LXDC32DAAC-459 [MURATA]
Low EMI noise and small footprint using inductor-imbedded ferrite substrate;
| 型号： | LXDC32DAAC-459 |
| 厂家： | 
muRata |
| 描述： | Low EMI noise and small footprint using inductor-imbedded ferrite substrate |
| 文件： | 总21页 (文件大小：1180K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LXDC32D series
Micro DCDC converter
1. Features
Low EMI noise and small footprint using inductor-imbedded ferrite substrate
2ch type DCDC converter
High efficiency using synchronous rectifier technology at 3MHz operation
PFM/PWM automatic mode switching function
Smooth mode transition between PFM mode and PWM mode with low-ripple-voltage PFM mode
2% DC voltage accuracy over full load current range (Vout=1.2~4V)
Maximum Load Current: 600mA (depends on output voltage)
Fixed output voltage: 0.8V – 4V (factory setting, 50mV step)
Internal soft start, overcurrent protection
2. Description
The LXDC32D series is a low power step-down DC-DC converter suitable for space-limited or noise-sensitive
applications. The device utilizes an inductor-embedded ferrite substrate that reduces radiated EMI noise and
conduction noise.
By adding output capacitors, it can be used as an LDO replacement. Its low noise and easy-to-assemble features
assure reliable power supply quality.
The device works in PFM mode at light load for extended battery life. At heavy load, it changes to PMW mode
automatically and maintains high efficiency using synchronous rectifying technology.
The device provides good output voltage accuracy even in PFM mode. It maintains 2% DC voltage accuracy over
the full current range (0-600mA, depends on output voltage), and shows very smooth mode transition between
PFM mode and PWM mode.
3. Typical Application Circuit
LXDC32D
Enable1
Enable2
Vin
EN1
EN2
Vin
Vout1
Vout2
Vout1
Vout2
GND
Cout2
Cout1
1
Feb. 2016
LXDC32D series
Micro DCDC converter
4．Mechanical Details
4-1 Outline
Top View
Side View
Bottom View
Unit: mm
Dimension
Mark
Dimension
Mark
L
W
T
a
b
c
3.2 ± 0.2
2.5 ± 0.2
g
h
i
0.5 ± 0.1
0.15 + 0.2 / - 0.15
0.7 ± 0.1
1.2 MAX
0.4 ± 0.1
j
0.3 ± 0.1
0.6 ± 0.1
k
l
0.3 ± 0.1
0.4 ± 0.1
0.9 ± 0.1
d
e
f
0.15 + 0.2/ - 0.15
0.45 ± 0.1
0.4 ± 0.1
m
n
0.4 ± 0.1
1.05 ± 0.1
4-2 Pin Function
Top View
Bottom View
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Feb. 2016
LXDC32D series
Micro DCDC converter
3
1
1
3
2
2
4
8
8
4
5
7
7
5
6
6
Pin No.
y
Description
I
/
O
l
1, 5
V I Vin pin supplies current to the LXDC32D internal
i n regulator.
n p
u
t
This is the ON/OFF control pin of the device.
Connecting this pin to GND keeps the device in
shutdown mode.
I
E n
N p
1 u
t
Pulling this pin to Vin enables the device with soft start.
This pin must not be left floating and must be
terminated.
If this pin is left open, the device may be off around
100mA output.
2
EN=H: Device ON, EN=L: Device OFF
O Regulated voltage output pin.
V
o
u
t
u
t
Apply output load between this pin and GND.
3
p
u
t
1
4,8
G - Ground pin
N
D
This is the ON/OFF control pin of the device.
Connecting this pin to GND keeps the device in
shutdown mode.
Pulling this pin to Vin enables the device with soft start.
This pin must not be left floating and must be
terminated.
I
E n
N p
2 u
t
6
7
If this pin is left open, the device may be off around
100mA output.
EN=H: Device ON, EN=L: Device OFF
Regulated voltage output pin.
Apply output load between this pin and GND.
V O
o u
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Feb. 2016
LXDC32D series
Micro DCDC converter
u t
t p
2 u
t
4-3. Functional Block Diagram
5. Ordering Information
Part number
Input
Voltage[V]
Output
Voltage[V]
Max Iout[mA]
MOQ
Vout1
Vout2
1.3
Iout1
600
600
600
600
600
600
Iout2
600
600
600
600
500
450
LXDC32DAAC-455
LXDC32DAAC-437
LXDC32DAAC-440
LXDC32DAAC-465
LXDC32DAAC-280
LXDC32DAAC-439
2.3 ~ 5.5
2.8 ~ 5.5
2.8 ~ 5.5
2.8 ~ 5.5
3.5 ~ 5.5
3.5 ~ 5.5
1.2
1.1
1.2
1.5
1.2
1.1
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
1.8
1.8
1.8
2.5
2.8
4
Feb. 2016
LXDC32D series
Micro DCDC converter
LXDC32DAAC-438
LXDC32DAAC-442
LXDC32DAAC-145
LXDC32DAAC-394
LXDC32DAAC-422
LXDC32DAAC-398
LXDC32DAAC-393
LXDC32DAAC-435
LXDC32DAAC-459
3.5 ~ 5.5
3.7 ~ 5.5
3.7 ~ 5.5
3.7 ~ 5.5
3.8 ~ 5.5
3.8 ~ 5.5
3.8 ~ 5.5
3.8 ~ 5.5
3.8 ~ 5.5
1.2
1.1
2.8
3.0
3.0
3.0
3.3
3.3
3.3
3.3
3.3
600
600
600
600
600
600
600
600
500
450
350
350
350
300
300
300
300
300
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
T/R, 1000pcs/R
1.35
1.8
0.9
0.95
1.0
1.8
2.5
# Output voltage can be set 50mV step from 0.8V to 4.0V. Please ask Murata representative.
6. Electrical Specification
6-1Absolute maximum ratings
Parameter
Symbol
Vin, EN
Ta
rating
6.3
Unit
V
Input voltage
o
Operating ambient temperature
Operating IC temperature
-40 to +85
C
o
TIC
-40 to +125
-40 to +85
C
o
Storage temperature
TSTO
C
6-2 Electrical characteristics (Ta=25℃)
Parameter
Symbol
Condition
Min.
2.3
Typ.
5.0
Max.
5.5
Unit
V
Input voltage
Vin
UVLO
UVLO
Iin-off
1.0
1.4
1.8
3
V
Input leak current
Vin=3.7V,EN1=0V,EN2=0V
Vout=0.9V
0
μ A
0.876
0.926
0.976
1.076
0.9
0.95
1.0
1.1
0.924
0.974
1.024
1.124
Vout=0.95V
Vin-Vout>1.0V
Vout=1.0V
Output voltage
accuracy
Vout
%
Vout=1.1V
Vout=1.2V~2.5V
Vin-Vout>1.0V
-2.0
+2.0
Vout=2.55V~3.25V Vin-Vout>0.7V
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Feb. 2016
LXDC32D series
Micro DCDC converter
Vout=3.3V
Vin-Vout>0.5V
Vout=0.9V~1.8V
0
0
0
600
500
Vout=1.85V~2.5V
Vout=2.55V~2.8V
Load current
range
450
mA
Iout
Vout=2.85V~3.0V
0
0
350
300
Vout=3.05V~3.3V
Vin=EN1=3.7V,
Vrpl1
Vrpl2
15
Iout1=600mA,BW=100MHz, EN2=0V
Ripple voltage
Parameter
mV
Vin=EN2=3.7V,
Iout2=300mA,BW=100MHz, EN1=0V
15
Symbol
Condition
Min.
Typ.
TBD
Max.
Unit
LXDC32DAAC-455
LXDC32DAAC-437
LXDC32DAAC-440
LXDC32DAAC-465
LXDC32DAAC-280
LXDC32DAAC-439
LXDC32DAAC-438
LXDC32DAAC-442
LXDC32DAAC-145
LXDC32DAAC-394
LXDC32DAAC-422
LXDC32DAAC-398
LXDC32DAAC-393
LXDC32DAAC-435
LXDC32DAAC-459
TBD
TBD
TBD
83
Vin=3.7V,
Iout1=Iout2=150mA
TBD
TBD
TBD
88
Efficiency
EFF
%
82
81
81
Vin=5.0V,
Iout1=Iout2=150mA
81
84
86
VENH
VENL
ON ; Enable
1.4
0
Vin
V
V
EN control
voltage
OFF ; Disable
0.25
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Feb. 2016
LXDC32D series
Micro DCDC converter
SW Frequency
Fosc
2.5
3.0
3.5
MHｚ
Vout=0.9V~1.8V
Vout=1.85V~2.5V
Vout=2.55V~2.8V
Vout=2.85V~3.0V
Vout=3.05V~3.3V
600
500
450
350
300
900
900
900
700
700
1200
1200
1200
1200
1200
mA
OCP
Over current
protection
If the over current event continues less than Tlatch, auto-recovery.
If the over current event continues more than Tlatch, latch-up.
Restart by toggling EN1 voltage or Vin voltage.
Restart by toggling EN2 voltage or Vin voltage.
Tlatch
Ton1
Latch-up mask time
20
usec
0.9
2.5
2.5
msec
Start-up time
Ton2
0.9
msec
(*1) External capacitors (Cout1: 10uF, Cout2: 10uF) should be placed near the module for proper operation.
(*2) The above characteristics are tested using the test circuit in section 8.
6-3 Thermal and Current De-rating Information
The following figures show the power dissipation and temperature rise characteristics. These data are measured
on Murata’s evaluation board of this device at no air-flow condition.
Io - Loss Characteristics (Vin=3.6V, Vo=1.8V)
Loss - ΔT Characteristics (Vin=3.6V, Vo=1.8V)
400
350
300
250
200
150
100
50
50
45
40
35
30
25
20
15
10
5
0
0
0
100
200
300
400
500
600
0
100
200
300
400
Io (mA)
Power Dissipation (mW)
The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a
continuous power delivering application. The amount of current de-rating is highly dependent on the
environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should
especially be taken in applications where the device temperature exceeds 85oC.
7
Feb. 2016
LXDC32D series
Micro DCDC converter
o
The IC temperature of the device must be kept lower than the maximum rating of 125 C. It is generally
recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for
the temperature of semiconductor is 80%.
MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress. Higher
temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be described by the
Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance). The below figure
shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out mechanisms in
MLCC capacitor is not reversible but cumulative over time.
Capacitor B1 Life vs Capacitor Case temperature
100000
Vin=5V
Vin=3.6V
10000
Vin=3.3V
Vin=2.5V
1000
100
10
1
0.1
20
40
60
80
100
120
e
Capacitor Case temperature(
)
The following steps should be taken before the design fix of user’s set for reliable operation.
1. The ambient temperature of the device should be kept below 85 oC
2. The IC temperature should be measured on the worst condition of each application. The temperature must be
kept below 125 oC. An appropriate de-rating of temperature and/or output current should be taken.
3. The MLCC temperature should be measured on the worst condition of each application. Considering the above
figure, it should be checked if the expected B1 life of MLCC is acceptable or not.
7. Detailed Description
PFM/PWM Mode
If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device operates
in discontinuous current mode with a sporadic switching pulse to keep high efficiency at light load.
The device uses constant on-time control in PFM operation, which produces a low ripple voltage and accurate
output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be
kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just
increasing the output capacitor.
The transition between PFM and PWM is also seamless and smooth.
The transition current between PFM and PWM is dependent on Vin, Vout and other factors, but the approximate
threshold is about 100-200mA.
8
Feb. 2016
LXDC32D series
Micro DCDC converter
PFM mode at light load
PWM mode at heavy load
Nominal output voltage
UVLO (Under Voltage Lock Out)
The input voltage (Vin) must reach or exceed the UVLO voltage (1.4Vtyp) before the device begins the start up
sequence even when the EN pin is kept high. The UVLO function protects against unstable operation at low Vin
levels .
Soft Start
The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system
progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because of
this function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal
soft-start time is 0.9msec. If you prefer a faster soft-start time, please contact a Murata representative.
Enable
The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin must
be terminated to logic high and must not be left floating. If the pin is left open, the device may operate at light load
but will not work at heavy load.
Pulling the EN pin to logic low forces the device into shutdown. The device does not have a discharge function
when it turns off. If you prefer a discharge function, please contact a Murata representative.
100% Duty Cycle Operation
The device can operate in 100% duty cycle mode, in which the high-side switch is constantly turned ON, thereby
providing a low input-to-output voltage difference.
When Vin and Vout become close and the duty cycle approaches 100%, the switching pulse will skip the nominal
switching period and the output voltage ripple may be larger than other conditions. It should be noted that this
condition does not mean a failure of the device.
Over Current Protection
When the output current reaches the OCP threshold, the device narrows the switching duty and decreases the
output voltage. If the OCP event is removed within the mask time (20usec typ), the output voltage recovers to the
nominal value automatically. If the OCP event continues over the mask time, the device will shutdown. After it is
shut down, it can be restarted by toggling the Vin or EN voltage.
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Feb. 2016
LXDC32D series
Micro DCDC converter
8. Test Circuit
Cout1
Cout2
: 10uF/6.3V (GRM188B30J106M)
: 10uF/6.3V (GRM188B30J106M)
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Feb. 2016
LXDC32D series
Micro DCDC converter
9. Micro DC-DC Converter evaluation board
Measurement setup
Vin_s
EN1
Vin
Vout2_s
Vout1_s
Vout1
LOAD
LOAD
Vout2
GND
GND
EN2
GND_s
The enable switch has three positions.
1. When it is toggled to “ON” side, the device starts operation.
2. When it is toggled to “OFF” side, the device stops operation and remains in shut down status.
3. When it is set to middle of “ON” and “OFF”, the EN pin floats and an external voltage can be applied to the
EN terminal pin on the EVB. If you don’t apply an external voltage to EN pin, the enable switch should not to
be set to the middle position.
※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables.
10.Reliability Tests
Result
(NG)
No.
1
Items
Specifications
Test Methods
QTY
Vibration
Resistance
Appearance :
No severe damages
Solder specimens on the testing jig
(glass fluorine boards) shown in
appended Fig.1 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
G
(0)
18
Frequency : 10~2000 Hz
Acceleration : 196 m/s2
Direction : X,Y,Z 3 axis
Period
: 2 h on each
direction Total 6 h.
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Feb. 2016
LXDC32D series
Micro DCDC converter
2
Deflection
Solder specimens on the testing jig
(glass epoxy boards) shown in
appended Fig.2 by a Pb free solder.
The soldering shall be done either by
iron or reflow and be conducted with
care so that the soldering is uniform
and free of defect such as by heat
shock.
G
(0)
18
Deflection : 1.6mm
3
Soldering strength (Push
Strength)
9.8 N Minimum
Solder specimens onto test jig shown
below. Apply pushing force at 0.5mm/s
until electrode pads are peeled off or
ceramics are broken. Pushing force is
applied to longitudinal direction.
G
(0)
Pushing Direction
18
Specimen
Jig
4
5
Solderability of
Termination
75%
of
the Immerse specimens first an ethanol
solution of rosin, then in a Pb free
solder solution for 3±0.5 sec. at 245±5
°C.
terminations is to be
soldered evenly and
continuously.
G
(0)
18
18
Preheat
: 150 °C, 60 sec.
Solder Paste : Sn-3.0Ag-0.5Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
Resistance to
Soldering Heat
(Reflow)
Appearance
No severe damages Preheat Temperature : 150-180 °C
Preheat Period : 90+/-30 sec. High
Satisfy
specifications listed High Temp. Period
in paragraph 6-2.
Temperature : 220 °C
: 20sec.
Electrical
specifications
G
(0)
Peak Temperature
: 260+5/-0 °C
Specimens are soldered twice with the
above condition, and then kept in
room condition for 24
measurements.
h before
Result
(NG)
No. Items
Specifications
Test Methods
QTY
18
6
High Temp.
Appearance
No severe damages
Temperature：85±2 ℃
Period：1000+48/-0 h
Room Condition：2～24h
G
(0)
Exposure
Electrical
specifications
Satisfy
specifications listed
in paragraph 6-2.
7
Temperature
Cycle
Condition：100 cycles in the following
table
Step
Temp(°C)
Time(min)
30±3
Min.
Operating
Temp.+0/-3
G
(0)
1
18
Max.
2
Operating
Temp.+3/-0
30±3
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Feb. 2016
LXDC32D series
Micro DCDC converter
8
9
Humidity
(Steady State)
Temperature：85±2 ℃
Humidity：80～90%RH
Period：1000+48/-0 h
Room Condition：2～24h
G
18
(0)
Low Temp.
Exposure
Temperature：-40±2 ℃
Period：1000+48/-0 h
Room Condition：2～24h
G
18
(0)
10
11
C：200pF、R：0Ω
ESD(Machine
Model)
G
(0)
TEST Voltage ：+/-100V
Number of electric discharges：1
5
C：100pF、R：1500Ω
ESD(Human
Body Model)
G
(0)
TEST Voltage ：+/-1000V
Number of electric discharges：1
5
Fig.1
Land Pattern
Top View
Unit:mm
Mark
a
Dimension
Mark
Dimension
0.4
0.6
f
g
h
i
0.5
b
0.15
0.7
c
0.15
0.45
d
1.5
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Feb. 2016
LXDC32D series
Micro DCDC converter
e
0.4
*Reference purposes only
Fig.2
Testing board
Unit：mm
■： Land pattern is same as
figure1
Glass-fluorine board t＝
1.6mm
Copper thickness over 35
m
Mounted situation Unit：mm
Device チップ
45
45
Test method
Unit：mm
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Feb. 2016
LXDC32D series
Micro DCDC converter
11. Tape and Reel Packing
1) Dimensions of Tape (Plastic tape)
Unit: mm
Feeding direction
2）
Dimensions of Reel
Unit: mm
2 0.5
±
60
180
φ
φ
13 0.2
φ
±
(13.0)
15.4±1.0
3）
Packing (Moisture-proof packing)
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity
indicator.
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Feb. 2016
LXDC32D series
Micro DCDC converter
Label
Desiccant
Humidity
Indicator
Label
Anti-humidity
Aluminum foil pack
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Feb. 2016
LXDC32D series
Micro DCDC converter
4）
Taping Diagrams
Feeding Hole
Feeding Direction
Chip
Symbol
Items
Ratings(mm)
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Feb. 2016
LXDC32D series
Micro DCDC converter
A
B
C
No components at trailer
No components at leader
Whole leader
min 160
min 100
min 400
6） The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward
the user.
7） Packaging unit: 1,000pcs/reel
8） Material：
Reel
Base Tape … Plastic
Plastic
Antistatic coating for both base tape and reel
…
Peeling of force
0.1~1.3N
165 to 180 °
Cover Tape
Base Tape
10）The number of the omissions is to two, and there is no consecutive missing part.
NOTICE
1. Storage Conditions:
・The product shall be stored without opening the packing under the ambient temperature from 5 to 35
deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40 deg.C.)
・The product left more than 6 months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object
and dropping the product, shall not be applied in order not to damage the packing materials.
・After the packing opened, the product shall be stored at < 30 deg.C / < 60 %RH and the product shall be
used within 168 hours.
When the color of the indicator in the packing changed, the product shall be baked before
soldering.
This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)
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Feb. 2016
LXDC32D series
Micro DCDC converter
2. Handling Conditions:
Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the
product because of the nature of ceramics structure.
Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor
solderability.
3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern should
be provided between IN and OUT terminals. Please refer to the specifications for the standard land
dimensions.
The recommended land pattern and dimensions are shown for a reference purpose only.
Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and
material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set.
When using underfill materials, be sure to check the mechanical characteristics in the actual set.
4. Soldering Conditions:
Soldering is allowed up through 2 times.
Carefully perform preheating ：△T less than 130 °C.
When products are immersed in solvent after mounting, pay special attention to maintain the temperature
difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent
products from damage. Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions (example)
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Feb. 2016
LXDC32D series
Micro DCDC converter
Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.
5. Cleaning Conditions:
The product is not designed to be cleaned after soldering.
6. Operational Environment Conditions:
Products are designed to work for electronic products under normal environmental conditions (ambient
temperature, humidity and pressure). Therefore, products have no problems to be used under the similar
conditions to the above-mentioned. However, if products are used under the following circumstances, it may
damage products and leakage of electricity and abnormal temperature may occur.
- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).
- In an atmosphere containing combustible and volatile gases.
- In a dusty environment. - Direct sunlight
- Water splashing place.
- Humid place where water condenses. - In a freezing environment.
If there are possibilities for products to be used under the preceding clause, consult with Murata before
actual use.
If static electricity is added to this product, degradation and destruction may be produced.
Please use it after consideration enough so that neither static electricity nor excess voltage is added at the
time of an assembly and measurement.
If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe
measures must be taken, including the following:
(1) Installation of protection circuits or other protective device to improve system safety
(2) Installation of redundant circuits in the case of single-circuit failure.
7. Input Power Capacity:
Products shall be used in the input power capacity as specified in this specifications.
Inform Murata beforehand, in case that the components are used beyond such input power capacity range .
8. Limitation of Applications:
The products are designed and produced for application in ordinary electronic equipment
(AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring
extremely high reliability following the application listed below, you should consult with the Murata staff in
advance.
- Aircraft equipment. - Aerospace equipment - Undersea equipment.
- Power plant control equipment.
- Medical equipment.
- Transportation equipment (vehicles, trains, ships, etc.).
20
Feb. 2016
LXDC32D series
Micro DCDC converter
- Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option
and dealer-installed option.
- Traffic signal equipment.
- Disaster prevention / crime prevention equipment.
- Data-procession equipment.
- Application which malfunction or operational error may endanger human life and property of assets.
- Application which related to occurrence the serious damage
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
!
Note:
Please make sure that your product has been evaluated and confirmed against your specifications when
our product is mounted to your product.
Product specifications are subject to change or our products in it may be discontinued without advance
notice.
This catalog is for reference only and not an official product specification document, therefore, please
review and approve our official product specification before ordering this product.
21
Feb. 2016
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