LQW18CN15NJ0Z# [MURATA]

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型号：	LQW18CN15NJ0Z#
厂家：	muRata
描述：
文件：	总10页 (文件大小：521K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec No.: JELF243A_9145C-01

P1/10

CHIP COILS (CHIP INDUCTORS) LQW18CN□□□□0Z□

Murata Standard Reference Specification [AEC-Q200]

1. Scope

This reference specification applies to chip coils (chip inductors) LQW18CN_0Z series for automotive electronics based on

AEC-Q200 except for power trains and safeties.

2. Part Numbering

(Ex.)

4N9

Product Structure Dimension Application Category Inductance Tolerance Performance

Category

Packaging

(L × W)

and

characteristic

Z: Automotive D: taping

*B: bulk

*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).

3. Part Number and Rating

Operating temperature range

Storage temperature range

-40°C to +125°C

Inductance

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Rated

current

(mA)^*1

ESD

Rank

5A: 8 kV

Customer

Murata

Nominal

value

Part number

Tolerance

(nH)

LQW18CN4N9D0ZD

LQW18CN15NJ0ZD

LQW18CN33NJ0ZD

LQW18CN55NJ0ZD

LQW18CN85NJ0ZD

LQW18CNR10K0ZD

LQW18CNR12J0ZD

LQW18CNR16J0ZD

LQW18CNR21J0ZD

LQW18CNR27J0ZD

LQW18CNR33J0ZD

LQW18CNR39J0ZD

LQW18CNR47J0ZD

LQW18CNR56J0ZD

LQW18CNR65J0ZD

4.9

D: ±0.5 nH

J: ±5%

K: ±10%

J: ±5%

0.015

0.025

0.035

0.045

0.060

0.10

2300

2000

1800

1600

1380

1260

1200

900

2600

2200

1700

1500

1400

1000

1100

1000

800

100

120

160

210

270

330

390

470

560

650

0.085

0.10

0.15

720

0.16

660

750

0.25

600

630

0.28

570

620

0.45

555

500

0.48

540

450

0.52

510

430

*1 As shown in the diagram below, derating is applied to the rated current based on the operating temperature.

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

MURATA MFG CO., LTD

Spec No.: JELF243A_9145C-01

P2/10

5. Appearance and Dimensions

Unit mass (typical value): 0.004 g

6. Marking

No marking.

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

7.1 Inductance

Measuring equipment: Keysight E4991A or the

equivalent

Measuring frequency:

Inductance: 10 MHz

SRF: Frequency when L value is 0 μH

Measuring conditions:

Measurement signal level: Approx. 0 dBm

Measurement terminal distance: 1.0 mm

Electrical length: 10.0 mm

Measuring fixture: Keysight 16197A

Position the chip coil under test as shown in the

measuring example below and connect it to the

electrode by applying weight.

Measurement example:

7.2 Self-resonant

frequency

Meet chapter 3 ratings.

Measuring method: see "Electrical performance:

Measuring method for inductance/Q" in the chapter

"15. Appendix".

7.3 DC resistance

7.4 Rated current

Meet chapter 3 ratings.

Measuring equipment: digital multimeter

Product temperature rise: 40°C max.

Apply the rated current specified in chapter 3.

MURATA MFG CO., LTD

Spec No.: JELF243A_9145C-01

P3/10

8. AEC-Q200 Requirement

8.1 Performance [based on table 5 for magnetics (inductors/transformer) AEC-Q200 Rev. D issued June 1,

2010]

AEC-Q200

Murata specification/deviation

No.

Stress

Test method

High

1000 h at 125°C

Set for 24 h at room condition, then

measured.

Meet table A after testing.

Table A

temperature

exposure

Appearance

No damage

Within ±5%

Inductance change rate

Temperature

cycling

1000 cycles

-40°C to +125°C

Set for 24 h at room condition, then

measured.

Meet table A after testing.

Biased humidity 1000 h at 85°C, 85% (RH). Unpowered.

Set for 24 h at room condition, then

measured.

Operational life Apply 125°C 1000 h

Set for 24 h at room condition, then

measured.

Meet table A after testing.

Apply derating of rated current.

External visual Visual inspection

No abnormalities

No defects

10 Physical

dimension

Meet chapter 5, "Appearance and

Dimensions".

12 Resistance to

solvents

Per MIL-STD-202

Method 215

Not applicable

13 Mechanical

shock

Per MIL-STD-202

Method 213

Meet table A after testing.

Condition C:

100 g’s (0.98 N), 6 ms, half sine, 12.3 ft/s

14 Vibration

5 g's (0.049 N) for 20 min, 12 cycles each Meet table A after testing.

of 3 orientations

Test from 10 Hz to 2000 Hz

15 Resistance to

No-heating

Pre-heating: 150°C±10°C, 60 s to 90 s

soldering heat Solder temperature

260°C±5°C

270°C±5°C

Immersion time 5 s

Meet table A after testing.

Immersion time 10 s

17 ESD

Per AEC-Q200-002

ESD rank: Refer to chapter 3 ratings.

Meet table A after testing.

18 Solderbility

Per J-STD-002

Method b: not applicable

95% of the terminations is to be soldered (except exposed

wire).

19 Electrical

Measured: inductance

Per UL-94

No defects

characterization

20 Flammability

21 Board flex

Not applicable

Epoxy-PCB (1.6 mm)

Deflection 2 mm (min.)

Holding time 60 s

Meet table A after testing.

22 Terminal

strength

Per AEC-Q200-006

A force of 17.7 N for 60 s

Appearance: no damage

Murata deviation request: 8 N for 5 s

MURATA MFG CO., LTD

Spec No.: JELF243A_9145C-01

P4/10

9. Specification of Packaging

9.1 Appearance and dimensions of tape (8 mm width/paper tape)

1.0±0.06

1.8±0.06

1.1 max.

(in mm)

9.2 Taping specifications

Packing quantity

4000 pcs/reel

(Standard quantity)

Packing method

The products are placed in embossed cavities of a base tape and sealed by a top tape and a bottom

tape.

Feed hole position

Joint

The feed holes on the base tape are on the right side when the top tape is pulled toward the user.

The base tape and the top tape are seamless.

Number of missing

products

Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

9.3 Break down force of tape

Break down force of top tape

5 N min.

Break down force of bottom tape

9.4 Peeling off force of top tape

Speed of peeling off

300 mm/min

Peeling off force

0.1 N to 0.6 N (The lower limit is for typical value.)

Top tape

165 to 180 degree

Bottom tape

Base tape

9.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

MURATA MFG CO., LTD

Spec No.: JELF243A_9145C-01

P5/10

9.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

()

(2) Murata classification number

(1)

(2)

9.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

9.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

186

* Above outer box size is typical. It depends on a

quantity of an order.

10.

Caution

10.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Disaster/crime prevention equipment

(7) Traffic signal equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

(8) Transportation equipment (trains, ships, etc.)

(9) Data-processing equipment

(10) Applications of similar complexity and/or reliability requirements

to the applications listed in the above

10.2 Precautions on rating

Do not use the products in excess of their rated current. Doing so may cause the product to generate heat, resulting in short

circuit between wires, wire breakage, or melted solder, which may cause dropping of parts.

10.3 Fail-safe

Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the

abnormal function or the failure of our product.

10.4 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,

etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated

corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of

product electrode, etc. We will not bear any responsibility for use under these environments.

MURATA MFG CO., LTD

Spec No.: JELF243A_9145C-01

P6/10

11. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other

mounting method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and

the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

11.1 Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering.

The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land

dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional

shift. If you use other land pattern, consider it adequately.

(in mm)

11.2 Flux and solder used

Flux

• Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

11.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

100°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product

quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

MURATA MFG CO., LTD

Spec No.: JELF243A_9145C-01

P7/10

11.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

11.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

11.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

MURATA MFG CO., LTD

Spec No.: JELF243A_9145C-01

P8/10

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

11.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

11.8 Cleaning

The product shall be cleaned under the following conditions.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in

mounted products and the PCB.

Item

Power

Requirement

20 W/L max.

Time

5 min max.

Frequency

(3) Cleaner

28 kHz to 40 kHz

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water

adequately and completely dry it so that no cleaner is left.

* For other cleaning, consult our technical department.

11.9 Storage and transportation

Storage period

Use the product within 12 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.

The recommended temperature range is -10°C to +40°C. The recommended relative humidity

range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the

electrode, resulting in poor solderability or corrosion of the coil wire of the product.

• Do not keep products in bulk packaging. Doing so may cause collision between the products or

between the products and other products, resulting in core chipping or wire breakage.

• Do not place the products directly on the floor; they should be placed on a palette so that they are

not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

MURATA MFG CO., LTD

Spec No.: JELF243A_9145C-01

P9/10

11.10 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some

operating condition may cause corrosion of wire of coil, leading to wire breakage.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your

board.

11.11 Handling of product

• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the

winding portion to prevent the breaking of wire.

• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

11.12 Handling with mounting equipment

• With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape

when the product is sucked with the pick-up nozzle.

When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.

• In some cases, the laser recognition function of the mounting equipment may not recognize this product correctly.

Please contact us when using laser recognition. (There is no problem with the permeation and reflection type.)

12.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering.

13. Appendix

Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is

included in the rating table.)

Perform measurement using the method described below. (Perform correction for the error deriving from the measuring

terminal.)

(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole

terminal as shown in the figure below.

(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using

the respective current and voltage for input/output.

V₁

I₁

V₂

I₂

Zm=

Zx=

(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.

Here,

α = D/A = 1

β = B/D = Zsm - (1 - Yom Zsm) Zss

Zm-β

Γ = C/A = Yom

Zx=α

1-ZmΓ

Zsm: measured impedance of short chip

Zss: residual impedance of short chip (0.771 nH)

Yom: measured admittance when measuring terminal is open

MURATA MFG CO., LTD

Spec No.: JELF243A_9145C-01

P10/10

(4) Calculate inductance Lx and Qx using the equations shown below.

Im (Zx)

Lx: inductance of chip coil

Qx: Q of chip coil

Lx=

2πf

Im (Zx)

Re (Zx)

Qx=

f: measuring frequency

MURATA MFG CO., LTD

LQW18CN15NJ0Z# [MURATA]

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