LQM2HPN1R0MJHL [MURATA]

General Purpose Inductor,;


型号：	LQM2HPN1R0MJHL
厂家：	muRata
描述：	General Purpose Inductor, PC 测试射频感应器电感器
文件：	总9页 (文件大小：207K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Only

Spec No. JELF243B-0044E-01

P.1/9

CHIP COIL (CHIP INDUCTORS) LQM2HPN□□□□JHL REFERENCE SPECIFICATION

1. Scope

This ｒeference specification applies to LQM2HPN_JHL series, Chip Coil (Chip Inductors).

2. Part Numbering

(ex)

Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Other

(L×W) and (T)

Characteristics

1R0

Packaging

L:Taping

*B:BULK

*B:Bulk packing also available

3. Rating

・Operating Temperature Range

・Storage Temperature Range

–40°C to + 85°C

Inductance

*3 Rated Current(A)

Self

Resistance

Resonant

(m ohm) Frequency

(MHz min.)

Customer

Part Number

MURATA

Part Number

*1 (Based on

*2(Based on

Tolerance

Inductance change) Temperature rise)

(μH)

(%)

Typ

3.5

Max

3.2

Typ

3.4

Max

2.7

Typ

Max

LQM2HPNR47MJHL

LQM2HPN1R0MJHL

LQM2HPN2R2MJHL

0.47

1.0

2.2

±20

2.4

1.6

2.1

1.4

2.9

1.9

2.3

1.5

110

138

*1: When applied Rated current to the Products , Inductance will be within ±30% of initial inductance value range.

*2: When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to

40℃ max.

*3: Keep the temperature (ambient temperature plus self-generation of heat) under 125℃

4. Testing Conditions

《Unless otherwise specified》

《In case of doubt》

Temperature : 20°C ±2°C

Humidity : 60%(RH) to 70%(RH)

Temperature : Ordinary Temperature / 15°C to 35°C

Humidity

: Ordinary Humidity

/ 25%(RH) to 85%(RH)

Atmospheric Pressure : 86kPa to 106kPa

5. Appearance and Dimensions

0.6±0.2

■Unit Mass (Typical value)

0.027g

1.1±0.1

(in mm)

2.5±0.2

2.0±0.2

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0044E-01

P.2/9

6. Electrical Performance

No.

Item

Specification

Inductance shall meet item 3.

Test Method

Measuring Equipment:

KEYSIGHT 4294A or equivalent (1mA)

Measuring Frequency: 1MHz

6.1 Inductance

6.2 DC Resistance

DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter

Digital multi meter

(TR6846 or equivalent)

terminal1

terminal2

DC resistance shall be measured after

putting chip coil between the terminal 2

under the condition of opening between

a and b.

Every measurement the terminal 1 shall

be shorted between a and b when

changing chip coil.

6.3 Rated Current

Self temperature rise shall be

limited to 40°C max.

The rated current is applied.

7. Mechanical Performance

No.

Item

Specification

Chip coil shall not be damaged after

tested as follows.

Test Method

7.1 Shear Test

Applied Direction

Chip Coil

Substrate

Force: 10N

Hold Duration: 5s±1s

Applied Direction: Parallel to PCB

Substrate: Glass-epoxy substrate

7.2 Bending Test

(100mm×40mm×1.0mm)

Pressure jig

R230

Deflection

Product

(in mm)

Speed of Applying Force: 0.5mm / s

Deflection: 2mm

Hold Duration: 30 s

7.3 Vibration

Oscillation Frequency:

10Hz to 2000Hz to 10Hz for 20 min

Total amplitude 3.0 mm or Acceleration

amplitude 245m/s²whichever is smaller.

Testing Time:

A period of 4h in each of 3 mutually

perpendicular directions.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0044E-01

P.3/9

No.

Item

Specification

Test Method

It shall be dropped on concrete or steel

board.

7.4 Drop

Chip coil shall not be damaged after

tested as follows.

Method : free fall

Height : 1m

Total of 10 cycles

7.5 Solderability

The wetting area of the electrode

shall be at least 90% covered with

new solder coating.

Flux: Ethanol solution of rosin 25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150°C±10°C / 60s to 90s

Solder Temperature: 240°C±5°C

Immersion Time: 3s±1s

7.6 Resistance to

Soldering Heat

Appearance: No damage

Inductance Change: within ±30%

Flux: Ethanol solution of rosin 25(wt)%

(Immersed for 5s to 10s)

Solder: Sn-3.0Ag-0.5Cu

Pre-Heating: 150°C±10°C / 60s to 90s

Solder Temperature: 270°C±5°C

Immersion Time: 10s±1s

Then measured after exposure in the room

condition for 24h±2h.

8. Environmental Performance

It shall be soldered on the substrate.

No.

Item

Specification

Test Method

Temperature: 85°C±2°C

Time: 1000h (+48h,-0h)

Then measured after exposure in the room

condition for 24h±2h.

8.1 Heat Resistance

8.2 Cold Resistance

8.3 Humidity

Appearance: No damage

Inductance Change: within ±30%

Temperature: -40°C±2°C

Time: 1000h (+48h, -0h)

Then measured after exposure in the room

condition for 24h±2h.

Temperature: 70°C±2°C

Humidity: 90%(RH) to 95%(RH)

Time: 1000h (+48h, -0h)

Then measured after exposure in the room

condition for 24h±2h.

8.4 Temperature

Cycle

1 cycle:

1 step: -40°C±2°C / 30 min±3 min

2 step: Ordinary temp. / 10 min to 15 min

3 step: 85°C±2°C / 30 min to 3 min

4 step: Ordinary temp. / 10 min to15 min

Total of 100cycles

Then measured after exposure in the room

condition for 24h±2h.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0044E-01

P.4/9

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape (8mm-wide)

2.0±0.05

0.1

4.0±0.1

φ1.5±

1.3±0.1

0.25±0.05

1.75±0.1

(in mm)

Direction of feed

2.25±0.1

Dimension of the Cavity is measured at the bottom side.

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

3,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,

and are not continuous. The Specified quantity per reel are kept.

9.3 Pull Strength

Plastic tape

Cover tape

10N min.

5N min.

9.4 Peeling off force of cover tape

165 to 180 degree

Speed of Peeling off

Peeling off force

300mm / min

Cover tape

Plastic tape

Plastic tape: 0.1N to 0.7N

(minimum value is typical)

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

Trailer

160 min.

Leader

2.0±0.5

190 min.

210 min.

Label

Empty tape Cover tape



13.0±0.2



60± ¹₀

9± ¹₀

13±1.4



21.0±0.8

Direction of feed



180±⁰₃

(in mm)

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0044E-01

P.5/9

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2),

Quantity etc ･･･

1) <Expression of Inspection No.>

□□ OOOO 

(1)

(2)

(3)

(1) Factory Code

(2) Date

First digit

Second digit

Third, Fourth digit : Day

: Year / Last digit of year

: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D

(3) Serial No.

2) <Expression of RoHS Marking>

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS Marking (2), Quantity, etc ･･･

9.8 Specification of Outer Case

Outer Case Dimensions

Standard Reel Quantity

in Outer Case (Reel)

(mm)

Label

186



Above Outer Case size is typical. It depends on a quantity of an order

10.

！

Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life,

body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Ｃｈｉｐｃｏｉｌ

Chip Ferrite Bead

Land pad thickness

and dimension d

18µm 35µm 70µm

Operating

Current

(A)

0 to 1.6

1.5

2.4

1.5

1.6 to 2.4 1.6 3.0 1.5 2.4

2.4 to 3.5 3.6

(in mm)

Solder Resist

Pattern

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0044E-01

P.6/9

11.2 Flux, Solder

・Use rosin-based flux.

Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).

Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder.

・Standard thickness of solder paste: 100μm to 150μm.

11.3 Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product

surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that

the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products

quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resultingin the

deterioration of product quality.

Soldering Profile for Lead Free solder

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150°C～180°C, 90s±30s

Heating

Peak temperature

Cycle of reflow

above 220°C, 30s～60s

245°C±3°C

above 230°C, 60s max.

260°C, 10s

2 times

11.4 Reworking with soldering iron

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C, 1 min

350°C max.

80W max.

φ3mm max.

3(+1, -0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Time

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on

the products due to the thermal shock.

11.5 Solder Volume

・Solder shall be used not to be exceeded the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

Recommendable

1/3T≦t≦T

T： thickness of electrode

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0044E-01

P.7/9

11.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length: a‹b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

(2)Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the board separation surface.

D *1

Perforation

Slit

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component in a position as far away from the screw holes

as possible.

Recommended

Screw Hole

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max.

Frequency : 28kHz to 40kHz

Time : 5 min max.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0044E-01

(3) Cleaner

P.8/9

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,

products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.

(5) Other cleaning Please contact us.

11.8 Resin coating

The inductance value may change and/or it may affect on the product's performance due to high

cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you

select resin.

In prior to use, please make the reliability evaluation with the product mounted in your application set.

11.9 Caution for use

There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of

tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or

pottery.)

11.10 Magnetic Saturation

When the excessive current over rated current is applied, the inductance value may change due to

magnetism.

11.11 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or

twisting to the substrate when cropping the substrate, inserting and removing a connector from the

substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

11.12 Storage and Handing Requirements

(1) Storage period

Use the products within 6 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature ： -10°C to 40°C

Humidity

： 15% to 85% relative humidity No rapid change on temperature and humidity

Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of

electrode, resulting in poor solderability.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so

on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

・Products should be stored under the airtight packaged condition.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical

shock.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243B-0044E-01

P.9/9

12. ! Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product

being mounted to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

MURATA MFG.CO., LTD

LQM2HPN1R0MJHL [MURATA]

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