LXDC2HL10G-301 [MURATA]

Low EMI noise and small footprint (5mm2) using inductor-embedded ferrite substrate;
LXDC2HL10G-301
型号: LXDC2HL10G-301
厂家: muRata    muRata
描述:

Low EMI noise and small footprint (5mm2) using inductor-embedded ferrite substrate

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LXDC2HL-G Series  
Micro DC-DC converter  
1. Features  
Low EMI noise and small footprint (5mm2) using inductor-embedded ferrite substrate  
PFM/PWM automatic mode switching function  
Smooth mode transient between PFM mode and PWM mode with low-ripple-voltage  
PFM mode  
2% DC voltage accuracy over full load current range  
Wide input voltage range : 2.3~5.5V  
Fixed output voltage : 0.8V 2. 5V (factory setting)  
Internal soft start, overcurrent protection  
2. Description  
The LXDC2HL series is a low power step-down DCDC converter, which is suitable for a space-limited or a noise-  
sensitive application. The device utilizes an inductor-embedded ferrite substrate, and the substrate eliminates  
radiated EMI noise and conduction noise efficiently.  
By just putting input/output capacitors, it can be used as a LDO replacement. Its low noise feature and easy to  
assembly feature assures reliable power supply quality.  
The device works in PFM mode at light load and it extends the battery life. At heavy load, its control mode  
changes to PMW mode automatically and it keeps high efficiency using synchronous rectifying technology. The  
device keeps good output voltage accuracy even in PFM mode. It keeps 2% DC voltage accuracy over full  
current range, and shows very smooth mode transient between PFM mode and PWM mode.  
3. Typical Application Circuit  
LXDC2HL-G LXDC2HL  
Enable  
VBAT  
EN  
Vin  
Vout  
Vout  
GND  
10uF  
1
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
4. Mechanical details  
4-1 Outline  
Top View  
Bottom  
View  
Side View  
Unit: mm  
Mark  
Dimension  
L
2.5 +/- 0.2  
2.0 +/- 0.2  
1.0 MAX  
W
T
a
0.85 +/- 0.1  
0.60 +/- 0.1  
0.15 +/- 0.15  
b
c
4-2. Pin Function  
Pin  
Symbol  
I/O  
Description  
Vin pin supplies current to the LXDC2HL internal regulator.  
1
Vin  
Input  
2
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
This is the ON/OFF control pin of the device.  
Connecting this pin to GND keeps the device in shutdown mode.  
Pulling this pin to Vin enables the device with soft start.  
This pin must not be left floating and must be terminated.  
If this pin is left open, the device may be off around 100mA output.  
EN=H: Device ON, EN=L: Device OFF  
2
EN  
Input  
Regulated voltage output pin.  
Apply output load between this pin and GND.  
3
4
Vout  
GND  
Output  
-
Ground pin  
4-3. Functional Block Diagram  
5. Ordering Information  
Part number  
LXDC2HL10G-301  
LXDC2HL11G-306  
LXDC2HL12G-302  
LXDC2HL13G-441  
LXDC2HL15G-303  
LXDC2HL18G-304  
LXDC2HL25G-341  
Output Voltage  
Device Specific Feature  
Standard Type  
Standard Type  
Standard Type  
Standard Type  
Standard Type  
Standard Type  
Standard Type  
MOQ  
1.0V  
1.1V  
1.2V  
1.3V  
1.5V  
1.8V  
2.5V  
T/R, 3000pcs/R  
T/R, 3000pcs/R  
T/R, 3000pcs/R  
T/R, 3000pcs/R  
T/R, 3000pcs/R  
T/R, 3000pcs/R  
T/R, 3000pcs/R  
6. Electrical Specification  
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July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
6-1 Absolute maximum ratings  
Parameter  
symbol  
Vin, EN  
Ta  
rating  
6.3  
Unit  
V
Input voltage  
o
Operating ambient temperature  
-40 to +85  
C
o
Operating IC temperature  
TIC  
-40 to +125  
-40 to +85  
C
o
Storage temperature  
TSTO  
C
6-2 Electrical characteristics (Ta=25)  
Parameter  
Input voltage  
UVLO voltage  
Symbol  
Vin  
Condition  
Min.  
2.3  
Typ.  
Max.  
5.5  
Unit  
3.7  
1.4  
V
V
UVLO  
1.0  
1.8  
Input leak current  
lin-off  
Vout  
Vin=3.7V, EN=0V  
Vin-Vout>1V  
0
2
uA  
LXDC2HL10G-301  
0.976  
1.076  
1.176  
1.274  
1.47  
1.764  
2.45  
0
1.0  
1.1  
1.2  
1.3  
1.5  
1.8  
2.5  
1.024  
1.124  
1.224  
1.326  
1.53  
1.836  
2.55  
300  
LXDC2HL11G-306  
LXDC2HL12G-302  
LXDC2HL13G-441  
LXDC2HL15G-303  
LXDC2HL18G-304  
Output voltage  
accuracy  
V
Vin-Vout>0.7V LXDC2HL25G-341  
LXDC2HL10G-301  
LXDC2HL11G-306  
0
250  
LXDC2HL12G-302  
0
250  
LXDC2HL13G-441  
0
250  
Load current range  
Iout  
mA  
LXDC2HL15G-303  
0
200  
LXDC2HL18G-304  
0
200  
LXDC2HL25G-341  
0
200  
LXDC2HL10G-301  
LXDC2HL11G-306  
15  
15  
15  
15  
15  
15  
Vin=3.7V,  
LXDC2HL12G-302  
LXDC2HL13G-441  
LXDC2HL15G-303  
LXDC2HL18G-304  
Ripple voltage  
Vrpl  
Iout=50mA,  
BW=100MHz  
mVpp  
4
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
LXDC2HL25G-341  
LXDC2HL10G-301  
15  
80  
LXDC2HL11G-306  
LXDC2HL12G-302  
LXDC2HL13G-441  
LXDC2HL15G-303  
LXDC2HL18G-304  
LXDC2HL25G-341  
81  
82  
Vin=3.7V,  
Iout=100mA  
83  
85  
86  
90  
Efficiency  
EFF  
%
VENH  
VENL  
Fosc  
ON ; Enable  
1.4  
0
Vin  
V
V
EN control voltage  
SW Frequency  
OFF ; Disable  
0.25  
1.2  
MHz  
LXDC2HL10G-301  
LXDC2HL11G-306  
LXDC2HL12G-302  
LXDC2HL13G-441  
LXDC2HL15G-303  
LXDC2HL18G-304  
LXDC2HL25G-341  
350  
300  
300  
300  
250  
250  
250  
700  
700  
700  
700  
700  
700  
700  
1350  
1350  
1350  
1350  
1350  
1350  
1350  
mA  
OCP  
Over current  
protection  
If the over current event continues less than Tlatch, auto-recovery.  
If the over current event continues more than Tlatch, latch-up.  
Restart by toggling EN voltage or Vin voltage  
Latch-up mask time  
20  
Tlatch  
Ton  
usec  
@Vout=0.8×Vnom  
Start-up time  
0.25  
msec  
(*1) External capacitors (Cout:10uF) shall be placed near the module in order to proper operation.  
(*2)The above characteristics are tested using the test circuit on section 8.  
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July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
6-3 Thermal and Current De-rating Information  
The following figures show the power dissipation and temperature rise characteristics. These data are  
measured on Murata’s evaluation board of this device at no air-flow condition.  
Io -Loss Characteristics (Vin=3.7V)  
Loss-ΔT Characteristics (Vin=3.7V)  
80  
70  
60  
50  
40  
30  
20  
10  
0
6
5
4
3
2
1
0
0
20  
40  
60  
80  
0
50  
100  
150  
200  
Power Dissipation[mW]  
Iout [mA]  
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a  
continuous power delivering application. The amount of current de-rating is highly dependent on the  
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should  
especially be taken in applications where the device temperature exceeds 85oC.  
o
The IC temperature of the device must be kept lower than the maximum rating of 125 C. It is generally  
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for  
the temperature of semiconductor is 80%.  
MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress. Higher  
temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be described by the  
Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance). The below figure  
shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out mechanisms in  
MLCC capacitor is not reversible but cumulative over time.  
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July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
The following steps should be taken before the design fix of user’s set for reliable operation.  
1. The ambient temperature of the device should be kept below 85 oC  
2. The IC temperature should be measured on the worst condition of each application. The temperature must  
be kept below 125 oC. An appropriate de-rating of temperature and/or output current should be taken.  
3. The MLCC temperature should be measured on the worst condition of each application. Considering the  
above figure, it should be checked if the expected B1 life of MLCC is acceptable or not.  
7. Detailed Description  
PFM/PWM Mode  
If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device  
operates in discontinuous current mode with a sporadic one switching pulse to keep high efficiency at light load.  
The device uses constant on time control in PFM operation, which produces a low ripple voltage and accurate  
output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be  
kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just  
increasing output capacitor.  
The transition between PFM and PWM is also seamless and smooth.  
The transition current between PFM and PWM is depend on Vin, Vout and other factors, but the ballpark  
threshold is about 100-200mA  
PFM mode at light load  
PWM mode at heavy load  
Nominal output voltage  
7
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
UVLO (Under Voltage Lock Out)  
The input voltage (Vin) must reach or exceed the UVLO voltage (1.4Vtyp) before the device begins the start up  
sequence even when EN pin kept high. UVLO function keeps away of an unstable operation at low Vin range  
Soft Start  
The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system  
progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because  
of the function, the output voltage increases gradually from zero to nominal voltage at start-up event. The  
nominal soft-start time is 0.25msec. If you prefer a faster soft-start time, please contact Murata representative.  
Enable  
The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin must  
be terminated to logic high and must not be left floating. If the pin is left open, the device may operate at light load  
but will not work at heavy load.  
Pulling the EN pin to logic low forces the device shutdown. The device does not have a discharge function when  
it turns off. If you prefer a discharge function, please contact Murata representative.  
100% Duty Cycle Operation  
The device can operate 100% duty cycle mode, in which high-side switch is constantly turned ON, thereby  
providing a low input-to-output voltage difference.  
When Vin and Vout becomes close and the duty gets close to 100%, the switching pulse will skip the nominal  
switching period and the output voltage ripple may be larger than other condition. It should be noted that this  
condition does not mean a failure of the device.  
Over Current Protection  
When the output current reaches the OCP threshold, the device narrows the switching duty and decrease the  
output voltage. If the OCP event is removed within the mask time (20usec typ), the output voltage recovers to the  
nominal value automatically. If the OCP event continues over the mask time, the device will shutdown.  
After it is shut down, it can be restarted by toggling the Vin or EN voltage.  
8
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
8. Test Circuit  
LXDC2HL-G  
Cout : 10uF/6.3V (GRM155R60J106M)  
9
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
9. Measurement Data  
Micro DC-DC Converter evaluation board (P2LX0244)  
Measurement setup  
Enable SW  
VIN_S  
VIN  
A
VOUT_S  
VOUT  
Load  
A
GND  
V
GND  
V
GND_S  
GND_S  
The enable switch has three positions.  
1. When it is toggled to “ON” side, the device starts operation.  
2. When it is toggled to “OFF” side, the device stop operation and keep shut down status.  
3. When it is set to middle of “ON” and “OFF”, the EN pin becomes floated and can be applied an external  
voltage through the EN terminal pin on the EVB. If you don’t apply external voltage to EN pin, the enable  
switch should not to be set to the middle position.  
The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables.  
Typical Measurement Data (reference purpose only) (Ta=25)  
Efficiency  
Vin=3.7V,Vout=1.0V  
Vin=3.7V,Vout=1.2V  
10  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
60  
1
10  
100  
1000  
1
10  
100  
1000  
Iout [mA]  
Iout [mA]  
Vin=3.7V,Vout=1.5V  
Vin=3.7V,Vout=1.8V  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
60  
1
10  
100  
1000  
1
10  
100  
1000  
Iout [mA]  
Iout [mA]  
Vin=3.7V,Vout=2.5V  
100  
95  
90  
85  
80  
75  
70  
65  
60  
1
10  
100  
1000  
Iout [mA]  
Load Regulation  
Vin=3.7V,Vout=1.0V  
Vin=3.7V,Vout=1.2V  
11  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
1.02  
1.01  
1
1.224  
1.212  
1.2  
0.99  
0.98  
1.188  
1.176  
0
50  
100  
150  
200  
250  
300  
0
50  
100  
150  
200  
250  
Iout [mA]  
Iout [mA]  
Vin=3.7V,Vout=1.5V  
Vin=3.7V,Vout=1.8V  
1.836  
1.53  
1.515  
1.5  
1.818  
1.8  
1.485  
1.47  
1.782  
1.764  
0
50  
100  
150  
200  
0
50  
100  
150  
200  
Iout [mA]  
Iout [mA]  
Vin=3.7V,Vout=2.5V  
2.55  
2.525  
2.5  
2.475  
2.45  
0
50  
100  
150  
200  
Iout [mA]  
Ripple Voltage  
Vin=3.7V,Vout=1.0V  
Vin=3.7V,Vout=1.2V  
12  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
3.7,Vout=1.1V  
50  
50  
40  
30  
20  
10  
0
40  
30  
20  
10  
0
0
50  
100  
150  
200  
250  
300  
0
50  
100  
150  
200  
250  
Iout [mA]  
Iout [mA]  
Vin=3.7V,Vout=1.5V  
Vin=3.7V,Vout=1.8V  
50  
50  
40  
30  
20  
10  
0
40  
30  
20  
10  
0
0
50  
100  
150  
200  
0
50  
100  
150  
200  
Iout [mA]  
Iout [mA]  
Vin=3.7V,Vout=2.5V  
50  
40  
30  
20  
10  
0
0
50  
100  
150  
200  
Iout [mA]  
Load Transient Response  
Vin=3.7V, Vout=1.8V  
13  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
192mV  
ΔIo=200mA  
10.Reliability Tests  
Result  
QTY  
No.  
1
Items  
Specifications  
Test Methods  
(NG)  
Vibration  
Resistance  
Appearance :  
No severe damag  
Solder specimens on the testing jig  
(glass fluorine boards) shown in  
appended Fig.1 by a Pb free solder.  
The soldering shall be done either by  
iron or reflow and be conducted with  
care so that the soldering is uniform  
and free of defect such as by heat  
shock.  
G
18  
(0)  
Frequency : 10~2000 Hz  
Acceleration : 196 m/s2  
Direction : X,Y,Z 3 axis  
Period : 2 h on each direction Total 6  
h.  
2
Deflection  
Solder specimens on the testing jig  
(glass epoxy boards) shown in  
appended Fig.2 by a Pb free solder.  
The soldering shall be done either by  
iron or reflow and be conducted with  
care so that the soldering is uniform  
and free of defect such as by heat  
shock.  
G
18  
(0)  
Deflection : 1.6mm  
14  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
3
Soldering strength (Push  
Strength)  
9.8 N Minimum  
Solder specimens onto test jig shown  
below. Apply pushing force at 0.5mm/s  
until electrode pads are peeled off or  
ceramics are broken. Pushing force is  
applied to longitudinal direction.  
G
Pushing Direction  
18  
(0)  
Specimen  
Jig  
4
5
Solderability of  
Termination  
75%  
of  
the Immerse specimens first an ethanol  
solution of rosin, then in a Pb free  
solder solution for 3±0.5 sec. at  
245±5 °C.  
terminations is to be  
soldered evenly and  
continuously.  
G
18  
Preheat  
: 150 °C, 60 sec.  
(0)  
Solder Paste : Sn-3.0Ag-0.5Cu  
Flux : Solution of ethanol and rosin  
(25 % rosin in weight proportion)  
Resistance to  
Soldering Heat  
(Reflow)  
Preheat Temperature : 150-180 °C  
Preheat Period  
Temperature  
: 90+/-30 sec. High  
: 220 °C High Temp.  
Appearance  
No severe damages  
Period : 20sec.  
Peak Temperature  
Specimens are soldered twice with the  
above condition, and then kept in  
: 260+5/-0 °C  
G
18  
(0)  
Satisfy  
specifications listed  
in paragraph 6-2.  
Electrical  
specifications  
room condition for 24  
measurements.  
h before  
Result  
(NG)  
No. Items  
Specifications  
Test Methods  
QTY  
18  
6
High Temp.  
Temperature85±2 ℃  
Period1000+48/-0 h  
Room Condition224h  
G
(0)  
Exposure  
7
Temperature  
Cycle  
Condition100 cycles in the following  
table  
Step  
1
Temp(°C)  
Time(min)  
30±3  
G
(0)  
Min.  
Operating  
Temp.+0/-3  
18  
Max.  
2
Operating  
Temp.+3/-0  
30±3  
8
Humidity  
(Steady State)  
Temperature85±2 ℃  
Humidity8090%RH  
Period1000+48/-0 h  
G
(0)  
18  
Appearance  
No severe damages  
Room Condition224h  
15  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
9
Low Temp.  
Exposure  
Temperature-40±2 ℃  
Period1000+48/-0 h  
Room Condition224h  
Electrical  
specifications  
Satisfy  
specifications listed  
in paragraph 6-2.  
G
18  
(0)  
10  
11  
C200pFR0Ω  
ESD(Machine  
Model)  
G
(0)  
TEST Voltage +/-100V  
5
Number of electric discharges1  
C100pFR1500Ω  
ESD(Human  
Body Model)  
G
(0)  
TEST Voltage +/-1000V  
Number of electric discharges1  
5
Fig.1  
Land Pattern  
Unitmm  
Symbol  
Dimensions  
0.85  
a
b
c
d
0.60  
0.5  
Reference  
only.  
purpose  
0.2  
Fig.2  
Testing board  
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July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
Unitmm  
■: Land pattern is same as  
figure1  
Glass-fluorine board t=  
1.6mm  
Copper thickness over 35  
mm  
Mounted situation  
Unitmm  
Device  
45  
45  
Test method  
Unitmm  
11. Tape and Reel Packing  
1Dimensions of Tape (Plastic tape)  
Unit: mm  
17  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
2Dimensions of Reel  
Unit: mm  
±
2 0.5  
Φ180  
Φ60  
±
Φ13 0.2  
(9.0)  
±
13.0 1.4  
18  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
3Taping Diagrams  
[1]Feeding Hole : As specified in (1)  
[2]Hole for chip : As specified in (1)  
: 50um in thickness  
: As specified in (1)  
[3]  
[1]  
[2]  
[3]  
[4]  
Feeding Hole  
Feeding Direction  
Chip  
19  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
Symbol  
Items  
No components at trailer  
No components at leader  
Whole leader  
Ratings(mm)  
A
B
C
min 160  
min 100  
min 400  
5The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled  
toward  
the user.  
6Packaging unit: 3,000 pcs./ reel  
7MaterialBase Tape  
… Plastic  
… Plastic  
Reel  
Antistatic coating for both base tape and reel  
8 Peeling of force  
0.1~1.0N  
165 to 180 °  
Cover Tape  
BaseTape  
20  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
NOTICE  
1. Storage Conditions:  
To avoid damaging the solderability of the external electrodes, be sure to observe the following points.  
- Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH.  
(Packing materials, In particular, may be deformed at the temperature over 40 °C.).  
- Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.).  
- Stored products should be used within 6 months of receipt. Solderability should be verified if this  
period is exceeded  
This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020)  
2. Handling Conditions:  
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the  
product because of the nature of ceramics structure.  
Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor  
solderability.  
3. Standard PCB Design (Land Pattern and Dimensions):  
All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern should  
be provided between IN and OUT terminals. Please refer to the specifications for the standard land  
dimensions.  
The recommended land pattern and dimensions are shown for a reference purpose only.  
Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and  
material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.  
When using underfill materials, be sure to check the mechanical characteristics in the actual set.  
4. Soldering Conditions:  
Soldering is allowed up through 2 times.  
Carefully perform preheating :△T less than 130 °C.  
When products are immersed in solvent after mounting, pay special attention to maintain the temperature  
difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent  
products from damage. Contact Murata before use if concerning other soldering conditions.  
21  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
Reflow soldering standard conditions (example)  
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.  
5. Cleaning Conditions:  
The product is not designed to be cleaned after soldering.  
6. Operational Environment Conditions:  
Products are designed to work for electronic products under normal environmental conditions (ambient  
temperature, humidity and pressure). Therefore, products have no problems to be used under the  
similar conditions to the above-mentioned. However, if products are used under the following  
circumstances, it may damage products and leakage of electricity and abnormal temperature may  
occur.  
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).  
- In an atmosphere containing combustible and volatile gases.  
- In a dusty environment. - Direct sunlight  
22  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
- Water splashing place.  
- Humid place where water condenses.  
- In a freezing environment.  
If there are possibilities for products to be used under the preceding clause, consult with Murata before  
actual use.  
If static electricity is added to this product, degradation and destruction may be produced.  
Please use it after consideration enough so that neither static electricity nor excess voltage is added at  
the time of an assembly and measurement.  
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe  
measures must be taken, including the following:  
(1) Installation of protection circuits or other protective device to improve system safety  
(2) Installation of redundant circuits in the case of single-circuit failure  
7. Input Power Capacity:  
Products shall be used in the input power capacity as specified in this specifications.  
Inform Murata beforehand, in case that the components are used beyond such input power capacity  
range .  
8. Limitation of Applications:  
The products are designed and produced for application in ordinary electronic equipment (AV  
equipment, OA equipment, telecommunication, etc). If the products are to be used in devices  
requiring extremely high reliability following the application listed below, you should consult with  
the Murata staff in advance.  
- Aircraft equipment. - Aerospace equipment - Undersea equipment.  
- Power plant control equipment.  
- Medical equipment.  
- Transportation equipment (vehicles, trains, ships, etc.).  
- Automobile equipment which includes the genuine brand of car manufacture, car factory-installed  
option and dealer-installed option.  
- Traffic signal equipment.  
- Disaster prevention / crime prevention equipment.  
- Data-procession equipment.  
- Application which malfunction or operational error may endanger human life and property of assets.  
- Application which related to occurrence the serious damage  
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.  
23  
July. 2015  
LXDC2HL-G Series  
Micro DC-DC converter  
! Note:  
Please make sure that your product has been evaluated and confirmed against your specifications  
when our product is mounted to your product.  
Product specifications are subject to change or our products in it may be discontinued without advance  
notice.  
This catalog is for reference only and not an official product specification document, therefore, please  
review and approve our official product specification before ordering this product.  
24  
July. 2015  

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