LQM21PN1R0MC0# [MURATA]

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型号：	LQM21PN1R0MC0#
厂家：	muRata
描述：
文件：	总9页 (文件大小：422K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec No.: JELF243B_0014P-01

P1/9

CHIP COILS (CHIP INDUCTORS) LQM21PN□□□□C0□ REFENCE SPECIFICATION

1. Scope

This reference specification applies to chip coils (chip inductors) LQM21PN_C0 series for general electronic equipment.

2. Part Numbering

(Ex.)

R47

Product ID Structure Dimension Application and Category Inductance Tolerance Dimension Other Packaging

(L × W)

characteristic

(T)

D: taping

*B: bulk

*B: Bulk packing is also available.

3. Part Number and Rating

Operating temperature range

Storage temperature range

-55°C to +125°C

Rated current

(A)^*1

Inductance

resistance

(Ω)

Self-resonant

frequency

(MHz min.)

Customer

Murata

Nominal

value

Ambient

Part number

Tolerance

(%)

temperature temperature

(μH)

85°C^*2

125°C^*2

LQM21PNR47MC0D

LQM21PN1R0MC0D

LQM21PN1R5MC0D

LQM21PN2R2MC0D

0.47

1.0

1.5

2.2

±20

0.12±25%

0.19±25%

0.26±25%

0.34±25%

100

1.1

0.8

0.7

0.6

0.82

0.60

0.52

0.45

*1 When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C

max.

*2 As shown in the diagram below, derating is applied to the rated current based on the operating temperature.

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

MURATA MFG CO., LTD

Spec No.: JELF243B_0014P-01

P2/9

5. Appearance and Dimensions

Unit mass (typical value): 0.007 g

6. Marking

No marking.

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

7.1 Inductance

Measuring equipment: Keysight 4294A or the equivalent

(1 mA)

Measuring frequency: 1 MHz

7.2 DC resistance Meet chapter 3 ratings.

Measuring equipment: digital multimeter

Measuring circuit:

Measure with the product set to terminal 2 and the switch

pressed (open between a and b). When setting or

removing the product, press the switch to short between a

and b.

7.3 Self-resonant Meet chapter 3 ratings.

frequency

Measuring equipment: Keysight 4294A or the equivalent

8. Mechanical Performance

No.

Item

Specification

Test method

8.1 Shear test

No significant mechanical damage or no Force application direction:

sign of electrode peeling off shall be

observed.

Applying force: 10 N

Holding time: 5 s±1 s

MURATA MFG CO., LTD

Spec No.: JELF243B_0014P-01

No. Item

8.2 Bending test

P3/9

Specification

Test method

No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40 mm ×

sign of electrode peeling off shall be

observed.

1.0 mm)

Pressurizing speed: 0.5 mm/s

Deflection: 3 mm

Holding time: 30 s

Pressure jig

R230

Deflection

Product

(in mm)

8.3 Vibration

Appearance shall have no significant

mechanical damage.

Oscillation frequency: 10 Hz to 2000 Hz, for approx. 20 min

Total amplitude: total amplitude of 3.0 mm or acceleration

amplitude of 245 m/s², whichever is smaller

Test time: 3 directions perpendicular to each other, 4 h for

each direction (12 h in total)

8.4 Drop

Appearance shall have no significant

mechanical damage.

The product shall be dropped so that it falls freely onto

concrete or a steel board.

Height: 1 m

Number of falls: 10 times

8.5 Solderability

90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin content of

be covered with new solder seamlessly. 25(wt)% for 5 s to 10 s

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 240°C±5°C

Immersion time: 3 s±1 s

8.6 Resistance to Appearance: No significant mechanical Flux: immersed in ethanol solution with a rosin content of

soldering heat damage shall be observed.

Inductance change rate: within ±20%

25(wt)% for 5 s to 10 s

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 270°C±5°C

Immersion time: 10 s±1 s

Post-treatment: left at a room temperature for 24 h±2 h

9. Environmental Performance

The product is soldered on a substrate for test.

No.

Item

Specification

Test method

9.1 Heat

Appearance: No significant mechanical Temperature: 125°C±2°C

resistance

damage shall be observed.

Test time: 1000 h (+48 h, -0 h)

Inductance change rate: within ±20%

Post-treatment: left at a room temperature for 24 h±2 h

9.2 Cold

Appearance: No significant mechanical Temperature: -55°C±2°C

resistance

damage shall be observed.

Test time: 1000 h (+48 h, -0 h)

Inductance change rate: within ±20%

Post-treatment: left at a room temperature for 24 h±2 h

9.3 Humidity

Appearance: No significant mechanical Temperature: 40°C±2°C

damage shall be observed.

Humidity: 90% (RH) to 95% (RH)

Inductance change rate: within ±20%

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room temperature for 24 h±2 h

9.4 Temperature

cycle

Appearance: No significant mechanical Single cycle conditions:

damage shall be observed.

Step 1: -55°C±2°C/30 min±3 min

Inductance change rate: within ±20%

(Inductance value: 0.47 μH)

Step 2: ordinary temperature/10 min to 15 min

Step 3: +125°C±2°C/30 min±3 min

Inductance change rate: within ±30%

(Inductance value: 1.0 μH to 2.2 μH)

Step 4: ordinary temperature/10 min to 15 min

Number of testing: 100 cycles

Post-treatment: left at a room temperature for 24 h±2 h

MURATA MFG CO., LTD

Spec No.: JELF243B_0014P-01

P4/9

10. Specification of Packaging

10.1 Appearance and dimensions of tape (8 mm width/paper tape)

1.45±0.05

2.25±0.1

0.8 max.

(in mm)

10.2 Taping specifications

Packing quantity

4000 pcs/reel

(Standard quantity)

Packing method

The products are placed in embossed cavities of a base tape and sealed by a top tape and a bottom

tape.

Feed hole position

Joint

The feed holes on the base tape are on the right side when the top tape is pulled toward the user.

The base tape and the top tape are seamless.

Number of missing

products

Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

Break down force of top tape

5 N min.

Break down force of bottom tape

10.4 Peeling off force of top tape

Speed of peeling off

300 mm/min

Peeling off force

0.1 N to 0.6 N (The lower limit is for typical value.)

Top tape

165 to 180 degree

Bottom tape

Base tape

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

MURATA MFG CO., LTD

Spec No.: JELF243B_0014P-01

P5/9

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

10.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

186

* Above outer box size is typical. It depends on a

quantity of an order.

11.

Caution

Restricted

Please contact us before using our products for the applications listed below which require especially high

applications reliability for the prevention of defects which might directly cause damage to the third party's life, body or

property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

(8) Disaster/crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and/or reliability requirements

to the applications listed in the above

12. Precautions for Use

This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a

conductive adhesive, please consult us beforehand.

12.1 Land dimensions

The following diagram shows the recommended land dimensions for flow and reflow soldering:

1.2

3.0 to 4.0

1.0

(in mm)

MURATA MFG CO., LTD

Spec No.: JELF243B_0014P-01

P6/9

12.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

12.3 Soldering conditions (flow, reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

150°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

(1) Flow

Temp.

(℃)

265℃±3℃

250℃

Limit Profile

150

Heating Time

Standard Profile

60s min.

Time.(s)

Standard profile

150°C/60 s min.

250°C/4 s to 6 s

2 times

Limit profile

Pre-heating

Heating

150°C/60 s min.

265°C±3°C/5 s

2 times

Number of flow cycles

(2) Reflow

Temp.

(℃)

260℃

230℃

245℃±3℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

Heating

Peak temperature

Number of reflow cycles

2 times

MURATA MFG CO., LTD

Spec No.: JELF243B_0014P-01

P7/9

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to be exceeded the upper limits as shown below.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

MURATA MFG CO., LTD

Spec No.: JELF243B_0014P-01

P8/9

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

12.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

12.8 Cleaning

The product shall be cleaned under the following conditions.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in

mounted products and the PCB.

Item

Power

Requirement

20 W/L max.

Time

5 min max.

Frequency

(3) Cleaner

28 kHz to 40 kHz

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water

adequately and completely dry it so that no cleaner is left.

* For other cleaning, consult our technical department.

12.9 Storage and transportation

Storage period

Use the product within 6 months after delivery.

If you do not use the product for more than 6 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.

The recommended temperature range is -10°C to +40°C. The recommended relative humidity

range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor

solderability.

• Do not place the products directly on the floor; they should be placed on a palette so that they are

not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

• Avoid storing the product by itself bare (i.e. exposed directly to air).

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

12.10 Resin coating

The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be

used for coating/molding products. So please pay your careful attention when you select resin. In prior to use, please make

the reliability evaluation with the product mounted in your application set.

MURATA MFG CO., LTD

Spec No.: JELF243B_0014P-01

P9/9

12.11 Handling of product

Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or other similar tools

when handling the product (instead, use tweezers with resin or ceramic tips).

12.12 Magnetic saturation

A current exceeding the rated current could cause the inductance value to drop due to magnetic saturation.

13.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our

product specifications or transact the approval sheet for product specifications before order.

MURATA MFG CO., LTD

LQM21PN1R0MC0# [MURATA]

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