LQW2BAS6N8J0C# [MURATA]

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型号：	LQW2BAS6N8J0C#
厂家：	muRata
描述：
文件：	总13页 (文件大小：368K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec No.:JELF243A-0181-01

P1/13

Chip Coil (Chip Inductors) LQW2BAS□□□□0C□ REFERENCE SPECIFICATION

1. Scope

This reference specification applies to chip coils (chip inductors) LQW2BAS□□□□0C□ series for general electronic

equipment.

2. Part Numbering

(Ex.)

2N7

Product ID

Type

Dimension Application and Inductance Tolerance Category

(L × W) characteristic

Packaging

L: taping

*B: bulk

*B: Bulk packing is also available.(The product sealed on the carrier tape is stored in a plastic bag.)

3. Part Number and Rating

Operating temperature range

Storage temperature range

-40°C to +85°C

Inductance

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Rated

current

(mA)

Customer

Murata

(Min.)

Nominal

value

Part number

Tolerance

(nH)

LQW2BAS2N7J0CL

LQW2BAS2N8J0CL

LQW2BAS3N0J0CL

LQW2BAS5N6J0CL

LQW2BAS6N0J0CL

LQW2BAS6N8J0CL

LQW2BAS7N5J0CL

LQW2BAS8N2G0CL

LQW2BAS8N2J0CL

LQW2BAS10NG0CL

LQW2BAS10NJ0CL

LQW2BAS12NG0CL

LQW2BAS12NJ0CL

LQW2BAS15NG0CL

LQW2BAS15NJ0CL

LQW2BAS18NG0CL

LQW2BAS18NJ0CL

LQW2BAS22NG0CL

LQW2BAS22NJ0CL

LQW2BAS24NG0CL

LQW2BAS24NJ0CL

LQW2BAS27NG0CL

LQW2BAS27NJ0CL

LQW2BAS33NG0CL

LQW2BAS33NJ0CL

LQW2BAS36NG0CL

LQW2BAS36NJ0CL

LQW2BAS39NG0CL

LQW2BAS39NJ0CL

2.7

2.8

3.0

5.6

6.0

6.8

7.5

8.2

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

0.03

0.06

0.08

0.03

0.11

0.14

0.12

0.10

0.15

0.17

0.20

0.22

0.25

0.27

0.29

15000

12200

5900

4500

5600

4800

4400

4300

4000

3200

3100

2600

2400

2580

2150

1900

2000

910

800

600

500

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P2/13

Rated

current

(mA)

Inductance

Nominal

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Customer

Part number

Murata

Part number

(Min.)

value

(nH)

Tolerance

LQW2BAS43NG0CL

LQW2BAS43NJ0CL

LQW2BAS47NG0CL

LQW2BAS47NJ0CL

LQW2BAS56NG0CL

LQW2BAS56NJ0CL

LQW2BAS68NG0CL

LQW2BAS68NJ0CL

LQW2BAS82NG0CL

LQW2BAS82NJ0CL

LQW2BAS91NG0CL

LQW2BAS91NJ0CL

LQW2BASR10G0CL

LQW2BASR10J0CL

LQW2BASR11G0CL

LQW2BASR11J0CL

LQW2BASR12G0CL

LQW2BASR12J0CL

LQW2BASR15G0CL

LQW2BASR15J0CL

LQW2BASR18G0CL

LQW2BASR18J0CL

LQW2BASR22G0CL

LQW2BASR22J0CL

LQW2BASR24G0CL

LQW2BASR24J0CL

LQW2BASR27G0CL

LQW2BASR27J0CL

LQW2BASR33G0CL

LQW2BASR33J0CL

LQW2BASR39J0CL

LQW2BASR47J0CL

LQW2BASR50J0CL

LQW2BASR56J0CL

LQW2BASR68J0CL

LQW2BASR82J0CL

LQW2BAS1R0J0CL

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

±2%

±5%

0.34

0.31

0.34

0.38

0.42

0.48

0.46

0.48

0.51

0.56

0.64

0.70

1.00

1.40

1.50

1.76

3.20

1.90

2.20

2.35

2.40

1800

1700

1600

1500

1330

1250

1100

920

500

400

350

310

290

250

200

230

190

180

170

100

110

120

150

180

220

240

270

330

390

470

500

560

680

820

1000

920

820

770

730

650

600

300

585

270

250

230

200

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P3/13

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

5. Appearance and Dimensions

■ Equivalent Circuit

■ Unit mass (typical value): 0.014 g

6. Marking

No marking.

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P4/13

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

7.1 Inductance / Q

Measuring equipment: Keysight E4991A or the

equivalent

Measuring frequency:

250 MHz 2.7 nH to

39 nH

68 nH

82 nH to 120 nH

200 MHz

150 MHz

43 nH to

Inductance

100 MHz 150 nH to 390 nH

50 MHz 470 nH to 500 nH

25 MHz 560 nH to 1000 nH

1500 MHz 2.7 nH to

1000 MHz 5.6 nH to

3.0 nH

8.2 nH

500 MHz

10 nH to 100 nH

250 MHz 110 nH to 390 nH

100 MHz 470 nH to

50 MHz 500 nH to 1000 nH

Measuring Condition:

Measurement signal level: Approx. 0dBm

Measurement terminal distance：1.5 mm

Electrical length: 10.0 mm

Measuring Fixture: KEYSIGHT 16197A

Position the chip coil under test as shown in the

measuring example below and connect it to the

electrode by applying weight.

Measurement example:

Measuring method: see "Electrical performance:

Measuring method for inductance/Q" in the chapter

"Appendix".

7.2 DC resistance

Meet chapter 3 ratings.

Measuring equipment: digital multimeter.

7.3 Self-resonant

frequency

Measuring equipment: Keysight N5230A or the

equivalent

7.4 Rated current

Temperature rise caused by self-

generated heat shall be limited to 40°C

max.

Apply the rated current specified in chapter 3.

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P5/13

8. Mechanical Performance

The product is soldered on a substrate for test.(Except Solderability)

(Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of being

specified special condition.)

No.

Item

Specification

Test method

8.1 Shear test

No significant mechanical damage or no Applying force: 10 N

sign of electrode peeling off shall be

observed.

Holding time: 5 s

Force application direction:

8.2 Bending test

No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40

sign of electrode peeling off shall be

observed.

mm × 1.6 mm)

Pressurizing speed: 1.0 mm/s

Pressure jig: R230

Amount of bending: 2 mm

Holding time: 20 s

8.3 Vibration

Appearance shall have no significant

mechanical damage.

Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz/20

min

Amplitude: total amplitude of 3.0 mm or acceleration

amplitude of 196 m/s2, whichever is smaller

Test time: 3 directions perpendicular to each other, 2

h for each direction (6 h in total)

8.4 Solderability

90% or more of the outer electrode shall Flux: Ethanol solution of rosin, 25(wt)%

be covered with new solder seamlessly. Pre-heating: 150°C/60 s

(except exposed wire)

Solder: Sn-3.0Ag-0.5Cu solder

Solder temperature: 245°C±3°C

Immersion time: 3 s

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P6/13

9. Environmental Performance

The product is soldered on a substrate for test.

(Test shall be done using Flux, Solder and Soldering condition which are specified in chapter 12 except the case of being

specified special condition.)

No.

Item

Specification

Test method

9.1 Heat life

Appearance: No significant mechanical Temperature: 85°C±2°C

damage shall be observed.

Applying Current: Rated Current

Inductance change rate: within ±10%

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left for 4 hours to 48 hours at room

temperature.

9.2 Cold resistance

9.3 Humidity

Appearance: No significant mechanical Temperature: -40°C±2°C

damage shall be observed.

Inductance change rate: within ±10%

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left for 4 hours to 48 hours at room

temperature.

Appearance: No significant mechanical Temperature: 40°C±2°C

damage shall be observed.

Inductance change rate: within ±10%

Humidity: 90% to 95% (RH)

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left for 4 hours to 48 hours at room

temperature.

9.4 Temperature cycle Appearance: No significant mechanical Single cycle conditions:

damage shall be observed.

Step 1: -40°C (+0°C, -3°C), 30 min (+3 min, -0 min)

Inductance change rate: within ±10%

Step 2: ordinary temperature, 3 min max.

Step 3: +85°C (+3°C, -0°C), 30 min (+3 min, -0 min)

Step 4: ordinary temperature, 3 min max.

Number of testing: 100 cycles

Post-treatment: left for 4 hours to 48 hours at room

temperature.

10. Specification of Packaging

10.1 Appearance and dimensions of tape (8 mm width/plastic tape)

1.8±0.1

2.3±0.1

1.65±0.1

(0.25)

(in mm)

* The dimensions of the cavity are measured at its bottom.

10.2 Taping specifications

Packing quantity

2000 pcs/reel

(Standard quantity)

Packing method

Feed hole position

Joint

The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and

bottom tape when the cavities of the carrier tape are punched type).

The feed holes on the carrier tape are on the right side when the cover tape (top tape when the

cavities of the carrier tape are punched type) is pulled toward the user.

The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type)

are seamless.

Number of missing

products

Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater,

and are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

Cover tape (or top tape)

5 N min.

Bottom tape (only when the cavities of the carrier tape are punched type)

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P7/13

10.4 Peeling off force of tape

Speed of peeling off

300 mm/min

0.1 N to 0.7 N (The lower limit is for typical value.)

Peeling off force

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

10.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

186

* Above outer box size is typical. It depends on a

quantity of an order.

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P8/13

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control equipment

(5) Medical equipment

(8) Disaster/crime prevention equipment

(9) Data-processing equipment

(10) Applications of similar complexity and/or reliability requirements

to the applications listed in the above

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other

mounting method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and

the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

12.1 Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering.

0.76

2.8

1.78

(in mm)

land pattern

solder resist

12.2 Flux and solder used

Flux

• Use a rosin-based flux.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P9/13

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

100°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product

quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P10/13

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

12.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

12.8 Cleaning

Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder

joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this

product.

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P11/13

12.9 Storage and transportation

Storage period

Use the product within 12 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and

humidity. The recommended temperature range is -10°C to +40°C. The recommended relative

humidity range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the

poor solderability.

• Do not place the products directly on the floor; they should be placed on a palette so that they

are not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

• Do not keep products in bulk packaging. Bulk storage could result in collisions between the

products or between the products and other parts, resulting in chipping or wire breakage.

• Avoid storing the product by itself bare (i.e. exposed directly to air).

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

12.10 Resin coating (including moisture-proof coating)

When the product is coated/molded with resin, its electrical characteristics may change.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc.

Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading

to wire breakage.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your

board.

12.11 Mounting conditions

Check the mounting condition before using.

Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,

misalignment, or damage to the product.

12.12 Operating environment

Do not use this product under the following environmental conditions as it may cause deterioration of product quality.

(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.

(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)

(2) In the atmosphere where liquid such as organic solvent, may splash on the products.

(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.

12.13 Mounting density

If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.

If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,

resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that

the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating

temperature for the product.

12.14 Handling of product

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to the

winding portion and electrode to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

13.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P12/13

Appendix

Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is

included in the rating table.)

Perform measurement using the method described below. (Perform correction to ensure that the inductance value is compatible

with inductors of other manufacturers.)

(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole

terminal as shown in the figure below.

(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using

the respective current and voltage for input/output.

V₁

I₁

V₂

I₂

Zm=

Zx=

(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.

Here,

α = D/A = 1

β = B/D = Zsm - (1 - Yom Zsm) Zss

Zm-β

1-ZmΓ

Γ = C/A = Yom

Zx=α

Zsm: measured impedance when measuring terminal is shorted

Zss: residual impedance of short chip (= Equivalent series inductance X)

Yom: measured admittance when measuring terminal is open

Important

In consideration of compatibility with other venders' products, Zss is defined as the correction value to fit

nominal inductance of other venders' products.

When calibrating the measurement, please input X value instead of the equivalent series inductance (ShortL)

for each L value.

Perform measurement of Q using the residual impedance 0.771 nH obtained through our conventional standard

measurement method.

(4) Calculate inductance Lx and Qx using the equations shown below.

Im (Zx)

Lx: inductance of chip coil

Qx: Q of chip coil

Lx=

2πf

Im (Zx)

Qx=

f: measuring frequency

Re (Zx)

MURATA MFG CO., LTD

Spec No.:JELF243A-0181-01

P13/13

Table: Equivalent series inductance to fit nominal inductance of other venders' products

Inductance

X (nH)

Equivalent series

Inductance

Part number

Measuring frequency

(MHz)

LQW2BAS2N7_0C

LQW2BAS2N8_0C

LQW2BAS3N0_0C

LQW2BAS5N6_0C

LQW2BAS6N0_0C

LQW2BAS6N8_0C

LQW2BAS7N5_0C

LQW2BAS8N2_0C

LQW2BAS10N_0C

LQW2BAS12N_0C

LQW2BAS15N_0C

LQW2BAS18N_0C

LQW2BAS22N_0C

LQW2BAS24N_0C

LQW2BAS27N_0C

LQW2BAS33N_0C

LQW2BAS36N_0C

LQW2BAS39N_0C

LQW2BAS43N_0C

LQW2BAS47N_0C

LQW2BAS56N_0C

LQW2BAS68N_0C

LQW2BAS82N_0C

LQW2BAS91N_0C

LQW2BASR10_0C

LQW2BASR11_0C

LQW2BASR12_0C

LQW2BASR15_0C

LQW2BASR18_0C

LQW2BASR22_0C

LQW2BASR24_0C

LQW2BASR27_0C

LQW2BASR33_0C

LQW2BASR39_0C

LQW2BASR47_0C

LQW2BASR50_0C

LQW2BASR56_0C

LQW2BASR68_0C

LQW2BASR82_0C

LQW2BAS1R0_0C

0.121

0.171

0.131

-0.009

0.031

0.301

-0.299

0.271

-0.229

0.371

0.051

-0.029

0.491

-0.389

0.931

0.481

0.531

0.771

-0.689

1.091

0.331

0.811

-0.839

-1.339

0.171

1.371

-1.629

-0.029

4.071

0.771

3.071

-1.429

4.071

0.971

-8.829

-2.529

-8.229

-2.229

-8.029

-6.329

250

200

150

100

MURATA MFG CO., LTD

LQW2BAS6N8J0C# [MURATA]

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