LQM21DN220N00# [MURATA]
;
| 型号： | LQM21DN220N00# |
| 厂家： | 
muRata |
| 描述： | |
| 文件： | 总8页 (文件大小：169K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Spec No. JELF243B-0004Q-01
P.1/8
CHIP COIL (CHIP INDUCTORS)
1. Scope
LQM21DN□□□□00□ REFERENCE SPECIFICATION
This reference specification applies to LQM21DN series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
M
21
D
N
1R0
N
0
0
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W) and D: Taping
Characteristics (Paper tape)
L: Taping
(Plastic tape)
*B: Bulk
*B: Bulk packing also available
3. Rating
・Operating Temperature Range
・Storage Temperature Range
– 40°C to + 85°C
– 55°C to +125°C
Self
DC
Resistance
Rated
Current
Customer
Part Number
MURATA
Part Number
Inductance
Resonant
Frequency
(MHz min.)
(H)
1.0
2.2
4.7
10
Tolerance
(Ω max.)
0.10
(mA)
60
40
30
15
13
7
LQM21DN1R0N00D
LQM21DN2R2N00D
LQM21DN4R7N00D
LQM21DN100N00D
LQM21DN220N00L
LQM21DN470N00L
75
50
35
24
16
7.5
0.17
0.30
±30%
0.50
22
0.65
47
1.20
4. Appearance and Dimensions
0.5±0.3
Ferrite
Electrode
T
2.0±0.2
1.25±0.2
(in mm)
Inductance: 1.0H to 10H
Inductance: 22H to 47H
0.85mm±0.2mm
1.25mm±0.2mm
Dimension of T
Unit Mass
Inductance: 1.0H to 10H
Inductance: 22H to 47H
0.010g
0.016g
(Typical value)
5. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : 20°C ± 2°C
: 60%(RH) to 70%(RH)
Atmospheric Pressure : 86kPa to 106kPa
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity
: Ordinary Humidity
/ 25%(RH) to 85%(RH) Humidity
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0004Q-01
P.2/8
6. Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
Agilent 4291A or equivalent (1mA)
Measuring Frequency: 1MHz
6.1 Inductance
6.2 DC Resistance
DC Resistance shall meet item 3.
Measuring Equipment: Digital multi meter
Digital multi meter
(TR6846 or equivalent)
a
terminal1
terminal2
SW
b
DC resistance shall be measured after putting
chip coil between the terminal 2 under the
condition of opening between a and b.
Every measurement the terminal 1 shall be
shorted between a and b when changing chip coil.
6.3 Self Resonant
Frequency
S.R.F shall meet item 3.
Measuring Equipment:
Agilent 4195A or equivalent (1mA)
(S.R.F)
6.4 Rated Current
Self temperature rise shall be
limited to 20°C max.
The rated current is applied.
Inductance Change: within ±50%
7. Mechanical Performance
No.
Item
Specification
Test Method
7.1 Shear Test
Chip coil shall not be damaged
after tested as test method.
Applied Direction:
Solder
Substrate
Chip Coil
Ｆ
Force: 10N
Hold Duration: 5 s±1 s
Substrate: Glass-epoxy substrate
(100mm40mm1.6mm)
Pressure jig
7.2 Bending Test
Chip coil shall not be damaged
after tested as test method.
R340
F
Deflection
Product
45
45
(in mm)
Speed of Applying Force: 1mm / s
Deflection: 2mm
Hold Duration: 30s
7.3 Vibration
Chip coil shall not be damaged
after tested as test method.
Oscillation Frequency:
10Hz to 55Hz to 10Hz for 1 min
Total Amplitude: 1.5mm
Testing Time: A period of 2 h in each of 3 mutually
Perpendicular directions.
7.4 Solderability
The wetting area of the electrode Flux: Ethanol solution of rosin 25(wt)%
shall be at least 90% covered
(Immersed for 5s to 10s)
with new solder coating.
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
7.5 Resistance to
Appearance: No damage
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Soldering Heat Inductance Change: within ±20%
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0004Q-01
P.3/8
8. Environmental Performance
It shall be soldered on the substrate.
No.
8.1 Heat
Item
Specification
Appearance: No damage
Test Method
Temperature: 85°C±2°C
Resistance
Inductance Change: within ±20% Time: 1000 h (+48h,-0h)
Then measured after exposure in the room condition
for 48h±2h.
8.2 Cold
Temperature: -40°C±2°C
Time: 1000 h (+48h,-0h)
Resistance
Then measured after exposure in the room condition
for 48h±2h.
8.3 Humidity
Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000 h (+48h, -0h)
Then measured after exposure in the room condition
for 48h±2h.
8.4 Temperature
1 cycle:
Cycle
1 step: -40°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: +85°C±2°C / 30 min± 3 min
4 step: Ordinary temp. / 10 min to 15 min
Total of 10 cycles
Then measured after exposure in the room condition
for 48h±2h.
9. Specification of Packaging
9.1 Appearance and Dimensions of paper tape,plastic tape (8mm-wide)
P/N
Type
Dimensions (in mm)
2.0±0.05
4.0±0.1 4.0±0.1
0.1
0
φ1.5±
1.75±0.1
LQM21D
1R0N00D
2R2N00D
4R7N00D
100N00D
8mm-wide
Paper tape
1.45±0.1
Direction of feed
max
.
1.1
2.0±0.05
1.3±0.1
0.2±0.1
0.1
0
4.0±0.1
φ1.5±
4.0±0.1
LQM21D
220N00L
470N00L
1.75±0.1
8mm-wide
Plastic tape
1.45±0.1
Direction of feed
・Dimension of the Cavity is measured at the bottom side.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0004Q-01
P.4/8
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
･Inductance : 1.0H to 10H (Paper tape)
･Inductance : 22H to 47 H (Plastic tape) 3,000 pcs / reel
(2) Packing Method
4,000 pcs / reel
(Paper tape)
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
(Plastic tape)
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
(Paper tape)
Base tape and Top tape has no spliced point.
(Plastic tape)
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
【Case of Paper tape】
【Case of Plastic tape】
Top tape
Plastic tape
Cover tape
10N min.
5N min.
5N min.
Bottom tape
9.4 Peeling off force
【Case of Paper tape】
165 to 180 degree
【Case of Plastic tape】
Top tape
165 to 180 degree
F
F
Cover tape
Plastic tape
Bottom tape
Base tape
Speed of Peeling off
Peeling off force
300mm / min
Paper tape: 0.1N to 0.6N
Plastic tape: 0.2N to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape / cover tape and empty tape) and trailer-tape (empty tape) as follows.
Trailer
160 min.
Leader
2.0±0.5
Label
190 min.
210 min.
Empty tape
13.0±0.2
Top tape:Paper tape
60+1
-
0
Cover tape:Plastic tape
Direction of feed
21.0±0.8
+1
-0
9.0
13.0±1.4
+0
180
-3
(in mm)
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0004Q-01
P.5/8
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2), Quantity
etc ･･･
1) <Expression of Inspection No.>
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
Third, Fourth digit : Day
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
(3) Serial No.
2) <Expression of RoHS Marking >
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS
Marking (2), Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
(mm)
Label
in Outer Case (Reel)
W
D
H
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order.
W
10. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Chip coil
c
a
b
c
1.2
3.0 to 4.0
1.0
a
b
Solder Resist
Land
(in mm)
11.2 Flux, Solder
･ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
･ Use Sn-3.0Ag-0.5Cu solder.
･ Standard thickness of solder paste:100m to 150m.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0004Q-01
P.6/8
11.3 Flow soldering / Reflow soldering conditions
･ Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that
the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
･Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Soldering profile
(1) Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Standard Profile
150℃, 60s min.
Limit Profile
Pre-heating
Heating
Cycle of flow
250℃, 4s～6s
2 times
265℃±3℃, 5s
2 times
(2) Reflow soldering profile
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C, 90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C, 30s～60s
above 230°C, 60s max.
260°C, 10s
245°C±3°C
2 times
2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C, 1 min
350°C max.
80W max.
φ3mm max.
3(+1, -0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0004Q-01
P.7/8
11.5 Solder Volume
･ Solder shall be used not to be exceeded the upper limits as shown below.
･ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T≦t≦T
t
T： thickness of product
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the
board.
［Products direction］
a
b
Products shall be located in the sideways
direction (Length: ab) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. separation
C
Products (A, B, C, D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the
mechanical tress in order of A ・C ・B D.
B
Seam
D
A
a
b
Slit
Length:a b
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
11.8 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating/molding products. So please pay your careful attention when
you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.9 Caution for use
There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of
tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or
pottery.)
11.10 Magnetic Saturation
When the excessive current over rated current is applied, the inductance value may change due to
magnetism.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0004Q-01
P.8/8
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so
on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12．! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product
being mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
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