LQP03TQ1N6B02# [MURATA]

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型号：	LQP03TQ1N6B02#
厂家：	muRata
描述：
文件：	总12页 (文件大小：249K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Reference Only

Spec No. JELF243C-0024B-01

P.1/12

CHIP COIL (CHIP INDUCTORS) LQP03TQ□□□□02D Reference Specification

1.Scope

This reference specification applies to LQP03TQ series, Chip coil (Chip Inductors).

2.Part Numbering

(ex)

0N6

Product ID Structure Dimension Applications Category Inductance Tolerance Features

Electrode Packaging

D:Taping

(L×W)

and

Characteristics

*B:Bulk

*Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)

3.Rating

・Operating Temperature.

・Storage Temperature.

–55°C to +125°C

Self Resonant

Frequency

Resistance

(Ω max)

Rated

Current

(mA)

Customer

MURATA

Inductance

(min)

(MHz)

Part Number

(nH)

0.6

Tolerance

Min.

*Typ.

LQP03TQ0N6W02D

LQP03TQ0N6B02D

LQP03TQ0N6C02D

LQP03TQ0N7W02D

LQP03TQ0N7B02D

LQP03TQ0N7C02D

LQP03TQ0N8W02D

LQP03TQ0N8B02D

LQP03TQ0N8C02D

LQP03TQ0N9W02D

LQP03TQ0N9B02D

LQP03TQ0N9C02D

LQP03TQ1N0W02D

LQP03TQ1N0B02D

LQP03TQ1N0C02D

LQP03TQ1N1W02D

LQP03TQ1N1B02D

LQP03TQ1N1C02D

LQP03TQ1N2W02D

LQP03TQ1N2B02D

LQP03TQ1N2C02D

LQP03TQ1N3W02D

LQP03TQ1N3B02D

LQP03TQ1N3C02D

LQP03TQ1N4W02D

LQP03TQ1N4B02D

LQP03TQ1N4C02D

LQP03TQ1N5W02D

LQP03TQ1N5B02D

LQP03TQ1N5C02D

LQP03TQ1N6B02D

LQP03TQ1N6C02D

LQP03TQ1N7B02D

LQP03TQ1N7C02D

LQP03TQ1N8B02D

LQP03TQ1N8C02D

LQP03TQ1N9B02D

LQP03TQ1N9C02D

LQP03TQ2N0B02D

LQP03TQ2N0C02D

LQP03TQ2N1B02D

LQP03TQ2N1C02D

LQP03TQ2N2B02D

LQP03TQ2N2C02D

20000

18000

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

0.05

1000

>20000

W:±0.05ｎH

B:±0.1ｎH

C:±0.2ｎH

0.08

800

17000

700

16000

15000

19700

0.10

1.6

1.7

1.8

1.9

2.0

2.1

2.2

19000

17200

16900

16100

16300

14300

13000

650

B:±0.1ｎH

C:±0.2ｎH

12500

11000

0.12

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.2/12

Rated

Current

(mA)

Self Resonant

Customer

MURATA

Frequency

(MHz)

Inductance

Resistance

(Ω max)

Part Number

(min)

(nH)

Tolerance

Min.

*Typ.

LQP03TQ2N3B02D

LQP03TQ2N3C02D

LQP03TQ2N4B02D

LQP03TQ2N4C02D

LQP03TQ2N5B02D

LQP03TQ2N5C02D

LQP03TQ2N6B02D

LQP03TQ2N6C02D

LQP03TQ2N7B02D

LQP03TQ2N7C02D

LQP03TQ2N8B02D

LQP03TQ2N8C02D

LQP03TQ2N9B02D

LQP03TQ2N9C02D

LQP03TQ3N0B02D

LQP03TQ3N0C02D

LQP03TQ3N1B02D

LQP03TQ3N1C02D

LQP03TQ3N2B02D

LQP03TQ3N2C02D

LQP03TQ3N3B02D

LQP03TQ3N3C02D

LQP03TQ3N4B02D

LQP03TQ3N4C02D

LQP03TQ3N5B02D

LQP03TQ3N5C02D

LQP03TQ3N6B02D

LQP03TQ3N6C02D

LQP03TQ3N7B02D

LQP03TQ3N7C02D

LQP03TQ3N8B02D

LQP03TQ3N8C02D

LQP03TQ3N9B02D

LQP03TQ3N9C02D

LQP03TQ4N0B02D

LQP03TQ4N0C02D

LQP03TQ4N1B02D

LQP03TQ4N1C02D

LQP03TQ4N2B02D

LQP03TQ4N2C02D

LQP03TQ4N3H02D

LQP03TQ4N3J02D

LQP03TQ4N7H02D

LQP03TQ4N7J02D

LQP03TQ5N1H02D

LQP03TQ5N1J02D

LQP03TQ5N6H02D

LQP03TQ5N6J02D

LQP03TQ6N2H02D

LQP03TQ6N2J02D

LQP03TQ6N8H02D

LQP03TQ6N8J02D

LQP03TQ7N5H02D

LQP03TQ7N5J02D

LQP03TQ8N2H02D

LQP03TQ8N2J02D

LQP03TQ9N1H02D

LQP03TQ9N1J02D

LQP03TQ10NH02D

LQP03TQ10NJ02D

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.0

4.1

4.2

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

11000

12600

0.15

550

500

450

12300

12100

12800

12300

12400

12100

11800

11400

11200

10000

0.20

0.24

9500

8000

B:±0.1ｎH

C:±0.2ｎH

10100

9900

9800

9700

0.25

400

10500

6500

10100

10000

9900

8800

8400

8800

8300

7900

7600

7100

6600

6300

360

0.35

350

300

250

0.39

0.55

6000

5400

4800

H:±3%

J:±5%

0.65

0.69

4500

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.3/12

Rated

Current

(mA)

Self Resonant

Frequency

(MHz)

Resistance

(Ω max)

Customer

MURATA

Inductance

Part Number

(min)

(nH)

Tolerance

Min.

*Typ.

LQP03TQ11NH02D

LQP03TQ11NJ02D

LQP03TQ12NH02D

LQP03TQ12NJ02D

LQP03TQ13NH02D

LQP03TQ13NJ02D

LQP03TQ15NH02D

LQP03TQ15NJ02D

LQP03TQ16NH02D

LQP03TQ16NJ02D

LQP03TQ18NH02D

LQP03TQ18NJ02D

LQP03TQ20NH02D

LQP03TQ20NJ02D

LQP03TQ22NH02D

LQP03TQ22NJ02D

LQP03TQ24NH02D

LQP03TQ24NJ02D

LQP03TQ27NH02D

LQP03TQ27NJ02D

LQP03TQ30NH02D

LQP03TQ30NJ02D

LQP03TQ33NH02D

LQP03TQ33NJ02D

LQP03TQ36NH02D

LQP03TQ36NJ02D

LQP03TQ39NH02D

LQP03TQ39NJ02D

LQP03TQ43NH02D

LQP03TQ43NJ02D

LQP03TQ47NH02D

LQP03TQ47NJ02D

LQP03TQ51NH02D

LQP03TQ51NJ02D

LQP03TQ56NH02D

LQP03TQ56NJ02D

LQP03TQ62NH02D

LQP03TQ62NJ02D

LQP03TQ68NH02D

LQP03TQ68NJ02D

LQP03TQ75NH02D

LQP03TQ75NJ02D

LQP03TQ82NH02D

LQP03TQ82NJ02D

LQP03TQ91NH02D

LQP03TQ91NJ02D

LQP03TQR10H02D

LQP03TQR10J02D

LQP03TQR11H02D

LQP03TQR11J02D

100

110

5600

4900

4800

0.69

3700

250

0.8

1.1

1.2

5100

3500

4800

4500

4100

200

150

3000

2000

1700

1500

1300

1200

1.6

2.0

2.5

4.0

6.0

3800

3400

3200

3000

2900

2800

2700

2600

2500

2300

2100

H:±3%

J:±5%

130

100

1100

7.0

2000

1000

900

8.0

9.0

1800

1700

1600

＊Typical value is actual performance.

4. Testing Conditions

《Unless otherwise specified》

《In case of doubt》

Temperature : 20°C ± 2°C

Humidity : 60%(RH) to 70 %(RH)

Atmospheric Pressure : 86kPa to 106 kPa

Temperature : Ordinary Temperature / 15°C to 35°C

Humidity: Ordinary Humidity / 25%(RH) to 85 %(RH)

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.4/12

5. Appearance and Dimensions

0.6±0.03mm

Top view

0.3±0.03mm

End view

Side view

■ Unit Mass (Typical value)

0.20mg

0.3±0.02mm

0.2±0.03mm

Bottom view

0.15±0.03mm

6. Marking

Side surface identification marking :Blue

Both side surface

Blue

7.Electrical Performance

No. Item

7.1 Inductance

Specification

Inductance shall meet item 3.

Test Method

Measuring Equipment:

KEYSIGHT E4991A or equivalent

Measuring Frequency: (0.6～30nH)500MHz

(33～110nH) 300MHz

Measuring Condition:

Test signal level / about 0dBm

Electrical length / 10mm

Weight / about 1N～5N

Measuring Fixture: KEYSIGHT 16197A

Position coil under test as shown in below

and contact coil with each terminal by

adding weight. Bottom side should be

a bottom, and should be in the direction of

the fixture for position of chip coil.

7.2

Q shall meet item 3.

TOP

BOTTOM

Measuring Method:See the endnote.

<Electrical Performance:Measuring

Method of Inductance/Q>

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.5/12

No. Item

Specification

Test Method

7.3 DC Resistance

7.4 Self Resonant

Frequency(S.R.F)

7.5 Rated

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment:Digital multi meter

Measuring Equipment:

KEYSIGHT N5230A or equivalent

The rated current is applied.

Self temperature rise shall be

limited to 25°C max.

Current

8.Mechanical Performance

No.

Item

Specification

Test Method

8.1 Shear Test

Chip coil shall not be damaged

after tested as test method.

Substrate:Glass-epoxy substrate

Land

0.24

0.3

0.9

(in mm)

Force:2N

Hold Duration:5 s±1 s

Applied Direction: Parallel to PCB

Chip coil

Substrate

8.2 Bending Test

Substrate:Glass-epoxy substrate

(100mm×40mm×0.8mm)

Speed of Applying Force:1mm /s

Deflection:1mm

Hold Duration:30 s

Pressure jig

R340

Deflection

Product

(in mm)

8.3 Vibration

Appearance:No damage

Inductance Change: within ±10%

Substrate: Glass-epoxy substrate

Oscillation Frequency:

10Hz to 2000Hz to 10Hz for 20 min

Total amplitude 1.5 mm or Acceleration

amplitude 196 m/s²whichever is smaller.

Testing Time:A period of 2h in each of

3 mutually perpendicular directions.

8.4 Solderability

The electrode shall be at least 90% Flux: Ethanol solution of rosin 25(wt)%

covered with new solder coating.

(Immersed for 5s to 10s)

Solder:Sn-3.0Ag-0.5Cu

Pre-Heating:150°C±10°C / 60s to 90s

Solder Temperature:240°C±5°C

Immersion Time:3s±1s

8.5 Resistance to

Soldering Heat

Appearance:No damage

Inductance Change: within ±10%

Flux: Ethanol solution of rosin 25(wt)%

(Immersed for 5s to 10s)

Solder:Sn-3.0Ag-0.5Cu

Pre-Heating:150°C±10°C / 60s to 90s

Solder Temperature:260°C±5°C

Immersion Time:5s±1s

Then measured after exposure in the room

condition for 24h±2h.

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.6/12

9.Environmental Performance

It shall be soldered on the substrate.

No.

Item

Specification

Appearance:No damage

Inductance Change: within ±10%

Test Method

Substrate: Glass-epoxy substrate

Temperature:125°C±2°C

9.1 Heat Resistance

9.2 Cold Resistance

9.3 Humidity

Time:1000h (+48h,-0h)

Then measured after exposure in the

room condition for 24h±2h.

Substrate: Glass-epoxy substrate

Temperature:-55°C±3°C

Time:1000 h (+48h,-0h)

Then measured after exposure in the

room condition for 24h±2h.

Substrate: Glass-epoxy substrate

Temperature:40°C±2°C

Humidity:90%(RH) to 95%(RH)

Time:1000 h(+48h,-0h)

Then measured after exposure in the

room condition for 24h±2h.

Substrate: Glass-epoxy substrate

1 cycle:

9.4 Temperature

Cycle

1 step:-55°C±2°C / 30min±3 min

2 step:Ordinary temp. / 10~15 min

3 step:125°C±2°C / 30±3 min

4 step: Ordinary temp. / 10~15 min

Total of 10 cycles

Then measured after exposure in the

room condition for 24h±2h.

10.Specification of Packaging

10.1 Appearance and Dimensions of paper tape (8mm-wide)

+0.1

-0

2.0±0.05

φ1.5

2.0±0.05

4.0±0.1

1.75±0.1

（0.35）

0.55 max.

(in mm)

Direction of feed

10.2 Specification of Taping

(1) Packing quantity (standard quantity)

15,000 pcs. / reel

(2) Packing Method

Products shall be packed in the cavity of the base tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Base tape and Cover tape has no spliced point.

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.7/12

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,

and are not continuous. The Specified quantity per reel is kept.

10.3 Pull Strength

Cover tape

5N min

10.4 Peeling off force of cover tape

Cover tape

Speed of Peeling off

300mm/min

165 to 180

゜

0.1N to 0.6N

(minimum value is typical)

Peeling off force

Base tape

10.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.

Trailer

160 min.

Leader

2.0±0.5

Label

190 min.

Empty tape Cover tape

210 min.

13.0±0.2

60⁺¹

Direction of feed

21.0±0.8

-0

9.0

13.0±1.4

(in mm)

180

-3

10.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2),

Quantity etc ･･･

∗1) <Expression of Inspection No.>

□□ OOOO ×××

(1)

(2)

(3)

(1) Factory Code

(2) Date

First digit : Year / Last digit of year

Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D

Third, Fourth digit : Day

(3) Serial No.

∗2) <Expression of RoHS Marking >

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity parts.

(2) MURATA classification number

10.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS Marking (∗2), Quantity, etc ･･･

10.8 Specification of Outer Case

Outer Case Dimensions

(mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

186

∗ Above Outer Case size is typical. It depends on a quantity of an order.

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.8/12

11. ！ Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially

high reliability for the prevention of defects which might directly cause damage to the third party's life,

body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

12. Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

12.1 Land pattern designing

Chip Coil Land

0.3

0.9

Solder resist

0.24

(in mm)

ａ

ｂ

12.2 Flux, Solder

・ Use rosin-based flux.

Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

Don’t use water-soluble flux.

・ Use Sn-3.0Ag-0.5Cu solder.

・ Standard thickness of solder paste : 100μm.

12.3 Reflow soldering conditions

・ Pre-heating should be in such a way that the temperature difference between solder and

product surface is limited to 150°C max. Cooling into solvent after soldering also should be

in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of

products quality.

・ Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting

in the deterioration of product quality.

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.9/12

・Reflow soldering profile

Temp.

260℃

230℃

(℃)

245℃±3℃

220℃

Limit Profile

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150°C～180°C 、90s±30s

Heating

Peak temperature

Cycle of reflow

above 220°C､30s～60s

above 230°C､60s max.

260°C,10s

245°C±3°C

2 times

12.4 Reworking with soldering iron

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Time

2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the

crack on the products due to the thermal shock.

12.5 Solder Volume

･ Solder shall be used not to be exceeded the upper limits as shown below.

1/3T≦t≦2T

Upper Limit

T : thickness of product

Recommendable

Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance and become easy to tilt.

12.6 Attention regarding P.C.B. bending

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to

warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:ａ＜b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.10/12

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible

to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to the board separation surface.

(2) Add slits in the board separation part.

D *1

(3) Keep the mounting position of the component away from the board separation surface.

Seam

Slit

Length:a b

*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during

the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.

12.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max.

(3) Cleaner

Frequency : 28kHz to 40kHz

Time : 5 min max.

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized

water in order to remove the cleaner.

(5) Other cleaning

Please contact us.

12.8 Resin coating

When products are coated with resin, please contact us in advance.

12.9 Handling of a substrate

(1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress

on a chip is different depending on PCB material and structure.

When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,

it will cause cracking of the chip due to the thermal expansion and contraction.

The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other

PCB material which has different thermal expansion coefficient from Glass-epoxy.

When other PCB materials are considered, please be sure to evaluate by yourself.

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.11/12

(2)After mounting products on a substrate, do not apply any stress to the product caused by bending or

twisting to the substrate when cropping the substrate, inserting and removing a connector from the

substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress

even from small bending or twisting.

When the flexible PCB is considered, please be sure to evaluate by yourself.

Bending

Twisting

12.10 Storage and Handing Requirements

(1) Storage period

Use the products within 12 months after deliverd.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature ： -10°C ~ 40°C

Humidity

： 30% to 70% relative humidity No rapid change on temperature and humidity.

・Products should not be stored on bulk packaging condition to prevent the chipping of the

core and the breaking of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity,

dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and

so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or

mechanical shock.

13．

! Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications

before ordering.

MURATA MFG.CO.,LTD

Reference Only

Spec No. JELF243C-0024B-01

P.12/12

(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.

V₁

I₁

V₂

I ₂

Test Head

Test fixture

Product

(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.

V₁

I ₁

V₂

I ₂

Zm=

Zx=

，

(3) Thus,the relation between Zx and Zm is following;

Zm-β

1-ZmΓ

where, α= D / A =1

Zx= α

β= B / D =Zsm-(1-Yom Zsm)Zss

Γ= C / A =Yom

Zsm:measured impedance of short chip

Zss:residual impedance of short chip (0.480nH)

Yom:measured admittance when opening the fixture

(4) Lx and Qx shall be calculated with the following equation.

Im(Zx)

2πf

Im(Zx)

Re(Zx)

Lx :Inductance of chip coil

Qx:Q of chip coil

Qx=

Lx=

，

:Measuring frequency

MURATA MFG.CO.,LTD

LQP03TQ1N6B02# [MURATA]

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