LQP03HQ4N8H02#_技术文档

Spec No.: JELF243C_0021J-01

P1/15

CHIP COILS (CHIP INDUCTORS) LQP03HQ□□□□02□ REFERENCE SPECIFICATION

1. Scope

This reference specification applies to chip coils (chip inductors) LQP03HQ_02 series for general electronic equipment.

2. Part Numbering

(Ex.)

LQ

P

03

H

Q

0N5

W

0

2

D

Product Structure Dimension Application

Category Inductance Tolerance Performance Electrode

specification

Packaging

D: taping

*B: bulk

ID

(L × W)

and

characteristic

*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).

3. Part Number and Rating

Operating temperature range

Storage temperature range

-55°C to +125°C

Self-resonant

frequency

(MHz)

Inductance

DC

resistance

(Ω max.)

Rated

current

(mA)

Customer

Part number

Murata

Part number

Q

(Min.)

Nominal

value

Lower

*Typical

value

Tolerance

limit

(nH)

LQP03HQ0N5W02D

LQP03HQ0N5B02D

LQP03HQ0N5C02D

LQP03HQ0N6W02D

LQP03HQ0N6B02D

LQP03HQ0N6C02D

LQP03HQ0N7W02D

LQP03HQ0N7B02D

LQP03HQ0N7C02D

LQP03HQ0N8W02D

LQP03HQ0N8B02D

LQP03HQ0N8C02D

LQP03HQ0N9W02D

LQP03HQ0N9B02D

LQP03HQ0N9C02D

LQP03HQ1N0W02D

LQP03HQ1N0B02D

LQP03HQ1N0C02D

LQP03HQ1N1W02D

LQP03HQ1N1B02D

LQP03HQ1N1C02D

LQP03HQ1N2W02D

LQP03HQ1N2B02D

LQP03HQ1N2C02D

LQP03HQ1N3W02D

LQP03HQ1N3B02D

LQP03HQ1N3C02D

LQP03HQ1N4W02D

LQP03HQ1N4B02D

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

20

0.04

20000

18000

16000

14000

13000

12000

>20000

20000

1100

20000

18000

17000

20000

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P2/15

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Customer

Part number

Murata

Part number

Q

(Min.)

Lower

*Typical

value

(nH)

Tolerance

limit

LQP03HQ1N4C02D

LQP03HQ1N5W02D

LQP03HQ1N5B02D

LQP03HQ1N5C02D

LQP03HQ1N6W02D

LQP03HQ1N6B02D

LQP03HQ1N6C02D

LQP03HQ1N7W02D

LQP03HQ1N7B02D

LQP03HQ1N7C02D

LQP03HQ1N8W02D

LQP03HQ1N8B02D

LQP03HQ1N8C02D

LQP03HQ1N9W02D

LQP03HQ1N9B02D

LQP03HQ1N9C02D

LQP03HQ2N0W02D

LQP03HQ2N0B02D

LQP03HQ2N0C02D

LQP03HQ2N1W02D

LQP03HQ2N1B02D

LQP03HQ2N1C02D

LQP03HQ2N2W02D

LQP03HQ2N2B02D

LQP03HQ2N2C02D

LQP03HQ2N3W02D

LQP03HQ2N3B02D

LQP03HQ2N3C02D

LQP03HQ2N4W02D

LQP03HQ2N4B02D

LQP03HQ2N4C02D

LQP03HQ2N5W02D

LQP03HQ2N5B02D

LQP03HQ2N5C02D

LQP03HQ2N6B02D

LQP03HQ2N6C02D

LQP03HQ2N7B02D

LQP03HQ2N7C02D

LQP03HQ2N8B02D

LQP03HQ2N8C02D

LQP03HQ2N9B02D

LQP03HQ2N9C02D

LQP03HQ3N0B02D

LQP03HQ3N0C02D

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3.0

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

W: ±0.05 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

20

0.04

0.05

0.07

0.08

0.12

12000

10000

9000

8000

20000

18500

16000

14700

15900

14300

13800

13000

11600

10500

1100

1000

800

600

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P3/15

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Customer

Part number

Murata

Part number

Q

(Min.)

Lower

*Typical

value

(nH)

Tolerance

limit

LQP03HQ3N1B02D

LQP03HQ3N1C02D

LQP03HQ3N2B02D

LQP03HQ3N2C02D

LQP03HQ3N3B02D

LQP03HQ3N3C02D

LQP03HQ3N4B02D

LQP03HQ3N4C02D

LQP03HQ3N5B02D

LQP03HQ3N5C02D

LQP03HQ3N6B02D

LQP03HQ3N6C02D

LQP03HQ3N7B02D

LQP03HQ3N7C02D

LQP03HQ3N8B02D

LQP03HQ3N8C02D

LQP03HQ3N9B02D

LQP03HQ3N9C02D

LQP03HQ4N0B02D

LQP03HQ4N0C02D

LQP03HQ4N1B02D

LQP03HQ4N1C02D

LQP03HQ4N2B02D

LQP03HQ4N2C02D

LQP03HQ4N3H02D

LQP03HQ4N3J02D

LQP03HQ4N4H02D

LQP03HQ4N4J02D

LQP03HQ4N5H02D

LQP03HQ4N5J02D

LQP03HQ4N6H02D

LQP03HQ4N6J02D

LQP03HQ4N7H02D

LQP03HQ4N7J02D

LQP03HQ4N8H02D

LQP03HQ4N8J02D

LQP03HQ4N9H02D

LQP03HQ4N9J02D

LQP03HQ5N0H02D

LQP03HQ5N0J02D

LQP03HQ5N1H02D

LQP03HQ5N1J02D

LQP03HQ5N6H02D

LQP03HQ5N6J02D

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.0

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

5.0

5.1

5.6

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

H: ±3%

20

0.17

0.25

7500

7000

5500

10500

9500

7700

500

400

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P4/15

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Customer

Part number

Murata

Part number

Q

(Min.)

Lower

*Typical

value

(nH)

Tolerance

limit

LQP03HQ6N2H02D

LQP03HQ6N2J02D

LQP03HQ6N8H02D

LQP03HQ6N8J02D

LQP03HQ7N5H02D

LQP03HQ7N5J02D

LQP03HQ8N2H02D

LQP03HQ8N2J02D

LQP03HQ9N1H02D

LQP03HQ9N1J02D

LQP03HQ10NH02D

LQP03HQ10NJ02D

LQP03HQ11NH02D

LQP03HQ11NJ02D

LQP03HQ12NH02D

LQP03HQ12NJ02D

LQP03HQ13NH02D

LQP03HQ13NJ02D

LQP03HQ15NH02D

LQP03HQ15NJ02D

LQP03HQ16NH02D

LQP03HQ16NJ02D

LQP03HQ18NH02D

LQP03HQ18NJ02D

LQP03HQ20NH02D

LQP03HQ20NJ02D

LQP03HQ22NH02D

LQP03HQ22NJ02D

LQP03HQ24NH02D

LQP03HQ24NJ02D

LQP03HQ27NH02D

LQP03HQ27NJ02D

LQP03HQ30NH02D

LQP03HQ30NJ02D

LQP03HQ33NH02D

LQP03HQ33NJ02D

LQP03HQ36NH02D

LQP03HQ36NJ02D

LQP03HQ39NH02D

LQP03HQ39NJ02D

LQP03HQ43NH02D

LQP03HQ43NJ02D

LQP03HQ47NH02D

LQP03HQ47NJ02D

6.2

6.8

7.5

8.2

9.1

10

11

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

20

15

12

0.25

0.3

0.4

0.5

0.7

0.8

0.82

1.6

2.0

2.5

5500

4500

4000

3500

3000

2000

1700

1500

1300

7700

7300

6400

5900

5200

5100

4200

3950

2900

2700

2600

2400

2200

2000

400

300

250

170

150

130

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P5/15

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Customer

Part number

Murata

Part number

Q

(Min.)

Lower

*Typical

value

(nH)

Tolerance

limit

LQP03HQ51NH02D

LQP03HQ51NJ02D

LQP03HQ56NH02D

LQP03HQ56NJ02D

LQP03HQ62NH02D

LQP03HQ62NJ02D

LQP03HQ68NH02D

LQP03HQ68NJ02D

LQP03HQ75NH02D

LQP03HQ75NJ02D

LQP03HQ82NH02D

LQP03HQ82NJ02D

LQP03HQ91NH02D

LQP03HQ91NJ02D

LQP03HQR10H02D

LQP03HQR10J02D

LQP03HQR11H02D

LQP03HQR11J02D

LQP03HQR12H02D

LQP03HQR12J02D

LQP03HQR13H02D

LQP03HQR13J02D

LQP03HQR15H02D

LQP03HQR15J02D

LQP03HQR16H02D

LQP03HQR16J02D

LQP03HQR18H02D

LQP03HQR18J02D

LQP03HQR20H02D

LQP03HQR20J02D

LQP03HQR22H02D

LQP03HQR22J02D

LQP03HQR24H02D

LQP03HQR24J02D

LQP03HQR27H02D

LQP03HQR27J02D

LQP03HQR30H02D

LQP03HQR30J02D

LQP03HQR33H02D

LQP03HQR33J02D

LQP03HQR36H02D

LQP03HQR36J02D

LQP03HQR39H02D

LQP03HQR39J02D

51

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

12

10

7

2.5

1200

1100

1000

900

2000

1800

1500

1400

1300

1100

960

130

100

80

56

2.5

56

2.5

62

5.0

62

5.0

68

5.0

68

5.0

75

5.0

75

5.0

82

5.0

82

5.0

91

7.0

91

7.0

80

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

7.0

80

7.0

900

80

8.0

900

80

8.0

900

80

8.0

800

80

8.0

800

80

8.0

700

80

7

8.0

700

960

80

7

8.0

700

880

80

7

8.0

700

880

80

9

8.0

700

1100

1000

900

80

9

8.0

700

80

9

8.5

700

80

9

8.5

700

80

9

9.0

700

75

9

9.0

700

75

9

9.5

650

75

9

9.5

650

900

75

9

10.0

11.0

12.0

13.0

13.5

14.5

650

900

70

9

650

900

70

9

650

850

70

9

650

850

70

9

600

800

65

9

600

800

65

9

550

750

65

9

550

750

65

9

500

700

60

9

500

700

60

8

500

650

60

8

500

650

60

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P6/15

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA)

Customer

Part number

Murata

Part number

Q

(Min.)

Lower

*Typical

value

(nH)

Tolerance

limit

LQP03HQR43H02D

LQP03HQR43J02D

LQP03HQR47H02D

430

470

H: ±3%

J: ±5%

H: ±3%

J: ±5%

8

15.5

16.5

500

450

650

600

50

LQP03HQR47J02D

* Typical value is actual performance.

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

5. Appearance and Dimensions

Unit mass (typical value): 0.22 mg

6. Marking

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

Measuring equipment: Keysight E4991A or the

equivalent

7.1 Inductance

7.2 Q

Measuring frequency:

500 MHz

300 MHz

0.5 nH to 30 nH

33 nH to 120 nH

130 nH to 470 nH

100 MHz

Measuring conditions:

Measurement signal level: Approx. 0 dBm

Electrical length: 10 mm

Weight: Approx. 1 N to 5 N

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

No. Item

P7/15

Specification

Test method

Measuring fixture: Keysight 16197A

Position the chip coil under test as shown in the

measuring example below and connect it to the

electrode by applying weight.

Measurement example:

Measuring method: see "Electrical performance:

Measuring method for inductance/Q" in the Appendix.

Measuring equipment: digital multimeter

Measuring equipment: Keysight N5230A or the

equivalent

7.3 DC resistance

7.4 Self-resonant

frequency

Meet chapter 3 ratings.

7.5 Rated current

Product temperature rise: 25°C max.

Apply the rated current specified in chapter 3.

8. Mechanical Performance

No.

Item

Specification

Test method

8.1 Shear test

No significant mechanical damage or no Test substrate: glass-epoxy substrate

sign of electrode peeling off shall be

observed.

Applying force: 2 N

Holding time: 5 s±1 s

Force application direction:

8.2 Bending test

No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40

sign of electrode peeling off shall be

observed.

mm × 0.8 mm)

Pressurizing speed: 1 mm/s

Pressure jig: R340

Deflection: 1 mm

Holding time: 30 s

8.3 Vibration

Appearance shall have no significant

mechanical damage.

Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for

approx. 20 min

Inductance change rate: within ±10%

Total amplitude: total amplitude of 1.5 mm or

acceleration amplitude of 196 m/s², whichever is

smaller

Test time: 3 directions perpendicular to each other, 2 h

for each direction (6 h in total)

8.4 Solderability

90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin content

be covered with new solder seamlessly.

of 25(wt)% for 5 s to 10 s

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 240°C±5°C

Immersion time: 3 s±1 s

8.5 Resistance to

soldering heat

Appearance: No significant mechanical

damage shall be observed.

Flux: immersed in ethanol solution with a rosin content

of 25(wt)% for 5 s to 10 s

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

No. Item

P8/15

Specification

Inductance change rate: within ±10%

Test method

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 260°C±5°C

Immersion time: 5 s±1 s

Post-treatment: left at a room condition for 24 h±2 h

9. Environmental Performance

The product is soldered on a glass-epoxy substrate for test.

No.

Item

Specification

Appearance: No significant mechanical

damage shall be observed.

Test method

Temperature: 125°C±2°C

Test time: 1000 h (+48 h, -0 h)

9.1 Heat resistance

Inductance change rate: within ±10%

Appearance: No significant mechanical

damage shall be observed.

Post-treatment: left at a room condition for 24 h±2 h

Temperature: -55°C±3°C

Test time: 1000 h (+48 h, -0 h)

9.2 Cold resistance

Inductance change rate: within ±10%

Post-treatment: left at a room condition for 24 h±2 h

9.3 Humidity

Appearance: No significant mechanical

damage shall be observed.

Inductance change rate: within ±10%

Temperature: 40°C±2°C

Humidity: 90% (RH) to 95% (RH)

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

9.4 Temperature cycle

Appearance: No significant mechanical

damage shall be observed.

Single cycle conditions:

Step 1: -55°C±2°C/30 min±3 min

Inductance change rate: within ±10%

Step 2: ordinary temperature/10 min to 15 min

Step 3: +125°C±2°C/30 min±3 min

Step 4: ordinary temperature/10 min to 15 min

Number of testing: 10 cycles

Post-treatment: left at a room condition for 24 h±2 h

10. Specification of Packaging

10.1 Appearance and dimensions of tape (8 mm width/paper tape)

A

B

t

(0.36)

(0.68)

0.55 max.

(in mm)

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P9/15

10.2 Taping specifications

Packing quantity

15000 pcs/reel

(Standard quantity)

Packing method

Feed hole position

Joint

The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom

tape when the cavities of the carrier tape are punched type).

The feed holes on the carrier tape are on the right side when the cover tape (top tape when the

cavities of the carrier tape are punched type) is pulled toward the user.

The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are

seamless.

Number of missing

products

Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

Cover tape (or top tape)

5 N min.

Bottom tape (only when the cavities of the carrier tape are punched type)

10.4 Peeling off force of tape

Speed of peeling off

Peeling off force

300 mm/min

0.1 N to 0.6 N (The lower limit is for typical value.)

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

Y

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P10/15

10.8 Specification of outer box

Dimensions of outer box

(mm)

Standard reel quantity

in outer box (reel)

Label

W

D

H

186

93

5

D

* Above outer box size is typical. It depends on a

quantity of an order.

W

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea

equipment

(4) Power plant control

equipment

(5) Medical equipment

(6) Transportation equipment (vehicles, (7) Traffic signal

trains, ships, etc.) equipment

(8) Disaster/crime

prevention

equipment

(9) Data-processing

equipment

(10) Applications of similar complexity and/or reliability

requirements to the applications listed in the above

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting

method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the

heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

12.1. Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering:

a

b

c

0.3

0.9

0.25 to 0.30

(in mm)

12.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P11/15

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C

max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product

quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P12/15

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

a

b

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

12.7 Handling of substrate

(1) The stress applied to the chip varies depending on the material and construction of the mounted substrate.

If the coefficients of thermal expansion for the substrate and chip vary significantly, the difference in thermal expansion and

shrinkage could cause cracks to form in the chip.

We assume that the products are mounted on glass-epoxy substrate. Assessment has not been conducted on substrates

where the coefficient of thermal expansion varies significantly from glass-epoxy substrates. If mounting on these

substrates, be sure to conduct full assessments before use.

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P13/15

(2) After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the

substrate.

Excessive mechanical stress may cause cracking in the product.

Also, if mounting on flexible substrates, excessive mechanical stress could be applied to the chip by even slight bending or

twisting when handling this substrate, and so please conduct full assessments before use.

Bending

Twisting

12.8 Cleaning

The product shall be cleaned under the following conditions.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in

mounted products and the PCB.

Item

Power

Requirement

20 W/L max.

Time

5 min max.

Frequency

(3) Cleaner

28 kHz to 40 kHz

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water

adequately and completely dry it so that no cleaner is left.

* For other cleaning, consult our technical department.

12.9 Storage and transportation

Storage period

Use the product within 12 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and

humidity. The recommended temperature range is -10°C to +40°C. The recommended relative

humidity range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor

solderability.

• Do not place the products directly on the floor; they should be placed on a palette so that they

are not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

• Do not keep products in bulk packaging. Bulk storage could result in collisions between the

products or between the products and other parts, resulting in chipping or wire breakage.

• Avoid storing the product by itself bare (i.e. exposed directly to air).

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

12.10 Resin coating (including moisture-proof coating)

Before applying any resin coating, please consult our technical department.

12.11 Mounting conditions

Check the mounting condition before using.

Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,

misalignment, or damage to the product.

12.12 Operating environment

Do not use this product under the following environmental conditions as it may cause deterioration of product quality.

(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.

(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)

(2) In the atmosphere where liquid such as organic solvent, may splash on the products.

(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P14/15

12.13 Mounting density

If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.

If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,

resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that

the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating

temperature for the product.

13.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG CO., LTD

Spec No.: JELF243C_0021J-01

P15/15

Appendix

Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included

in the rating table.)

Perform measurement using the method described below. (Perform correction for the error deriving from the measuring

terminal.)

(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole

terminal as shown in the figure below.

(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using

the respective current and voltage for input/output.

V₁

I₁

V₂

I₂

Zm=

Zx=

(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.

Here,

α = D/A = 1

β = B/D = Zsm - (1 - Yom Zsm) Zss

Γ = C/A = Yom

Zm-β

Zx=α

1-ZmΓ

Zsm: measured impedance of short chip

Zss: residual impedance of short chip (0.480 nH)

Yom: measured admittance when measuring

terminal is open

(4) Calculate inductance Lx and Qx using the equations shown below.

Im(Zx)

Lx: inductance of chip coil

Qx: Q of chip coil

Lx=

2πf

Im(Zx)

Qx=

f: measuring frequency

Re(Zx)

MURATA MFG CO., LTD


型号：	LQP03HQ4N8H02#
厂家：	muRata
描述：
文件：	总15页 (文件大小：598K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LQP03HQ4N8H02# [MURATA]

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