LQW15CE1R5M10# [MURATA]

;


型号：	LQW15CE1R5M10#
厂家：	muRata
描述：
文件：	总9页 (文件大小：605K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec No.: JELF243A-0187-01

P1/9

Chip Coil (Chip Inductor) LQW15CE□□□□10□ Reference Specification

1. Scope

This reference specification applies to Chip Coil (Chip Inductor) LQW15CE□□□□10□ series for general electronic

equipment.

2. Part Numbering

(Ex.)

1R0

Product ID

Type

Dimension Application and Inductance Tolerance

(L × W) characteristic

Category

Packaging

D: taping

*B: bulk

*B: Bulk packing is also available.(The product sealed on the carrier tape is stored in a plastic bag.)

3. Part Number and Rating

Operating temperature range -55°C to +125°C

Storage temperature range

-55°C to +125°C

Rated current

(mA)

Inductance

Self-

resistance

(Ω max.)

Customer

Part number

Murata

Part number

resonant

frequency

(MHz min.)

Based on temperature rise ^*

Nominal

value

Based on

inductance

change

Tolerance

(%)

Ambient Ambient

temperature temperature

(nH)

85°C

270

190

170

130

125°C

135

LQW15CE1R0M10D 1000

LQW15CE1R5M10D 1500

LQW15CE2R2M10D 2200

LQW15CE3R3M10D 3300

±20

0.94

1.50

1.80

3.65

120

100

480

350

300

220

* As shown in the diagram below, derating is applied to the rated current based on the operating temperature

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

株式会社村田製作所

Spec No.: JELF243A-0187-01

P2/9

5. Appearance and Dimensions

■ Equivalent Circuit

Unit mass (typical value): 0.001 g

6. Marking

No marking.

7. Electrical Performance

No.

Item

Specification

Test method

7.1 Inductance

Meet chapter 3 ratings.

Measuring equipment: Keysight E4991A or the

equivalent

Measuring frequency: 1 MHz

Test signal level: about 0 dBm

Measurement terminal distance:0.5 mm

Electrical length: 10.0 mm

Measuring Fixture: Keysight 16197A

Position the chip coil under test as shown in the

measuring example below and connect it to the

electrode by applying weight.

Measurement example:

Measuring method: see "Electrical performance:

Measuring method for inductance/Q" in the chapter

"Appendix".

7.2 DC resistance

Meet chapter 3 ratings.

Measuring equipment: digital multimeter

7.3 Self-resonant

frequency

Measuring equipment: Keysight N5230A or the

equivalent

7.4 Rated current

When rated current is applied to the

products, inductance will be within

±30% of initial inductance value range.

Temperature rise caused by self-

generated heat shall be limited to 40°C

max.

Apply the rated current specified in chapter 3.

株式会社村田製作所

Spec No.: JELF243A-0187-01

P3/9

8. Mechanical Performance

The product is soldered on a substrate for test.(Except Solderability)

(Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of

being specified special condition.)

No.

Item

Specification

Test method

8.1 Shear test

No significant mechanical damage or

Applying force: 4 N

no sign of electrode peeling off shall be Holding time: 5 s

observed.

Force application direction:

8.2 Bending test

No significant mechanical damage or

Test substrate: glass-epoxy substrate (100 mm × 40

no sign of electrode peeling off shall be mm × 0.8 mm)

observed.

Pressurizing speed: 0.08 mm/s

Pressure jig: R230

Amount of bending: 2 mm

Holding time: 5 s

8.3 Vibration

Appearance shall have no significant

mechanical damage.

Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz/20

min

Amplitude: total amplitude of 3.0 mm or

acceleration amplitude of 196 m/s2, whichever is

smaller

Test time: 3 directions perpendicular to each other,

2 h for each direction (6 h in total)

8.4 Solderability

95% or more of the outer electrode

shall be covered with new solder

seamlessly.

Flux: Ethanol solution of rosin, 25(wt)%

Pre-heating: 150°C/60 s

Solder: Sn-3.0Ag-0.5Cu solder

Solder temperature: 245°C±3°C

Immersion time: 3 s

(except exposed wire)

9. Environmental Performance

The product is soldered on a substrate for test.

(Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of

being specified special condition.)

No.

Item

Specification

Test method

9.1 Heat

Appearance: No significant

mechanical damage shall be

observed.

Temperature: 125°C±2°C

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left for 4 hours to 48 hours at room

resistance

Inductance change rate: within ±30% temperature.

9.2 Cold

Appearance: No significant

mechanical damage shall be

observed.

Temperature: -55°C±2°C

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left for 4 hours to 48 hours at room

resistance

Inductance change rate: within ±10% temperature.

9.3 Humidity

Appearance: No significant

mechanical damage shall be

observed.

Temperature: 40°C±2°C

Humidity: 90% to 95% (RH)

Test time: 1000 h (+48 h, -0 h)

Inductance change rate: within ±10% Post-treatment: left for 4 hours to 48 hours at room

temperature.

9.4 Temperature Appearance: No significant

Single cycle conditions:

cycle

mechanical damage shall be

observed.

Inductance change rate: within ±10%

Step 1: -55°C (+0°C, -3°C), 30 min (+3 min, -0 min)

Step 2: ordinary temperature, 3 min max.

Step 3: +125°C (+3°C, -0°C), 30 min (+3 min, -0 min)

Step 4: ordinary temperature, 3 min max.

Number of testing: 100 cycles

Post-treatment: left for 4 hours to 48 hours at room

temperature.

株式会社村田製作所

Spec No.: JELF243A-0187-01

P4/9

10. Specification of Packaging

10.1 Appearance and dimensions of tape (8 mm width/paper tape)

(0.7)

(1.2)

0.8 max.

(in mm)

10.2 Taping specifications

Packing quantity

10000 pcs/reel

(Standard quantity)

Packing method

Feed hole position

Joint

The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and

bottom tape when the cavities of the carrier tape are punched type).

The feed holes on the carrier tape are on the right side when the cover tape (top tape when the

cavities of the carrier tape are punched type) is pulled toward the user.

The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched

type) are seamless.

Number of missing Number of missing products within 0.025% of the number per reel or 1 pc., whichever is

products greater, and are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

Cover tape (or top tape)

5 N min.

Bottom tape (only when the cavities of the carrier tape are punched type)

10.4 Peeling off force of tape

Speed of peeling off

Peeling off force

300 mm/min

0.1 N to 0.7 N (The lower limit is for typical value.)

株式会社村田製作所

Spec No.: JELF243A-0187-01

P5/9

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity,

etc.

10.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

186

* Above outer box size is typical. It depends on a

quantity of an order.

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for

the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

(8) Disaster/crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and/or reliability requirements

to the applications listed in the above

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

株式会社村田製作所

Spec No.: JELF243A-0187-01

P6/9

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the

product, overheating could occur, resulting in wire breakage, burning, or other serious fault.

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other

mounting method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of

thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume,

and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is

assumed.

12.1 Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering.

0.4

1.4

0.66

(in mm)

12.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 50 μm to 100 μm

If you want to use a flux other than the above, please consult our technical department.

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

100°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C

max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

株式会社村田製作所

Spec No.: JELF243A-0187-01

P7/9

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the

failure of mechanical or electrical performance.

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to

reduce stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

株式会社村田製作所

Spec No.: JELF243A-0187-01

P8/9

12.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

12.8 Cleaning

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken

solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade

this product.

12.9 Storage and transportation

Storage period

Use the product within 12 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and

humidity. The recommended temperature range is -10°C to +40°C. The recommended relative

humidity range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the

poor solderability.

• Do not place the products directly on the floor; they should be placed on a palette so that they

are not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

• Do not keep products in bulk packaging. Bulk storage could result in collisions between the

products or between the products and other parts, resulting in chipping or wire breakage.

• Avoid storing the product by itself bare (i.e. exposed directly to air).

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

12.10 Resin coating (including moisture-proof coating)

When the product is coated/molded with resin, its electrical characteristics may change.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc.

Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials,

leading to wire breakage.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your

board.

12.11 Mounting conditions

Check the mounting condition before using.

If installation conditions (nozzle, device requirements, etc.) are not suitable for the product, a pick-up error or shifting of

the pick-up position could occur, resulting in damage to the product.

In some cases, the laser recognition function of the mounting equipment may not recognize this product correctly.

Please contact us when using laser recognition. (There is no problem with the permeation and reflection type.)

12.12 Operating environment

Do not use this product under the following environmental conditions as it may cause deterioration of product quality.

(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.

(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)

(2) In the atmosphere where liquid such as organic solvent, may splash on the products.

(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.

12.13 Mounting density

If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.

If this product is subjected to a significant amount of heat from other products, this could adversely affect product

quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a

manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the

rated operating temperature for the product.

株式会社村田製作所

Spec No.: JELF243A-0187-01

P9/9

12.14 Handling of product

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched

to the winding portion and electrode to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

13.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted

to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering.

Appendix

Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is

included in the rating table.)

Perform measurement using the method described below. (Perform correction for the error deriving from the measuring

terminal.)

(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-

pole terminal as shown in the figure below.

(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by

using the respective current and voltage for input/output.

V₁

I₁

V₂

I₂

Zm=

Zx=

(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as

follows.

Here,

α = D/A = 1

β = B/D = Zsm - (1 - Yom Zsm) Zss

Γ = C/A = Yom

Zm-β

Zx=α

1-ZmΓ

Zsm: measured impedance of short chip

Zss: residual impedance of short chip (0.556 nH)

Yom: measured admittance when measuring terminal is

open

(4) Calculate inductance Lx and Qx using the equations shown below.

Im (Zx)

Lx: inductance of chip coil

Qx: Q of chip coil

Lx=

2πf

Im (Zx)

Re (Zx)

f: measuring frequency

Qx=

株式会社村田製作所

LQW15CE1R5M10# [MURATA]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E