the mounting condition before using.

Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,

misalignment, or damage to the product.

11.12 Operating environment

Do not use this product under the following environmental conditions as it may cause deterioration of product quality.

(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.

(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)

(2) In the atmosphere where liquid such as organic solvent, may splash on the products.

(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.

11.13 Mounting density

If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.

If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,

resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that

the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating

temperature for the product.

11.14 Handling of product

Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or other similar tools

when handling the product (instead, use tweezers with resin or ceramic tips).

12.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications before order

MURATA MFG CO., LTD

LQM18DH330M70# [MURATA]

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