LQW18AN22NG0ZD [MURATA]

General Purpose Inductor, 0.022uH, 2%, 1 Element, SMD, CHIP, 0603;


型号：	LQW18AN22NG0ZD
厂家：	muRata
描述：	General Purpose Inductor, 0.022uH, 2%, 1 Element, SMD, CHIP, 0603 测试射频感应器电感器
文件：	总11页 (文件大小：298K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SpecNo.JELF243A-9116B-01

P.1/11

Reference Only

CHIP COIL (CHIP INDUCTORS) LQW18AN□□□□0ZD

Murata Standard Reference Specification 【AEC-Q200】

1. Scope

This reference specification applies to LQW18AN_0ZD series, Chip coil (Chip Inductors) for automotive Electronics

based on AEC-Q200 except for Power train and Safety.

2. Part Numbering

(ex) LQ

Product ID Structure Dimension Applications Category Inductance Tolerance Features Application

(L×W)

2N2

Packaging

and

Z:Automotive D:Taping

Characteristics

3. Rating

・Operating Temperature Range

–55°C to +125°C

・Storage Temperature Range.

–55°C to +125°C

Self Resonant

Inductance

(∗1)

(min.)

Rated

Current

(mA)

ESD

Rank

6: 25kV

Resistance Frequency

(∗1)

(Ω max.)

Customer

MURATA

Part Number

(∗1)

(MHz min.)

(nH)

2.2

3.6

Tolerance

LQW18AN2N2D0ZD

LQW18AN3N6C0ZD

LQW18AN3N6D0ZD

LQW18AN3N9C0ZD

LQW18AN3N9D0ZD

LQW18AN4N3C0ZD

LQW18AN4N3D0ZD

LQW18AN4N7D0ZD

LQW18AN5N6C0ZD

LQW18AN5N6D0ZD

LQW18AN6N2C0ZD

LQW18AN6N2D0ZD

LQW18AN6N8C0ZD

LQW18AN6N8D0ZD

LQW18AN7N5C0ZD

LQW18AN7N5D0ZD

LQW18AN8N2C0ZD

LQW18AN8N2D0ZD

LQW18AN8N7C0ZD

LQW18AN8N7D0ZD

LQW18AN9N1C0ZD

LQW18AN9N1D0ZD

LQW18AN9N5D0ZD

LQW18AN10NG0ZD

LQW18AN10NJ0ZD

LQW18AN11NG0ZD

LQW18AN11NJ0ZD

LQW18AN12NG0ZD

LQW18AN12NJ0ZD

LQW18AN13NG0ZD

LQW18AN13NJ0ZD

LQW18AN15NG0ZD

LQW18AN15NJ0ZD

LQW18AN16NG0ZD

LQW18AN16NJ0ZD

D:±0.5nH

0.042

700

C:±0.2nH

D:±0.5nH

3.9

0.059

850

4.3

4.7

5.6

D:±0.5nH

6.2

6.8

7.5

8.2

8.7

0.082

750

C:±0.2nH

D:±0.5nH

6000

9.1

9.5

0.11

650

D:±0.5nH

G:±2%

J:±5%

0.13

0.16

600

550

5500

MURATA MFG.CO., LTD

SpecNo.JELF243A-9116B-01

P.2/11

ESD

Rank

6: 25kV

Reference Only

Resistance

(∗1)

Self Resonant

Frequency

(∗1)

Inductance

Rated

Current

(mA)

Customer

Part Number

MURATA

Part Number

(∗1)

(min.)

(nH)

Tolerance

(Ω max.)

(MHz min.)

LQW18AN18NG0ZD

LQW18AN18NJ0ZD

LQW18AN20NG0ZD

LQW18AN20NJ0ZD

LQW18AN22NG0ZD

LQW18AN22NJ0ZD

LQW18AN24NG0ZD

LQW18AN24NJ0ZD

LQW18AN27NG0ZD

LQW18AN27NJ0ZD

LQW18AN30NG0ZD

LQW18AN30NJ0ZD

LQW18AN33NG0ZD

LQW18AN33NJ0ZD

LQW18AN36NG0ZD

LQW18AN36NJ0ZD

LQW18AN39NG0ZD

LQW18AN39NJ0ZD

LQW18AN43NG0ZD

LQW18AN43NJ0ZD

LQW18AN47NG0ZD

LQW18AN47NJ0ZD

LQW18AN51NG0ZD

LQW18AN51NJ0ZD

LQW18AN56NG0ZD

LQW18AN56NJ0ZD

LQW18AN62NG0ZD

LQW18AN62NJ0ZD

LQW18AN68NG0ZD

LQW18AN68NJ0ZD

LQW18AN72NG0ZD

LQW18AN72NJ0ZD

LQW18AN75NG0ZD

LQW18AN75NJ0ZD

LQW18AN82NG0ZD

LQW18AN82NJ0ZD

LQW18AN91NG0ZD

LQW18AN91NJ0ZD

LQW18ANR10G0ZD

LQW18ANR10J0ZD

LQW18ANR11G0ZD

LQW18ANR11J0ZD

LQW18ANR12G0ZD

LQW18ANR12J0ZD

LQW18ANR13G0ZD

LQW18ANR13J0ZD

LQW18ANR15G0ZD

LQW18ANR15J0ZD

LQW18ANR16G0ZD

LQW18ANR16J0ZD

5500

4900

4600

3800

3700

3300

3200

2900

2800

2700

2600

2500

2400

2300

2200

2100

2050

2000

1900

1800

1700

1600

1450

1400

1350

0.16

0.17

0.21

550

500

440

0.23

0.26

0.29

420

400

380

0.33

0.35

0.51

0.38

370

360

280

340

G:±2%

J:±5%

0.56

270

0.60

0.64

0.68

1.2

250

230

220

200

180

170

160

150

100

110

120

130

150

160

1.3

1.4

1.5

2.1

MURATA MFG.CO., LTD

SpecNo.JELF243A-9116B-01

P.3/11

Reference Only

Self

Resistance

(∗1)

Inductance

(∗1)

(min.)

Resonant

Frequency

(∗1)

Rated

Current

(mA)

ESD

Rank

6: 25kV

Customer

Part Number

MURATA

Part Number

(nH)

Tolerance

(Ω max.)

(MHz min.)

LQW18ANR18G0ZD

LQW18ANR18J0ZD

LQW18ANR20G0ZD

LQW18ANR20J0ZD

LQW18ANR22G0ZD

LQW18ANR22J0ZD

LQW18ANR27G0ZD

LQW18ANR27J0ZD

LQW18ANR33G0ZD

LQW18ANR33J0ZD

LQW18ANR39G0ZD

LQW18ANR39J0ZD

LQW18ANR47G0ZD

LQW18ANR47J0ZD

180

200

220

270

330

390

470

2.2

2.4

2.5

3.4

5.5

6.2

7.0

1300

1250

1200

960

140

120

G:±2%

J:±5%

110

800

700

(∗1) Standard Testing Conditions

《Unless otherwise specified》

Temperature : Ordinary Temperature / 15°C to 35°C

Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)

《In case of doubt》

Temperature

Humidity

: 20°C±2°C

: 60%(RH) to 70%(RH)

Atmospheric Pressure : 86kPa to 106 kPa

4. Appearance and Dimensions

1.6±0.2

■Unit Mass (Typical value)

0.003g

(in mm)

0.3±0.1

MURATA MFG.CO., LTD

SpecNo.JELF243A-9116B-01

P.4/11

Reference Only

5. Electrical Performance

No.

Item

Specification

Test Method

5.1 Inductance

Inductance shall meet item 3.

Measuring Equipment：KEYSIGHT E4991A or equivalent

Measuring Frequency：<Inductance> 100MHz

<Q> 250MHz / 2.2nH~ 39nH

200MHz / 43nH~ 68nH

150MHz / 72nH~160nH

100MHz / 180nH~470nH

Measuring Condition：Test signal level / about 0dBm

Electrical length / 0.94cm

Measuring Fixture：KEYSIGHT 16193A

Position coil under test as shown in below and contact coil

with each terminal by adding weight.

5.2

Q shall meet item 3.

1mm

6.97mm

Measuring Method：See the endnote.

<Electrical Performance：Measuring

Method of Inductance / Q>

5.3 DC Resistance

DC Resistance shall meet item 3.

S.R.F shall meet item 3.

Measuring Equipment：Digital multi meter

5.4 Self Resonant

Frequency (S.R.F)

Measuring Equipment：KEYSIGHT N5230A or equivalent

5.5 Rated Current

Self temperature rise shall be

limited to 20°C max.

The rated current is applied.

Inductance Change：within ±10%

6. Q200 Requirement

6.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer)

AEC-Q200 Rev.D issued June 1. 2010

AEC-Q200

Murata Specification / Deviation

Meet Table A after testing.

Stress

Test Method

High

1000hours at 125 deg C

Set for 24hours at room

temperature, then measured.

Temperature

Exposure

Table A

Appearance

No damage

Inductance change

(at 100MHz)

Within ±5％

Temperature

Cycling

1000cycles

Meet Table A after testing.

-40 deg C to +125 deg C

Set for 24hours at room

temperature,then

measured.

Biased Humidity

Operational Life

1000hours at 85 deg C, 85%RH Meet Table A after testing.

unpowered.

Apply Rated Current 125 deg C Meet Table A after testing.

1000hours

Set for 24hours at room

temperature, then measured

External Visual

Visual inspection

No abnormalities

MURATA MFG.CO., LTD

SpecNo.JELF243A-9116B-01

AEC-Q200

P.5/11

Reference Only

Murata Specification / Deviation

10 Physical Dimension Meet ITEM 4

(Style and Dimensions)

Stress

Test Method

No defects

12 Resistance

to Solvents

Per

MIL-STD-202

Method 215

Not Applicable

13 Mechanical Shock Per MIL-STD-202

Method 213

Meet Table A after testing.

Condition C：100g’s(0.98N), 6ms

Half sine, 12.3ft / s

14 Vibration

5g's(0.049N) for 20 minutes,

12cycles each of 3

orientations

Test from 10-2000Hz.

15 Resistance

No-heating

Pre-heating：150C + / -10 deg C, 60s to 90s

to Soldering Heat

Solder temperature

260C+ / -5 deg C

Immersion time 10s

Meet Table A after testing.

17 ESD

Per AEC-Q200-002

ESD Rank：Refer to Item 3. Rating.

Meet Table A after testing.

18 Solderbility

Per J-STD-002

Method b：Not Applicable

95% of the terminations is to be soldered.

(Except exposed wire)

19 Electrical

Measured : Inductance

Per UL-94

No defects

Characterization

20 Flammability

21 Board Flex

Not Applicable

Epoxy-PCB(1.6mm)

Deflection 2mm(min)

Holding time 60s

Meet Table B after testing.

Table B

Appearance

No damage

DC resistance

change

Within ±10％

22 Terminal Strength

Per AEC-Q200-006

A force of 17.7N

for 60s

Murata Deviation Request：10N / 5s

No defect

7. Specification of Packaging

7.1 Appearance and Dimensions of paper tape (8mm-wide)

2.0±0.05

1.5±⁰₀^.1

4.0±0.1

1.75±0.1

4.0±0.1

1.0±0.05

(in mm)

Direction of feed

1.1 max.

MURATA MFG.CO., LTD

SpecNo.JELF243A-9116B-01

P.6/11

Reference Only

7.2 Specification of Taping

(1) Packing quantity (standard quantity)

4,000 pcs. / reel

(2) Packing Method

Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Base tape and Top tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,

and are not continuous. The Specified quantity per reel is kept.

7.3 Pull Strength

Top tape

5N min.

Bottom tape

7.4 Peeling off force of cover tape

Top tape

165 to 180 degree

Bottom tape

Speed of Peeling off

300mm/min

0.1N to 0.6N

(minimum value is typical)

Peeling off force

Base tape

7.5 Dimensions of Leader-tape,Trailer and Reel

There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows.

Trailer

Leader

160 min.

2.0±0.5

Label

190 min.

Empty tape Cover tape

210 min.

13.0±0.2

60⁺¹

Direction of feed

21.0±0.8

-0

9.0

(in mm)

13.0±1.4

180

-3

7.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･

∗1) <Expression of Inspection No.>

□□OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date

First digit

: Year / Last digit of year

Second digit

: Month / Jan. to Sep. → 1 to 7, Oct. to Dec. → O, N, D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS marking »

ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

7.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,

Quantity, etc ･･･

MURATA MFG.CO., LTD

SpecNo.JELF243A-9116B-01

P.7/11

Reference Only

7.8 Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

Label

186

∗ Above Outer Case size is typical. It depends on a quantity

of an order.

Caution

8.1 Caution(Rating)

Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short /

open circuit of the product or falling off the product may be occurred.

8.2 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused

by the abnormal function or the failure of our product.

8.3 Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster prevention / crime prevention equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

(9) Data-processing equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

9. Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

9.1 Land pattern designing

Recommended land patterns for reflow soldering are as follows:

These have been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Chip Coil

Land

Solder resist

0.6 to 0.8

1.9 to 2.0

0.7 to 1.0

(in mm)

9.2 Flux, Solder

・Use rosin-based flux.

Includes middle activator equivalent to 0.06(wt)% to 0.1(wt)% Chlorine.

Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

Don’t use water-soluble flux.

・Use Sn-3.0Ag-0.5Cu solder.

・Standard thickness of solder paste : 100μm to 150μm.

MURATA MFG.CO., LTD

SpecNo.JELF243A-9116B-01

P.8/11

Reference Only

9.3 Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited

to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of

product quality.

・Reflow soldering profile

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard Profile

Limit Profile

Pre-heating

150°C～180°C 、90s±30s

Heating

above 220°C､30s～60s

245°C±3°C

above 230°C､60s max.

260°C,10s

Peak temperature

Cycle of reflow

2 times

9.4 Reworking with soldering iron

The following conditions must be strictly followed when using a soldering iron.

Pre-heating

150°C,1 min

350°C max.

80W max.

φ3mm max.

3(+1,-0)s

Tip temperature

Soldering iron output

Tip diameter

Soldering time

Time

2 times

Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products

due to the thermal shock.

9.5 Solder Volume

・Solder shall be used not to be exceed the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

Upper Limit

Recommendable(t)

1/3T≦t≦T

T：thickness of product

MURATA MFG.CO., LTD

SpecNo.JELF243A-9116B-01

P.9/11

Reference Only

9.6 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length:a＜b) to the mechanical

stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures

Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface.

D ∗1

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from

the board separation surface.

Seam

∗1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

Slit

Length:a b

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

Screw Hole

Recommended

9.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at

the mounted products and P.C.B.

Power：20 W / l max.

Frequency：28kHz to 40kHz

Time：5 min max.

(3) Cleaner

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in

order to remove the cleaner.

(5) Other cleaning

Please contact us.

9.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some

operating condition may cause corrosion of wire of coil, leading to open circuit.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on

your board.

9.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched

to the winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

MURATA MFG.CO., LTD

SpecNo.JELF243A-9116B-01

9.10 Notice of product handling at mounting

P.10/11

Reference Only

In some mounting machines,when picking up components support pin pushes up the components from the bottom of base

tape. In this case, please remove the support pin. The support pin may damage the components and break wire.

In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser recognition.

(There is no problem with the permeation and reflection type.)

9.11 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the

substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to

the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

9.12 Storage and Handing Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature ： -10°C to 40°C

Humidity

： 15% to 85% relative humidity No rapid change on temperature and humidity

・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of

electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking

of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

10.

Note

(1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted

to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG.CO., LTD

SpecNo.JELF243A-9116B-01

P.11/11

Reference Only

(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.

V₁

I₁

V₂

I ₂

Test Head

Test fixture

Product

(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.

V₁

I ₁

V₂

I ₂

Zm=

，

Zx=

(3) Thus,the relation between Zx and Zm is following;

Zm-β

where, α= D / A =1

Zx= α

1-ZmΓ

β= B / D =Zsm-(1-Yom Zsm)Zss

Γ= C / A =Yom

Zsm： measured impedance of short chip

Zss ： residual impedance of short chip (0.771nH)

Yom： measured admittance when opening the fixture

(4) Lx and Qx shall be calculated with the following equation.

Im(Zx)

Re(Zx)

Lx： Inductance of chip coil

Qx： Q of chip coil

Lx=

Qx =

2πf

f ： Measuring frequency

MURATA MFG.CO., LTD

LQW18AN22NG0ZD [MURATA]

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