LQW2UASR10F00# [MURATA]

;


型号：	LQW2UASR10F00#
厂家：	muRata
描述：
文件：	总13页 (文件大小：578K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Spec No.: JELF243A_0085L-01

P1/13

CHIP COILS (CHIP INDUCTORS) LQW2UAS□□□□00□ REFERENCE SPECIFICATION

1. Scope

This reference specification applies to chip coils (chip inductors) LQW2UAS_00 series for general electronic equipment.

2. Part Numbering

(Ex.)

12N

Product Structure Dimension Application Category Inductance Tolerance Performance Electrode Packaging

(L × W)

and

characteristic

specification L: taping

*B: bulk

*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).

3. Part Number and Rating

Operating temperature range

Storage temperature range

-55°C to +125°C

Inductance

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Rated

current

(mA)

Customer

Murata

(Min.)

Nominal

value

Part number

Tolerance

(nH)

LQW2UAS12NG00L

LQW2UAS12NJ00L

LQW2UAS18NG00L

LQW2UAS18NJ00L

LQW2UAS22NF00L

LQW2UAS22NG00L

LQW2UAS22NJ00L

LQW2UAS27NG00L

LQW2UAS27NJ00L

LQW2UAS33NF00L

LQW2UAS33NG00L

LQW2UAS33NJ00L

LQW2UAS39NF00L

LQW2UAS39NG00L

LQW2UAS39NJ00L

LQW2UAS47NF00L

LQW2UAS47NG00L

LQW2UAS47NJ00L

LQW2UAS56NF00L

LQW2UAS56NG00L

LQW2UAS56NJ00L

LQW2UAS68NF00L

LQW2UAS68NG00L

LQW2UAS68NJ00L

LQW2UAS82NF00L

LQW2UAS82NG00L

LQW2UAS82NJ00L

LQW2UASR10F00L

LQW2UASR10G00L

LQW2UASR10J00L

100

G: ±2%

J: ±5%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

0.09

0.11

0.12

0.13

0.14

0.15

0.16

0.18

0.20

0.22

0.56

3300

2500

2400

1600

1500

1300

1000

650

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

Customer

P2/13

Rated

current

(mA)

Inductance

Nominal

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Murata

(Min.)

Part number

value

(nH)

Tolerance

LQW2UASR12F00L

LQW2UASR12G00L

LQW2UASR12J00L

LQW2UASR15F00L

LQW2UASR15G00L

LQW2UASR15J00L

LQW2UASR18F00L

LQW2UASR18G00L

LQW2UASR18J00L

LQW2UASR22F00L

LQW2UASR22G00L

LQW2UASR22J00L

LQW2UASR27F00L

LQW2UASR27G00L

LQW2UASR27J00L

LQW2UASR33F00L

LQW2UASR33G00L

LQW2UASR33J00L

LQW2UASR39F00L

LQW2UASR39G00L

LQW2UASR39J00L

LQW2UASR47F00L

LQW2UASR47G00L

LQW2UASR47J00L

LQW2UASR56F00L

LQW2UASR56G00L

LQW2UASR56J00L

LQW2UASR62F00L

LQW2UASR62G00L

LQW2UASR62J00L

LQW2UASR68F00L

LQW2UASR68G00L

LQW2UASR68J00L

LQW2UASR75F00L

LQW2UASR75G00L

LQW2UASR75J00L

LQW2UASR82F00L

LQW2UASR82G00L

LQW2UASR82J00L

LQW2UASR91F00L

LQW2UASR91G00L

LQW2UASR91J00L

LQW2UAS1R0F00L

LQW2UAS1R0G00L

LQW2UAS1R0J00L

LQW2UAS1R2J00L

120

150

180

220

270

330

390

470

560

620

680

750

820

910

1000

1200

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

F: ±1%

G: ±2%

J: ±5%

0.63

0.70

0.77

0.84

0.91

1.05

1.12

1.19

1.33

1.40

1.47

1.54

1.61

1.68

1.75

2.0

950

850

750

700

600

570

500

450

415

375

360

350

320

290

210

650

580

620

500

450

470

400

300

400

360

400

380

370

310

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

Customer

P3/13

Rated

current

(mA)

Inductance

Nominal

resistance

(Ω max.)

Self-resonant

frequency

(MHz min.)

Murata

(Min.)

Part number

value

(nH)

Tolerance

LQW2UAS1R5J00L

LQW2UAS1R8J00L

LQW2UAS2R2J00L

LQW2UAS2R7J00L

LQW2UAS3R3J00L

LQW2UAS3R9J00L

LQW2UAS4R7J00L

1500

1800

2200

2700

3300

3900

4700

J: ±5%

2.3

2.6

2.8

3.2

3.4

3.6

4.0

120

140

130

110

330

300

280

290

260

4. Testing Conditions

Unless otherwise specified

Temperature: ordinary temperature (15°C to 35°C)

Humidity: ordinary humidity [25% to 85% (RH)]

In case of doubt

Temperature: 20°C±2°C

Humidity: 60% to 70% (RH)

Atmospheric pressure: 86 kPa to 106 kPa

5. Appearance and Dimensions

Unit mass (typical value): 0.039 g

6. Marking

No marking.

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

P4/13

7. Electrical Performance

No.

Item

Specification

Meet chapter 3 ratings.

Test method

7.1 Inductance

Measuring equipment: Keysight E4991A or the

equivalent

Measuring frequency:

Inductance

50 MHz 12 nH to 82 nH

25 MHz 100 nH to 1000 nH

7.9 MHz 1200 nH to 4700 nH

500 MHz 12 nH to 15 nH

350 MHz 18 nH to 120 nH

100 MHz 150 nH to 820 nH

50 MHz 910 nH to 2200 nH

25 MHz 2700 nH to 4700 nH

Measuring conditions:

Measurement signal level: Approx. 0 dBm

Measurement terminal distance: 1.5 mm

Electrical length: 10.0 mm

Weight: Approx. 1 N to 3 N

Measuring fixture: Keysight 16197A

Position the chip coil under test as shown in the

measuring example below and connect it to the

electrode by applying weight.

7.2

Meet chapter 3 ratings.

Measurement example:

Measuring method: see "Electrical performance:

Measuring method for inductance/Q" in the chapter

"16. Appendix".

7.3 DC resistance

Meet chapter 3 ratings.

Measuring equipment: digital multimeter

7.4 Self-resonant

frequency

Measuring equipment: Keysight N5230A or the

equivalent

7.5 Rated current

Product temperature rise: 40°C max.

Apply the rated current specified in chapter 3.

8. Mechanical Performance

No.

Item

Specification

Test method

8.1 Shear test

No significant mechanical damage or no Test substrate: glass-epoxy substrate

sign of electrode peeling off shall be

observed.

Force application direction:

Applying force: 10 N

Holding time: 5 s±1 s

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

No. Item

P5/13

Specification

Test method

8.2 Bending test

No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40

sign of electrode peeling off shall be

observed.

mm × 1.0 mm)

Pressurizing speed: 1 mm/s

Deflection: 3 mm

Holding time: 5 s

8.3 Vibration

Appearance shall have no significant

mechanical damage.

Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for

approx. 15 min

Total amplitude: total amplitude of 3.0 mm or

acceleration amplitude of 196 m/s², whichever is

smaller

Test time: 3 directions perpendicular to each other, 2 h

for each direction (6 h in total)

8.4 Solderability

90% or more of the outer electrode shall Flux: immersed in ethanol solution [including an

be covered with new solder seamlessly. activator with a chlorine conversion value of 0.06(wt)%]

with a rosin content of 25(wt)% for 5 s to 10 s.

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 240°C±5°C

Immersion time: 3 s±1 s

8.5 Resistance to

soldering heat

Appearance: No significant mechanical

damage shall be observed.

Inductance change rate: within ±5%

Flux: immersed in ethanol solution [including an

activator with a chlorine conversion value of 0.06(wt)%]

with a rosin content of 25(wt)% for 5 s to 10 s.

Solder: Sn-3.0Ag-0.5Cu solder

Pre-heating: 150°C±10°C/60 s to 90 s

Solder temperature: 270°C±5°C

Immersion time: 10 s±1 s

Post-treatment: left at a room condition for 24 h±2 h

9. Environmental Performance

The product is soldered on a substrate for test.

No.

Item

Specification

Test method

9.1 Heat resistance

9.2 Cold resistance

9.3 Humidity

Appearance: No significant mechanical Temperature: 125°C±2°C

damage shall be observed.

Test time: 1000 h (+48 h, -0 h)

Inductance change rate: within ±5%

Q change rate: within ±20%

Post-treatment: left at a room condition for 24 h±2 h

Appearance: No significant mechanical Temperature: -55°C±2°C

damage shall be observed.

Test time: 1000 h (+48 h, -0 h)

Inductance change rate: within ±5%

Q change rate: within ±20%

Post-treatment: left at a room condition for 24 h±2 h

Appearance: No significant mechanical Temperature: 85°C±2°C

damage shall be observed.

Humidity: 85% (RH)

Inductance change rate: within ±5%

Q change rate: within ±20%

Test time: 1000 h (+48 h, -0 h)

Post-treatment: left at a room condition for 24 h±2 h

9.4 Temperature cycle Appearance: No significant mechanical Single cycle conditions:

damage shall be observed.

Step 1: -55°C±2°C/30 min±3 min

Inductance change rate: within ±5%

Q change rate: within ±20%

Step 2: ordinary temperature/10 min to 15 min

Step 3: +125°C±2°C/30 min±3 min

Step 4: ordinary temperature/10 min to 15 min

Number of testing: 10 cycles

Post-treatment: left at a room condition for 24 h±2 h

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

P6/13

10. Specification of Packaging

10.1 Appearance and dimensions of tape (8 mm width/plastic tape)

2.7±0.1

2.8±0.1

2.15±0.1

0.25±0.05

(in mm)

* The dimensions of the cavity are measured at its bottom.

10.2 Taping specifications

Packing quantity

2000 pcs/reel

(Standard quantity)

Packing method

Feed hole position

Joint

The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.

The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.

The plastic tape and the cover tape are seamless.

Number of missing

products

Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

10.3 Break down force of tape

Break down force of cover tape

10 N min.

10.4 Peeling off force of cover tape

Speed of peeling off

300 mm/min

Peeling off force

0.1 N to 0.6 N (The lower limit is for typical value.)

Cover tape

165 to 180 degree

Plastic tape

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader

section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

P7/13

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.

*1 Expression of inspection No.: (1) Factory code



□□

(1)

○○○○

(2)

(2) Date

First digit: year/last digit of year

(3)

Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D

Third, Fourth digit: day

(3) Serial No.

*2 Expression of RoHS marking: (1) RoHS regulation conformity

ROHS-

()

(2) Murata classification number

(1)

(2)

10.7 Marking on outer box (corrugated box)

Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

10.8 Specification of outer box

Dimensions of outer box

Standard reel quantity

(mm)

Label

in outer box (reel)

186

* Above outer box size is typical. It depends on a

quantity of an order.

11.

Caution

11.1 Restricted applications

Please contact us before using our products for the applications listed below which require especially high reliability for the

prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(2) Aerospace equipment

(3) Undersea equipment

(4) Power plant control

equipment

(5) Medical equipment

(6) Transportation equipment

(vehicles, trains, ships, etc.)

(7) Traffic signal equipment

(8) Disaster/crime

prevention equipment

(9) Data-processing

equipment

(10) Applications of similar complexity and/or reliability

requirements to the applications listed in the above

11.2 Precautions on rating

Avoid using in exceeded the rated temperature range, rated voltage, or rated current.

Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.

11.3 Inrush current

If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,

overheating could occur, resulting in wire breakage, burning, or other serious fault.

11.4 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,

etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated

corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of

product electrode, etc. We will not bear any responsibility for use under these environments.

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

P8/13

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other

mounting method, for example, using a conductive adhesive, please consult us beforehand.

Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal

expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.

The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and

the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.

12.1 Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering.

The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land

dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional

shift. If you use other land pattern, consider it adequately.

(in mm)

Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.

12.2 Flux and solder used

Flux

• Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%.

• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).

• Do not use a water-soluble flux.

Solder

• Use Sn-3.0Ag-0.5Cu solder.

• Standard thickness of solder paste: 100 μm to 150 μm

If you want to use a flux other than the above, please consult our technical department.

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

P9/13

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

150°C max.

Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

• Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product

quality.

Temp.

(℃)

260℃

230℃

Limit Profile

245℃±3℃

220℃

180

150

Standard Profile

30s～60s

60s max.

90s±30s

Time.(s)

Standard profile

Limit profile

Pre-heating

150°C to 180°C/90 s±30 s

Above 220°C/30 s to 60 s

245°C±3°C

150°C to 180°C/90 s±30 s

Above 230°C/60 s max.

260°C/10 s

Heating

Peak temperature

Number of reflow cycles

2 times

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.

Item

Requirement

150°C/approx. 1 min

350°C max.

Pre-heating

Tip temperature of soldering iron

Power consumption of soldering iron

Tip diameter of soldering iron

Soldering time

80 W max.

ø3 mm max.

3 s (+1 s, -0 s)

2 times max.

Number of reworking operations

* Avoid a direct contact of the tip of the soldering iron with the product. Such a

direction contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to increase the volume too much.

An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of

mechanical or electrical performance.

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

P10/13

12.6 Product's location

The following shall be considered when designing and laying out PCBs.

(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.

[Products direction]

Products shall be located in the sideways direction (length: a < b) to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures as possible to reduce

stress.

Contents of measures

Stress level

A > D^*1

A > B

(1) Turn the mounting direction of the component parallel to the

board separation surface.

(2) Add slits in the board separation part.

(3) Keep the mounting position of the component away from the

board separation surface.

A > C

*1 A > D is valid when stress is added vertically to the perforation as with hand separation.

If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the

tightening of the screw.

Mount the component in a position as far away from the screw holes as possible.

12.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending

Twisting

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

P11/13

12.8 Cleaning

The product shall be cleaned under the following conditions.

(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C

max.

(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in

mounted products and the PCB.

Item

Power

Requirement

20 W/L max.

Time

5 min max.

Frequency

(3) Cleaner

28 kHz to 40 kHz

Alcohol-based cleaner: IPA

Aqueous agent: PINE ALPHA ST-100S

(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water

adequately and completely dry it so that no cleaner is left.

* For other cleaning, consult our technical department.

12.9 Storage and transportation

Storage period

Use the product within 12 months after delivery.

If you do not use the product for more than 12 months, check solderability before using it.

Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.

The recommended temperature range is -10°C to +40°C. The recommended relative humidity

range is 15% to 85%.

Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the

electrode, resulting in poor solderability or corrosion of the coil wire of the product.

• Do not keep products in bulk packaging. Doing so may cause collision between the products or

between the products and other products, resulting in core chipping or wire breakage.

• Do not place the products directly on the floor; they should be placed on a palette so that they are

not affected by humidity or dust.

• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.

Transportation

Excessive vibration and impact reduces the reliability of the products. Exercise caution when

handling the products.

12.10 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.

A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some

operating condition may cause corrosion of wire of coil, leading to wire breakage.

So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.

Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your

board.

12.11 Handling of product

• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the

winding portion to prevent the breaking of wire.

• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

12.12 Handling with mounting equipment

With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape

when the product is sucked with the pick-up nozzle.

When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.

13.

Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to

your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our product

specifications or transact the approval sheet for product specifications before ordering.

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

P12/13

14. Appendix

Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is

included in the rating table.)

Perform measurement using the method described below. (Perform correction to ensure that the inductance value is

compatible with inductors of other manufacturers.)

(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole

terminal as shown in the figure below.

(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using

the respective current and voltage for input/output.

V₁

I₁

V₂

I₂

Zm=

Zx=

(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.

Here,

α = D/A = 1

β = B/D = Zsm - (1 - Yom Zsm) Zss

Zm-β

Γ = C/A = Yom

Zx=α

1-ZmΓ

Zsm: measured impedance when measuring terminal is shorted

Zss: residual impedance of short chip (= Equivalent series inductance X^*1)

Yom: measured admittance when measuring terminal is open

*1 Important

X: In consideration of compatibility with other venders' products, Zss is defined as the correction value to fit

nominal inductance of other venders' products.

When calibrating the measurement, please input X value instead of the equivalent series inductance (ShortL)

for each L value.

Perform measurement of Q using the residual impedance 0.771 nH obtained through our conventional standard

measurement method.

(4) Calculate inductance Lx and Qx using the equations shown below.

Im (Zx)

Lx: inductance of chip coil

Qx: Q of chip coil

Lx=

2πf

Im (Zx)

Re (Zx)

Qx=

f: measuring frequency

MURATA MFG CO., LTD

Spec No.: JELF243A_0085L-01

P13/13

Table: Equivalent series inductance to fit nominal inductance of other venders' products

Inductance

X (nH)

Equivalent series

Inductance

Part number

Measuring frequency

(MHz)

LQW2UAS12N_00

LQW2UAS18N_00

LQW2UAS22N_00

LQW2UAS27N_00

LQW2UAS33N_00

LQW2UAS39N_00

LQW2UAS47N_00

LQW2UAS56N_00

LQW2UAS68N_00

LQW2UAS82N_00

LQW2UASR10_00

LQW2UASR12_00

LQW2UASR15_00

LQW2UASR18_00

LQW2UASR22_00

LQW2UASR27_00

LQW2UASR33_00

LQW2UASR39_00

LQW2UASR47_00

LQW2UASR56_00

LQW2UASR62_00

LQW2UASR68_00

LQW2UASR75_00

LQW2UASR82_00

LQW2UASR91_00

LQW2UAS1R0_00

LQW2UAS1R2_00

LQW2UAS1R5_00

LQW2UAS1R8_00

LQW2UAS2R2_00

LQW2UAS2R7_00

LQW2UAS3R3_00

LQW2UAS3R9_00

LQW2UAS4R7_00

0.511

0.321

7.9

0.941

0.651

1.711

0.741

2.071

2.351

2.281

2.921

3.351

3.871

4.371

5.271

3.271

8.871

12.771

22.271

20.971

24.971

28.371

44.271

35.371

47.171

56.371

79.171

15.771

5.771

6.771

25.771

63.771

91.771

67.771

163.771

MURATA MFG CO., LTD

LQW2UASR10F00# [MURATA]

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