27L2000-20_技术文档

INDEX

MX27L2000

2M-BIT [256Kx8] CMOS EPROM

FEATURES

• 256Kx 8 organization

• Standby current: 20uA

• Wide power supply range, 2.7V DC to 3.6V DC

• +12.5V programming voltage

• Fast access time: 120/150/200/250 ns

• Totally static operation

• Completely TTL compatible

• Operating current:20mA @ 3.6V, 5MHz

• Package type:

- 32 pin ceramic DIP, plastic DIP

- 32 pin SOP

- 8x20mm 32-lead TSOP(I)

- 8x14mm 32-lead TSOP(I)

- 8x13.4mm 32-lead TSOP(I)

GENERAL DESCRIPTION

programmers may be used. The MX27L2000 supports a

intelligent fast programming algorithm which can result in

programming time of less than one minute.

The MX27L2000 is a 3V only, 2M-bit, ultraviolet Erasable

Programmable Read Only Memory. It is organized as

256K words by 8 bits per word, operates from a single +

3 volt supply, has a static standby mode, and features

fast single address location programming. All program-

ming signals are TTL levels, requiring a single pulse. For

programming outside from the system, existing EPROM

This EPROM is packaged in industry standard 32 pin

dual-in-line packages, 32 lead SOP and 32 lead TSOP(I)

packages.

BLOCK DIAGRAM

PIN CONFIGURATIONS

32 CDIP/PDIP/SOP

CE

CONTROL

LOGIC

OUTPUT

Q0~Q7

PGM

OE

BUFFERS

VCC

PGM

A17

A14

A13

A8

VPP

A16

A15

A12

A7

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

1

2

3

4

.

Y-DECODER

X-DECODER

Y-SELECT

5

A6

6

A9

A5

7

A0~A17

A11

OE

A10

CE

2M BIT

CELL

A4

8

ADDRESS

INPUTS

A3

9

MAXTRIX

A2

10

11

12

13

14

15

16

A1

Q7

A0

Q6

Q0

VCC

VSS

Q5

Q1

Q4

Q2

Q3

GND

32 TSOP(I) (8x20mm,8x14mm,8x13.4mm)

PIN DESCRIPTION

SYMBOL

A0~A17

Q0~Q7

CE

PIN NAME

A11

A9

1

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

OE

A10

CE

Q7

Q6

Q5

Q4

Q3

GND

Q2

Q1

Q0

A0

2

Address Input

Data Input/Output

Chip Enable Input

A8

3

A13

A14

A17

PGM

VCC

VPP

A16

A15

A12

A7

4

5

6

7

OE

Output Enable Input

Programmable Enable Input

Program Supply Voltage

No Internal Connection

Power Supply Pin (+5V)

Ground Pin

8

MX27L2000

9

PGM

VPP

10

11

12

13

14

15

16

NC

A6

A1

A5

A2

VCC

A4

A3

GND

REV.2.5, APR 09,1998

P/N: PM0372

1

INDEX

MX27L2000

through each address of the device. When the

programming mode is completed, the data in all address

is verified at VCC = VPP = 5V ±10%.

FUNCTIONAL DESCRIPTION

THE ERASURE OF THE MX27L2000

PROGRAM INHIBIT MODE

The MX27L2000 is erased by exposing the chip to an

ultraviolet light source. A dosage of 15 W seconds/cm²is

requiredtocompletelyeraseaMX27L2000. Thisdosage

can be obtained by exposure to an ultraviolet lamp -

wavelength of 2537 Angstroms (A) - with intensity of

12,000 uW/cm²for 15 to 20 minutes. The MX27L2000

should be directly under and about one inch from the

source and all filters should be removed from the UV light

source prior to erasure.

Programming of multiple MX27L2000s in parallel with

different data is also easily accomplished by using the

Program Inhibit Mode. Except for CE and OE, all like

inputsoftheparallelMX27L2000maybecommon. ATTL

low-level program pulse applied to an MX27L2000 CE

input with VPP = 12.5 ±0.5 V and PGM LOW will program

that MX27L2000. A high-level CE input inhibits the other

MX27L2000s from being programmed.

It is important to note that the MX27L2000, and similar

devices, will be cleared for all bits of their programmed

stateswithlightsourceshavingwavelengthsshorterthan

4000 A. Although erasure times will be much longer than

that with UV sources at 2537 A, nevertheless the

exposure to fluorescent light and sunlight will eventually

erase the MX27L2000 and exposure to them should be

prevented to realize maximum system reliability. If used

in such an environment, the package window should be

covered by an opaque label or substance.

PROGRAM VERIFY MODE

Verification should be performed on the programmed bits

to determine that they were correctly programmed. The

verification should be performed with OE and CE, at VIL,

PGM at VIH, and VPP at its programming voltage.

AUTO IDENTIFY MODE

The auto identify mode allows the reading out of a binary

code from an EPROM that will identify its manufacturer

and device type. This mode is intended for use by

programming equipment for the purpose of automatically

matching the device to be programmed with its

corresponding programming algorithm. This mode is

functional in the 25°C ±5°C ambient temperature range

that is required when programming the MX27L2000.

THE PROGRAMMING OF THE MX27L2000

When the MX27L2000 is delivered, or it is erased, the

chip has all 2M bits in the "ONE" or HIGH state. "ZEROs"

are loaded into the MX27L2000 through the procedure of

programming.

To activate this mode, the programming equipment must

force 12.0 ±0.5 V on address line A9 of the device. Two

identifier bytes may then be sequenced from the device

outputs by toggling address line A0 from VIL to VIH. All

other address lines must be held at VIL during auto

identify mode.

For programming, the data to be programmed is applied

with 8 bits in parallel to the data pins.

Vcc must be applied simultaneously or before Vpp, and

removed simultaneously or after Vpp. When

programming an MXIC EPROM, a 0.1uF capacitor is

required across Vpp and ground to suppress spurious

voltage transients which may damage the device.

Byte 0 ( A0 = VIL) represents the manufacturer code, and

byte 1 (A0 = VIH), the device identifier code. For the

MX27L2000, these two identifier bytes are given in the

Mode Select Table. All identifiers for manufacturer and

device codes will possess odd parity, with the MSB (Q7)

defined as the parity bit.

FAST PROGRAMMING

The device is set up in the fast programming mode when

the programming voltage VPP = 12.75V is applied, with

VCC = 6.25 V and PGM = VIH (Algorithm is shown in

Figure 1). The programming is achieved by applying a

single TTL low level 100us pulse to the PGM input after

addresses and data line are stable. If the data is not

verified, an additional pulse is applied for a maximum of

25 pulses. This process is repeated while sequencing

REV.2.5, APR 09,1998

P/N: PM0372

2

INDEX

MX27L2000

READ MODE

It is recommended that CE be decoded and used as the

primary device-selecting function, while OE be made a

common connection to all devices in the array and

connected to the READ line from the system control bus.

This assures that all deselected memory devices are in

their low-power standby mode and that the output pins

are only active when data is desired from a particular

memory device.

The MX27L2000 has two control functions, both of which

must be logically satisfied in order to obtain data at the

outputs. Chip Enable (CE) is the power control and

should be used for device selection. Output Enable (OE)

istheoutputcontrolandshouldbeusedtogatedatatothe

output pins, independent of device selection. Assuming

that addresses are stable, address access time (tACC) is

equal to the delay from CE to output (tCE). Data is

available at the outputs tQE after the falling edge of OE,

assuming that CE has been LOW and addresses have

been stable for at least tACC - tQE.

SYSTEM CONSIDERATIONS

Duringtheswitchbetweenactiveandstandbyconditions,

transient current peaks are produced on the rising and

falling edges of Chip Enable. The magnitude of these

transient current peaks is dependent on the output

capacitanceloadingofthedevice. Ataminimum,a0.1uF

ceramic capacitor (high frequency, low inherent

inductance) should be used on each device between Vcc

and GND to minimize transient effects. In addition, to

overcome the voltage drop caused by the inductive

effects of the printed circuit board traces on EPROM

arrays, a4.7uFbulkelectrolyticcapacitorshouldbeused

between VCC and GND for each eight devices. The

location of the capacitor should be close to where the

power supply is connected to the array.

STANDBY MODE

The MX27L2000 has a CMOS standby mode which

reducesthemaximumVCCcurrent to100uA. Itisplaced

in CMOS standby when CE is at VCC ± 0.3 V. The

MX27L2000alsohasaTTL-standbymodewhichreduces

the maximum VCC current to 1.5 mA. It is placed in TTL-

standby when CE is at VIH. When in standby mode, the

outputsareinahigh-impedancestate, independentofthe

OE input.

TWO-LINE OUTPUT CONTROL FUNCTION

To accommodate multiple memory connections, a two-

line control function is provided to allow for:

1. Low memory power dissipation,

2. Assurance that output bus contention will not occur.

MODE SELECT TABLE

PINS

MODE

CE

OE

VIL

VIH

X

PGM

X

A0

X

A9

X

VPP

VCC

VPP

VCC

OUTPUTS

DOUT

High Z

DIN

Read

VIL

Output Disable

Standby (TTL)

Standby (CMOS)

Program

VIL

X

VIH

X

VCC±0.3V

VIL

X

VIH

VIL

X

VIL

VIH

X

Program Verify

Program Inhibit

Manufacturer Code(3)

Device Code(3)

VIL

X

DOUT

High Z

C2H

VIH

X

VIL

X

VIL

VIH

VH

VIL

X

20H

3. A1 - A8 = A10 - A17 = VIL(For auto select)

NOTES: 1. VH = 12.0 V ± 0.5 V

4. See DC Programming Characteristics for VPP voltage during

programming.

2. X = Either VIH or VIL

REV.2.5, APR 09,1998

P/N: PM0372

3

INDEX

MX27L2000

FIGURE 1. FAST PROGRAMMING FLOW CHART

START

ADDRESS = FIRST LOCATION

VCC = 6.25V

VPP = 12.75V

X = 0

PROGRAM ONE 100us PULSE

INCREMENT X

INTERACTIVE

SECTION

YES

X = 25?

NO

FAIL

VERIFY BYTE

?

PASS

NO

LAST ADDRESS

INCREMENT ADDRESS

FAIL

YES

VCC = VPP = 5.25V

VERIFY SECTION

FAIL

DEVICE FAILED

VERIFY ALL BYTES

?

PASS

DEVICE PASSED

REV.2.5, APR 09,1998

P/N: PM0372

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INDEX

MX27L2000

SWITCHING TEST CIRCUITS

DEVICE

UNDER

TEST

1.8K ohm

+5V

DIODES = IN3064

OR EQUIVALENT

CL

6.2K ohm

CL = 100 pF including jig capacitance (30pF for MX27L2000-120, 150ns)

SWITCHING TEST WAVEFORMS

2.0V

0.8V

2.0V

0.8V

TEST POINTS

AC driving levels

OUTPUT

INPUT

AC TESTING: AC driving levels are 3.0V/0V for both commercial grade and industrial grade.

Input pulse rise and fall times are < 10ns.

1.5V

TEST POINTS

AC driving levels

OUTPUT

INPUT

AC TESTING: (1) AC driving levels are 3.0V/0V for commercial grade and industrial grade.

Input pulse rise and fall times are < 10ns.

(2) For MX27L2000-12/15.

REV.2.5, APR 09,1998

P/N: PM0372

5

INDEX

MX27L2000

ABSOLUTE MAXIMUM RATINGS

NOTICE:

RATING

VALUE

Stresses greater than those listed under ABSOLUTE MAXIMUM RAT-

INGS may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or any other

conditions above those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating

conditions for extended period may affect reliability.

NOTICE:

Ambient Operating Temperature

Storage Temperature

Applied Input Voltage

Applied Output Voltage

VCC to Ground Potential

V9 & VPP

-40^oC to 85^oC

-65^oC to 125^oC

-0.5V to 7.0V

-0.5V to VCC + 0.5V

-0.5V to 7.0V

Specifications contained within the following tables are subject to

change.

-0.5V to 13.5V

DC/AC Operating Conditions for Read Operation

MX27L2000

-12

-15

0°C to 70°C

-

-20

-25

Operating Temperature

Vcc Power Supply

Commercial

Industrial

0°C to 70°C

-

0°C to 70°C

-40°C to 85°C

2.7V to 3.6V

0°C to 70°C

-40°C to 85°C

2.7V to 3.6V

DC CHARACTERISTICS

SYMBOL

VOH

VOL

VIH

PARAMETER

MIN.

MAX.

UNIT

V

CONDITIONS

Output High Voltage

Output Low Voltage

2.4

IOH = -0.4mA, VCC=3.0V

IOL = 2.1mA, VCC=3.0V

0.4

V

Input High Voltage

2.0

-0.3

-10

VCC + 0.5

V

VIL

Input Low Voltage

0.8

10

V

2.7V < VCC < 3.6V

ILI

Input Leakage Current

Output Leakage Current

VCC Power-Down Current

VCC Standby Current

VCC Active Current

uA

mA

uA

VIN = 0 to 3.6V

ILO

10

VOUT = 0 to 5.5V

ICC3

ICC2

ICC1

IPP

20

CE = VCC ±0.3V

0.25

20

CE = VIH

CE = VIL, f=5MHz, Iout = 0mA, VCC=3.6V

CE = OE = VIL, VPP = VCC

VPP Supply Current Read

10

CAPACITANCE TA = 25^oC, f = 1.0 MHz (Sampled only)

SYMBOL

CIN

PARAMETER

TYP.

8

MAX.

12

UNIT

CONDITIONS

VIN = 0V

Input Capacitance

Output Capacitance

VPP Capacitance

pF

COUT

CVPP

8

12

VOUT = 0V

VPP = 0V

18

25

REV.2.5, APR 09,1998

P/N: PM0372

6

INDEX

MX27L2000

AC CHARACTERISTICS

27L2000-12

MIN MAX.

120

27L2000-15

MIN. MAX.

150

27L2000-20 27L2000-25

MIN. MAX. MIN. MAX.

SYMBOL PARAMETER

UNIT CONDITIONS

tACC

tCE

Address to Output Delay

200

250

ns

CE = OE =VIL

OE = VIL

Chip Enable to Output Delay

120

150

tOE

tDF

Output Enable to Output Delay

OE High to Output Float,

50

65

100

0

120

0

ns

70

CE = VIL

ns

0

35

0

50

60

0

or CE High to Output Floa

tOH

Output Hold from Address,

0

ns

CE or OE which ever occurred first

DC PROGRAMMING CHARACTERISTICS TA = 25^oC ±5°C

SYMBOL

VOH

VOL

VIH

PARAMETER

MIN.

MAX.

UNIT

CONDITIONS

IOH = -0.40mA

IOL = 2.1mA

Output High Voltage

2.4

V

Output Low Voltage

0.4

V

Input High Voltage

2.0

VCC + 0.5

0.8

V

VIL

Input Low Voltage

-0.3

-10

V

ILI

Input Leakage Current

A9 Auto Select Voltage

VCC Supply Current (Program & Verify)

VPP Supply Current(Program)

Fast Programming Supply Voltage

Fast Programming Voltage

10

uA

V

VIN = 0 to 3.6V

VH

11.5

12.5

50

ICC3

IPP2

VCC1

VPP1

mA

V

30

CE=PGM=VIL,OE=VIH

6.00

12.5

6.50

13.0

V

AC PROGRAMMING CHARACTERISTICS TA = 25^oC ±5°C

SYMBOL

tAS

PARAMETER

MIN.

2.0

0

MAX.

UNIT

us

CONDITIONS

Address Setup Time

OE Setup Time

tOES

tDS

Data Setup Time

us

ns

us

tAH

Address Hold Time

Data Hold Time

tDH

2.0

0

tDFP

tVPS

tPW

Output Enable to Output Float Delay

VPP Setup Time

130

105

2.0

95

2.0

2

PGM Program Pulse Width

VCC Setup Time

us

ns

tVCS

tCES

tOE

CE Setup Time

Data valid from OE

150

REV.2.5, APR 09,1998

P/N: PM0372

7

INDEX

MX27L2000

WAVEFORMS

READ CYCLE

ADDRESS

INPUTS

DATA ADDRESS

tACC

CE

tCE

OE

tDF

DATA

OUT

VALID DATA

tOE

tOH

FAST PROGRAMMING ALGORITHM WAVEFORM

PROGRAM

PROGRAM VERIFY

VIH

Addresses

VIL

tAH

tAS

Hi-z

DATA OUT VALID

DATA

VPP

DATA IN STABLE

tDFP

tDS

tDH

VPP1

VCC

tVPS

tVCS

VCC1

VCC

CE

VIH

VIL

tCES

VIH

VIL

PGM

OE

tOE

Max

tOES

tPW

VIH

VIL

REV.2.5, APR 09,1998

P/N: PM0372

8

INDEX

MX27L2000

ORDERING INFORMATION

CERAMIC PACKAGE

PART NO.

ACCESS TIME(ns)

OPERATING

STANDBY

OPERATING

TEMPERATURE

0°C to 70°C

PACKAGE

CURRENT MAX.(mA)

CURRENT MAX.(uA)

MX27L2000DC-12

MX27L2000DC-15

MX27L2000DC-20

MX27L2000DC-25

MX27L2000DI-12

MX27L2000DI-15

MX27L2000DI-20

MX27L2000DI-25

120

150

200

250

120

150

200

250

20

32 Pin DIP

0°C to 70°C

-40°C to 85°C

PLASTIC PACKAGE

PART NO.

ACCESS TIME(ns)

OPERATING

STANDBY

OPERATING

TEMPERATURE

0°C to 70°C

-40°C to 85°C

PACKAGE

CURRENT MAX.(mA)

CURRENT MAX.(uA)

MX27L2000PC-12

MX27L2000MC-12

MX27L2000TC-12

MX27L2000PC-15

MX27L2000MC-15

MX27L2000TC-15

MX27L2000PC-20

MX27L2000MC-20

MX27L2000TC-20

MX27L2000PC-25

MX27L2000MC-25

MX27L2000TC-25

MX27L2000PI-12

MX27L2000MI-12

MX27L2000TI-12

MX27L2000PI-15

MX27L2000MI-15

MX27L2000TI-15

MX27L2000PI-20

MX27L2000MI-20

MX27L2000TI-20

MX27L2000PI-25

MX27L2000MI-25

MX27L2000TI-25

120

150

200

250

120

150

200

250

20

32 Pin DIP

32 Pin SOP

8x20mm 32 Pin TSOP(I)

32 Pin DIP

32 Pin SOP

8x20mm 32 Pin TSOP(I)

32 Pin DIP

32 Pin SOP

8x20mm 32 Pin TSOP(I)

32 Pin DIP

32 Pin SOP

8x20mm 32 Pin TSOP(I)

32 Pin DIP

32 Pin SOP

8x20mm 32 Pin TSOP(I)

32 Pin DIP

32 Pin SOP

8x20mm 32 Pin TSOP(I)

32 Pin DIP

32 Pin SOP

8x20mm 32 Pin TSOP(I)

32 Pin DIP

32 Pin SOP

8x20mm 32 Pin TSOP(I)

REV.2.5, APR 09,1998

P/N: PM0372

9

INDEX

MX27L2000

PLASTIC PACKAGE

PART NO.

ACCESS TIME(ns)

OPERATING

STANDBY

OPERATING

TEMPERATURE

0°C to 70°C

PACKAGE

CURRENT MAX.(mA) CURRENT MAX.(uA)

MX27L2000T2C-12

MX27L2000T2C-15

MX27L2000T2C-20

MX27L2000T2C-25

MX27L2000T2I-12

MX27L2000T2I-15

MX27L2000T2I-20

MX27L2000T2I-25

MX27L2000T3C-12

MX27L2000T3C-15

MX27L2000T3C-20

MX27L2000T3C-25

MX27L2000T3I-12

MX27L2000T3I-15

MX27L2000T3I-20

MX27L2000T3I-25

120

150

200

250

120

150

200

250

120

150

200

250

120

150

200

250

20

8x14mm 32 Pin TSOP(I)

8x13.4mm 32 Pin TSOP(I)

0°C to 70°C

-40°C to 85°C

0°C to 70°C

-40°C to 85°C

REV.2.5, APR 09,1998

P/N: PM0372

10

INDEX

MX27L2000

PACKAGE INFORMATION

32-PIN CERDIP(MSI) WITH WINDOW (600mil)

ITEM

A

MILLIMETERS INCHES

32

17

42.26 max

1.90 ±.38

2.54 [TP]

.46 [REF]

38.07

1.665 max

.075 ±.015

.100 [TP]

.018 [REF]

1.500

B

N

C

D

E

F

1.42 [REF]

3.43 ±.38

.96 ±.43

4.06

.056 [REF]

.135 ±.015

.038 ±.017

.160

1

16

G

H

I

K

L

A

I

J

5.00

.203

J

K

15.58 ±.13

13.20 ±.38

.25 [REF]

ø8.12

.614 ±.005

.520 ±.015

.010 [REF]

ø.320

G

H

L

M

N

F

D

E

C

B

M

0.15¡

NOTE: Each lead centerline is located within .25

mm[.01 inch] of its true position [TP] at

maximum material condition.

32-PIN PLASTIC DIP(600 mil)

ITEM

A

MILLIMETERS INCHES

32

17

42.13 max.

1.90 [REF]

2.54 [TP]

.46 [Typ.]

38.07

1.660 max.

.075 [REF]

.100 [TP]

B

C

D

E

.018 [Typ.]

1.500

F

1.27 [Typ.]

3.30 ±.25

.51 [REF]

3.94 ±.25

5.33 max.

15.22 ±.25

13.97 ±.25

.25 [Typ.]

.050 [Typ.]

.130 ±.010

.020 [REF]

.155 ±.010

.210 max.

.600 ±.010

.550 ±.010

.010 [Typ.]

16

1

G

H

I

A

K

L

J

I

J

K

H

G

L

M

F

C

NOTE: Each lead centerline is located within .25

mm[.01 inch] of its true position [TP] at

maximum material condition.

0~15¡

D

M

B

E

REV.2.5, APR 09,1998

P/N: PM0372

11

INDEX

MX27L2000

PACKAGE INFORMATION(Continued)

32-PIN PLASTIC SOP (450 mil)

32

17

16

B

ITEM

A

MILLIMETERS INCHES

20.95 max.

1.00 [REF]

1.27 [TP]

.40 [Typ.]

.05 min.

.825 max.

.039 [REF]

.050 [TP]

.016 [Typ.]

.002 min.

.120 max.

.106 ±.005

.556 ±.010

.445 ±.005

.056

B

C

D

E

F

3.05 max.

2.69 ±.13

14.12 ±.25

11.30 ±.13

1.42

1

G

H

I

H

I

A

J

G

F

K

.20 [Typ.]

.79

.008 [Typ.]

.031

K

L

NOTE: Each lead centerline is located within .25

mm[.01 inch] of its true position [TP] at

maximum material condition.

E

L

D

C

32-PIN PLASTIC TSOP

ITEM

MILLIMETERS INCHES

A

20.0 ±.20

18.40 ±.10

8.20 max.

0.15 [Typ.]

.80 [Typ.]

.20 ±.10

.30 ±.10

.50 [Typ.]

.45 max.

0 ~ .20

.078 ±.006

.724 ±.004

.323 max.

.006 [Typ.]

.031 [Typ.]

.008 ±.004

.012 ±.004

.020 [Typ.]

.018 max.

0 ~ .008

A

B

C

D

E

F

G

H

I

C

O

N

M

J

K

L

1.00 ±.10

1.27 max.

.50

.039 ±.004

.050 max.

.020

M

N

K

L

D

0 ~ 5°

.500

J

E

I

F

H

G

NOTE: Each lead centerline is located within .25

mm[.01 inch] of its true position [TP] at

maximum material condition.

REV.2.5, APR 09,1998

P/N: PM0372

12

INDEX

MX27L2000

Revision History

Revision No. Description

Date

2.0

Eliminate Interactive Programming Mode.

5/29/1997

AC driving levels changed from 2.4V/0.4V to 3V/0V.

IPP 100uA --> 10uA

Add 120/150ns speed grades.

Corrected errors in the DC/AC Operating Conditions for Read Operation

Add 8x14mm and 8x13.4mm 32-TSOP(I) Packages

Change TSOP Orientation

2.1

2.2

2.3

2.4

2.5

8/07/1997

12/24/1997

2/5/1998

2/24/1998

4/09/1998

REV.2.5, APR 09,1998

P/N: PM0372

13

INDEX

MX27L2000

MACRONIX INTERNATIONAL CO., LTD.

HEADQUARTERS:

TEL:+886-3-578-8888

FAX:+886-3-578-8887

EUROPE OFFICE:

TEL:+32-2-456-8020

FAX:+32-2-456-8021

JAPAN OFFICE:

TEL:+81-44-246-9100

FAX:+81-44-246-9105

SINGAPORE OFFICE:

TEL:+65-747-2309

FAX:+65-748-4090

TAIPEI OFFICE:

TEL:+886-3-509-3300

FAX:+886-3-509-2200

MACRONIX AMERICA, INC.

TEL:+1-408-453-8088

FAX:+1-408-453-8488

CHICAGO OFFICE:

TEL:+1-847-963-1900

FAX:+1-847-963-1909

http : //www.macronix.com

MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice.

14


型号：	27L2000-20
厂家：	MACRONIX INTERNATIONAL
描述：	2M-BIT [256Kx8] CMOS EPROM 2M- BIT [ 256Kx8 ] CMOS EPROM 可编程只读存储器电动程控只读存储器
文件：	总14页 (文件大小：102K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

27L2000-20 [Macronix]

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