LQM2MPNR24MEHL [MURATA]
FIXED IND 240NH 3A 34 MOHM SMD;
| 型号： | LQM2MPNR24MEHL |
| 厂家： | 
muRata |
| 描述： | FIXED IND 240NH 3A 34 MOHM SMD 测试 射频感应器 电感器 |
| 文件： | 总8页 (文件大小：203K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reference Only
Spec No. JELF243B-0049A-01
P1/8
CHIP COIL (CHIP INDUCTORS) LQM2MPN□□□□EHL REFERENCE SPECIFICATION
1. Scope
This reference specification applies to LQM2MPN□□□□EHL series, Chip Coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
M
2M
P
N
R24
M
E
H
L
Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Other
Packaging
L:Taping
*B:BULK
(L×W)
and
(%)
(T)
Characteristics
*B:Bulk packing also available
3. Rating
・Operating Temperature Range
・Storage Temperature Range
– 40°C to + 85°C
– 40°C to + 85°C
Inductance
DC
*3 Rated Current(A)
Self
Resistance
(m ohm)
Customer
Part Number
MURATA
Part Number
Resonant
Frequency
(MHz min.)
*1 (Based on
Inductance change)
*2(Based on
Temperature rise)
(μH)
Tolerance
±20%
Typ
4.5
2.5
2.2
2.0
0.9
0.85
Max
4.1
2.3
Typ
3.3
2.8
2.3
2.0
2.1
1.45
Max
2.6
Typ
35
Max
44
LQM2MPNR24MEHL
LQM2MPNR47MEHL
LQM2MPNR68MEHL
LQM2MPN1R0MEHL
LQM2MPN1R5MEHL
LQM2MPN2R2MEHL
0.24
0.47
0.68
1.0
130
80
60
50
40
30
50
63
2.15
1.75
1.5
75
94
2.0
100
90
125
113
225
1.8
1.5
0.75
0.7
1.6
180
2.2
1.1
*1: When applied Rated current to the Products, Inductance will be within ±30% of initial inductance value range.
*2: When applied Rated current to the Products, temperature rise caused by self-generated heat shall be limited to
40℃ max.
*3: Keep the temperature (ambient temperature plus self-generation of heat) under 125℃.
4. Testing Conditions
《Unless otherwise specified》
《In case of doubt》
Temperature : 20°C ± 2°C
/ 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH)
Temperature : Ordinary Temperature / 15°C to 35°C
Humidity
: Ordinary Humidity
Atmospheric Pressure : 86kPa to 106kPa
5. Appearance and Dimensions
0.5 ± 0.2
■Unit Mass (Typical value)
0.010g
0.7 ± 0.1
(in mm)
2.0 ± 0.2
1.6 ± 0.2
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0049A-01
P2/8
6. Electrical Performance
No.
Item
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:
Agilent 4294A or quivalent (1mA)
Measuring Frequency: 1MHz
6.1 Inductance
6.2 DC Resistance
DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter
Digital multi meter
(TR6846 or equivalent)
a
terminal1
terminal2
SW
b
DC resistance shall be measured after
putting chip coil between the terminal 2
under the condition of opening between
a and b.
Every measurement the terminal 1 shall
be shorted between a and b when
changing chip coil.
6.3 Self Resonant
Frequency (S.R.F)
S.R.F shall meet item 3.
Measuring Equipment:
Agilent 4294A or equivalent
7. Mechanical Performance
No.
Item
Specification
Chip coil shall not be damaged after
tested as follows.
Test Method
7.1 Shear Test
Applied Direction
Chip Coil
F
Substrate
Force: 10N
Hold Duration: 5s±1s
Applied Direction: Parallel to PCB
Substrate: Glass-epoxy substrate
7.2 Bending Test
(100mm×40mm×1.0mm)
Solder: Reflow
Pressure jig
F
R230
Deflection
(in mm)
Product
45
45
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 30 s
7.3 Vibration
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 3.0 mm or Acceleration
amplitude 245m/s2 whichever is smaller.
Testing Time:
A period of 4h in each of 3 mutually
perpendicular directions.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0049A-01
P3/8
No.
Item
Specification
Chip coil shall not be damaged after
tested as follows.
Test Method
7.4 Drop
It shall be dropped on concrete or steel
board.
Method : free fall
Height : 1m
Total of 10 cycles
7.5 Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
7.6 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±30%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
Test Method
Temperature: 85°C±2°C
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.1 Heat Resistance
8.2 Cold Resistance
8.3 Humidity
Appearance: No damage
Inductance Change: within ±30%
Temperature: -40°C±2°C
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h,-0h)
Then measured after exposure in the room
condition for 24h±2h.
8.4 Temperature
Cycle
1 cycle:
1 step: -40°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: 85°C±2°C / 30 min to 3 min
4 step: Ordinary temp. / 10 min to15 min
Total of 100cycles
Then measured after exposure in the room
condition for 24h±2h.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0049A-01
P4/8
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape (8mm-wide)
2.0±0.05
0.1
0
4.0±0.1
4.0±0.1
φ1.5±
0.9±0.1
1.75±0.1
0.25±0.05
(in mm)
Direction of feed
Dimension of the Cavity is measured at the bottom side.
1.9±0.1
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Plastic tape
Cover tape
10N min.
5N min.
9.4 Peeling off force of cover tape
165 to 180 degree
F
Cover tape
Plastic tape
Speed of Peeling off
Peeling off force
300mm / min
Plastic tape: 0.1N to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
160 min.
2.0±0.5
190 min.
210 min.
Label
Empty tape Cover tape
13.0±0.2
60± 10
9± 10
13±1.4
21.0±0.8
Direction of feed
180±03
(in mm)
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0049A-01
P5/8
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1), RoHS marking (2),
Quantity etc ･･･
1) <Expression of Inspection No.>
□□ OOOO
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
Third, Fourth digit : Day
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
(3) Serial No.
2) <Expression of RoHS marking >
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2), Quantity, etc ･･･
9.8 Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
in Outer Case (Reel)
(mm)
D
Label
W
H
H
186
186
93
5
D
Above Outer Case size is typical. It depends on a quantity of an order
W
10. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Ｃｈｉｐ ｃｏｉｌ
c
d
Land pad thickness
and dimension d
18µm 35µm 70µm
Operating
Current
(A)
a
b
c
0 to 1.5
1.5 to 2.5 0.8
2.5 to 4.5
1.8
1.8 2.4
5.0
1.8
1.8
2.4
1.8
1.8
1.8
a
b
2.4
(in mm)
Solder Resist
Pattern
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0049A-01
P6/8
11.2 Flux, Solder
・Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste: 100μm to 150μm.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that
the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
Soldering Profile for Lead Free solder
Temp.
(℃)
260℃
230℃
Limit Profile
245℃±3℃
220℃
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C～180°C, 90s±30s
Heating
Peak temperature
Cycle of reflow
above 220°C, 30s～60s
245°C±3°C
above 230°C, 60s max.
260°C, 10s
2 times
2 times
11.4 Reworking with soldering iron
Soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C, 1 min
350°C max.
80W max.
φ3mm max.
3(+1, -0)s
Tip temperature
Soldering iron output
Tip diameter
Soldering time
Time
2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the products due to the thermal shock.
11.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
1/3T≦t≦T
t
T： thickness of electrode
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0049A-01
P7/8
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
a
b
Products shall be located in the sideways
direction (Length: a‹b) to the mechanical
stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. separation
C
Products (A, B, C, D) shall be located carefully so
that products are not subject to the mechanical
stress due to warping the board.
B
Seam
D
Because they may be subjected the mechanical
stress in order of ACBD.
A
a
b
Slit
Length:a‹b
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
(3) Cleaner
Frequency : 28kHz to 40kHz
Time : 5 min max.
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
11.8 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you
select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.9 Caution for use
There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of
tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or
pottery.)
11.10 Magnetic Saturation
When the excessive current over rated current is applied, the inductance value may change due to
magnetism.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0049A-01
P8/8
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity
： 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so
on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12． ! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD
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