LQP02TN2N5B02#_技术文档

Spec No.: JELF243C_0014AC-01

P1/16

CHIP COILS (CHIP INDUCTORS) LQP02TN□□□□02□ REFERENCE SPECIFICATION

1. Scope

This reference specification applies to chip coils (chip inductors) LQP02TN_02series for general electronic equipment.

2. Part Numbering

(Ex.)

LQ

P

02

T

N

0N2

B

0

2

D

Product Structure Dimension Application Category Inductance Tolerance Performance Electrode

Packaging

ID

(L × W)

and

characteristic

specification D: 8 mm width

/paper tape

L: 4 mm width

/plastic tape

*B: bulk

*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).

3. Part Number and Rating

Operating temperature range

Storage temperature range

-55°C to +125°C

Self-resonant

frequency

(MHz)

Inductance

DC

resistance

(Ω max.)

Rated

current

(mA)

Customer

Part number

Murata

Part number

Q

(Min.)

Nominal

value

Lower

*Typical

Tolerance

limit

value

(nH)

LQP02TN0N2B02D

LQP02TN0N2B02L

LQP02TN0N2C02D

LQP02TN0N2C02L

LQP02TN0N3B02D

LQP02TN0N3B02L

LQP02TN0N3C02D

LQP02TN0N3C02L

LQP02TN0N4B02D

LQP02TN0N4B02L

LQP02TN0N4C02D

LQP02TN0N4C02L

LQP02TN0N5B02D

LQP02TN0N5B02L

LQP02TN0N5C02D

LQP02TN0N5C02L

LQP02TN0N6B02D

LQP02TN0N6B02L

LQP02TN0N6C02D

LQP02TN0N6C02L

LQP02TN0N7B02D

LQP02TN0N7B02L

LQP02TN0N7C02D

LQP02TN0N7C02L

LQP02TN0N8B02D

LQP02TN0N8B02L

LQP02TN0N8C02D

0.2

0.3

0.4

0.5

0.6

0.7

0.8

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

-

0.50

20000

18000

17000

16500

20000

320

-

8

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

Customer

P2/16

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Murata

Q

(Min.)

Part number

Lower

*Typical

value

(nH)

Tolerance

limit

value

LQP02TN0N8C02L

LQP02TN0N9B02D

LQP02TN0N9B02L

LQP02TN0N9C02D

LQP02TN0N9C02L

LQP02TN1N0B02D

LQP02TN1N0B02L

LQP02TN1N0C02D

LQP02TN1N0C02L

LQP02TN1N1B02D

LQP02TN1N1B02L

LQP02TN1N1C02D

LQP02TN1N1C02L

LQP02TN1N2B02D

LQP02TN1N2B02L

LQP02TN1N2C02D

LQP02TN1N2C02L

LQP02TN1N3B02D

LQP02TN1N3B02L

LQP02TN1N3C02D

LQP02TN1N3C02L

LQP02TN1N4B02D

LQP02TN1N4B02L

LQP02TN1N4C02D

LQP02TN1N4C02L

LQP02TN1N5B02D

LQP02TN1N5B02L

LQP02TN1N5C02D

LQP02TN1N5C02L

LQP02TN1N6B02D

LQP02TN1N6B02L

LQP02TN1N6C02D

LQP02TN1N6C02L

LQP02TN1N7B02D

LQP02TN1N7B02L

LQP02TN1N7C02D

LQP02TN1N7C02L

LQP02TN1N8B02D

LQP02TN1N8B02L

LQP02TN1N8C02D

LQP02TN1N8C02L

LQP02TN1N9B02D

LQP02TN1N9B02L

LQP02TN1N9C02D

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

8

0.50

0.60

0.70

0.75

16500

13000

12500

11500

9500

20000

16100

15900

15300

14800

14400

11700

12000

11800

11300

12000

320

220

200

9500

9000

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

Customer

P3/16

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Murata

Q

(Min.)

Part number

Lower

*Typical

value

(nH)

Tolerance

limit

value

LQP02TN1N9C02L

LQP02TN2N0B02D

LQP02TN2N0B02L

LQP02TN2N0C02D

LQP02TN2N0C02L

LQP02TN2N1B02D

LQP02TN2N1B02L

LQP02TN2N1C02D

LQP02TN2N1C02L

LQP02TN2N2B02D

LQP02TN2N2B02L

LQP02TN2N2C02D

LQP02TN2N2C02L

LQP02TN2N3B02D

LQP02TN2N3B02L

LQP02TN2N3C02D

LQP02TN2N3C02L

LQP02TN2N4B02D

LQP02TN2N4B02L

LQP02TN2N4C02D

LQP02TN2N4C02L

LQP02TN2N5B02D

LQP02TN2N5B02L

LQP02TN2N5C02D

LQP02TN2N5C02L

LQP02TN2N6B02D

LQP02TN2N6B02L

LQP02TN2N6C02D

LQP02TN2N6C02L

LQP02TN2N7B02D

LQP02TN2N7B02L

LQP02TN2N7C02D

LQP02TN2N7C02L

LQP02TN2N8B02D

LQP02TN2N8B02L

LQP02TN2N8C02D

LQP02TN2N8C02L

LQP02TN2N9B02D

LQP02TN2N9B02L

LQP02TN2N9C02D

LQP02TN2N9C02L

LQP02TN3N0B02D

LQP02TN3N0B02L

LQP02TN3N0C02D

1.9

2.0

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3.0

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

8

0.75

0.80

1.10

9000

7500

12000

11100

11200

10000

9700

200

9700

9500

9300

9100

9200

12000

11800

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

Customer

P4/16

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Murata

Q

(Min.)

Part number

Lower

*Typical

value

(nH)

Tolerance

limit

value

LQP02TN3N0C02L

LQP02TN3N1B02D

LQP02TN3N1B02L

LQP02TN3N1C02D

LQP02TN3N1C02L

LQP02TN3N2B02D

LQP02TN3N2B02L

LQP02TN3N2C02D

LQP02TN3N2C02L

LQP02TN3N3B02D

LQP02TN3N3B02L

LQP02TN3N3C02D

LQP02TN3N3C02L

LQP02TN3N4B02D

LQP02TN3N4B02L

LQP02TN3N4C02D

LQP02TN3N4C02L

LQP02TN3N5B02D

LQP02TN3N5B02L

LQP02TN3N5C02D

LQP02TN3N5C02L

LQP02TN3N6B02D

LQP02TN3N6B02L

LQP02TN3N6C02D

LQP02TN3N6C02L

LQP02TN3N7B02D

LQP02TN3N7B02L

LQP02TN3N7C02D

LQP02TN3N7C02L

LQP02TN3N8B02D

LQP02TN3N8B02L

LQP02TN3N8C02D

LQP02TN3N8C02L

LQP02TN3N9B02D

LQP02TN3N9B02L

LQP02TN3N9C02D

LQP02TN3N9C02L

LQP02TN4N0B02D

LQP02TN4N0B02L

LQP02TN4N0C02D

LQP02TN4N0C02L

LQP02TN4N1B02D

LQP02TN4N1B02L

LQP02TN4N1C02D

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.0

4.1

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

8

1.10

1.30

7500

11800

12000

10400

10200

10100

10300

10100

9700

200

180

9700

9800

9600

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

Customer

P5/16

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Murata

Q

(Min.)

Part number

Lower

*Typical

value

(nH)

Tolerance

limit

value

LQP02TN4N1C02L

LQP02TN4N2B02D

LQP02TN4N2B02L

LQP02TN4N2C02D

LQP02TN4N2C02L

LQP02TN4N3H02D

LQP02TN4N3H02L

LQP02TN4N3J02D

LQP02TN4N3J02L

LQP02TN4N7H02D

LQP02TN4N7H02L

LQP02TN4N7J02D

LQP02TN4N7J02L

LQP02TN5N1H02D

LQP02TN5N1H02L

LQP02TN5N1J02D

LQP02TN5N1J02L

LQP02TN5N6H02D

LQP02TN5N6H02L

LQP02TN5N6J02D

LQP02TN5N6J02L

LQP02TN6N2H02D

LQP02TN6N2H02L

LQP02TN6N2J02D

LQP02TN6N2J02L

LQP02TN6N8H02D

LQP02TN6N8H02L

LQP02TN6N8J02D

LQP02TN6N8J02L

LQP02TN7N5H02D

LQP02TN7N5H02L

LQP02TN7N5J02D

LQP02TN7N5J02L

LQP02TN8N2H02D

LQP02TN8N2H02L

LQP02TN8N2J02D

LQP02TN8N2J02L

LQP02TN9N1H02D

LQP02TN9N1H02L

LQP02TN9N1J02D

LQP02TN9N1J02L

LQP02TN10NH02D

LQP02TN10NH02L

LQP02TN10NJ02D

4.1

4.2

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

10

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

8

1.30

1.50

1.80

2.00

2.10

2.50

7500

7000

6500

6000

5500

4500

4000

9600

8700

8800

8600

8300

7500

7400

7100

6500

6200

5600

5300

180

160

140

10

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

Customer

P6/16

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Murata

Q

(Min.)

Part number

Lower

*Typical

value

(nH)

Tolerance

limit

value

LQP02TN10NJ02L

LQP02TN11NH02D

LQP02TN11NH02L

LQP02TN11NJ02D

LQP02TN11NJ02L

LQP02TN12NH02D

LQP02TN12NH02L

LQP02TN12NJ02D

LQP02TN12NJ02L

LQP02TN13NH02D

LQP02TN13NH02L

LQP02TN13NJ02D

LQP02TN13NJ02L

LQP02TN15NH02D

LQP02TN15NH02L

LQP02TN15NJ02D

LQP02TN15NJ02L

LQP02TN16NH02D

LQP02TN16NH02L

LQP02TN16NJ02D

LQP02TN16NJ02L

LQP02TN18NH02D

LQP02TN18NH02L

LQP02TN18NJ02D

LQP02TN18NJ02L

LQP02TN20NH02D

LQP02TN20NH02L

LQP02TN20NJ02D

LQP02TN20NJ02L

LQP02TN22NH02D

LQP02TN22NH02L

LQP02TN22NJ02D

LQP02TN22NJ02L

LQP02TN24NH02D

LQP02TN24NH02L

LQP02TN24NJ02D

LQP02TN24NJ02L

LQP02TN27NH02D

LQP02TN27NH02L

LQP02TN27NJ02D

LQP02TN27NJ02L

LQP02TN30NH02D

LQP02TN30NH02L

LQP02TN30NJ02D

10

11

12

13

15

16

18

20

22

24

27

30

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

8

7

6

2.50

2.80

3.20

3.50

5.00

5.50

6.50

4000

3500

3000

2500

2300

2000

1800

5300

4400

4200

3800

3600

3400

3100

3000

2800

2500

2600

140

120

90

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

Customer

P7/16

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Murata

Q

(Min.)

Part number

Lower

*Typical

value

(nH)

Tolerance

limit

value

LQP02TN30NJ02L

LQP02TN33NH02D

LQP02TN33NH02L

LQP02TN33NJ02D

LQP02TN33NJ02L

LQP02TN36NH02D

LQP02TN36NH02L

LQP02TN36NJ02D

LQP02TN36NJ02L

LQP02TN39NH02D

LQP02TN39NH02L

LQP02TN39NJ02D

LQP02TN39NJ02L

30

33

36

39

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

6

4

6.50

7.00

1800

1600

2600

2300

2100

90

* Typical value is actual performance.

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

5. Appearance and Dimensions

Unit mass (typical value): 0.05 mg

6. Marking

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

P8/16

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

Measuring equipment: Keysight E4991A or the

equivalent

7.1 Inductance

7.2 Q

Measuring frequency:

500 MHz

300 MHz

0.2 nH to 30 nH

33 nH to 39 nH

Measuring conditions:

Measurement signal level: Approx. 0 dBm

Electrical length: 27.3 mm

Weight: Approx. 3 N

Measuring fixture: Keysight 16196D

Position the chip coil under test as shown in the

measuring example below and connect it to the

electrode by applying weight.

Measurement example:

Product insertion hole: ø0.3 mm

Measuring method: see "Electrical performance:

Measuring method for inductance/Q" in the Appendix.

Measuring equipment: digital multimeter

Measuring equipment: Keysight 8753C or the

equivalent

7.3 DC resistance

7.4 Self-resonant

frequency

Meet chapter 3 ratings.

7.5 Rated current

Product temperature rise: 25°C max.

Apply the rated current specified in chapter 3.

8. Mechanical Performance

No.

8.1

Item

Shear test

Specification

Test method

No significant mechanical damage or no Test substrate: glass-epoxy substrate

sign of electrode peeling off shall be

observed.

Applying force: 1 N

Holding time: 5 s±1 s

Force application direction:

Test substrate: glass-epoxy substrate (100 mm × 40

mm × 0.8 mm)

Pressurizing speed: 1 mm/s

Pressure jig: R340

8.2 Bending test

No significant mechanical damage or no

sign of electrode peeling off shall be

observed.

Deflection: 1 mm

Holding time: 30 s

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

No. Item

P9/16

Specification

Test method

8.3 Vibration

Appearance shall have no significant

mechanical damage.

Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for

approx. 20 min

Total amplitude: total amplitude of 1.5 mm or

acceleration amplitude of 196 m/s², whichever is

smaller

Test time: 3 directions perpendicular to each other, 2 h

for each direction (6 h in total)

8.4 Solderability

90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin content

be covered with new solder seamlessly. of 25(wt)% for 5 s to 10 s

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 240°C±5°C

Immersion time: 3 s±1 s

8.5 Resistance to

soldering heat

Appearance: No significant mechanical

damage shall be observed.

Flux: immersed in ethanol solution with a rosin content

of 25(wt)% for 5 s to 10 s

Inductance change rate: within ±10%

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 260°C±5°C

Immersion time: 5 s±1 s

Post-treatment: left at a room condition for 24 h±2 h

9. Environmental Performance

The product is soldered on a glass-epoxy substrate for test.

No.

Item

Specification

Test method

9.1 Heat resistance

9.2 Cold resistance

9.3 Humidity

Appearance: No significant mechanical Temperature: 125°C±2°C

damage shall be observed.

Test time: 1000 h (+48 h, -0 h)

Inductance change rate: within ±10%

Post-treatment: left at a room condition for 24 h±2 h

Appearance: No significant mechanical Temperature: -55°C±3°C

damage shall be observed.

Test time: 1000 h (+48 h, -0 h)

Inductance change rate: within ±10%

Post-treatment: left at a room condition for 24 h±2 h

Appearance: No significant mechanical Temperature: 40°C±2°C

damage shall be observed.

Humidity: 90% (RH) to 95% (RH)

Inductance change rate: within ±10%

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

9.4 Temperature cycle Appearance: No significant mechanical Single cycle conditions:

damage shall be observed.

Step 1: -55°C±2°C/30 min±3 min

Inductance change rate: within ±10%

Step 2: ordinary temperature/10 min to 15 min

Step 3: +125°C±2°C/30 min±3 min

Step 4: ordinary temperature/10 min to 15 min

Number of testing: 10 cycles

Post-treatment: left at a room condition for 24 h±2 h

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

P10/16

10. Specification of Packaging

10.1 Appearance and dimensions of tape

• 8 mm width/paper tape

A

B

t

(0.24)

(0.47)

0.39 max.

(in mm)

• 4 mm width/plastic tape

A

B

t

(0.21)

(0.43)

(0.23)

(0.2)

t'

(in mm)

* The dimensions of the cavity are measured at its bottom.

10.2 Taping specifications

Packing quantity

(Standard quantity)

20000 pcs/reel (carrier tape: 8 mm width, 2 mm pitch)

40000 pcs/reel (carrier tape: 4 mm width, 1 mm pitch)

Packing method

Feed hole position

Joint

The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and

bottom tape when the cavities of the carrier tape are punched type).

The feed holes on the carrier tape are on the right side when the cover tape (top tape when the

cavities of the carrier tape are punched type) is pulled toward the user.

The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type)

are seamless.

Number of missing

products

Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

Cover tape (or top tape)

5 N min.

Bottom tape (only when the cavities of the carrier tape are punched type)

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

P11/16

10.4 Peeling off force of tape

Speed of peeling off

300 mm/min

0.1 N to 0.6 N (The lower limit is for typical value.)

Peeling off force

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

• 8 mm width carrier tape

• 4 mm width carrier tape

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

Y

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

P12/16

10.8 Specification of outer box

Dimensions of outer box

(mm)

Tape width Standard reel quantity

(mm)

in outer box(reel)

Label

W

D

H

4

8

10

5

H

186

93

D

* Above outer box size is typical. It depends on a quantity of an

order.

W

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea

equipment

(4) Power plant control

equipment

(5) Medical equipment

(6) Transportation equipment (vehicles, (7) Traffic signal

trains, ships, etc.) equipment

(8) Disaster/crime

prevention

equipment

(9) Data-processing

equipment

(10) Applications of similar complexity and/or reliability

requirements to the applications listed in the above

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting

method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the

heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

12.1. Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering:

a

b

c

0.16 to 0.20

0.40 to 0.56

0.20 to 0.23

(in mm)

12.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 50 μm to 80 μm

If you want to use a flux other than the above, please consult our technical department.

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

P13/16

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C

max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product

quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

12.4 Reworking with soldering iron

Do not perform reworking with a soldering iron on this product.

12.5 Solder volume

Solder shall be used not to be exceeded the upper limits as shown below.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

a

b

Poor example

〈

〉

Good example

〈

〉

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

P14/16

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

12.7 Handling of substrate

(1) The stress applied to the chip varies depending on the material and construction of the mounted substrate.

If the coefficients of thermal expansion for the substrate and chip vary significantly, the difference in thermal expansion and

shrinkage could cause cracks to form in the chip.

We assume that the products are mounted on glass-epoxy substrate. Assessment has not been conducted on substrates

where the coefficient of thermal expansion varies significantly from glass-epoxy substrates. If mounting on these

substrates, be sure to conduct full assessments before use.

(2) After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the

substrate.

Excessive mechanical stress may cause cracking in the product.

Also, if mounting on flexible substrates, excessive mechanical stress could be applied to the chip by even slight bending or

twisting when handling this substrate, and so please conduct full assessments before use.

Bending

Twisting

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

P15/16

12.8 Cleaning

The product shall be cleaned under the following conditions.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in

mounted products and the PCB.

Item

Power

Requirement

20 W/L max.

Time

5 min max.

Frequency

(3) Cleaner

28 kHz to 40 kHz

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water

adequately and completely dry it so that no cleaner is left.

* For other cleaning, consult our technical department.

12.9 Storage and transportation

Storage period

Use the product within 12 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and

humidity. The recommended temperature range is -10°C to +40°C. The recommended relative

humidity range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor

solderability.

• Do not place the products directly on the floor; they should be placed on a palette so that they

are not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

• Do not keep products in bulk packaging. Bulk storage could result in collisions between the

products or between the products and other parts, resulting in chipping or wire breakage.

• Avoid storing the product by itself bare (i.e. exposed directly to air).

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

12.10 Resin coating (including moisture-proof coating)

Before applying any resin coating, please consult our technical department.

12.11 Mounting conditions

Check the mounting condition before using.

Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,

misalignment, or damage to the product.

12.12 Operating environment

Do not use this product under the following environmental conditions as it may cause deterioration of product quality.

(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.

(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)

(2) In the atmosphere where liquid such as organic solvent, may splash on the products.

(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.

12.13 Mounting density

If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.

If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,

resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that

the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating

temperature for the product.

13.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG CO., LTD

Spec No.: JELF243C_0014AC-01

P16/16

Appendix

Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included

in the rating table.)

Perform measurement using the method described below. (Perform correction for the error deriving from the measuring

terminal.)

(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole

terminal as shown in the figure below.

(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using

the respective current and voltage for input/output.

V₁

I₁

V₂

I₂

Zm=

Zx=

(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.

Here,

α = D/A = 1

β = B/D = Zsm - (1 - Yom Zsm) Zss

Γ = C/A = Yom

Zm-β

Zx=α

1-ZmΓ

Zsm: measured impedance of short chip

Zss: residual impedance of short chip (0.110 nH)

Yom: measured admittance when measuring

terminal is open

(4) Calculate inductance Lx and Qx using the equations shown below.

Im(Zx)

Lx: inductance of chip coil

Qx: Q of chip coil

Lx=

2πf

Im(Zx)

Qx=

f: measuring frequency

Re(Zx)

MURATA MFG CO., LTD


型号：	LQP02TN2N5B02#
厂家：	muRata
描述：
文件：	总16页 (文件大小：733K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LQP02TN2N5B02# [MURATA]

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