MYRGP055100B21RA [MURATA]
Power Supply Module,;型号: | MYRGP055100B21RA |
厂家: | muRata |
描述: | Power Supply Module, |
文件: | 总20页 (文件大小:1810K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
☆GreenOperationCompatible
■GENERAL DESCRIPTION
The MYRGP-W/MYRGP-B series is a synchronous step-down micro DC/DC converter
which integrates an inductor and a control IC in one tiny package (2.0mm×2.5mm, h=1.0mm).
An internal coil simplifies the circuit and enables minimization of noise and other operational
trouble due to the circuit wiring. A wide operating voltage range of 2.5V to 5.5V enables
support for applications that require an internally fixed output voltage (0.8V to 3.6V).
The MYRGP-W/MYRGP-B series use synchronous rectification at an operating frequency
of 3.0MHz. The MYRGP-W/MYRGP-B series use High Speed Transient Response -COT
synchronous rectification.
PWM control (MYRGP-W) or PWM/PFM switching control (MYRGP-B) automatic can be selected.
The series have a high speed soft-start as fast as 0.3ms in typical for quick turn-on. With the built-in UVLO (Under Voltage Lock
Out) function, the internal P-channel driver transistor is forcedOFF when input voltagebecomes 2.0V or lower. WhenCE=Low,
the integrated CLdischarge function which enables the electric chargeat the outputcapacitor CL to be dischargedvia the internal
discharge switch located between the LX and VSS pins. The power consumption will be less than 1.0μA.
■FEATURES
■APPLICATIONS
Input Voltage
:2.5V~5.5V
: 0.8V~3.6V(±2.0%)
:3.0MHz
●Note BookPC
OutputVoltage
Switching Frequency
Output Current
Efficiency
●TabletPC
●SSD(Solid State Drive)
●Mobilephone
:1.0A
: 93% (VIN=5.0V, VOUT=3.3V/300mA)
: High Speed Transient Response -COT
100% DutyCycle
●Digital still camera
●Portable gamemachine
ControlMethods
PWM (MYRGP-W)
PWM/PFM(MYRGP-B)
: Thermal Shut Down Current
Limit Circuit(Drop)
CircuitProtection
Functions
Short Circuit Protection(Latch)
: Soft-start Circuit Built-in
UVLO
CLDischarge
: Low ESR CeramicCapacitor
Output Capacitor
Operating Ambient Temperature
Environmentally Friendly
: -40℃~+105℃
: EU RoHS Compliant, Pb Free
Halogen Free
■TYPICAL PERFORMANCE
■TYPICAL APPLICATIONCIRCUIT
CHARACTERISTICS
MYRGP-W/MYRGP-B
(VOUT=3.3V)
100
7
MYRGP-B
80
1 Lx
6
VIN
CIN
60
4.7μF
AGND
PGND 5
CE 4
2
3
CL
10μF
1.0A
40
VOUT
MYRGP-W
8
20
VIN=5.0V
0
0.1
1
10
100
1000
Output Current : IOUT(mA)
Export Control Code : X0863, Document No : D90DH00050
MYRGP-W/B series A01 Page 1 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■BLOCK DIAGRAM
L1
L2
Inductor
Short
Protection
V
OUT
R1
R2
CFB
High Side
CurrentLim it
VIN
Phase
Compensation
Error
Comparator
Amp.
AGND
CE
S
R
Synch
Buffer
Drive
Q
Logic
Lx
Vrefwith
SoftStart
CE ControlLogic,
UVLO
Thermal Shutdown
Minimum
On Time
Generator
VIN
PGND
VOUT
PWM/PFM
Selector
* The MYRGP-W offers a fixed PWM control, a Control Logic of PWM/PFM Selector is fixed at “PWM” internally.
The MYRGP-B control scheme is a fixed PWM/PFM automatic switching, a Control Logic of PWM/PFM Selector is fixed at “PWM/PFM automatic
switching” internally.
Diodes inside the circuit are an ESD protection diode and a parasitic diode.
MYRGP-W/B series A01 Page 2 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
PIN CONFIGURATION
■
* It should be connected the pin No.2 and 5 to the GND pin.
* If the dissipation pad needs to be connected to other pins, it should be
connected to the GND pin.
* Please refer to pattern layout page for the connecting to PCB.
BOTTOM VIEW
■
PINASSIGNMENT
PINNUMBER
PINNAME
Lx
FUNCTIONS
SwitchingOutput
AnalogGround
1
2
3
4
5
6
7
8
AGND
VOUT
CE
Fixed Output Voltage PIN
ChipEnable
PGND
VIN
PowerGround
PowerInput
L1
InductorElectrodes
InductorElectrodes
L2
■FUNCTION TABLE
CE PIN Function
PINNAME
SIGNAL
Low
STATUS
Stand-by
Active
CE
High
* Please do not leave the CE pin open.
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
VIN PinVoltage
SYMBOL
VIN
RATINGS
-0.3 ~ + 6.2
UNITS
V
V
LX PinVoltage
VLx
- 0.3 ~ VIN + 0.3 or + 6.2 (*1)
- 0.3 ~ VIN + 0.3 or + 4.0(*2)
- 0.3 ~ + 6.2
VOUT Pin Voltage
Vout
V
CE PinVoltage
VCE
V
1000(*3)
Power Dissipation
Operating AmbientTemperature
StorageTemperature
Pd
mW
℃
℃
Topr
Tstg
- 40 ~ + 105
- 55 ~ +125
All voltages are described based on the GND (AGND and PGND) pin.
(*1) The maximum value should be either VIN+0.3 or +6.2 in the lowest voltage
(*2) The maximum value should be either VIN+0.3 or +4.0 in the lowest voltage
(*3) The power dissipation figure shown is PCB mounted (40mm×40mm, t=1.6mm, Glass Epoxy FR-4).
Please refer to page 11 for details.
MYRGP-W/B series A01 Page 3 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■
ELECTRICAL CHARACTERISTICS
Ta=25℃
●MYRGP-W/MYRGP-B
PARAMETER
SYMBOL
VOUT
CONDITIONS
MIN.
TYP.
MAX.
UNITS
V
CIRCUIT
When connected to external conponets,
IOUT =30mA
Output Voltage
<E-1>
<E-2>
<E-3>
①
①
VIN
Operating Voltage Range
2.5
-
-
5.5
V
When connected to external
components, VIN =<C-1>
IOUTMAX
VUVLO
Maximum Output Current
UVLO Voltage (*2)
1000
1.35
-
-
mA
V
①
③
②
Vout=0.6V,
2
2.48
40
Voltage which Lx pin holding ”L” level (*6)
Quiescent Current
(MYRGP-B)
VOUT =VOUT(E) ×1.1V
Iq
25
0
μA
Quiescent Current
(MYRGP-W)
VOUT =VOUT(E) ×1.1V
Iq
-
-
400
825
1
μA
μA
ns
②
②
①
ISTB
Stand-by Current
VCE =0V
When connected to external
components, VIN =VCE=<C-1>, IOUT=1mA
tONmin
TTSD
Minimum ON time (*2)
<E-5>
<E-6>
<E-7>
Thermal Shutdown
-
-
150
-
-
℃
℃
①
①
THYS
Thermal shutdown Hysteresis
LxSW ”H” ON Resistance
30
RLXH
RLXL
VOUT=0.6V, ILX=100mA (*3)
-
-
0.24
0.16
0.37
0.3
Ω
Ω
④
④
LxSW ”L” ON Resistance
(*4)
VOUT=VOUT(T) × 1.1V, ILX=100mA (*3)
LxSW ”H” Leakage
Current
ILeakH
VIN=5.5V, VCE=0V, VOUT=0V, VLX=5.5V
VIN=5.5V, VCE=0V, VOUT=0V, VLX=0V
-
0
30
μA
⑤
LxSW ”L” Leakage
Current
ILeakL
ILIMH
ΔVOUT
-
1.3
-
0
1
2.5
-
μA
A
⑤
⑥
①
Current Limit (*5)
VOUT=0.6V, ILx until Lx pin oscillates
IOUT=30mA
1.5
Output Voltage Temperature
Characterisics
/
±100
ppm/℃
(VOUT・Δtopr) -40℃≦Topr≦85℃
VOUT=0.6V, Applied voltage to VCE,
VCEH
CE”H” Voltage
1.4
-
-
5.5
0.3
V
V
③
③
Voltage changes Lx to “H” level (*6)
VFB=0.6V, Applied voltage to VCE,
Voltage changes Lx to “L” level (*6)
VCEL
CE”L” Voltage
AGND
ICEH
ICEL
CE”H” Current
CE”L” Current
VIN=5.5V, VCE=5.5V, VOUT=0V
VIN=5.5V, VCE=0V, VOUT=0V
-0.1
-0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
After "H" is fed to CE, the time by when
clocks are generated at Lx pin.
tSS
Soft-start Time
0.1
0.3
0.5
ms
V
③
③
Short Protection
Threshold Voltage
Sweeping VOUT, VOUT voltage which Lx
becomes “L” level (*6)
VSHORT
RDCHG
0.17
0.27
210
0.37
CL Discharge
Inductance
VCE=0V, VOUT=4.0V
Test Freq.=1MHz
∆T=+40deg
50
-
300
Ω
μH
A
⑦
-
L
1
-
-
IDC
Inductor Rated Current
-
1.3
-
Unless otherwise stated, VIN=5.0V, VCE=5.0V, VOUT(T)=Nominal Voltage
NOTE:
(*1) When the difference between the input and the output is small, 100% duty might come up and internal control circuits keep P-ch driver turning
on even though the output current is not so large.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*2) Including UVLO detect voltage, hysteresis operating voltage range for UVLO release voltage.
(*3) RLXH=(VIN - Lx pin measurement voltage) / 100mA, RLXL=Lx pin measurement voltage / 100mA (*4) Design value
(*5) Current limit denotes the level of detection at peak of coil current.
(*6) "H"=VIN~VIN - 1.2V, "L"=- 0.1V~+ 0.1V
for the MYRGP-B series
MYRGP-W/B series A01 Page 4 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■ELECTRICAL CHARACTERISTICS
●SPEC Table (VOUT, tONmin
)
tONmin
tONmin
NOMINAL
OUTPUT
VOLTAGE
NOMINAL
OUTPUT
VOLTAGE
VOUT
<E-2>
VOUT
fOSC=3.0MHz
fOSC=3.0MHz
<E-1>
<E-3>
<C-1>
<E-5>
<E-6>
<E-7>
<E-1> <E-2> <E-3>
<C-1>
<E-5>
<E-6>
<E-7>
MIN.
0.784
0.833
0.882
0.931
0.980
1.029
1.078
1.127
1.176
1.225
1.274
1.323
1.372
1.421
1.470
1.519
1.568
1.617
1.666
1.715
1.764
1.813
1.862
1.911
1.960
2.009
2.058
2.107
2.156
TYP.
0.800
0.850
0.900
0.950
1.000
1.050
1.100
1.150
1.200
1.250
1.300
1.350
1.400
1.450
1.500
1.550
1.600
1.650
1.700
1.750
1.800
1.850
1.900
1.950
2.000
2.050
2.100
2.150
2.200
MAX.
0.816
0.867
0.918
0.969
1.020
1.071
1.122
1.173
1.224
1.275
1.326
1.377
1.428
1.479
1.530
1.581
1.632
1.683
1.734
1.785
1.836
1.887
1.938
1.989
2.040
2.091
2.142
2.193
2.244
MIN.
71
TYP.
119
121
122
123
123
130
136
142
148
154
160
167
173
179
185
191
198
200
200
200
200
200
200
200
200
200
200
200
200
MAX.
166
169
171
172
160
169
177
185
193
201
209
217
225
233
241
249
257
260
260
260
260
260
260
260
260
260
260
260
260
MIN.
2.205
2.254
2.303
2.352
2.401
2.450
2.499
2.548
2.597
2.646
2.695
2.744
2.793
2.842
2.891
2.940
2.989
3.038
3.087
3.136
3.185
3.234
3.283
3.332
3.381
3.430
3.479
3.528
TYP.
MAX.
MIN.
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
142
144
146
148
151
153
TYP.
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
203
206
209
212
215
218
MAX.
260
260
260
260
260
260
260
260
260
260
260
260
260
260
260
260
260
260
260
260
260
260
264
268
272
276
280
284
VOUT(T)
0.80
VIN
VOUT(T)
2.25
VIN
2.70
2.250 2.295
2.300 2.346
2.350 2.397
2.400 2.448
2.450 2.499
2.500 2.550
2.550 2.601
2.600 2.652
2.650 2.703
2.700 2.754
2.750 2.805
2.800 2.856
2.850 2.907
2.900 2.958
2.950 3.009
3.000 3.060
3.050 3.111
3.100 3.162
3.150 3.213
3.200 3.264
3.250 3.315
3.300 3.366
3.350 3.417
3.400 3.468
3.450 3.519
3.500 3.570
3.550 3.621
3.600 3.672
3.75
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
1.45
1.50
1.55
1.60
1.65
1.70
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
2.15
2.20
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.70
2.75
2.83
2.92
3.00
3.08
3.17
3.25
3.33
3.42
3.50
3.58
3.67
72
2.30
2.35
2.40
2.45
2.50
2.55
2.60
2.65
2.70
2.75
2.80
2.85
2.90
2.95
3.00
3.05
3.10
3.15
3.20
3.25
3.30
3.35
3.40
3.45
3.50
3.55
3.60
3.83
3.92
4.00
4.08
4.17
4.25
4.33
4.42
4.50
4.58
4.67
4.75
4.83
4.92
5.00
5.08
5.17
5.25
5.33
5.42
5.50
5.50
5.50
5.50
5.50
5.50
5.50
73
74
86
91
95
99
104
108
112
117
121
125
130
134
138
140
140
140
140
140
140
140
140
140
140
140
140
■TYPICAL CIRCUIT
7
PARAMETER
VALUE
CIN
10V/4.7μF
10V/10μF
1 Lx
6
VIN
CIN
CL
4.7μF
CL
AGND
VOUT
PGND 5
CE 4
2
3
10
μF
1.0A
8
NOTE:
The integrated Inductor can be used only for this DC/DC
converter. Please do not use this inductor for other
reasons.
MYRGP-W/B series A01 Page 5 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■TEST CIRCUITS
< Circuit No.①>
< Circuit No.②>
Wave Form Measure Point
L
L2
L1
L2
L1
Lx
VOUT
Lx
VOUT
VIN
VIN
AGND
A
AGND
A
CL
V
RL
1
μF
CIN
PGND
PGND
CE
CE
※
External Components
1.0 H(Selected goods)
CIN 4.7 F(Ceramic)
CL:10 F(Ceramic)
L:
μ
:
μ
μ
< Circuit No.③>
< Circuit No.④>
Wave Form Measure Point
L2
L1
L2
L1
VOUT
Lx
VOUT
Lx
VIN
AGND
VIN
AGND
1
μ
F
V
RPulldown
ILX
1
μF
200
Ω
PGND
CE
PGND
CE
RLXH=(VIN-VL)/ILX
RLXL=VLX/ILX
< Circuit No.⑤>
< Circuit No.⑥>
Wave Form Measure Point
L2
L1
L2
L1
ILeakH
A
VOUT
Lx
VOUT
Lx
ILeakL
VIN
AGND
AGND
VIN
ILIMH
1
μ
F
1μF
ICEH
A
V
PGND
CE
CE
PGND
ICEL
< Circuit No.⑦>
L2
L1
IVO UT
A
VOUT
Lx
VIN
AGND
1
μF
CE
PGND
MYRGP-W/B series A01 Page 6 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■OPERATIONAL EXPLANATION
The MYRGP-W/MYRGP-B series consists of a reference voltage source, error amplifier, comparator, phase
compensation, minimum
on time generation circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel MOS switching
transistor for the synchronous switch, current limiter circuit, UVLO circuit, thermal shutdown circuit, short protection circuit,
PWM/PFM selection circuit and others. (See the BLOCK DIAGRAM below.)
L1
L2
Inductor
Short
Protection
VOUT
R1
R2
CFB
High Side
Current Lim it
VIN
Phase
Compensation
Error
Amp.
Comparator
AGND
CE
S
Synch
Buffer
Drive
Q
Logic
Lx
R
Vref with
SoftStart
CE ControlLogic,
UVLO
Thermal Shutdown
Minimum
On Time
Generator
VIN
PGND
VOUT
PWM/PFM
Selector
<BLOCKDIAGRAM>
The method is High Speed circuit Architecture for Transient with Constant On Time control, which features on time control
method and a fast transient response that also achieves low output voltage ripple.
The on time (ton) is determined by the input voltage and output voltage, and turns on the Pch MOS driver Tr. for a fixed time.
During the off time (toff), the voltage that is fed back through R1 and R2 is compared to the reference voltage by the error amp,
and the error amp output is phase compensated and sent to the comparator. The comparator compares this signal to the
reference voltage, and if the signal is lower than the reference voltage, sets the SR latch. On time then resumes. By doing this,
PWM operation takes place with the off time controlled to the optimum duty ratio and the output voltage is stabilized. The phase
compensation circuit optimizes the frequency characteristics of the error amp, and generates a ramp wave similar to the ripple
voltage that occurs in the output to modulate the output signal of the error amp. This enables a stable feedback system to be
obtained even when a low ESR capacitor such as a ceramic capacitor is used, and a fast transient response and stabilization of
the output voltage are achieved.
<Minimum on time generation circuit>
Generates an on time that dependson the input voltageand outputvoltage(ton). Theon time is set as givenby the equations below.
ton (ns) =VOUT/VIN×333
<Switchingfrequency>
The switching frequency can be obtained from the on time (ton), which is determined by the input voltage and output voltage,
as given by the equationbelow.
fOSC (MHz) = VOUT(V) / (VIN(V)×ton(ns))
<100% duty cycle mode>
When the load current is heavy and the voltage difference between input voltage and output voltage is small, 100% duty cycle
mode is activated and it keeps the Pch MOS driver Tr. turning on. 100% duty cycle mode attains a high output voltage stability
and a high-speed response under all load conditions, from light to heavy, even in conditions where the dropout voltage is low.
<Erroramp>
The error amp monitors the output voltage. The voltage divided by the internal R1 and R2 resistors is a feedback voltage for
Error Amp. and compared to the reference voltage. The output voltage of the error amp becomes higher when the feedback
voltage is higher than the reference voltage. The frequency characteristics of the error amp are optimized internally.
MYRGP-W/B series A01 Page 7 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■OPERATIONAL EXPLANATION (Continued)
<CurrentLimit>
The current limiter circuit of the MYRGP-W/MYRGP-B series monitors the current flowing through the P-channel MOS driver
transistor connected to the Lx pin. When the driver current is greater than a specific level, the current limit function operates to
turn off the pulses from the Lx pin at any given timing. When the over current state is eliminated, the IC resumes its normal
operation.
<Reference voltage source, soft-startfunction>
The reference voltage forms a reference that is used to stabilize the output voltage of the IC. After chip enable of the IC, the
reference voltage connected to the error amp increases linearly during the soft-start interval.
This allows the voltage divided by the internal R1 and R2 resistors and the reference voltage to be controlled in a balanced
manner, and the output voltage rises in proportion to the rise in the reference voltage. This operation prevents rush input current
and enables the output voltage to rise smoothly.
If the output voltage does not reach the set output voltage within the soft start time, such as when the load is heavy or a large
capacity output capacitor is connected, the balancing of the voltage divided by the internal resistors R1 and R2 and the
reference voltage is lost, however, the current restriction function activates to prevent an excessive increase of input current,
enabling a smooth rise of the outputvoltage.
<PWM/PFM selectioncircuit>
PWM control is a continuous conduction mode, and operates at a stable switching frequency by means of an on time (ton) that is
determined by the input voltage and output voltage regardless of the load.
PWM/PFM auto switching control is a discontinuous conduction mode at light loads, and lowers the switching frequency to
reduce switching loss and improveefficiency.
The MYRGP-W series is internally fixed to PWM control.
The MYRGP-B series is internally fixed to PWM/PFM auto switching control.
<CEfunction>
Operation starts when “H” voltage is input into the CE pin. The IC can be put in the shutdown state by inputting “L” voltage into
the CE pin. In the shutdown state, the supply current of the IC is 0μA (TYP.), and the Pch MOS driver Tr. and Nch MOS switch
Tr. for synchronous rectification turn off. The CE pin is a CMOS input and the sink current is 0μA.
<UVLO>
When the VIN voltage becomes 2.00V (TYP.) or lower, the P-ch MOS driver transistor output driver transistor is forced OFF to
prevent false pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 2.10V (TYP.)
or higher, switching operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate
output startup operation. The UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to be
suspended; therefore, the internal circuitry remains in operation
.
<ThermalShutdown>
For protection against heat damage of the ICs, thermal shutdown function monitors chip temperature. The thermal shutdown
circuit starts operating and the P-ch MOS driver and N-ch MOS driver transistor will be turned off when the chip’s temperature
reaches 150℃. When the temperature drops to 120℃ (TYP.) or less after shutting of the current flow, the IC performs the soft-
start function to initiate output startupoperation.
<Short-circuit protectionfunction>
The short-circuit protection circuit protects the device that is connected to this product and to the input/output in situations
such as when the output is accidentally shorted to GND. The short-circuit protection circuit monitors the output
voltage, and when the output voltage falls below the short-circuit protection threshold voltage, it turns off the Pch MOS driver Tr
and latches it. Once in the latched state, operation is resumed by turning off the IC from the CE pin and then restarting, or by re-
input into the VINpin.
MYRGP-W/B series A01 Page 8 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■OPERATIONAL EXPLANATION (Continued)
<CL High SpeedDischarge>
The product can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which
enables a whole IC circuit put into OFF state, is inputted via the N-ch MOS switch transistor located between the VOUT pin and
the GND pin. When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid
applicationmalfunction.
Output Voltage Dischage characteristics
RDCHG=210Ω (TYP.)CL=10μF
/ τ
V=VOUT(T) × e - t
t =τLn (VOUT(T) / V)
V : Output voltage after discharge
VOUT(T) : Outputvoltage
t : Dischargetime
τ:CL×RDCHG
CL : Capacitance of Output capacitor
RDCHG : CL auto-dischargeresistance,
but it depends on supply voltage.
MYRGP-W/B series A01 Page 9 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■NOTE ON USE
1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or
deteriorated if IC is used beyond the absolute MAX. specifications.
2. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by
external component selection, such as the coil inductance, capacitance values, and board layout of external components.
Once the design has been completed, verification with actual components should be done.
3. The DC/DC converter characteristics depend greatly on the externally connected components as well as on the
characteristics of this IC, so refer to the specifications and standard circuit examples of each component when carefully
considering which components to select. Be especially careful of the capacitor characteristics and use B characteristics (JIS
standard) or X7R, X5R (EIA standard) ceramic capacitors.
4. Sufficiently reinforce the ground wiring. In particular, reinforce near the PGND and AGND pin as fluctuations of the ground
phase due to the ground current during switching may cause the operation of the IC to become unstable.
5. Mount external components as close as possible to the IC. Keep the wiring short and thick to lower the wiring impedance.
6. A feature of High Speed Transient Response -COT control is that it controls the off time in order to control the duty, which
power loss between the input (VIN pin) and output (VOUT pin) due to the load, and thus the switching
addition, changes in the on time due to 100% duty cycle mode are allowed. For this reason, caution
varies due to the effects of
frequency fluctuates. In
must be exercised as the characteristics of the switching frequency will vary depending on the external component
characteristics, board layout, input voltage, output voltage, load current and other parameters.
7. Due to propagation delay inside the product, the on time generated by the minimum on time generation circuit may not be the
same as the on time that is the ratio of the input voltage to the output voltage.
8. With regard to the current limiting value, the actual coil current may at times exceed the electrical characteristics due to
propagation delay inside the product.
9. The CE pin is a CMOS input pin. Do not use with the pin open. If connecting to the input or ground, use a resistor up to 1MΩ.
To prevent malfunctioning of the device connected to this product or the input/output due to short circuiting between pins, it is
recommended that a resistor be connected.
10. If the outputvoltagedropsbelowtheshortcircuit protection threshold voltageat theendof the softstartinterval, operationwill stop.
11. PWM/PFM auto switching control is a discontinuous conduction mode when the load is light, and in cases where the voltage
difference between input and output is low or the coil inductance is higher than the value indicated in the standard circuit
example, the coil current may reverse when the load is light, and thus pulse skipping will not be possible and light load
efficiency will worsen.
12. When the input voltage is close to the minimum input voltage, the current limit circuit might not be able to work.
13. When the voltage difference between input voltage and output voltage is low, the load stability feature may deteriorate.
14. If the capacitance value is not sufficient by degrading CL due to the low temp. condition and DC bias feature, 100% duty
cycle might come up for the load transient condition. Add capacitance value for CL if necessary.
15. If the capacitance value is not sufficient by degrading CL due to the low temp. condition and DC bias feature, the duty cycle
might not be stable. Add capacitance value for CL if necessary.
16.MURATA places an importance on improving our products and their reliability.We request that users incorporate fail-
safe designs and post-aging protection treatment when using MURATA products in their systems.
MYRGP-W/B series A01 Page 10 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■NOTE ON USE (Continued)
17. Please use within the power dissipation range below. Please also note that the power dissipation may changed by test
conditions, the power dissipation figure shown is PCB mounted.
Pakage Body Temperature vs Operating Temperature
Pd vs Operating Temperature
the power loss of mini DC/DC according to the following formula:
power loss = VOUT×IOUT×((100/EFFI) – 1) (W)
VOUT : Output Voltage (V)
IOUT : Output Current (A)
EFFI : Conversion Efficiency (%)
Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness:1.6mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (unit: mm)
MYRGP-W/B series A01 Page 11 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
NOTE ON USE (Continued)
■
18. Instructions of patternlayouts
The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high,
please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible.
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible
to the VIN pin, PGND pin.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents
at the time of switching may result in instability of the IC.
(5) This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-channel and
N- channel MOS driver transistors. Please consider the countermeasures against heat if necessary.
<Reference patternlayout>
<BACK SIDE TOPVIEW>
<TOPVIEW>
MYRGP-W/B series A01 Page 12 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Output Voltage vs. Output Current
MYRGP120100W21RA
MYRGP120100B21RA
MYRGP180100W21RA
MYRGP180100B21RA
MYRGP330100W21RA
MYRGP330100B21RA
MYRGP-W/B series A01 Page 13 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Efficiency vs. Output Current
MYRGP120100W21RA, VOUT=1.2V
MYRGP120100B21RA, VOUT=1.2V
MYRGP180100B21RA, VOUT=1.8V
MYRGP330100B21RA, VOUT=3.3V
MYRGP180100W21RA, VOUT=1.8V
MYRGP330100W21RA, VOUT=3.3V
MYRGP-W/B series A01 Page 14 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3) Ripple Voltage vs. Output Current
MYRGP120100B21RA, VOUT=1.2V
MYRGP120100W21RA, VOUT=1.2V
MYRGP180100W21RA, VOUT=1.8V
MYRGP180100B21RA, VOUT=1.8V
MYRGP180100B21RA, VOUT=3.3V
MYRGP180100W21RA, VOUT=3.3V
MYRGP-W/B series A01 Page 15 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Output Voltage vs. AmbientTemperature
MYRGP120100W21RA, VOUT=1.2V
MYRGP180100B21RA, VOUT=1.8V
MYRGP330100W21RA, VOUT=3.3V
(5) Quiescent Current vs. AmbientTemperature
MYRGP-B Series
(6) CE Voltage vs. AmbientTemperature
MYRGP-W/MYRGP-B Seires
MYRGP-W/B series A01 Page 16 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) Load Transient Response
(1)MYRGP180100B21RA, VIN=4.2V, VOUT=1.8V / IOUT=0.1mA
⇔500mA
VOUT = 1.8V
IOUT = 0.1mA
⇔ 500mA
(2)MYRGP180100B21RA, VIN=4.2V, VOUT=1.8V / IOUT=100mA
⇔500mA
VOUT = 1.8V
IOUT = 100mA
⇔ 500mA
MYRGP-W/B series A01 Page 17 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
PACKAGING INFORMATION
■
●
Packaging (2.0mm×2.5mm, h=1.0mm
)
2.5±0.1
(0.32 MAX)
(0.32 MAX)
1PIN INDENT
0.3±0.05
1
2
3
7
■
External Lead
8
Au
Sn
5
4
6
(0.22)
(0.55)
(0.22)
(0.5)
1.5±0.05
(0.5)
●Reference Pattern Layout (unit:mm)
●Reference Metal Mask Design (unit:mm)
* I plementatio
y 0.05m .
m
m
n
MYRGP-W/B series A01 Page 18 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
■
MARKING RULE
①
represents products series
MARK
PRODUCTSERIES
2
3
MYRGP******W21RA
MYRGP******B21RA
1
2
3
6
5
4
②
represents integer and oscillation frequency of the output voltage
SWITCHING
OUTPUT
VOLTAGE(V)
MARK
FREQUENCY
(MHz)
PRODUCT SERIES
N
P
R
S
0.x
1.x
2.x
3.x
MYRGP0**100*21RA
MYRGP1**100*21RA
MYRGP2**100*21RA
MYRGP3**100*21RA
3
③
represents the decimal part of output voltage
OUTPUT
MARK
PRODUCT SERIES
VOLTAGE(V)
X.0
X.05
X.1
0
A
1
MYRGP*00100*21RA
MYRGP*05100*21RA
MYRGP*10100*21RA
MYRGP*15100*21RA
MYRGP*20100*21RA
MYRGP*25100*21RA
MYRGP*30100*21RA
MYRGP*35100*21RA
MYRGP*40100*21RA
MYRGP*45100*21RA
MYRGP*50100*21RA
MYRGP*55100*21RA
MYRGP*60100*21RA
MYRGP*65100*21RA
MYRGP*70100*21RA
MYRGP*75100*21RA
MYRGP*80100*21RA
MYRGP*85100*21RA
MYRGP*90100*21RA
MYRGP*95100*21RA
X.15
X.2
B
2
X.25
X.3
C
3
X.35
X.4
D
4
X.45
X.5
E
5
X.55
X.6
F
6
X.65
X.7
H
7
X.75
X.8
K
8
X.85
X.9
L
9
X.95
M
④
,
⑤
represents production lot number
09 0A 0Z 11 9Z A1 A9 AA
(G, I, J, O, Q, W excluded)
Note: No character inversion used.
01~
、
~
、
~
、
~
、
~AZ、B1~ZZ in order.
MYRGP-W/B series A01 Page 19 of 20
“PicoBK™” MYRGP-W/MYRGP-B series
1.0A Inductor Built-in Step-Down DC/DC Converters
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or completeness
of the information contained in this datasheet nor grant any license to any intellectual property rights
of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require extremely
high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human
life, bodily injury, serious property damage including but not limited to devices or equipment used in 1)
nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other
transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless
Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or
property damage resulting from such failure, customers are required to incorporate adequate safety
measures in their designs, such as system fail safes, redundancy and fire prevention features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Murata
Manufacturing Co., Ltd. in writing in advance.
MYRGP-W/B series A01 Page 20 of 20
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