LQP02HV10NH02#_技术文档

Reference Only

Spec No. JELF243C-0034G-01

P.1/12

CHIP COIL (CHIP INDUCTORS) LQP02HV□□□□02□ Reference Specification

1.Scope

This reference specification applies to LQP02HV□□□□02□ series, Chip coil (Chip Inductors).

2.Part Numbering

(ex)

LQ

P

02

H

V

0N4

B

0

2

L

Product ID Structure Dimension Applications Category Inductance Tolerance Features

Electrode Packaging

L:4mm-wide / plastic tape

*B:Bulk

(L×W)

and

Characteristics

*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)

3.Rating

・Operating Temperature.

・Storage Temperature.

–55°C to +125°C

Inductance

(nH)

(＠500MHz)

Q

(min)

(＠500MHz)

DC

Resistance

(Ω max)

Self Resonant

Frequency

(GHz Min.)

Rated

Current

(mA)

Customer

Part Number

MURATA

Part Number

Tolerance

LQP02HV0N4B02L

0.4

B:±0.1nH

17

0.03

18.0

1000

LQP02HV0N4C02L

LQP02HV0N5B02L

LQP02HV0N5C02L

LQP02HV0N6B02L

LQP02HV0N6C02L

LQP02HV0N7B02L

LQP02HV0N7C02L

LQP02HV0N8B02L

LQP02HV0N8C02L

LQP02HV0N9B02L

LQP02HV0N9C02L

LQP02HV1N0B02L

LQP02HV1N0C02L

LQP02HV1N1B02L

LQP02HV1N1C02L

LQP02HV1N2B02L

LQP02HV1N2C02L

LQP02HV1N3B02L

LQP02HV1N3C02L

LQP02HV1N4B02L

LQP02HV1N4C02L

LQP02HV1N5B02L

LQP02HV1N5C02L

LQP02HV1N6B02L

LQP02HV1N6C02L

LQP02HV1N7B02L

LQP02HV1N7C02L

LQP02HV1N8B02L

LQP02HV1N8C02L

LQP02HV1N9B02L

LQP02HV1N9C02L

LQP02HV2N0B02L

LQP02HV2N0C02L

LQP02HV2N1B02L

LQP02HV2N1C02L

LQP02HV2N2B02L

LQP02HV2N2C02L

LQP02HV2N3B02L

LQP02HV2N3C02L

LQP02HV2N4B02L

LQP02HV2N4C02L

LQP02HV2N5B02L

LQP02HV2N5C02L

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.3

2.4

2.5

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

17

16

0.03

0.04

0.05

0.06

0.07

0.08

0.09

0.11

0.18

0.19

18.0

16.6

13.9

12.2

11.9

1000

900

800

730

680

640

600

540

420

410

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

P.2/12

Inductance

Q

(min)

(＠500MHz)

DC

Resistance

(Ω max)

Self Resonant

Frequency

(GHz Min.)

Rated

Current

(mA)

Customer

Part Number

MURATA

Part Number

(nH)

Tolerance

(＠500MHz)

2.6

2.7

2.8

2.9

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.0

4.1

4.2

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

10

LQP02HV2N6B02L

LQP02HV2N6C02L

LQP02HV2N7B02L

LQP02HV2N7C02L

LQP02HV2N8B02L

LQP02HV2N8C02L

LQP02HV2N9B02L

LQP02HV2N9C02L

LQP02HV3N0B02L

LQP02HV3N0C02L

LQP02HV3N1B02L

LQP02HV3N1C02L

LQP02HV3N2B02L

LQP02HV3N2C02L

LQP02HV3N3B02L

LQP02HV3N3C02L

LQP02HV3N4B02L

LQP02HV3N4C02L

LQP02HV3N5B02L

LQP02HV3N5C02L

LQP02HV3N6B02L

LQP02HV3N6C02L

LQP02HV3N7B02L

LQP02HV3N7C02L

LQP02HV3N8B02L

LQP02HV3N8C02L

LQP02HV3N9B02L

LQP02HV3N9C02L

LQP02HV4N0B02L

LQP02HV4N0C02L

LQP02HV4N0B02E

LQP02HV4N0C02E

LQP02HV4N1B02L

LQP02HV4N1C02L

LQP02HV4N2B02L

LQP02HV4N2C02L

LQP02HV4N3H02L

LQP02HV4N3J02L

LQP02HV4N7H02L

LQP02HV4N7J02L

LQP02HV5N1H02L

LQP02HV5N1J02L

LQP02HV5N6H02L

LQP02HV5N6J02L

LQP02HV6N2H02L

LQP02HV6N2J02L

LQP02HV6N8H02L

LQP02HV6N8J02L

LQP02HV7N5H02L

LQP02HV7N5J02L

LQP02HV8N2H02L

LQP02HV8N2J02L

LQP02HV9N1H02L

LQP02HV9N1J02L

LQP02HV10NH02L

LQP02HV10NJ02L

LQP02HV11NH02L

LQP02HV11NJ02L

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

B:±0.1nH

C:±0.2nH

H:±3%

16

0.19

0.21

0.24

0.25

0.46

0.53

0.57

0.65

11.9

11.3

10.2

9.4

410

390

360

260

240

230

220

9.4

8.2

7.1

J:±5%

7.1

H:±3%

7.1

J:±5%

H:±3%

7.1

J:±5%

7.1

H:±3%

7.1

J:±5%

7.1

H:±3%

7.1

J:±5%

7.1

H:±3%

7.1

J:±5%

7.1

H:±3%

7.1

J:±5%

7.1

H:±3%

7.1

J:±5%

7.1

H:±3%

5.5

J:±5%

5.5

H:±3%

5.5

J:±5%

10

5.5

H:±3%

11

5.5

J:±5%

11

5.5

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

P.3/12

Rated

Current

(mA)

Inductance

Q

(min)

DC

Resistance

(Ω max)

Self Resonant

Frequency

Customer

MURATA

(nH)

Part Number

Tolerance

(＠500MHz)

(GHz Min.)

(＠500MHz)

H:±3%

J:±5%

H:±3%

J:±5%

H:±3%

J:±5%

H:±3%

J:±5%

H:±3%

J:±5%

H:±3%

J:±5%

H:±3%

J:±5%

H:±3%

J:±5%

H:±3%

J:±5%

LQP02HV12NH02L

LQP02HV12NJ02L

LQP02HV13NH02L

LQP02HV13NJ02L

LQP02HV15NH02L

LQP02HV15NJ02L

LQP02HV16NH02L

LQP02HV16NJ02L

LQP02HV18NH02L

LQP02HV18NJ02L

LQP02HV20NH02L

LQP02HV20NJ02L

LQP02HV22NH02L

LQP02HV22NJ02L

LQP02HV24NH02L

LQP02HV24NJ02L

LQP02HV27NH02L

LQP02HV27NJ02L

12

16

0.65

0.75

0.97

1.08

1.48

2.00

5.2

5.0

4.8

4.5

3.2

220

200

180

170

140

120

12

13

15

16

18

20

22

24

27

＊

Typical value is actual performance.

4. Testing Conditions

《Unless otherwise specified》

《In case of doubt》

Temperature : Ordinary Temperature / 15°C to 35°C

Humidity: Ordinary Humidity / 25%(RH) to 85 %(RH)

Temperature : 20°C ± 2°C

Humidity

: 60%(RH) to 70 %(RH)

Atmospheric Pressure : 86kPa to 106 kPa

5. Appearance and Dimensions

0.4±0.02mm

0.2±0.02mm

■Unit Mass (Typical value)

Top view

End view

0.085mg

0.3±0.02mm

Side view

0.14±0.03mm

Bottom view

0.14±0.03mm

6. Marking

Side surface identification marking :Blue

Both side surface

Blue

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

P.4/12

7.Electrical Performance

No.

Item

Specification

Inductance shall meet item 3.

Test Method

Measuring Equipment:

KEYSIGHT E4991B or equivalent

7.1 Inductance

Measuring Frequency: 500MHz

Measuring Fixture: KEYSIGHT 16198A

Contact board: (KEYSIGHT

：

Guide PCA0201,

100 m gap between electrode:60

μ

m)

.

Measuring Condition:

Test signal level / about 0dBm

Electrical length /0mm

Weight: about 250g

7.2

Q

Q shall meet item 3.

Measuring Method:See the endnote

<Electrical Performance:Measuring

Method of Inductance/Q>

7.3 DC Resistance

7.4 Self Resonant

Frequency(S.R.F)

7.5 Rated

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment:Digital multi meter

Measuring Equipment:

KEYSIGHT N5230A or equivalent

The rated current is applied.

Self temperature rise shall be

limited to 25°C max.

Current

8.Mechanical Performance

No.

Item

Specification

Test Method

8.1 Shear Test

Chip coil shall not be damaged

after tested as test method.

Substrate:Glass-epoxy substrate

Land

0.16

0.2

0.56

(in mm)

Force:1N

Hold Duration:5 s±1 s

Applied Direction: Parallel to PCB

Chip coil

F

Substrate

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

No. Item

P.5/12

Specification

Test Method

Substrate:Glass-epoxy substrate

(100mm×40mm×0.8mm)

8.2 Bending Test

Chip coil shall not be damaged

after tested as test method.

Speed of Applying Force:1mm /s

Deflection:1mm

Hold Duration:30 s

Pressure jig

R340

F

Deflection

45

Product

(in mm)

8.3 Vibration

Appearance:No damage

Substrate: Glass-epoxy substrate

Oscillation Frequency:

10Hz to 2000Hz to 10Hz for 20 min

Total amplitude 1.5 mm or Acceleration

amplitude 196 m/s²whichever is smaller.

Testing Time:A period of 2h in each of

3 mutually perpendicular directions.

8.4 Solderability

The electrode shall be at least 90% Flux: Ethanol solution of rosin 25(wt)%

covered with new solder coating.

(Immersed for 5s to 10s)

Solder:Sn-3.0Ag-0.5Cu

Pre-Heating:150°C±10°C / 60s to 90s

Solder Temperature:240°C±5°C

Immersion Time:3s±1s

8.5 Resistance to

Soldering Heat

Appearance:No damage

Inductance Change: within ±10%

Flux: Ethanol solution of rosin 25(wt)%

(Immersed for 5s to 10s)

Solder:Sn-3.0Ag-0.5Cu

Pre-Heating:150°C±10°C / 60s to 90s

Solder Temperature:260°C±5°C

Immersion Time:5s±1s

Then measured after exposure in the room

condition for 24h±2h.

9.Environmental Performance

It shall be soldered on the substrate.

No.

Item

Specification

Appearance:No damage

Inductance Change: within ±10%

Test Method

Substrate: Glass-epoxy substrate

Temperature:125°C±2°C

9.1 Heat Resistance

9.2 Cold Resistance

9.3 Humidity

Time:1000h (+48h,-0h)

Then measured after exposure in the

room condition for 24h±2h.

Substrate: Glass-epoxy substrate

Temperature:-55°C±3°C

Time:1000 h (+48h,-0h)

Then measured after exposure in the

room condition for 24h±2h.

Substrate: Glass-epoxy substrate

Temperature:40°C±2°C

Humidity:90%(RH) to 95%(RH)

Time:1000 h(+48h,-0h)

Then measured after exposure in the

room condition for 24h±2h.

Substrate: Glass-epoxy substrate

1 cycle:

9.4 Temperature

Cycle

1 step:-55°C±2°C / 30min±3 min

2 step:Ordinary temp. / 10~15 min

3 step:125°C±2°C / 30±3 min

4 step: Ordinary temp. / 10~15 min

Total of 10 cycles

Then measured after exposure in the

room condition for 24h±2h.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

P.6/12

10.Specification of Packaging

10.1 Appearance and Dimensions

【

4mm-wide / plastic tape

】

2.0±0.04

0.20±0.05

1.0±0.02

φ0.8±0.04

(0.46)

(in mm)

(0.34)

1.0±0.02

(0.24)

10.2 Specification of Taping

4mm-wide / plastic tape

【

】

(1) Packing quantity (standard quantity)

30,000 pcs. / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,

and are not continuous. The Specified quantity per reel is kept.

10.3 Pull Strength

Cover tape

5N min

10.4 Peeling off force of cover tape

165 to 180 degree

F

Speed of Peeling off

300mm/min

Cover tape

0.1N to 0.6N

(minimum value is typical)

Peeling off force

Plastic tape

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

P.7/12

10.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.

【4mm-wide / plastic tape】

Trailer

160 min.

Leader

2.0±0.5

Label

190 min.

Empty tape Cover tape

210 min.

φ

13.0±0.2

φ

60⁺¹

-

0

Direction of feed

φ

21.0±0.8

9.0 ⁺¹

4.4±0.5

-0

7.0±0.51.4

13.0±

+0

φ

180

-3

10.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2),

Quantity etc ･･･

∗1) <Expression of Inspection No.>

□□ OOOO ×××

(1)

(2)

(3)

(1) Factory Code

(2) Date

First digit : Year / Last digit of year

Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D

Third, Fourth digit : Day

(3) Serial No.

∗2) <Expression of RoHS Marking >

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

10.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS Marking (∗2), Quantity, etc ･･･

10.8 Specification of Outer Case

Outer Case Dimensions

Standard Reel Quantity

in Outer Case (Reel)

Label

(mm)

D

H

W

H

186

93

10(4mm-wide / plastic tape)

D

W

∗ Above Outer Case size is typical. It depends on a quantity of an order.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

P.8/12

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for

the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

(8) Disaster/crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and/or reliability requirements

to the applications listed in the above

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the

product, overheating could occur, resulting in wire breakage, burning, or other serious fault.

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other

mounting method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the

heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

12.1 Land pattern designing

Land

Solder resist

Chip Coil

c

a

b

c

0.20

0.56

0.16

(in mm)

ａ

ｂ

12.2 Flux, Solder

・

Use rosin-based flux.

Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

Don’t use water-soluble flux.

・

Use Sn-3.0Ag-0.5Cu solder.

Standard thickness of solder paste : 50μm ~65μm.

12.3 Reflow soldering conditions

・

Pre-heating should be in such a way that the temperature difference between solder and

product surface is limited to 150°C max. Cooling into solvent after soldering also should be

in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of

products quality.

・

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

P.9/12

・Reflow soldering profile

Temp.

260℃

(℃)

245℃±3℃

230℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

150°C

above 220°C 30s

245°C 3°C

2 times

Limit Profile

±30s

above 230°C､60s max.

Pre-heating

Heating

Peak temperature

Cycle of reflow

～

180°C

、

90s

､

～

60s

±

260°C,10s

2 times

12.4 Reworking with soldering iron

Reworking with soldering iron is disapproved.

12.5 Solder Volume

Solder shall be used not to be exceeded the upper limits as shown below.

･

1/3T

≦t≦T

Upper Limit

T : thickness of product

Recommendable

Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance and become easy to tilt.

12.6 Attention regarding P.C.B. bending

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to

warping the board.

［

Products direction］

Products shall be located in the sideways

direction (Length:ａ＜b) to the mechanical

stress.

a

b

Poor example

〈

〉

Good example

〈

〉

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

P.10/12

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface.

(2) Add slits in the board separation part.

A

>

D *1

B

A

>

(3) Keep the mounting position of the component away from the board separation surface.

A

C

B

Seam

D

A

a

b

Slit

Length:a b

<

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.

12.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 min max.

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized

water in order to remove the cleaner.

(5) Other cleaning

Please contact us.

12.8 Resin coating

When products are coated with resin, please contact us in advance.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

P.11/12

12.9 Handling of a substrate

(1)There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress

on a chip is different depending on PCB material and structure.

When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,

it will cause cracking of the chip due to the thermal expansion and contraction.

The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other

PCB material which has different thermal expansion coefficient from Glass-epoxy.

When other PCB materials are considered, please be sure to evaluate by yourself.

(2)After mounting products on a substrate, do not apply any stress to the product caused by bending or

twisting to the substrate when cropping the substrate, inserting and removing a connector from the

substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress

even from small bending or twisting.

When the flexible PCB is considered, please be sure to evaluate by yourself.

Bending

Twisting

12.10 Storage and Handing Requirements

(1) Storage period

Use the products within 12 months after deliverd.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature ： -10°C ~ 40°C

Humidity

： 15% to 85% relative humidity No rapid change on temperature and humidity.

・Products should not be stored on bulk packaging condition to prevent the chipping of the

core and the breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity,

dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and

so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or

mechanical shock.

12.11 Mounting conditions

Check the mounting condition before using.

Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up

errors, misalignment, or damage to the product.

12.12 Operating environment

Do not use this product under the following environmental conditions as it may cause deterioration of product quality.

(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.

(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)

(2) In the atmosphere where liquid such as organic solvent, may splash on the products.

(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.

MURATA MFG.CO., LTD

Reference Only

Spec No. JELF243C-0034G-01

P.12/12

12.13 Mounting density

If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.

If this product is subjected to a significant amount of heat from other products, this could adversely affect product

quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a

manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the

rated operating temperature for the product.

13．

! Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.

2

1

I

A

C

B

D

Zx

Zm

V

2

V

1

V₁

I₁

A

C

B

D

V₂

I ₂

=

Test Head

Test fixture

Product

(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.

V₁

I ₁

V₂

I ₂

Zm=

Zx=

，

(3) Thus,the relation between Zx and Zm is following;

Zm- where,

1-Zm

β

Γ

α

β

Γ

= D / A =1

= B / D =Zsm-(1-Yom Zsm)Zss

= C / A =Yom

Zx=

α

Zsm:measured impedance of short chip

Zss:residual impedance of short chip (0.19nH)

Yom:measured admittance when opening the fixture

(4) Lx and Qx shall be calculated with the following equation.

Im(Zx)

Re(Zx)

Lx :Inductance of chip coil

Qx:Q of chip coil

Qx=

Lx=

2π

f

，

f

:Measuring frequency

MURATA MFG.CO., LTD


型号：	LQP02HV10NH02#
厂家：	muRata
描述：
文件：	总12页 (文件大小：363K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LQP02HV10NH02# [MURATA]

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