LQP03TN3N6BZ2#_技术文档

Spec No.: JELF243C_9101E-01

P1/14

CHIP COILS (CHIP INDUCTORS) LQP03TN□□□□Z2□

Murata Standard REFERENCE SPECIFICATION [AEC-Q200]

1. Scope

This reference specification applies to chip coils (chip inductors) LQP03TN_Z2 series for automotive electronics based on

AEC-Q200 except for power trains and safeties.

2. Part Numbering

(Ex.)

LQ

P

03

T

N

0N6

B

Z

2

D

Product Structure Dimension Application Category Inductance Tolerance Performance

Electrode

specification

Packaging

D: taping

*B: bulk

ID

(L × W)

and

characteristic

*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).

3. Part Number and Rating

Operating temperature range

Storage temperature range

-55°C to +125°C

Self-resonant

frequency

(MHz)

Inductance

DC

resistance

(Ω max.)

Rated

current

(mA) 1C: 1kV

ESD

Rank

Customer

Part number

Murata

Part number

Q

(Min.)

Nominal

value

Lower

*Typical

Tolerance

limit

value

(nH)

LQP03TN0N6BZ2D

LQP03TN0N6CZ2D

LQP03TN0N7BZ2D

LQP03TN0N7CZ2D

LQP03TN0N8BZ2D

LQP03TN0N8CZ2D

LQP03TN0N9BZ2D

LQP03TN0N9CZ2D

LQP03TN1N0BZ2D

LQP03TN1N0CZ2D

LQP03TN1N1BZ2D

LQP03TN1N1CZ2D

LQP03TN1N2BZ2D

LQP03TN1N2CZ2D

LQP03TN1N3BZ2D

LQP03TN1N3CZ2D

LQP03TN1N4BZ2D

LQP03TN1N4CZ2D

LQP03TN1N5BZ2D

LQP03TN1N5CZ2D

LQP03TN1N6BZ2D

LQP03TN1N6CZ2D

LQP03TN1N7BZ2D

LQP03TN1N7CZ2D

LQP03TN1N8BZ2D

LQP03TN1N8CZ2D

LQP03TN1N9BZ2D

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

14

0.07

0.08

0.10

0.15

20000

18000

17000

16000

15000

12500

20000

19600

17900

20000

19100

17700

15100

850

800

750

600

1C

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P2/14

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA) 1C: 1kV

ESD

Rank

Customer

Part number

Murata

Part number

Q

(Min.)

Lower

*Typical

value

(nH)

Tolerance

limit

value

LQP03TN1N9CZ2D

LQP03TN2N0BZ2D

LQP03TN2N0CZ2D

LQP03TN2N1BZ2D

LQP03TN2N1CZ2D

LQP03TN2N2BZ2D

LQP03TN2N2CZ2D

LQP03TN2N3BZ2D

LQP03TN2N3CZ2D

LQP03TN2N4BZ2D

LQP03TN2N4CZ2D

LQP03TN2N5BZ2D

LQP03TN2N5CZ2D

LQP03TN2N6BZ2D

LQP03TN2N6CZ2D

LQP03TN2N7BZ2D

LQP03TN2N7CZ2D

LQP03TN2N8BZ2D

LQP03TN2N8CZ2D

LQP03TN2N9BZ2D

LQP03TN2N9CZ2D

LQP03TN3N0BZ2D

LQP03TN3N0CZ2D

LQP03TN3N1BZ2D

LQP03TN3N1CZ2D

LQP03TN3N2BZ2D

LQP03TN3N2CZ2D

LQP03TN3N3BZ2D

LQP03TN3N3CZ2D

LQP03TN3N4BZ2D

LQP03TN3N4CZ2D

LQP03TN3N5BZ2D

LQP03TN3N5CZ2D

LQP03TN3N6BZ2D

LQP03TN3N6CZ2D

LQP03TN3N7BZ2D

LQP03TN3N7CZ2D

LQP03TN3N8BZ2D

LQP03TN3N8CZ2D

LQP03TN3N9BZ2D

LQP03TN3N9CZ2D

LQP03TN4N0BZ2D

LQP03TN4N0CZ2D

LQP03TN4N1BZ2D

1.9

2.0

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.0

4.1

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

B: ±0.1 nH

14

0.15

0.20

0.25

0.30

0.40

12500

11000

10000

9500

8000

7000

6000

5700

5300

15100

14800

13900

13400

12900

12200

13300

13000

11800

12400

11900

11300

10600

10900

9400

600

500

450

400

350

1C

9400

9600

9500

8200

8100

7900

8600

8400

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P3/14

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA) 1C: 1kV

ESD

Rank

Customer

Part number

Murata

Part number

Q

(Min.)

Lower

*Typical

value

(nH)

Tolerance

limit

value

LQP03TN4N1CZ2D

LQP03TN4N2BZ2D

LQP03TN4N2CZ2D

LQP03TN4N3HZ2D

LQP03TN4N3JZ2D

LQP03TN4N7HZ2D

LQP03TN4N7JZ2D

LQP03TN5N1HZ2D

LQP03TN5N1JZ2D

LQP03TN5N6HZ2D

LQP03TN5N6JZ2D

LQP03TN6N2HZ2D

LQP03TN6N2JZ2D

LQP03TN6N8HZ2D

LQP03TN6N8JZ2D

LQP03TN7N5HZ2D

LQP03TN7N5JZ2D

LQP03TN8N2HZ2D

LQP03TN8N2JZ2D

LQP03TN9N1HZ2D

LQP03TN9N1JZ2D

LQP03TN10NHZ2D

LQP03TN10NJZ2D

LQP03TN11NHZ2D

LQP03TN11NJZ2D

LQP03TN12NHZ2D

LQP03TN12NJZ2D

LQP03TN13NHZ2D

LQP03TN13NJZ2D

LQP03TN15NHZ2D

LQP03TN15NJZ2D

LQP03TN16NHZ2D

LQP03TN16NJZ2D

LQP03TN18NHZ2D

LQP03TN18NJZ2D

LQP03TN20NHZ2D

LQP03TN20NJZ2D

LQP03TN22NHZ2D

LQP03TN22NJZ2D

LQP03TN24NHZ2D

LQP03TN24NJZ2D

LQP03TN27NHZ2D

LQP03TN27NJZ2D

LQP03TN30NHZ2D

4.1

4.2

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

10

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

14

12

9

0.40

0.60

0.70

0.80

0.70

0.80

0.70

0.95

0.80

2.30

1.90

2.30

2.95

5300

4400

4200

4000

3900

3700

3600

3300

3200

2900

2600

2200

2000

1700

8400

8600

9800

8800

8600

8000

7900

8000

6700

6600

5900

5800

5400

4300

3800

3700

3400

3600

3300

3200

2900

2700

350

300

250

200

150

140

120

1C

10

11

12

13

15

16

18

20

22

24

27

30

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P4/14

Self-resonant

frequency

(MHz)

Inductance

Nominal

DC

resistance

(Ω max.)

Rated

current

(mA) 1C: 1kV

ESD

Rank

Customer

Part number

Murata

Part number

Q

(Min.)

Lower

*Typical

value

(nH)

Tolerance

limit

value

LQP03TN30NJZ2D

LQP03TN33NHZ2D

LQP03TN33NJZ2D

LQP03TN36NHZ2D

LQP03TN36NJZ2D

LQP03TN39NHZ2D

LQP03TN39NJZ2D

LQP03TN43NHZ2D

LQP03TN43NJZ2D

LQP03TN47NHZ2D

LQP03TN47NJZ2D

LQP03TN51NHZ2D

LQP03TN51NJZ2D

LQP03TN56NHZ2D

LQP03TN56NJZ2D

LQP03TN62NHZ2D

LQP03TN62NJZ2D

LQP03TN68NHZ2D

LQP03TN68NJZ2D

LQP03TN75NJZ2D

LQP03TN75NHZ2D

LQP03TN82NHZ2D

LQP03TN82NJZ2D

LQP03TN91NHZ2D

LQP03TN91NJZ2D

LQP03TNR10HZ2D

LQP03TNR10JZ2D

LQP03TNR11HZ2D

LQP03TNR11JZ2D

LQP03TNR12HZ2D

LQP03TNR12JZ2D

30

33

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

H: ±3%

J: ±5%

9

8

2.95

3.00

3.60

3.90

8

1700

1500

1300

1200

1100

1000

900

2700

2600

2400

2200

2000

1800

1500

1400

1300

1100

120

100

80

1C

33

36

39

43

47

51

56

62

8

68

8

68

8

75

10

75

10

82

10

82

10

91

10

91

10

900

80

100

110

120

10

900

80

10

900

80

12

800

80

12

800

80

12

800

80

12

800

80

* Typical value is actual performance.

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P5/14

5. Appearance and Dimensions

Unit mass (typical value): 0.2 mg

6. Marking

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

Measuring equipment: Keysight E4991A or the

equivalent

7.1 Inductance

7.2 Q

Measuring frequency:

500 MHz 0.6 nH to 30 nH

300 MHz 33 nH to 120 nH

Measuring conditions:

Measurement signal level: Approx. 0 dBm

Measurement terminal distance: 0.2 mm

Electrical length: 10 mm

Weight: Approx. 1 N to 5 N

Measuring fixture: Keysight 16197A

Position the chip coil under test as shown in the

measuring example below and connect it to the

electrode by applying weight.

Measurement example:

Measuring method: see "Electrical performance:

Measuring method for inductance/Q" in the Appendix.

Measuring equipment: digital multimeter

Measuring equipment: Keysight N5230A or the

equivalent

7.3 DC resistance

7.4 Self-resonant

frequency

Meet chapter 3 ratings.

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

No. Item

P6/14

Specification

Test method

7.5 Rated current

Product temperature rise: 25°C max.

Apply the rated current specified in chapter 3.

8. AEC-Q200 Requirement

8.1 Performance [based on table 5 for magnetics (inductors/transformer) AEC-Q200 Rev. D issued June 1,

2010]

AEC-Q200

Murata specification/deviation

No.

3

Stress

Test method

High

1000 h at 125°C

Set for 24 h at room condition, then

measured.

Meet table A after testing.

Table A

temperature

exposure

Appearance

No damage

Within ±10%

Inductance change rate:

0.6 nH to 30 nH (at 500 MHz)

33 nH to 120 nH (at 300MHz)

Substrate: 6-layers FR-4

4

Temperature

cycling

1000 cycles

-40°C to +125°C

Meet table A after testing.

Substrate: 6-layers FR-4

Set for 24 h at room condition, then

measured.

7

8

9

Biased humidity 1000 h at 85°C, 85% (RH). Unpowered. Meet table A after testing.

Set for 24 h at room condition, then

measured.

Substrate: 6-layers FR-4

Operational life Apply 125°C 1000 h

Meet table A after testing.

Substrate: 6-layers FR-4

Set for 24 h at room condition, then

measured.

External visual Visual inspection

No abnormalities

No defects

10 Physical

dimension

Meet chapter 5, "Appearance and

Dimensions".

12 Resistance to

solvents

Per MIL-STD-202

Method 215

Not applicable

13 Mechanical

shock

Per MIL-STD-202

Method 213

Meet table A after testing.

Substrate: 6-layers FR-4

Condition F:

1500 g’s (14.7 N), 0.5 ms, half sine

14 Vibration

5 g's (0.049 N) for 20 min, 12 cycles each Meet table A after testing.

of 3 orientations

Substrate: 6-layers FR-4

Test from 10 Hz to 2000 Hz

15 Resistance to

soldering heat

No-heating

Solder temperature

260°C±5°C

Pre-heating: 150°C±10°C, 60 s to 90 s

Meet table A after testing.

Immersion time 10 s

17 ESD

Per AEC-Q200-002

Per J-STD-002

ESD rank: Refer to chapter 3 ratings.

Substrate: 6-layers FR-4

18 Solderbility

Method b: not applicable

Pre-heating: 150°C±10°C, 60 s to 90 s

90% of the terminations is to be soldered.

19 Electrical

Measured: inductance

Per UL-94

No defects

characterization

20 Flammability

21 Board flex

Not applicable

Epoxy-PCB (1.6 mm)

Deflection 2 mm (min.)

Holding time 60 s

Meet table B after testing.

Murata deviation request:

Substrate: FR-4 (0.8 mm_thickness)

Holding time: 30 s

Table B

Appearance

No damage

Within ±10%

DC resistance change rate

22 Terminal

strength

Per AEC-Q200-006

A force of 17.7 N for 60 s

Murata deviation request: 2 N for 5 s

Substrate: 6-layers FR-4

No defects

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P7/14

9. Specification of Packaging

9.1 Appearance and dimensions of tape (8 mm width/paper tape)

A

B

t

0.35±0.03

0N6 to 62N：0.67±0.03

68N to R12：0.65±0.03

0.55 max.

(in mm)

9.2 Taping specifications

Packing quantity

15000 pcs/reel

(Standard quantity)

Packing method

Feed hole position

Joint

The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom

tape when the cavities of the carrier tape are punched type).

The feed holes on the carrier tape are on the right side when the cover tape (top tape when the

cavities of the carrier tape are punched type) is pulled toward the user.

The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are

seamless.

Number of missing

products

Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

9.3 Break down force of tape

Cover tape (or top tape)

5 N min.

Bottom tape (only when the cavities of the carrier tape are punched type)

9.4 Peeling off force of tape

Speed of peeling off

Peeling off force

300 mm/min

0.1 N to 0.6 N (The lower limit is for typical value.)

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P8/14

9.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

9.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

Y

()

(2) Murata classification number

(1)

(2)

9.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

9.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

W

D

H

186

93

5

D

* Above outer box size is typical. It depends on a

quantity of an order.

W

10.

Caution

10.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea

equipment

(4) Power plant control

equipment

(5) Medical equipment

(6) Transportation equipment (7) Traffic signal

(trains, ships, etc.) equipment

(8) Disaster/crime

prevention

equipment

(9) Data-processing

equipment

(10) Applications of similar complexity and/or

reliability requirements to the applications listed in

the above

10.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P9/14

10.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

10.4 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the

abnormal function or the failure of our product.

11. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting

method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the

heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

11.1. Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering:

a

b

c

0.2 to 0.3

0.8 to 0.9

0.2 to 0.3

(in mm)

11.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 60 μm to 100 μm

If you want to use a flux other than the above, please consult our technical department.

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P10/14

11.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C

max.

Insufficient pre-heating or sudden cooling may cause cracks or other defects on the ceramic body, resulting in the

deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product

quality.

Standard profile

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

Limit profile

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Pre-heating

Heating

Peak temperature

Number of reflow cycles

Cooling speed

2 times

5°C/sec max.

11.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

11.5 Solder volume

Solder shall be used not to be exceeded the upper limits as shown below.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P11/14

11.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

a

b

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

11.7 Handling of substrate

• Do not mount on a flexible substrate.

• Contact our technical department in advance if you want to use a multilayer substrate with less than six layers.

* When mounting on a flexible substrate or a multi-layered substrate with less than six layers, cracks may occur due to stress

on the product.

(1) The stress applied to the chip varies depending on the material and construction of the mounted substrate.

If the coefficients of thermal expansion for the substrate and chip vary significantly, the difference in thermal expansion and

shrinkage could cause cracks to form in the chip.

We assume that the products are mounted on glass-epoxy substrate. Assessment has not been conducted on substrates

where the coefficient of thermal expansion varies significantly from glass-epoxy substrates. Conduct a thorough

assessment before mounting on these substrates.

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P12/14

(2) After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the

substrate.

Excessive mechanical stress may cause cracking in the product.

Also, if mounting on flexible substrates, excessive mechanical stress could be applied to the chip by even slight bending or

twisting when handling this substrate, and so please conduct full assessments before use.

Bending

Twisting

11.8 Cleaning

The product shall be cleaned under the following conditions.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in

mounted products and the PCB.

Item

Power

Requirement

20 W/L max.

Time

5 min max.

Frequency

(3) Cleaner

28 kHz to 40 kHz

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water

adequately and completely dry it so that no cleaner is left.

* For other cleaning, consult our technical department.

11.9 Storage and transportation

Storage period

Use the product within 12 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and

humidity. The recommended temperature range is -10°C to +40°C. The recommended relative

humidity range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor

solderability.

• Do not place the products directly on the floor; they should be placed on a palette so that they

are not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

• Do not keep products in bulk packaging. Bulk storage could result in collisions between the

products or between the products and other parts, resulting in chipping or wire breakage.

• Avoid storing the product by itself bare (i.e. exposed directly to air).

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

11.10 Resin coating (including moisture-proof coating)

Before applying any resin coating, please consult our technical department.

11.11 Mounting conditions

Check the mounting condition before using.

Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,

misalignment, or damage to the product.

11.12 Operating environment

Do not use this product under the following environmental conditions as it may cause deterioration of product quality.

(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.

(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)

(2) In the atmosphere where liquid such as organic solvent, may splash on the products.

(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P13/14

11.13 Mounting density

If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.

If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,

resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that

the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating

temperature for the product.

12.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG CO., LTD

Spec No.: JELF243C_9101E-01

P14/14

Appendix

Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included

in the rating table.)

Perform measurement using the method described below. (Perform correction for the error deriving from the measuring

terminal.)

(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole

terminal as shown in the figure below.

(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using

the respective current and voltage for input/output.

V₁

I₁

V₂

I₂

Zm=

Zx=

(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.

Here,

α = D/A = 1

β = B/D = Zsm - (1 - Yom Zsm) Zss

Γ = C/A = Yom

Zm-β

Zx=α

1-ZmΓ

Zsm: measured impedance of short chip

Zss: residual impedance of short chip (0.480 nH)

Yom: measured admittance when measuring

terminal is open

(4) Calculate inductance Lx and Qx using the equations shown below.

Im(Zx)

Lx: inductance of chip coil

Qx: Q of chip coil

Lx=

2πf

Im(Zx)

Qx=

f: measuring frequency

Re(Zx)

MURATA MFG CO., LTD


型号：	LQP03TN3N6BZ2#
厂家：	muRata
描述：
文件：	总14页 (文件大小：633K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LQP03TN3N6BZ2# [MURATA]

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