NFM15CC223C1C3 [MURATA]

This product specification is applied to Chip EMIFIL;


型号：	NFM15CC223C1C3
厂家：	muRata
描述：	This product specification is applied to Chip EMIFIL
文件：	总10页 (文件大小：464K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Chip EMIFIL®Chip 3-terminal Capacitor for General

NFM15CC223C1C3_ (0402, 22000pF, DC16V)

_: packaging code

Reference Sheet

1.Scope

This product specification is applied to Chip EMIFIL®Chip 3-terminal Capacitor used for General Electronic equipment.

ꢀꢀ

2.MURATA Part NO. System

(Ex.)

NFM

223

(7)Packaging

Code

(3)Nominal

Capacitance

(4)Temperature (5)DC Rated

Characteristics Voltage

(1)L/W

Dimensions

(6)Electrode

(2)Features

3. Type & Dimensions

a)Equivalent Circuit

(Unit:mm)

(1)-1 L

(1)-2 W

1.0±0.1

0.35±0.1

0.5±0.2

0.15±0.1

0.4±0.1

0.17±0.1

0.1 min.

4.Rated value

(5)

DC Rated

Voltage

Rated

Current

(mA)

(3) Nominal Capacitance

Capacitance Tolerance

Insulation

Specifications and Test Methods

(Operating /Storage Temp. Range)

Resistance Resistance

22000 pF

±20 %

DC 16 V

1A(DC) 40mΩmax. 1000MΩmin.

-55 to 85 °C / -55 to 85 °C

5.Package

mark

(7) Packaging

Packaging Unit

10000 pcs./Reel

f180mm Reel

PAPER W8P2

Product specifications in this catalog are as of Mar.3,2016,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

NFM15CC223C1C3-01

■SPECIFICATIONS AND TEST METHODS

Electrical Performance

Item

Capacitance

Specification

Shown in Rated value.

Test Method

Frequency : 1.0±0.1kHz

Voltage : 1V±0.2V(rms)

(Cap.)

Voltage : Rated Voltage

Time : 2 minutes max.

Insulation

Resistance(I.R.)

DC Resistance

Measured with 100mA max.

Withstanding Voltage

Products shall not be damaged.

Shown in Rated value.

Test Voltage : Rated Voltage x 300%

Time : 1 to 5 s

Charge Current : 50 mA max.

Operating Temperature

Storage Temperature

Includes self-heating

Standard Testing Condition

< Unless otherwise specified >

Temperature : Ordinary Temp. / 15 °C to 35 °C

< In case of doubt >

Temperature: 20 °C ± 2 °C

Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH) Humidity: 60 %(RH) to 70 %(RH)

Atmospheric pressure: 86 kPa to 106 kPa

JEMCPS-02207C

■SPECIFICATIONS AND TEST METHODS

Mechanical Performance

Item

Appearance and

Dimensions

Specification

Appearance:No defects or abnormalities.

Dimensions:Within the specified dimensions.

Test Method

Appearance:Visual inspection.

Dimensions:Using calipers.

Solderability

Electrodes shall be at least 90% covered with

new solder coating.

Flux : Ethanol solution of rosin, 25(wt)%

Pre-heat : 150±10°C, 60 to 90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 240 ± 3°C

Immersion Time : 3±1 s

Immersion and emersion rates : 25mm / s

Resistance to

soldering heat

Meet Table 1.

Table 1

Flux : Ethanol solution of rosin, 25(wt)%

Pre-heat : 150±10°C, 60 to 90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 270 ± 5°C

Immersion Time : 10 ± 1 s

Immersion and emersion rates : 25mm / s

Initial values :

Appearance

Cap. Change

I.R.

No damaged

Within ±7.5%

Meet the initial rated

value.

Resistance

0.05 max.

measured after heat treatment (150+0 / -10 °C,1hour) and

exposure in the room condition for 48±4 hours.

Then measured after exposure in the room condition for 48±

4 hours.

Bending Strength

Meet Table 2.

Table 2

It shall be soldered on the glass-epoxy substrate

(100×40×0.8mm).

Deflection : 1.0 mm

Keeping Time : 5 s

Appearance

Cap. Change

No damaged

Within ±7.5%

Pressure jig

Resistance

0.05max.

R340

Deflection

(in mm)

Product

Drop

Products shall be no failure after tested.

It shall be dropped on concrete or steel board.

Height : 1m

Method : Free fall

Attitude from which the product is dropped : 3 directions

The Number of Time : 3 times for each direction

(Total 9 times)

Bonding Strength

The electrodes shall be no failure after tested.

It shall be soldered on the glass-epoxy substrate.

Applying Force (F) : 5 N

Applying Time : 5 s

R0.5

0.3

(in mm)

1.6

0.25

Vibration

Meet Table 3.

Table 3

It shall be soldered on the glass-epoxy substrate.

Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute.

Total amplitude 3.0 mm or Acceleration amplitude 196m/s2

whichever is smaller.

Time : A period of 2 hours in each of 3 mutually

perpendicular directions. (Total 6 hours)

Appearance

Capacitance

No damaged

Meet the initial rated

value.

Resistance

0.05max.

Preconditioning : Heat treatment (150+0 / -10 °C,1hour)

JEMCPS-02207C

■SPECIFICATIONS AND TEST METHODS

Environment Performance

It shall be soldered on the glass-epoxy substrate.

Item

Specification

Test Method

1 Cycle

ꢀ 1 step : Minimum Operating Temperature

+0 / -3°C / 30+3 / -0 min

ꢀ 2 step : Room Temperature / within 3 min

ꢀ 3 step : Maximum Operating Temperature

+3 / -0°C / 30 +3 / -0 min

ꢀ 4 step : Room Temperature / within 3 min

Total of 10 cycles

Temperature Cycling Meet Table 4.

Table 4

Appearance

Cap. Change

I.R.

No damaged

Within ±12.5%

Meet the initial rated

value.

Resistance

0.05 max.

Initial values : measured after heat treatment(150+0 / -10°C

,1hour) and exposure in the room condition for 48±4 hours.

Then measured after exposure in the room condition for 48±4

hours.

If it’s doubt, the mesuring has to be done after 1 hours

curing at 150+0 / -10°C and 48±4 hours storage.

Humidity

Meet Table 5.

Table 5

Temperature : 40±2°C

Humidity : 90 to 95%(RH)

Time : 500+24 / -0 hours

Appearance

Cap. Change

I.R.

Resistance

No damaged

Within ±12.5%

105M min.

Initial values: measured after heat treatment (150+0 / -10°C ,

1hour) and exposure in the room condition for 48±4 hours.

Then measured after exposure in the room condition for 48±4

hours.

0.05max.

If it ’ s doubt, the mesuring has to be done after 1 hours

curing at 150+0 / -10°C and 48±4 hours storage.

Heat Life

Temperature : : Maximum Operating Temperature ± 2 °C

Test Voltage : Rated Voltage x 150%

Charge Current : 50 mA max.

Time : 1000+48 / -0 hours

Initial values: measured after heat treatment (150+0 / -10°C ,

1hour) and exposure in the room condition for 48±4 hours.

Then measured after exposure in the room condition for 48±4

hours.

If it’s doubt, the mesuring has to be done after 1 hours curing

at 150+0 / -10°C and 48±4 hours storage.

JEMCPS-02207C

P A C K A G I N G

NFM15 Type

1. Appearance and Dimensions (8mm-wide paper tape)

<Fig.1>

1.75±0.1

2.0±0.05 2.0±0.05

4.0±0.1

0.1

1.5

0.6

max.

0.62±0.04

(in:mm)

<Fig.2>

1.75±0.1

2.0±0.05 2.0±0.05

4.0±0.1

0.1

1.5

0.6max.

0.62±0.04

(in mm)

NFM15CC series

NFM15PC473/104/224/435

Fig.1

Code

NFM15PC474/105

NFM15PC755

NFM15PC915

Fig.

Fig.1

Fig.2

0.65ꢀ*

1.15ꢀ*

0.6 max.

0.75ꢀ*

1.15ꢀ*

0.75 max.

0.72ꢀ*

1.29ꢀ*

0.9 max.

0.78ꢀ*

1.29ꢀ*

0.9 max.

*typical

2. Specification of Taping

(1) Packing quantity (standard quantity)

10,000 pcs. / reel

(2) Packing Method

Products shall be packaged in the cavity of the base tape and sealed by cover tape.

(3) Sprocket Hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Base tape and Cover tape

The base tape and Cover tape have no spliced point.

(5) Cavity

There shall not be burr in the cavity.

(6) Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not continuous.

The specified quantity per reel is kept.

3. Pull Strength of Cover tape

5Nmin.

4. Peeling off force of Cover tape

0.1N to 0.6N (minimum value is typical)

Speed of Peeling off : 300 mm / min

5. Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape and empty tape) and trailer-tape (empty tape) as follows.

Leader

Trailer

160 min.

2.0±0.5

190 min.

210 min.

Label

Empty tape Cover tape

13.0±0.2

60±¹₀

9±¹₀

13±1.4

21.0±0.8

Direction of feed

(in mm)

180±⁰₃

JEMCPP-02230D

Caution

1. Mounting density

Add special attention to radiating heat of products when mounting this product near the products with heating.

The excessive heat by other products may cause deterioration of insulation resistance and excessive heat at this product,

resulting in a fire.

2. Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high

reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.

ꢀ(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment

ꢀ (5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment

ꢀ (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment

ꢀ (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above

JEMCPC-02243B

Notice

Products can only be soldered with reflow.

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

1. Flux and Solder

Flux

Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).

Do not use water-soluble flux.

Other flux (except above) Please contact us for details, then use.

Solder

Use Sn-3.0Ag-0.5Cu solder

Use of Sn-Zn based solder will deteriorate performance of products.

In case of using Sn-Zn based solder, please contact Murata in advance.

2. Note for Assembling

< Points of Attention about NFM Pattern Forms>

The loaded stresses are different to a chip depend on PCB materials and structures.

When the chip will be mounted on the metal PCB contained alumina material, PCB heat expansion/contraction

will be a cause of chip cracks because the coefficients of thermal expressions are different between metal PCB

and the chip itself. In case of mounting 1005 or smaller size of NFM on single-layered glass epoxy board,

chip cracks will be occurred because of the same reason.

< Thermal Shock >

Pre-heating should be in such a way that the temperature difference between solder and products surface is limited

to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is

limited to 100°C max.

3. Attention Regarding P.C.B. Bending

The following shall be considered when designing P.C.B.'s and laying out products.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.

[Products direction]

Products shall be located in the sideways

direction (Length:a<b) to the mechanical stress.

Poor example

〈

〉

Good example

〈

〉

(2) Products location on P.C.B. near seam for separation.

Seam

Products (A,B,C,D) shall be located carefully so that products are

not subject to the mechanical stress due to warping the board.

Because they may be subjected the mechanical stress in order

of A>C>B≒D.

Slit



Length:a b

4. Pre-heating Temperature

Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be

limited to 100°C max. to avoid the heat stress for the products.

5. Reflow Soldering

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ• Standard printing pattern of solder paste.

1) Soldering paste printing for reflow

• Standard thickness of solder paste: 100µm to 150µm.

• Use the solder paste printing pattern of the right pattern.

• For the resist and copper foil pattern, use standard land dimensions.

0.25

0.7

(in mm)

1.3

2) Soldering Conditions

Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of

product quality.

260°C

Temp.

(°C)

245°C±3°C

230°C

220°C

Limit Profile

180

150

30s 60s

～

Standard Profile

60s max.

90s±30s

Standard Profile

Time.(s)

Limit Profile

Pre-heating

150°C ~ 180°C , 90s ± 30s

above 220°C , 30s ~ 60s

245°C ± 3°C

Heating

above 230°C , 60s max.

260°C , 10s

Peak temperature

Cycle of reflow

2 times

JEMCPC-02243B

Notice

6. Reworking with Soldering iron

The following conditions shall be strictly followed when using a soldering iron.

• Tip temperature : 340°C max.

• Soldering time : 3(+1,-0) s

• Tip diameter : φ2mm max.

• Times : 1time only.

• Soldering iron output : 30W max.

Note : Adjust the pre-heat temperature to ⊿T＜190℃ between the component and a soldering iron.

Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the material due to the thermal shock.

7. Solder Volume

Solder shall be used not to be exceeded as shown below.

Upper Limit

Recommendable

1/3T

 

t T(T:Chip thickness)

1/3T≤t (T:Chip Thickness)

Accordingly increasing the solder volume, the mechanical stress to product is also increased.

Excessive solder volume may cause the failure of mechanical or electrical performance.

8. Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))

(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the

mounted products and P.C.B.

Power

: 20W / l max.

Frequency : 28kHz to 40kHz

Time

: 5 minutes max.

(3) Cleaner

1. Cleaner

ꢀꢀIsopropyl alcohol (IPA)

2. Aqueous agent

ꢀꢀPINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to

remove the cleaner.

(5) Other cleaning

Please contact us.

9. Operating Environment

Do not use this product under the following environmental conditions, on deterioration of the performance, such as

insulation resistance may result from the use.

(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)

(2) in the atmosphere where liquid such as organic solvent, may splash on the products.

(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.

10. Resin coating

The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin

to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please

make the reliability evaluation with the product mounted in your application set.

11. Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

ꢀꢀꢀꢀꢀꢀBending ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ

ꢀꢀꢀꢀꢀTwisting

JEMCPC-02243B

Notice

12. Component Mounting

If low bottom dead point of the pick-up nozzle is too low, chip cracks will be occurred because an extra power will be

added to the chip during mounting. Therefore, the bottom dead point of pick-up nozzle must be set on/over the upper

surface of the PCB. Adjusting is required when the bottom dead point will be set by correcting board warp.

It is recommended that using the larger pick-up nozzle than chip length for avoiding what force impact will be centered

to the middle point of components. Before assembling, please confirm its mounting accuracy under the best condition.

pick-up nozzle

吸着ノズル

吸着ノズル投影線

shape of pick-up nozzle

good

○

poor

チップ搭載時の

pick-up nozzle position

吸着ノズル位置

longer direction of

吸着ノズル長手寸法

吸着ノズルの設定下死点

position adjusting of

in component placing

pick-up nozzle

bottom dead point

13. Standard Land Dimensions

The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.

Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be

arranged according to the figure to reinforce the ground-pattern.

In case of changing the land dimentions marked by ※, a solder bridge between terminations of the chip

could occur. In this case, please contact us before change.

< Standard land dimensions for reflow >

･Side on which chips are mounted

(in mm)

14. Storage condition

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage environment condition

・Products should be stored in the warehouse on the following conditions.

Temperature: -10 to +40°C

Humidity: 15 to 85% relative humidity

No rapid change on temperature and humidity

・Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode,

resulting in poor solderability.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

・Products should be stored under the airtight packaged condition.

(3) Delivery

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

JEMCPC-02243B

NOTE

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted

to your product.

(2) You are requested not to use our product deviating from the agreed specifications.

(3) We consider it not appropriate to include any terms and conditions with regard to the business transaction in the

product specifications, drawings or other technical documents. Therefore, if your technical documents as above

include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement

liability clause, they will be deemed to be invalid.

JEMCPC-02243B

NFM15CC223C1C3 [MURATA]

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