LQW15AN9N2G00#_技术文档

Spec No.: JELF243A_0050AC-01

P1/15

CHIP COILS (CHIP INDUCTORS) LQW15AN□□□□00□ REFERENCE SPECIFICATION

1. Scope

This reference specification applies to chip coils (chip inductors) LQW15AN_00 series for general electronic equipment.

2. Part Numbering

(Ex.)

LQ

W

15

A

N

1N5

B

0

D

Product Structure Dimension Application

Category Inductance Tolerance Performance

Electrode

Packaging

ID

(L × W)

and

characteristic

specification D: taping

*B: bulk

*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).

3. Part Number and Rating

Operating temperature range

Storage temperature range

-55°C to +125°C

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(GHz min.)

Rated

current

(mA)

Customer

Part number

Murata

Part number

Q

(Min.)

value

(nH)

Tolerance

LQW15AN1N5B00D

LQW15AN1N5C00D

LQW15AN1N5D00D

LQW15AN1N6C00D

LQW15AN1N6D00D

LQW15AN1N7C00D

LQW15AN1N7D00D

LQW15AN1N8C00D

LQW15AN1N8D00D

LQW15AN2N4B00D

LQW15AN2N4C00D

LQW15AN2N4D00D

LQW15AN2N5B00D

LQW15AN2N5C00D

LQW15AN2N5D00D

LQW15AN2N6B00D

LQW15AN2N6C00D

LQW15AN2N6D00D

LQW15AN2N7B00D

LQW15AN2N7C00D

LQW15AN2N7D00D

LQW15AN2N8B00D

LQW15AN2N8C00D

LQW15AN2N8D00D

LQW15AN2N9B00D

LQW15AN2N9C00D

LQW15AN2N9D00D

LQW15AN3N0B00D

LQW15AN3N0C00D

LQW15AN3N0D00D

LQW15AN3N1B00D

1.5

1.6

1.7

1.8

2.4

2.5

2.6

2.7

2.8

2.9

3.0

3.1

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

C: ±0.2 nH

D: ±0.5 nH

C: ±0.2 nH

D: ±0.5 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

10

20

0.03

0.07

0.10

0.16

0.05

0.07

0.13

18.0

17.0

16.0

15.0

14.0

1000

750

640

460

850

750

570

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

Customer

P2/15

Rated

current

(mA)

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(GHz min.)

Murata

Q

(Min.)

Part number

value

(nH)

Tolerance

LQW15AN3N1C00D

LQW15AN3N1D00D

LQW15AN3N2B00D

LQW15AN3N2C00D

LQW15AN3N2D00D

LQW15AN3N9B00D

LQW15AN3N9C00D

LQW15AN3N9D00D

LQW15AN4N1B00D

LQW15AN4N1C00D

LQW15AN4N1D00D

LQW15AN4N3B00D

LQW15AN4N3C00D

LQW15AN4N3D00D

LQW15AN4N4B00D

LQW15AN4N4C00D

LQW15AN4N4D00D

LQW15AN4N5B00D

LQW15AN4N5C00D

LQW15AN4N5D00D

LQW15AN4N6B00D

LQW15AN4N6C00D

LQW15AN4N6D00D

LQW15AN4N7B00D

LQW15AN4N7C00D

LQW15AN4N7D00D

LQW15AN4N8B00D

LQW15AN4N8C00D

LQW15AN4N8D00D

LQW15AN4N9B00D

LQW15AN4N9C00D

LQW15AN4N9D00D

LQW15AN5N0B00D

LQW15AN5N0C00D

LQW15AN5N0D00D

LQW15AN5N1B00D

LQW15AN5N1C00D

LQW15AN5N1D00D

LQW15AN5N8B00D

LQW15AN5N8C00D

LQW15AN5N8D00D

LQW15AN6N2B00D

LQW15AN6N2C00D

LQW15AN6N2D00D

LQW15AN6N3B00D

LQW15AN6N3C00D

3.1

3.2

3.9

4.1

4.3

4.4

4.5

4.6

4.7

4.8

4.9

5.0

5.1

5.8

6.2

6.3

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

20

15

25

0.13

0.17

0.07

0.12

0.09

14.0

10.0

8.0

570

500

750

600

700

8.0

6.0

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

Customer

P3/15

Rated

current

(mA)

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(GHz min.)

Murata

Q

(Min.)

Part number

value

(nH)

Tolerance

LQW15AN6N3D00D

LQW15AN6N4B00D

LQW15AN6N4C00D

LQW15AN6N4D00D

LQW15AN6N5B00D

LQW15AN6N5C00D

LQW15AN6N5D00D

LQW15AN6N6B00D

LQW15AN6N6C00D

LQW15AN6N6D00D

LQW15AN6N7B00D

LQW15AN6N7C00D

LQW15AN6N7D00D

LQW15AN6N8G00D

LQW15AN6N8H00D

LQW15AN6N8J00D

LQW15AN6N9G00D

LQW15AN6N9H00D

LQW15AN6N9J00D

LQW15AN7N0G00D

LQW15AN7N0H00D

LQW15AN7N0J00D

LQW15AN7N1G00D

LQW15AN7N1H00D

LQW15AN7N1J00D

LQW15AN7N2G00D

LQW15AN7N2H00D

LQW15AN7N2J00D

LQW15AN7N3G00D

LQW15AN7N3H00D

LQW15AN7N3J00D

LQW15AN7N5G00D

LQW15AN7N5H00D

LQW15AN7N5J00D

LQW15AN8N2G00D

LQW15AN8N2H00D

LQW15AN8N2J00D

LQW15AN8N6G00D

LQW15AN8N6H00D

LQW15AN8N6J00D

LQW15AN8N7G00D

LQW15AN8N7H00D

LQW15AN8N7J00D

LQW15AN8N8G00D

LQW15AN8N8H00D

LQW15AN8N8J00D

6.3

6.4

6.5

6.6

6.7

6.8

6.9

7.0

7.1

7.2

7.3

7.5

8.2

8.6

8.7

8.8

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

B: ±0.1 nH

C: ±0.2 nH

D: ±0.5 nH

G: ±2%

H: ±3%

25

0.09

0.13

0.14

6.0

5.5

700

570

540

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

Customer

P4/15

Rated

current

(mA)

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(GHz min.)

Murata

Q

(Min.)

Part number

value

(nH)

Tolerance

LQW15AN8N9G00D

LQW15AN8N9H00D

LQW15AN8N9J00D

LQW15AN9N0G00D

LQW15AN9N0H00D

LQW15AN9N0J00D

LQW15AN9N1G00D

LQW15AN9N1H00D

LQW15AN9N1J00D

LQW15AN9N2G00D

LQW15AN9N2H00D

LQW15AN9N2J00D

LQW15AN9N3G00D

LQW15AN9N3H00D

LQW15AN9N3J00D

LQW15AN9N4G00D

LQW15AN9N4H00D

LQW15AN9N4J00D

LQW15AN9N5G00D

LQW15AN9N5H00D

LQW15AN9N5J00D

LQW15AN9N6G00D

LQW15AN9N6H00D

LQW15AN9N6J00D

LQW15AN9N7G00D

LQW15AN9N7H00D

LQW15AN9N7J00D

LQW15AN9N8G00D

LQW15AN9N8H00D

LQW15AN9N8J00D

LQW15AN9N9G00D

LQW15AN9N9H00D

LQW15AN9N9J00D

LQW15AN10NG00D

LQW15AN10NH00D

LQW15AN10NJ00D

LQW15AN11NG00D

LQW15AN11NH00D

LQW15AN11NJ00D

LQW15AN12NG00D

LQW15AN12NH00D

LQW15AN12NJ00D

LQW15AN13NG00D

LQW15AN13NH00D

LQW15AN13NJ00D

LQW15AN15NG00D

8.9

9.0

9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

10

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

25

30

25

30

0.14

0.17

0.14

0.21

0.16

5.5

5.0

540

500

430

460

10

11

12

13

15

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

Customer

P5/15

Rated

current

(mA)

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(GHz min.)

Murata

Q

(Min.)

Part number

value

(nH)

Tolerance

LQW15AN15NH00D

LQW15AN15NJ00D

LQW15AN16NG00D

LQW15AN16NH00D

LQW15AN16NJ00D

LQW15AN18NG00D

LQW15AN18NH00D

LQW15AN18NJ00D

LQW15AN19NG00D

LQW15AN19NH00D

LQW15AN19NJ00D

LQW15AN20NG00D

LQW15AN20NH00D

LQW15AN20NJ00D

LQW15AN22NG00D

LQW15AN22NH00D

LQW15AN22NJ00D

LQW15AN23NG00D

LQW15AN23NH00D

LQW15AN23NJ00D

LQW15AN24NG00D

LQW15AN24NH00D

LQW15AN24NJ00D

LQW15AN27NG00D

LQW15AN27NH00D

LQW15AN27NJ00D

LQW15AN30NG00D

LQW15AN30NH00D

LQW15AN30NJ00D

LQW15AN33NG00D

LQW15AN33NH00D

LQW15AN33NJ00D

LQW15AN36NG00D

LQW15AN36NH00D

LQW15AN36NJ00D

LQW15AN39NG00D

LQW15AN39NH00D

LQW15AN39NJ00D

LQW15AN40NG00D

LQW15AN40NH00D

LQW15AN40NJ00D

LQW15AN43NG00D

LQW15AN43NH00D

LQW15AN43NJ00D

LQW15AN47NG00D

LQW15AN47NH00D

15

16

18

19

20

22

23

24

27

30

33

36

39

40

43

47

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

30

25

0.16

0.24

0.27

0.30

0.52

0.58

0.63

0.70

1.08

5.0

4.5

4.0

3.8

3.5

3.3

3.2

3.1

3.0

2.9

460

370

310

280

270

260

250

210

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

Customer

P6/15

Rated

current

(mA)

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(GHz min.)

Murata

Q

(Min.)

Part number

value

(nH)

Tolerance

LQW15AN47NJ00D

LQW15AN51NG00D

LQW15AN51NH00D

LQW15AN51NJ00D

LQW15AN56NG00D

LQW15AN56NH00D

LQW15AN56NJ00D

LQW15AN62NG00D

LQW15AN62NH00D

LQW15AN62NJ00D

LQW15AN68NG00D

LQW15AN68NJ00D

LQW15AN72NG00D

LQW15AN72NJ00D

LQW15AN75NG00D

LQW15AN75NJ00D

LQW15AN82NG00D

LQW15AN82NJ00D

LQW15AN91NG00D

LQW15AN91NJ00D

LQW15ANR10J00D

LQW15ANR12J00D

47

51

56

62

68

72

75

82

91

100

120

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

H: ±3%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

25

20

1.08

1.17

1.82

1.96

2.10

2.24

2.38

2.52

2.66

2.9

2.85

2.8

2.6

2.5

2.4

2.3

2.1

1.5

1.0

210

200

145

140

135

130

125

120

110

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

5. Appearance and Dimensions

Unit mass (typical value): 0.0008 g

6. Marking

No marking.

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

P7/15

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

7.1 Inductance

Measuring equipment: Keysight E4991A or the

equivalent

Measuring frequency:

Inductance

Q

100 MHz

250 MHz 1.5 nH to 43 nH

200 MHz 47 nH to 68 nH

150 MHz 72 nH to 120 nH

Measuring conditions:

Measurement signal level: Approx. 0 dBm

Measurement terminal distance: 0.5 mm

Electrical length: 10.0 mm

Measuring fixture: Keysight 16197A

Position the chip coil under test as shown in the

measuring example below and connect it to the

electrode by applying weight.

Measurement example:

7.2

Q

Meet chapter 3 ratings.

Measuring method: see "Electrical performance:

Measuring method for inductance/Q" in the chapter

"16. Appendix".

7.3 DC resistance

Meet chapter 3 ratings.

Measuring equipment: digital multimeter

7.4 Self-resonant

frequency

Measuring equipment: Keysight N5230A or the

equivalent

7.5 Rated current

Product temperature rise: 20°C max.

Apply the rated current specified in chapter 3.

8. Mechanical Performance

No.

Item

Specification

Test method

8.1 Shear test

No significant mechanical damage or no Test substrate: glass-epoxy substrate

sign of electrode peeling off shall be

observed.

Force application direction:

Applying force: 5 N

Holding time: 5 s±1 s

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

No. Item

P8/15

Specification

Test method

8.2 Bending test

No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40

sign of electrode peeling off shall be

observed.

mm × 0.8 mm)

Pressurizing speed: 1 mm/s

Deflection: 2 mm

Holding time: 5 s

8.3 Vibration

Appearance shall have no significant

mechanical damage.

Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for

approx. 1 min

Total amplitude: 1.5 mm

Test time: 3 directions perpendicular to each other, 2 h

for each direction (6 h in total)

8.4 Solderability

90% or more of the outer electrode shall Flux: immersed in ethanol solution [including an

be covered with new solder seamlessly. activator with a chlorine conversion value of 0.06(wt)%]

with a rosin content of 25(wt)% for 5 s to 10 s.

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 240°C±5°C

Immersion time: 3 s±1 s

8.5 Resistance to

soldering heat

Appearance: No significant mechanical Flux: immersed in ethanol solution [including an

damage shall be observed.

activator with a chlorine conversion value of 0.06(wt)%]

with a rosin content of 25(wt)% for 5 s to 10 s.

Solder: Sn-3.0Ag-0.5Cu solder

Inductance change rate: within ±5%

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 270°C±5°C

Immersion time: 10 s±1 s

Post-treatment: left at a room condition for 24 h±2 h

9. Environmental Performance

The product is soldered on a substrate for test.

No.

Item

Specification

Test method

9.1 Heat resistance

9.2 Cold resistance

9.3 Humidity

Appearance: No significant mechanical

damage shall be observed.

Inductance change rate: within ±5%

Q change rate: within ±20%

Temperature: 125°C±2°C

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

Appearance: No significant mechanical

damage shall be observed.

Inductance change rate: within ±5%

Q change rate: within ±20%

Temperature: -55°C±2°C

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

Appearance: No significant mechanical

damage shall be observed.

Inductance change rate: within ±5%

Q change rate: within ±20%

Temperature: 70°C±2°C

Humidity: 90% (RH) to 95% (RH)

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

9.4 Temperature cycle Appearance: No significant mechanical

damage shall be observed.

Single cycle conditions:

Step 1: -55°C±2°C/30 min±3 min

Inductance change rate: within ±5%

Q change rate: within ±20%

Step 2: ordinary temperature/10 min to 15 min

Step 3: +125°C±2°C/30 min±3 min

Step 4: ordinary temperature/10 min to 15 min

Number of testing: 10 cycles

Post-treatment: left at a room condition for 24 h±2 h

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

P9/15

10. Specification of Packaging

10.1 Appearance and dimensions of tape (8 mm width/paper tape)

(in mm)

A^*(mm)

(Dimensional

tolerance ±0.03)

B^*(mm)

Inductance

(Dimensional

tolerance ±0.03)

1N5, 2N4 to 2N8, 3N9 to 4N8, 5N8 to 6N8, 8N2 to 9N9, 11N, 12N, 15N

0.69

0.66

0.64

1.18

1N6 to 1N8, 2N9, 3N0, 3N1, 3N2, 4N9 to 5N1, 6N9 to 7N5, 10N, 13N, 16N to 23N,

R10, R12

24N to 91N

*Typical value

10.2 Taping specifications

Packing quantity

10000 pcs/reel

(Standard quantity)

Packing method

Feed hole position

Joint

The products are placed in embossed cavities of a base tape and sealed by a cover tape.

The feed holes on the base tape are on the right side when the cover tape is pulled toward the user.

The base tape and the cover tape are seamless.

Number of missing

products

Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

Break down force of cover tape

5 N min.

10.4 Peeling off force of cover tape

Speed of peeling off

300 mm/min

Peeling off force

0.1 N to 0.6 N (The lower limit is for typical value.)

Cover tape

F

165 to 180

°

゜

Base tape

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

P10/15

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

Y

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

10.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

W

D

H

186

93

5

D

* Above outer box size is typical. It depends on a

quantity of an order.

W

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

P11/15

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea

equipment

(4) Power plant control

equipment

(5) Medical equipment

(6) Transportation equipment (vehicles, (7) Traffic signal

trains, ships, etc.) equipment

(8) Disaster/crime

prevention equipment

(9) Data-processing

equipment

(10) Applications of similar complexity and/or reliability

requirements to the applications listed in the above

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

11.4 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,

etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated

corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of

product electrode, etc. We will not bear any responsibility for use under these environments.

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other

mounting method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and

the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

12.1 Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering.

The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land

dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional

shift. If you use other land pattern, consider it adequately.

a

b

c

0.50

1.2

0.65

(in mm)

12.2 Flux and solder used

Flux

• Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

P12/15

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

150°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product

quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

P13/15

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

a

b

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

12.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

P14/15

12.8 Cleaning

The product shall be cleaned under the following conditions.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in

mounted products and the PCB.

Item

Power

Requirement

20 W/L max.

Time

5 min max.

Frequency

28 kHz to 40 kHz

(3) Cleaner

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water

adequately and completely dry it so that no cleaner is left.

* For other cleaning, consult our technical department.

12.9 Storage and transportation

Storage period

Use the product within 12 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.

The recommended temperature range is -10°C to +40°C. The recommended relative humidity

range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the

electrode, resulting in poor solderability or corrosion of the coil wire of the product.

• Do not keep products in bulk packaging. Doing so may cause collision between the products or

between the products and other products, resulting in core chipping or wire breakage.

• Do not place the products directly on the floor; they should be placed on a palette so that they are

not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

12.10 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some

operating condition may cause corrosion of wire of coil, leading to wire breakage.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your

board.

12.11 Handling of product

• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the

winding portion to prevent the breaking of wire.

• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

12.12 Handling with mounting equipment

• With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape

when the product is sucked with the pick-up nozzle.

When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.

• In some cases, the laser recognition function of the mounting equipment may not recognize this product correctly.

Please contact us when using laser recognition. (There is no problem with the permeation and reflection type.)

13.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG CO., LTD

Spec No.: JELF243A_0050AC-01

P15/15

14. Appendix

Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is

included in the rating table.)

Perform measurement using the method described below. (Perform correction for the error deriving from the measuring

terminal.)

(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole

terminal as shown in the figure below.

(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using

the respective current and voltage for input/output.

V₁

I₁

V₂

I₂

Zm=

Zx=

(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.

Here,

α = D/A = 1

β = B/D = Zsm - (1 - Yom Zsm) Zss

Zm-β

Γ = C/A = Yom

Zx=α

1-ZmΓ

Zsm: measured impedance of short chip

Zss: residual impedance of short chip (0.556 nH)

Yom: measured admittance when measuring terminal is open

(4) Calculate inductance Lx and Qx using the equations shown below.

Im (Zx)

Lx: inductance of chip coil

Qx: Q of chip coil

Lx=

2πf

Im (Zx)

Re (Zx)

Qx=

f: measuring frequency

MURATA MFG CO., LTD


型号：	LQW15AN9N2G00#
厂家：	muRata
描述：
文件：	总15页 (文件大小：577K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LQW15AN9N2G00# [MURATA]

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