LQW18AN17NG80#_技术文档

Spec No.: JELF243A_0102J-01

P1/14

CHIP COILS (CHIP INDUCTORS) LQW18AN□□□□80□ REFERENCE SPECIFICATION

1. Scope

This reference specification applies to chip coils (chip inductors) LQW18AN_80 series for general electronic equipment.

2. Part Numbering

(Ex.)

LQ

W

18

A

N

2N2

C

8

0

D

Product Structure Dimension Application Category Inductance Tolerance Performance Electrode Packaging

ID

(L × W)

and

characteristic

specification D: taping

*B: bulk

*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).

3. Part Number and Rating

Operating temperature range

Storage temperature range

-55°C to +125°C

Inductance

DC

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Rated

current

(mA)^*1

Customer

Murata

Q

(Min.)

Nominal

value

Part number

Tolerance

(nH)

LQW18AN2N2C80D

LQW18AN2N4C80D

LQW18AN3N0C80D

LQW18AN3N9B80D

LQW18AN3N9C80D

LQW18AN3N9G80D

LQW18AN4N1B80D

LQW18AN4N1C80D

LQW18AN4N1G80D

LQW18AN4N2B80D

LQW18AN4N2C80D

LQW18AN4N2G80D

LQW18AN4N3B80D

LQW18AN4N3C80D

LQW18AN4N3G80D

LQW18AN4N7B80D

LQW18AN4N7C80D

LQW18AN4N7G80D

LQW18AN4N9B80D

LQW18AN4N9C80D

LQW18AN4N9G80D

LQW18AN5N6C80D

LQW18AN5N6G80D

LQW18AN6N0C80D

LQW18AN6N0G80D

LQW18AN6N5C80D

LQW18AN6N5G80D

LQW18AN6N8C80D

LQW18AN6N8G80D

LQW18AN7N2C80D

2.2

2.4

3.0

3.9

4.1

4.2

4.3

4.7

4.9

5.6

6

C: ±0.2 nH

B: ±0.1 nH

C: ±0.2 nH

G: ±2%

24

18

13

30

35

25

23

38

40

38

0.018

0.026

0.17

15000

10000

11600

10400

7300

3200

2400

670

0.028

0.036

0.054

0.081

0.040

2200

2100

1500

1200

1900

B: ±0.1 nH

C: ±0.2 nH

G: ±2%

B: ±0.1 nH

C: ±0.2 nH

G: ±2%

B: ±0.1 nH

C: ±0.2 nH

G: ±2%

B: ±0.1 nH

C: ±0.2 nH

G: ±2%

B: ±0.1 nH

C: ±0.2 nH

G: ±2%

7300

C: ±0.2 nH

G: ±2%

6650

C: ±0.2 nH

G: ±2%

6650

6

6650

6.5

6.8

7.2

C: ±0.2 nH

G: ±2%

6650

C: ±0.2 nH

G: ±2%

6650

C: ±0.2 nH

6650

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P2/14

Rated

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Customer

Murata

Q

(Min.)

current

Part number

value

(nH)

Tolerance

(mA)^*1

LQW18AN7N2G80D

LQW18AN7N5C80D

LQW18AN7N5G80D

LQW18AN8N2C80D

LQW18AN8N2G80D

LQW18AN8N4C80D

LQW18AN8N4G80D

LQW18AN8N7C80D

LQW18AN8N7G80D

LQW18AN9N1C80D

LQW18AN9N1G80D

LQW18AN9N5C80D

LQW18AN9N5G80D

LQW18AN9N9C80D

LQW18AN9N9G80D

LQW18AN10NG80D

LQW18AN10NJ80D

LQW18AN11NG80D

LQW18AN11NJ80D

LQW18AN12NG80D

LQW18AN12NJ80D

LQW18AN13NG80D

LQW18AN13NJ80D

LQW18AN15NG80D

LQW18AN15NJ80D

LQW18AN16NG80D

LQW18AN16NJ80D

LQW18AN17NG80D

LQW18AN17NJ80D

LQW18AN18NG80D

LQW18AN18NJ80D

LQW18AN19NG80D

LQW18AN19NJ80D

LQW18AN22NG80D

LQW18AN22NJ80D

LQW18AN23NG80D

LQW18AN23NJ80D

LQW18AN24NG80D

LQW18AN24NJ80D

LQW18AN25NG80D

LQW18AN25NJ80D

LQW18AN27NG80D

LQW18AN27NJ80D

LQW18AN28NG80D

LQW18AN28NJ80D

LQW18AN30NG80D

7.2

7.5

8.2

8.4

8.7

9.1

9.5

9.9

10

11

G: ±2%

C: ±0.2 nH

G: ±2%

C: ±0.2 nH

G: ±2%

C: ±0.2 nH

G: ±2%

C: ±0.2 nH

G: ±2%

C: ±0.2 nH

G: ±2%

C: ±0.2 nH

G: ±2%

C: ±0.2 nH

G: ±2%

J: ±5%

38

35

38

40

37

38

40

0.040

0.048

0.052

0.064

0.075

0.086

0.098

0.12

6650

7000

4750

5000

4600

3450

3600

2880

1900

1500

1600

1500

1400

1300

1200

1100

G: ±2%

J: ±5%

11

12

13

15

16

17

18

19

22

23

24

25

27

28

30

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P3/14

Rated

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Customer

Murata

Q

(Min.)

current

Part number

value

(nH)

Tolerance

(mA)^*1

LQW18AN30NJ80D

LQW18AN31NG80D

LQW18AN31NJ80D

LQW18AN33NG80D

LQW18AN33NJ80D

LQW18AN34NG80D

LQW18AN34NJ80D

LQW18AN36NG80D

LQW18AN36NJ80D

LQW18AN37NG80D

LQW18AN37NJ80D

LQW18AN39NG80D

LQW18AN39NJ80D

LQW18AN41NG80D

LQW18AN41NJ80D

LQW18AN43NG80D

LQW18AN43NJ80D

LQW18AN44NG80D

LQW18AN44NJ80D

LQW18AN47NG80D

LQW18AN47NJ80D

LQW18AN48NG80D

LQW18AN48NJ80D

LQW18AN51NG80D

LQW18AN51NJ80D

LQW18AN52NG80D

LQW18AN52NJ80D

LQW18AN56NG80D

LQW18AN56NJ80D

LQW18AN58NG80D

LQW18AN58NJ80D

LQW18AN68NG80D

LQW18AN68NJ80D

LQW18AN69NG80D

LQW18AN69NJ80D

LQW18AN72NG80D

LQW18AN72NJ80D

LQW18AN73NG80D

LQW18AN73NJ80D

LQW18AN75NG80D

LQW18AN75NJ80D

LQW18AN78NG80D

LQW18AN78NJ80D

LQW18AN82NG80D

LQW18AN82NJ80D

LQW18AN83NG80D

30

31

33

34

36

37

39

41

43

44

47

48

51

52

56

58

68

69

72

73

75

78

82

83

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

40

37

40

32

35

38

35

37

34

28

34

0.12

0.11

0.15

0.20

0.16

0.21

0.23

0.27

0.26

0.30

0.38

0.47

0.41

0.5

2880

3150

3000

3280

2780

2700

2750

2600

2400

2380

2330

2280

2230

1100

1050

910

1000

840

830

750

770

700

630

560

590

550

0.5

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P4/14

Rated

Inductance

Nominal

DC

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Customer

Murata

Q

(Min.)

current

Part number

value

(nH)

Tolerance

(mA)^*1

LQW18AN83NJ80D

LQW18AN91NG80D

LQW18AN91NJ80D

LQW18AN94NG80D

LQW18AN94NJ80D

LQW18ANR10G80D

LQW18ANR10J80D

LQW18ANR11G80D

LQW18ANR11J80D

LQW18ANR12G80D

LQW18ANR12J80D

LQW18ANR15G80D

LQW18ANR15J80D

LQW18ANR18G80D

LQW18ANR18J80D

LQW18ANR20G80D

LQW18ANR20J80D

LQW18ANR21G80D

LQW18ANR21J80D

LQW18ANR22G80D

LQW18ANR22J80D

LQW18ANR25G80D

LQW18ANR25J80D

LQW18ANR27G80D

LQW18ANR27J80D

LQW18ANR30G80D

LQW18ANR30J80D

LQW18ANR33G80D

LQW18ANR33J80D

LQW18ANR36G80D

LQW18ANR36J80D

LQW18ANR39G80D

LQW18ANR39J80D

83

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

34

33

34

32

28

25

27

25

24

25

0.5

2230

1900

1750

1730

1650

1580

1380

1350

1330

1250

1200

1100

1050

1100

550

520

490

450

420

310

290

280

250

260

220

190

91

0.54

0.63

0.7

91

94

100

110

120

150

180

200

210

220

250

270

300

330

360

390

0.7

0.72

0.87

1.65

1.74

1.98

2.08

2.28

2.42

3.12

3.84

3.98

4.23

*1 As shown in the diagram below, derating is applied to the rated current based on the operating temperature.

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P5/14

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

5. Appearance and Dimensions

Unit mass (typical value): 0.0034 g

6. Marking

No marking.

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P6/14

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

7.1 Inductance

Measuring equipment: Keysight E4991A or the

equivalent

Measuring frequency:

Inductance

Q

100 MHz

250 MHz 2.2 nH to 44 nH

200 MHz 47 nH to 69 nH

150 MHz 72 nH to 150 nH

100 MHz 180 nH to 390 nH

Measuring conditions:

Measurement signal level: Approx. 0 dBm

Measurement terminal distance: 1.0 mm

Electrical length: 10.0 mm

Measuring fixture: Keysight 16197A

Position the chip coil under test as shown in the

measuring example below and connect it to the

electrode by applying weight.

Measurement example:

7.2

Q

Meet chapter 3 ratings.

Measuring method: see "Electrical performance:

Measuring method for inductance/Q" in the chapter

"16. Appendix".

7.3 DC resistance

Meet chapter 3 ratings.

Measuring equipment: digital multimeter

7.4 Self-resonant

frequency

Measuring equipment: Keysight N5230A or the

equivalent

7.5 Rated current

Product temperature rise: 40°C max.

Apply the rated current specified in chapter 3.

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P7/14

8. Mechanical Performance

No.

Item

Specification

Test method

8.1 Shear test

No significant mechanical damage or no Test substrate: glass-epoxy substrate

sign of electrode peeling off shall be

observed.

Force application direction:

Applying force: 5 N

Holding time: 5 s±1 s

8.2 Bending test

No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40

sign of electrode peeling off shall be

observed.

mm × 1.6 mm)

Pressurizing speed: 1 mm/s

Deflection: 2 mm

Holding time: 30 s

8.3 Vibration

Appearance shall have no significant

mechanical damage.

Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for

approx. 1 min

Total amplitude: 1.5 mm

Test time: 3 directions perpendicular to each other, 2 h

for each direction (6 h in total)

8.4 Solderability

90% or more of the outer electrode shall Flux: immersed in ethanol solution [including an

be covered with new solder seamlessly. activator with a chlorine conversion value of 0.06(wt)%]

with a rosin content of 25(wt)% for 5 s to 10 s.

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 240°C±5°C

Immersion time: 3 s±1 s

8.5 Resistance to

soldering heat

Appearance: No significant mechanical Flux: immersed in ethanol solution [including an

damage shall be observed.

activator with a chlorine conversion value of 0.06(wt)%]

with a rosin content of 25(wt)% for 5 s to 10 s.

Solder: Sn-3.0Ag-0.5Cu solder

Inductance change rate: within ±5%

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 270°C±5°C

Immersion time: 10 s±1 s

Post-treatment: left at a room condition for 24 h±2 h

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P8/14

9. Environmental Performance

The product is soldered on a substrate for test.

No.

Item

Specification

Test method

9.1 Heat resistance

9.2 Cold resistance

9.3 Humidity

Appearance: No significant mechanical Temperature: 125°C±2°C

damage shall be observed.

Inductance change rate: within ±5%

Q change rate: within ±20%

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

Appearance: No significant mechanical Temperature: -55°C±2°C

damage shall be observed.

Test time: 1000 h (+48 h, -0 h)

Inductance change rate: within ±5%

Q change rate: within ±20%

Post-treatment: left at a room condition for 24 h±2 h

Appearance: No significant mechanical Temperature: 40°C±2°C

damage shall be observed.

Humidity: 90% (RH) to 95% (RH)

Inductance change rate: within ±5%

Q change rate: within ±20%

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

9.4 Temperature cycle Appearance: No significant mechanical Single cycle conditions:

damage shall be observed.

Step 1: -55°C±2°C/30 min±3 min

Inductance change rate: within ±5%

Q change rate: within ±20%

Step 2: ordinary temperature/10 min to 15 min

Step 3: +125°C±2°C/30 min±3 min

Step 4: ordinary temperature/10 min to 15 min

Number of testing: 10 cycles

Post-treatment: left at a room condition for 24 h±2 h

10. Specification of Packaging

10.1 Appearance and dimensions of tape (8 mm width/paper tape)

A

B

t

1.15±0.05

1.9±0.05

1.1 max.

(in mm)

10.2 Taping specifications

Packing quantity

4000 pcs/reel

(Standard quantity)

Packing method

The products are placed in embossed cavities of a base tape and sealed by a top tape and a bottom

tape.

Feed hole position

Joint

The feed holes on the base tape are on the right side when the top tape is pulled toward the user.

The base tape and the top tape are seamless.

Number of missing

products

Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

Break down force of top tape

5 N min.

Break down force of bottom tape

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P9/14

10.4 Peeling off force of top tape

Speed of peeling off

300 mm/min

Peeling off force

0.1 N to 0.6 N (The lower limit is for typical value.)

Top tape

F

165 to 180 degree

Bottom tape

Base tape

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

Y

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

10.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

W

D

H

186

93

5

D

* Above outer box size is typical. It depends on a

quantity of an order.

W

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P10/14

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea

equipment

(4) Power plant control

equipment

(5) Medical equipment

(6) Transportation equipment (vehicles,

trains, ships, etc.)

(7) Traffic signal

equipment

(8) Disaster/crime

prevention equipment

(9) Data-processing

equipment

(10) Applications of similar complexity and/or reliability

requirements to the applications listed in the above

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

11.4 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,

etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated

corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of

product electrode, etc. We will not bear any responsibility for use under these environments.

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other

mounting method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and

the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

12.1 Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering.

The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land

dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional

shift. If you use other land pattern, consider it adequately.

a

b

c

0.86

2.00

1.15

(in mm)

12.2 Flux and solder used

Flux

• Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P11/14

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

150°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of

product quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P12/14

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

a

b

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

12.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P13/14

12.8 Cleaning

The product shall be cleaned under the following conditions.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in

mounted products and the PCB.

Item

Power

Requirement

20 W/L max.

Time

5 min max.

Frequency

(3) Cleaner

28 kHz to 40 kHz

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water

adequately and completely dry it so that no cleaner is left.

* For other cleaning, consult our technical department.

12.9 Storage and transportation

Storage period

Use the product within 12 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.

The recommended temperature range is -10°C to +40°C. The recommended relative humidity

range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the electrode,

resulting in poor solderability or corrosion of the coil wire of the product.

• Do not keep products in bulk packaging. Doing so may cause collision between the products or

between the products and other products, resulting in core chipping or wire breakage.

• Do not place the products directly on the floor; they should be placed on a palette so that they are

not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

12.10 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some

operating condition may cause corrosion of wire of coil, leading to wire breakage.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your

board.

12.11 Handling of product

• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the

winding portion to prevent the breaking of wire.

• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

12.12 Handling with mounting equipment

• With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape

when the product is sucked with the pick-up nozzle.

When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.

• In some cases, the laser recognition function of the mounting equipment may not recognize this product correctly.

Please contact us when using laser recognition. (There is no problem with the permeation and reflection type.)

13.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG CO., LTD

Spec No.: JELF243A_0102J-01

P14/14

14. Appendix

Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is

included in the rating table.)

Perform measurement using the method described below. (Perform correction for the error deriving from the measuring

terminal.)

(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole

terminal as shown in the figure below.

(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using

the respective current and voltage for input/output.

V₁

I₁

V₂

I₂

Zm=

Zx=

(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.

Here,

α = D/A = 1

β = B/D = Zsm - (1 - Yom Zsm) Zss

Zm-β

Γ = C/A = Yom

Zx=α

1-ZmΓ

Zsm: measured impedance of short chip

Zss: residual impedance of short chip (0.771 nH)

Yom: measured admittance when measuring terminal is open

(4) Calculate inductance Lx and Qx using the equations shown below.

Im (Zx)

Lx: inductance of chip coil

Qx: Q of chip coil

Lx=

2πf

Im (Zx)

Re (Zx)

Qx=

f: measuring frequency

MURATA MFG CO., LTD


型号：	LQW18AN17NG80#
厂家：	muRata
描述：
文件：	总14页 (文件大小：592K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LQW18AN17NG80# [MURATA]

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