MX29F004TRC-90 [Macronix]

Flash, 512KX8, 90ns, PDSO32, 12 X 20 MM, PLASTIC, REVERSE, TSOP-32;
MX29F004TRC-90
型号: MX29F004TRC-90
厂家: MACRONIX INTERNATIONAL    MACRONIX INTERNATIONAL
描述:

Flash, 512KX8, 90ns, PDSO32, 12 X 20 MM, PLASTIC, REVERSE, TSOP-32

光电二极管
文件: 总33页 (文件大小:226K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INDEX  
ADVANCED INFORMATION  
MX29F004T/B  
4M-BIT [512KX8] CMOS FLASH MEMORY  
FEATURES  
• 524,288 x 8 only  
• Erase suspend/Erase Resume  
- Suspends an erase operation to read data from,  
or program data to, another sector that is not being  
erased, then resumes the erase.  
• Status Reply  
- Data polling & Toggle bit for detection of program  
and erase cycle completion.  
• Chip protect/unprotect for 5V only system or 5V/  
12V system.  
• 100,000 minimum erase/program cycles  
• Latch-up protected to 100mA from -1V to VCC+1V  
• Low VCC write inhibit3.2V  
• Package type:  
- 32-pin PLCC, TSOP or PDIP  
• Single power supply operation  
- 5.0V only operation for read, erase and program  
operation  
• Fast access time: 70/90/120ns  
• Low power consumption  
- 30mA maximum active current  
- 1uA typical standby current  
• Command register architecture  
- Byte Programming (7us typical)  
- Block Erase  
(Block structure:16KB/8KB/8KB/32KB and 64KBx7)  
• Auto Erase (chip & block) and Auto Program  
- Automatically erase any combination of sectors  
with Erase Suspend capability.  
- Automatically program and verify data at specified  
address  
• Compatibility with JEDEC standard  
- Pinout and software compatible with single-power  
supply Flash  
GENERAL DESCRIPTION  
The MX29F004T/B is a 4-mega bit Flash memory  
organized as 512K bytes of 8 bits. MXIC's Flash  
memoriesofferthemostcost-effectiveandreliableread/  
write non-volatile random access memory. The  
MX29F004T/B is packaged in 32-pin PLCC, TSOP,  
PDIP. Itisdesignedtobereprogrammedanderasedin-  
system or in-standard EPROM programmers.  
during erase and programming, while maintaining  
maximum EPROM compatibility.  
MXIC Flash technology reliably stores memory  
contents even after 100,000 erase and program  
cycles. The MXIC cell is designed to optimize the  
erase and programming mechanisms. In addition,  
the combination of advanced tunnel oxide  
processing and low internal electric fields for erase  
and programming operations produces reliable  
cycling. The MX29F004T/B uses a 5.0V±10% VCC  
supply to perform the High Reliability Erase and  
auto Program/Erase algorithms.  
ThestandardMX29F004T/Boffersaccesstimesasfast  
as 70ns, allowing operation of high-speed  
microprocessors without wait states. To eliminate bus  
contention,theMX29F004T/Bhasseparatechipenable  
(CE) and output enable (OE ) controls.  
MXIC's Flash memories augment EPROM functionality  
with in-circuit electrical erasure and programming. The  
MX29F004T/Busesacommandregistertomanagethis  
functionality. The command register allows for 100%  
TTL level control inputs and fixed power supply levels  
The highest degree of latch-up protection is  
achieved with MXIC's proprietary non-epi process.  
Latch-up protection is proved for stresses up to  
100 milliamps on address and data pin from -1V to  
VCC + 1V.  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
1
INDEX  
MX29F004T/B  
PIN CONFIGURATIONS  
32 PDIP  
32 PLCC  
VCC  
WE  
A17  
A14  
A13  
A8  
A18  
A16  
A15  
A12  
A7  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
1
2
3
4
1
32  
30  
29  
4
5
9
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
Q0  
A14  
A13  
A8  
5
A6  
6
A9  
A5  
7
A11  
OE  
A10  
CE  
A4  
8
A9  
A3  
9
MX29F004T/B  
25  
A11  
OE  
A10  
CE  
Q7  
A2  
10  
11  
12  
13  
14  
15  
16  
A1  
Q7  
A0  
Q6  
Q0  
Q5  
Q1  
13  
14  
21  
Q4  
Q2  
17  
20  
Q3  
GND  
32 TSOP (Standard Type) (12mm x 20mm)  
32 TSOP (Reverse Type) (12mm x 20mm)  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
A11  
A9  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
OE  
A10  
CE  
Q7  
Q6  
Q5  
Q4  
Q3  
GND  
Q2  
Q1  
Q0  
A0  
OE  
A11  
A9  
2
2
A10  
3
A8  
3
CE  
A8  
4
A13  
A14  
A17  
WE  
VCC  
A18  
A16  
A15  
A12  
A7  
4
Q7  
A13  
A14  
A17  
WE  
5
5
Q6  
6
6
Q5  
7
7
Q4  
8
8
Q3  
VCC  
A18  
A16  
A15  
A12  
A7  
MX29F004T/B  
MX29F004T/B  
9
9
GND  
10  
10  
11  
12  
13  
14  
15  
16  
Q2  
11  
Q1  
12  
Q0  
13  
A0  
14  
A1  
15  
A2  
16  
A3  
A6  
A1  
A6  
A5  
A2  
A5  
A4  
A3  
A4  
PIN DESCRIPTION  
SYMBOL  
A0~A18  
Q0~Q7  
CE  
PIN NAME  
Address Input  
Data Input/Output  
Chip Enable Input  
Write Enable Input  
Output Enable Input  
Ground Pin  
WE  
OE  
GND  
VCC  
+5.0V single power supply  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
2
INDEX  
MX29F004T/B  
BLOCK STRUCTURE  
MX29F004T TOP BOOT SECTOR ADDRESS TABLE  
Sector Size  
Address Range (in hexadecimal)  
(x8) Address Range  
00000h-0FFFFh  
Sector  
SA0  
SA1  
SA2  
SA3  
SA4  
SA5  
SA6  
SA7  
SA8  
SA9  
SA10  
A18  
0
A17  
0
A16  
0
A15  
X
X
X
X
X
X
X
0
A14  
X
A13  
X
(Kbytes)  
64  
64  
64  
64  
64  
64  
64  
32  
8
0
0
1
X
X
10000h-1FFFFh  
0
1
0
X
X
20000h-2FFFFh  
0
1
1
X
X
30000h-3FFFFh  
1
0
0
X
X
40000h-4FFFFh  
1
0
1
X
X
50000h-5FFFFh  
1
1
0
X
X
60000h-6FFFFh  
1
1
1
X
X
70000h-77FFFh  
1
1
1
1
0
0
78000h-79FFFh  
1
1
1
1
0
1
8
7A000h-7BFFFh  
7C000h-7FFFFh  
1
1
1
1
1
X
16  
MX29F004B BOTTEM BOOT SECTOR ADDRESS TABLE  
Sector Size  
Address Range (in hexadecimal)  
(x8) Address Range  
00000h-03FFFh  
Sector  
SA0  
SA1  
SA2  
SA3  
SA4  
SA5  
SA6  
SA7  
SA8  
SA9  
SA10  
A18  
0
A17  
0
A16  
0
A15  
0
A14  
0
A13  
X
(Kbytes)  
16  
8
0
0
0
0
1
0
04000h-05FFFh  
0
0
0
0
1
1
8
06000h-07FFFh  
0
0
0
1
X
X
32  
64  
64  
64  
64  
64  
64  
64  
08000h-0FFFFh  
0
0
1
X
X
X
X
X
X
X
X
X
10000h-1FFFFh  
0
1
0
X
X
20000h-2FFFFh  
0
1
1
X
X
30000h-3FFFFh  
1
0
0
X
X
40000h-4FFFFh  
1
0
1
X
X
50000h-5FFFFh  
1
1
0
X
X
60000h-6FFFFh  
1
1
1
X
X
70000h-7FFFFh  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
3
INDEX  
MX29F004T/B  
BLOCK DIAGRAM  
WRITE  
STATE  
CONTROL  
INPUT  
PROGRAM/ERASE  
HIGH VOLTAGE  
CE  
OE  
WE  
MACHINE  
(WSM)  
LOGIC  
STATE  
MX29F004T/B  
FLASH  
ADDRESS  
LATCH  
REGISTER  
ARRAY  
ARRAY  
A0-A18  
AND  
SOURCE  
HV  
BUFFER  
Y-PASS GATE  
COMMAND  
DATA  
DECODER  
PGM  
SENSE  
DATA  
HV  
AMPLIFIER  
COMMAND  
DATA LATCH  
PROGRAM  
DATA LATCH  
Q0-Q7  
I/O BUFFER  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
4
INDEX  
MX29F004T/B  
AUTOMATIC PROGRAMMING  
AUTOMATIC ERASE ALGORITHM  
The MX29F004T/B is byte programmable using the  
Automatic Programming algorithm. The Automatic  
Programming algorithm makes the external system do  
not need to have time out sequence or to verify the data  
programmed. The typical room temperature chip  
programming time of the MX29F004T/B is less than 4  
seconds.  
MXIC's Automatic Erase algorithm requires the user to  
writecommandstothecommandregisterusingstandard  
microprocessor write timings. The device will  
automatically pre-program and verification the entire  
array. Then the device automatically times the erase  
pulse width, provides the erase verify, and counts the  
number of sequences. A status bit toggling between  
consecutive read cycles, provides feedback to the user  
as to the status of the programming operation.  
AUTOMATIC CHIP ERASE  
The entire chip is bulk erased using 10 ms erase pulses  
according to MXIC's Automatic Chip Erase algorithm.  
Typicalerasureatroomtemperatureisaccomplishedin  
less than 4 second. The Automatic Erase algorithm  
automaticallyprogramstheentirearraypriortoelectrical  
erase. Thetimingandverificationofelectricaleraseare  
controlled internally within the device.  
Register contents serve as inputs to an internal state-  
machine which controls the erase and programming  
circuitry. During write cycles, the command register  
internally latches address and data needed for the  
programming and erase operations. During a system  
write cycle, addresses are latched on the falling edge,  
and data are latched on the rising edge of WE .  
AUTOMATIC BLOCK ERASE  
MXIC's Flash technology combines years of EPROM  
experience to produce the highest levels of quality,  
reliability, and cost effectiveness. The MX29F004T/B  
electrically erases all bits simultaneously using Fowler-  
Nordheim tunneling. The bytes are programmed by  
using the EPROM programming mechanism of hot  
electron injection.  
The MX29F004T/B is block(s) erasable using MXIC's  
Auto Block Erase algorithm. Block erase modes  
allow blocks of the array to be erased in one erase  
cycle. The Automatic Block Erase algorithm  
automatically programs the specified block(s) prior to  
electrical erase. The timing and verification of  
electrical erase are controlled internally within the  
device.  
During a program cycle, the state-machine will control  
the program sequences and command register will not  
respond to any command set. During a Sector Erase  
cycle, the command register will only respond to Erase  
Suspendcommand.AfterEraseSuspendiscompleted,  
the device stays in read mode. After the state machine  
hascompleteditstask,itwillallowthecommandregister  
to respond to its full command set.  
AUTOMATIC PROGRAMMING ALGORITHM  
MXIC's Automatic Programming algorithm requires the  
user to only write program set-up commands (include 2  
unlock write cycle and A0H) and a program command  
(program data and address). The device automatically  
timestheprogrammingpulsewidth,providestheprogram  
verification, and counts the number of sequences. A  
statusbitsimilartoDATApollingandastatusbittoggling  
between consecutive read cycles, provides feedback to  
the user as to the status of the programming operation.  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
5
INDEX  
MX29F004T/B  
TABLE1. SOFTWARE COMMAND DEFINITIONS  
First Bus  
Cycle  
Second Bus Third Bus  
Cycle Cycle  
Fourth Bus Fifth Bus  
Cycle Cycle  
Sixth Bus  
Cycle  
Command  
Bus  
Cycle Addr  
XXXH F0H  
RA RD  
555H AAH 2AAH 55H 555H 90H  
Data Addr Data Addr Data Addr Data Addr Data Addr Data  
Reset  
1
Read  
1
Read Silicon ID  
Porgram  
4
4
6
6
1
1
6
ADI DDI  
PA PD  
555H AAH 2AAH 55H 555H A0H  
555H AAH 2AAH 55H 555H 80H  
555H AAH 2AAH 55H 555H 80H  
XXXH B0H  
Chip Erase  
555H AAH 2AAH 55H  
555H AAH 2AAH 55H  
555H 10H  
SA 30H  
Sector Erase  
Sector Erase Suspend  
Sector Erase Resume  
Unlock for sector  
protect/unprotect  
XXXH 30H  
555H AAH 2AAH 55H 555H 80H  
555H AAH 2AAH 55H  
555H 20H  
Note:  
1. ADI = Address of Device identifier; A1=0, A0 = 0 for manufacture code,A1=0, A0 =1 for device code.  
(Refer to table 3)  
DDI = Data of Device identifier : C2H for manufacture code, 45H/46H for device code.  
X = X can be VIL or VIH  
RA=Address of memory location to be read.  
RD=Data to be read at location RA.  
2. PA = Address of memory location to be programmed.  
PD = Data to be programmed at location PA.  
SA = Address to the sector to be erased.  
3. The system should generate the following address patterns: 555H or 2AAH to Address A10~A0.  
Address bit A11~A18=X=Don't care for all address commands except for Program Address (PA) and Sector  
Address (SA). Write Sequence may be initiated with A11~A18 in either state.  
COMMAND DEFINITIONS  
Deviceoperationsareselectedbywritingspecificaddress  
anddatasequencesintothecommandregister. Writing  
incorrect address and data values or writing them in the  
improper sequence will reset the device to the read  
mode. Table 1 defines the valid register command  
sequences. Note that the Erase Suspend (B0H) and  
EraseResume(30H)commandsarevalidonlywhilethe  
Sector Erase operation is in progress. Either of the two  
reset command sequences will reset the device(when  
applicable).  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
6
INDEX  
MX29F004T/B  
TABLE 2. MX29F004T/B BUS OPERATION  
Mode  
Pins  
CE  
L
OE  
L
WE  
H
A0  
L
A1  
L
A6  
X
A9  
Q0 ~ Q7  
C2H  
Read Silicon ID  
Manfacturer Code(1)  
Read Silicon ID  
Device Code(1)  
Read  
VID(2)  
L
L
H
H
L
X
VID(2)  
45H/46H  
L
H
L
L
L
L
H
X
H
L
A0  
X
A1  
X
A6  
X
A9  
X
DOUT  
Standby  
X
HIGH Z  
HIGH Z  
DIN(3)  
X
Output Disable  
Write  
H
X
X
X
X
H
A0  
X
A1  
X
A6  
L
A9  
VID(2)  
Chip Protect with 12V  
system(6)  
VID(2)  
L
Chip Unprotect with 12V  
system(6)  
L
L
L
L
L
X
VID(2)  
L
X
X
X
X
X
X
X
H
X
X
H
X
H
X
L
VID(2)  
VID(2)  
H
X
Verify Chip Protect  
with 12V system  
Chip Protect without 12V  
system (6)  
L
H
L
Code(5)  
X
H
H
L
Chip Unprotect without 12V  
system (6)  
L
H
X
X
H
X
Verify Chip Protect/Unprotect  
without 12V system (7)  
Reset  
H
X
H
Code(5)  
HIGH Z  
X
X
NOTES:  
1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 1.  
2. VID is the Silicon-ID-Read high voltage, 11.5V to 13V.  
3. Refer to Table 1 for valid Data-In during a write operation.  
4. X can be VIL or VIH.  
5. Code=00H means unprotected.  
Code=01H means protected.  
6. Refer to chip protect/unprotect algorithm and waveform.  
Must issue "unlock for chip protect/unprotect" command before "chip protect/unprotect without 12V system" command.  
7. The "verify chip protect/unprotect without 12V sysytem" is only following "Chip protect/unprotect without 12V system"  
command.  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
7
INDEX  
MX29F004T/B  
READ/RESET COMMAND  
SET-UP AUTOMATIC CHIP/BLOCK ERASE  
The read or reset operation is initiated by writing the  
read/reset command sequence into the command  
register. Microprocessor read cycles retrieve array  
data. The device remains enabled for reads until the  
command register contents are altered.  
Chip erase is a six-bus cycle operation. There are two  
"unlock" write cycles. These are followed by writing the  
"set-up"command80H. Twomore "unlock"writecycles  
are then followed by the chip erase command 10H.  
The Automatic Chip Erase does not require the device  
to be entirely pre-programmed prior to executing the  
Automatic Chip Erase. Upon executing the Automatic  
Chip Erase, the device automatically will program and  
verify the entire memory for an all-zero data pattern.  
When the device is automatically verified to contain an  
all-zeropattern,aself-timedchiperaseandverifybegin.  
Theeraseandverifyoperationsarecompletedwhenthe  
data on Q7 is "1" at which time the device returns to the  
Read mode. The system is not required to provide any  
control or timing during these operations.  
If program-fail or erase-fail happen, the write of F0H will  
resetthedevicetoaborttheoperation. Avalidcommand  
must then be written to place the device in the desired  
state.  
SILICON-ID-READ COMMAND  
Flash memories are intended for use in applications  
where the local CPU alters memory contents. As such,  
manufacturer and device codes must be accessible  
while the device resides in the target system. PROM  
programmerstypicallyaccesssignaturecodesbyraising  
A9toahighvoltage. However,multiplexinghighvoltage  
onto address lines is not generally desired system  
design practice.  
When using the Automatic Chip Erase algorithm, note  
that the erase automatically terminates when adequate  
erasemarginhasbeenachievedforthememoryarray(no  
erase verification command is required).  
TheMX29F004T/BcontainsaSilicon-ID-Readoperation  
to supplement traditional PROM programming  
methodology. The operation is initiated by writing the  
read silicon ID command sequence into the command  
register. Followingthecommandwrite,areadcyclewith  
A1=VIL,A0=VILretrievesthemanufacturercodeofC2H.  
A read cycle with A1=VIL, A0=VIH returns the device  
code of 45H/46H for MX29F004T/B.  
IftheEraseoperationwasunsuccessful, thedataonQ5  
is "1"(see Table 4), indicating an Erase Failure.  
Theautomaticerasebeginsontherisingedgeofthelast  
WE pulse in the command sequence and terminates  
when the data on Q7 is "1" and the data on Q6 stops  
toggling for two consecutive read cycles, at which time  
the device returns to the Read mode.  
TABLE 3. EXPANDED SILICON ID CODE  
Pins  
A0  
A1  
Q7  
1
Q6  
1
Q5  
0
Q4  
0
Q3  
0
Q2  
0
Q1  
1
Q0  
0
Code(Hex)Code  
Manufacture code  
VIL  
VIL  
C2H  
45H  
46H  
01H  
00H  
Device code for MX29F004T VIH VIL  
Device code for MX29F004B VIH VIL  
0
1
0
0
0
1
0
1
0
1
0
0
0
1
1
0
Protected Chip  
X
X
VIH  
VIH  
0
0
0
0
0
0
0
1
Unprotected Chip  
0
0
0
0
0
0
0
0
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
8
INDEX  
MX29F004T/B  
BLOCK ERASE COMMANDS  
The Automatic Block Erase does not require the  
device to be entirely pre-programmed prior to  
executing the Automatic Set-up Block Erase  
command and Automatic Block Erase command.  
Upon executing the Automatic Block Erase  
command, the device automatically will program and  
verify the block(s) memory for an all-zero data  
pattern. The system is not required to provide any  
controls or timing during these operations.  
When using the Automatic Block Erase algorithm,  
note that the erase automatically terminates when  
adequate erase margin has been achieved for the  
memory array (no erase verifIcation command is  
required). Sector erase is a six-bus cycle operation.  
There are two "unlock" write cycles. These are  
followed by writing the set-up command 80H. Two  
more "unlock" write cycles are then followed by the  
sector erase command 30H. The sector address is  
latched on the falling edge of WE, while the  
command(data) is latched on the rising edge of WE.  
Block addresses selected are loaded into internal  
register on the sixth falling edge of WE. Each succes-  
sive block load cycle started by the falling edge of WE  
must begin within 80µs from the rising edge of the  
preceding WE. Otherwise, the loading period ends  
and internal auto block erase cycle starts. (Monitor  
Q3 to determine if the sector erase timer window is  
still open, see section Q3, Sector Erase Timer.) Any  
command other than Block Erase(30H) or Erase  
Suspend(B0H) during the time-out period resets the  
device to read mode.  
When the block(s) is automatically verified to contain  
an all-zero pattern, a self-timed block erase and verify  
begin. The erase and verify operations are complete  
when the data on Q7 is "1" and the data on Q6 stops  
toggling for two consecutive read cycles, at which  
time the device returns to the Read mode. The  
system is not required to provide any control or timing  
during these operations.  
Table 4. Write Operation Status  
Status  
Q7  
Q6  
Q5  
0
Q3  
0
Q2  
1
Byte Program in Auto Program Algorithm  
Auto Erase Algorithm  
Q7 Toggle  
0
1
Toggle  
1
0
1
Toggle  
Toggle  
(Note1)  
Data  
Erase Suspend Read  
0
0
In Progress  
(Erase Suspended Sector)  
Erase Suspend Read  
Erase Suspended Mode  
Data Data Data Data  
(Non-Erase Suspended Sector)  
Erase Suspend Program  
Q7 Toggle  
(Note2)  
0
0
1
(Note3)  
1
(Non-Erase Suspended Sector)  
Byte Program in Auto Program Algorithm  
Program/Erase in Auto Erase Algorithm  
Q7 Toggle  
1
1
1
0
1
1
Exceeded  
0
Toggle  
N/A  
N/A  
Time Limits Erase Suspended Mode  
Erase Suspend Program  
Q7 Toggle  
(Non-Erase Suspended Sector)  
Notes:  
1.Performing successive read operations from the erase-suspended sector will cause Q2 to toggle.  
2.Performing successive read operations from any address will cause Q6 to toggle.  
3.Reading the byte address being programmed while in the erase-suspend program mode will indicate logic "1" at the Q2 bit.  
However, successive reads from the erase-suspended sector will cause Q2 to toggle.  
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If the program opetation was unsuccessful, the data on  
Q5 is "1"(see Table 4), indicating a program failure. The  
automatic programming operation is completed when  
the data read on Q6 stops toggling for two consecutive  
read cycles and the data on Q7 and Q6 are equivalent  
todatawrittentothesetwobits, atwhichtimethedevice  
returns to the Read mode(no program verify command  
is required).  
ERASE SUSPEND  
Thiscommandonlyhasmeaningwhilethestatemachine  
is executing Automatic Block Erase operation, and  
thereforewillonlyberespondedduringAutomaticBlock  
Erase operation. However, When the Erase Suspend  
commandiswrittenduringthesectorerasetime-out,the  
device immediately terminates the time-out period and  
suspends the erase operation. After this command has  
been executed, the command register will initiate erase  
suspend mode. The state machine will return to read  
mode automatically after suspend is ready. At this time,  
state machine only allows the command register to  
respondtotheReadMemoryArray, EraseResumeand  
program commands.  
DATA POLLING-Q7  
The MX29F004T/B also features Data Polling as a  
methodtoindicatetothehostsystemthattheAutomatic  
Program or Erase algorithms are either in progress or  
completed.  
While the Automatic Programming algorithm is in  
operation, anattempttoreadthedevicewillproducethe  
complement data of the data last written to Q7. Upon  
completion of the Automatic Program Algorithm an  
attempt to read the device will produce the true data last  
written to Q7. The Data Polling feature is valid after the  
risingedgeofthefourth WEpulseofthefourwritepulse  
sequences for automatic program.  
The system can determine the status of the program  
operation using the Q7 or Q6 status bits, just as in the  
standard program operation. After an erase-suspend  
program operation is complete, the system can once  
again read array data within non-suspended blocks.  
ERASE RESUME  
This command will cause the command register to clear  
thesuspendstateandreturnbacktoSectorErasemode  
but only if an Erase Suspend command was previously  
issued. Erase Resume will not have any effect in all  
otherconditions.AnotherEraseSuspendcommandcan  
be written after the chip has resumed erasing.  
While the Automatic Erase algorithm is in operation, Q7  
willread"0"untiltheeraseoperationiscompeted. Upon  
completion of the erase operation, the data on Q7 will  
read"1". TheDataPollingfeatureisvalidaftertherising  
edge of the sixth WE pulse of six write pulse sequences  
for automatic chip/sector erase.  
SET-UP AUTOMATIC PROGRAM  
COMMANDS  
The Data Polling feature is active during Automatic  
Program/Erase algorithm or sector erase time-out.(see  
section Q3 Sector Erase Timer)  
To initiate Automatic Program mode, A three-cycle  
commandsequenceisrequired. Therearetwo"unlock"  
writecycles. ThesearefollowedbywritingtheAutomatic  
Program command A0H.  
Once the Automatic Program command is initiated, the  
next WE pulse causes a transition to an active  
programming operation. Addresses are latched on the  
fallingedge,and dataareinternally latchedon therising  
edgeoftheWEpulse. TherisingedgeofWEalsobegins  
the programming operation. The system is not required  
to provide further controls or timings. The device will  
automatically provide an adequate internally generated  
program pulse and verify margin.  
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Q2 toggles when the system reads at addresses within  
thosesectorsthathavebeenselectedforerasure. (The  
system may use either OE or CE to control the read  
cycles.) ButQ2cannotdistinguishwhetherthesectoris  
actively erasing or is erase-suspended. Q6, by  
comparison, indicates whether the device is actively  
erasing, or is in Erase Suspend, but cannot distinguish  
which sectors are selected for erasure. Thus, both  
statusbitsarerequiredforsectorsandmodeinformation.  
Refer to Table 4 to compare outputs for Q2 and Q6.  
Q6:Toggle BIT I  
Toggle Bit I on Q6 indicates whether an Automatic  
Program or Erase algorithm is in progress or complete,  
or whether the device has entered the Erase Suspend  
mode. Toggle Bit I may be read at any address, and is  
valid after the rising edge of the final WE pulse in the  
command sequence(prior to the program or erase  
operation), and during the sector time-out.  
During an Automatic Program or Erase algorithm  
operation,successivereadcyclestoanyaddresscause  
Q6 to toggle. The system may use either OE or CE to  
controlthereadcycles.Whentheoperationiscomplete,  
Q6 stops toggling.  
Reading Toggle Bits Q6/ Q2  
Whenever the system initially begins reading toggle bit  
status, it must read Q7-Q0 at least twice in a row to  
determinewhetheratogglebitistoggling. Typically, the  
system would note and store the value of the toggle bit  
after the first read. After the second read, the system  
would compare the new value of the toggle bit with the  
first. If the toggle bit is not toggling, the device has  
completedtheprogramoreraseoperation. Thesystem  
can read array data on Q7-Q0 on the following read  
cycle.  
After an erase command sequence is written, if the chip  
has been protected, Q6 toggles and returns to reading  
array data.  
The system can use Q6 and Q2 together to determine  
whetherasectorisactivelyerasingoriserasesuspended.  
Whenthedeviceisactivelyerasing(thatis,theAutomatic  
Erase algorithm is in progress), Q6 toggling. When the  
device enters the Erase Suspend mode, Q6 stops  
toggling. However, the system must also use Q2 to  
determinewhichsectorsareerasingorerase-suspended.  
Alternatively, the system can use Q7.  
However, if after the initial two read cycles, the system  
determines that the toggle bit is still toggling, the system  
alsoshould notewhetherthevalueofQ5ishigh(seethe  
sectiononQ5). Ifitis,thesystemshouldthendetermine  
again whether the toggle bit is toggling, since the toggle  
bit may have stopped toggling just as Q5 went high. If  
the toggle bit is no longer toggling, the device has  
successfuly completed the program or erase operation.  
If it is still toggling, the device did not complete the  
operation successfully, and the system must write the  
reset command to return to reading array data.  
If a program address falls within a protected sector, Q6  
togglesforapproximately2usaftertheprogramcommand  
sequence is written, then returns to reading array data.  
Q6 also toggles during the erase-suspend-program  
mode, and stops toggling once the Automatic Program  
algorithm is complete.  
Theremainingscenarioisthatsysteminitiallydetermines  
that the toggle bit is toggling and Q5 has not gone high.  
The system may continue to monitor the toggle bit and  
Q5 through successive read cycles, determining the  
status as described in the previous paragraph.  
Alternatively, it may choose to perform other system  
tasks. Inthiscase,thesystemmuststartatthebeginning  
of the algorithm when it returns to determine the status  
of the operation.  
Table 4 shows the outputs for Toggle Bit I on Q6.  
Q2:Toggle Bit II  
The "Toggle Bit II" on Q2, when used with Q6, indicates  
whether a particular sector is actively eraseing (that is,  
the Automatic Erase alorithm is in process), or whether  
thatsectoriserase-suspended. ToggleBitIisvalidafter  
the rising edge of the final WE pulse in the command  
sequence.  
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with its control register architecture, alteration of the  
memorycontentsonlyoccursaftersuccessfulcompletion  
of specific command sequences. The device also  
incorporates several features to prevent inadvertent  
write cycles resulting from VCC power-up and power-  
down transition or system noise.  
Q5  
Exceeded Timing Limits  
Q5willindicateiftheprogramorerasetimehasexceeded  
the specified limits(internal pulse count). Under these  
conditionsQ5willproducea"1". Thistime-outcondition  
indicates that the program or erase cycle was not  
successfullycompleted. DataPollingandToggleBitare  
the only operating functions of the device under this  
condition.  
Q3  
Sector Erase Timer  
After the completion of the initial sector erase command  
sequence, the sector erase time-out will begin. Q3 will  
remain low until the time-out is complete. Data Polling  
and Toggle Bit are valid after the initial sector erase  
command sequence.  
If this time-out condition occurs during sector erase  
operation, it specifies that a particular sector is bad and  
it may not be reused. However, other sectors are still  
functional and may be used for the program or erase  
operation. The device must be reset to use other  
sectors. Write the Reset command sequence to the  
device, and then execute program or erase command  
sequence. Thisallowsthesystemtocontinuetousethe  
other active sectors in the device.  
If Data Polling or the Toggle Bit indicates the device has  
been written with a valid erase command, Q3 may be  
usedtodetermineifthesectorerasetimerwindowisstill  
open. If Q3 is high ("1") the internally controlled erase  
cycle has begun; attempts to write subsequent  
commands to the device will be ignored until the erase  
operation is completed as indicated by Data Polling or  
Toggle Bit. If Q3 is low ("0"), the device will accept  
additional sector erase commands. To insure the  
command has been accepted, the system software  
shouldcheckthestatusofQ3priortoandfollowingeach  
subsequent sector erase command. If Q3 were high on  
the second status check, the command may not have  
been accepted.  
If this time-out condition occurs during the chip erase  
operation, it specifies that the entire chip is bad or  
combination of sectors are bad.  
If this time-out condition occurs during the byte  
programmingoperation,itspecifiesthattheentiresector  
containing that byte is bad and this sector maynot be  
reused, (other sectors are still functional and can be  
reused).  
The time-out condition may also appear if a user tries to  
program a non blank location without erasing. In this  
case the device locks out and never completes the  
Automatic Algorithm operation. Hence, the system  
never reads a valid data on Q7 bit and Q6 never stops  
toggling. Once the Device has exceeded timing limits,  
the Q5 bit will indicate a "1". Please note that this is not  
adevicefailureconditionsincethedevicewasincorrectly  
used.  
WRITE PULSE "GLITCH" PROTECTION  
Noise pulses of less than 5ns(typical) on CE or WE will  
not initiate a write cycle.  
LOGICAL INHIBIT  
Writing is inhibited by holding any one of OE = VIL, CE  
= VIH or WE = VIH. To initiate a write cycle CE and WE  
must be a logical zero while OE is a logical one.  
DATA PROTECTION  
POWER SUPPLY DECOUPLING  
TheMX29F004T/Bisdesignedtoofferprotectionagainst  
accidental erasure or programming caused by spurious  
system level signals that may exist during power  
transition. During power up the device automatically  
resets the state machine in the Read mode. In addition,  
In order to reduce power switching effect, each device  
should have a 0.1uF ceramic capacitor connected  
between its VCC and GND.  
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It is also possible to determine if the chip is unprotected  
in the system by writing the Read Silicon ID command.  
PerformingareadoperationwithA1=VIH,itwillproduce  
00H at data outputs(Q0-Q7) for an unprotected sector.  
It is noted that all sectors are unprotected after the chip  
unprotect algorithm is completed.  
CHIP PROTECTION WITH 12V SYSTEM  
TheMX29F004T/Bfeatureshardwaresectorprotection.  
This feature will disable both program and erase  
operations for these sectors protected. To activate this  
mode, the programming equipment must force VID on  
address pin A9 and control pin OE, (suggest VID = 12V)  
A6 = VIL and CE = VIL.(see Table 2) Programming of  
the protection circuitry begins on the falling edge of the  
WE pulse and is terminated on the rising edge. Please  
refer to chip protect algorithm and waveform.  
POWER-UP SEQUENCE  
TheMX29F004T/BpowersupintheReadonlymode. In  
addition, thememorycontentsmayonlybealteredafter  
successful completion of the predefined command  
sequences.  
To verify programming of the protection circuitry, the  
programming equipment must force VID on address pin  
A9(withCEandOEatVILandWEatVIH). WhenA1=1,  
it will produce a logical "1" code at device output Q0 for  
a protected sector. Otherwise the device will produce  
00H for the unprotected sector. In this mode, the  
addresses, except for A1, are don't care. Address  
locationswithA1=VILarereservedtoreadmanufacturer  
and device codes.(Read Silicon ID)  
CHIP PROTECTION WITHOUT 12V SYSTEM  
The MX29F004T/B also feature a hardware chip  
protectionmethodinasystemwithout12Vpowersuppply.  
The programming equipment do not need to supply 12  
volts to protect all sectors. The details are shown in chip  
protect algorithm and waveform.  
It is also possible to determine if chip is protected in the  
system by writing a Read Silicon ID command.  
PerformingareadoperationwithA1=VIH,itwillproduce  
a logical "1" at Q0 for the protected sector.  
CHIP UNPROTECT WITHOUT 12V SYSTEM  
The MX29F004T/B also feature a hardware chip  
unprotection method in a system without 12V power  
supply. The programming equipment do not need to  
supply 12 volts to unprotect all sectors. The details are  
shown in chip unprotect algorithm and waveform.  
CHIP UNPROTECT WITH 12V SYSTEM  
The MX29F004T/B also features the chip unprotect  
mode, so that all sectors are unprotected after chip  
unprotect is completed to incorporate any changes in  
the code.  
To activate this mode, the programming equipment  
must force VID on control pin OE and address pin A9.  
The CE pins must be set at VIL. Pins A6 must be set to  
VIH.(seeTable2) Refertochipunprotect algorithmand  
waveform for the chip unprotect algorithm. The  
unprotection mechanism begins on the falling edge of  
the WE pulse and is terminated on the rising edge.  
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MX29F004T/B  
CAPACITANCE (TA = 25oC, f = 1.0 MHz)  
SYMBOL  
CIN  
PARAMETER  
MIN.  
TYP  
MAX.  
8
UNIT  
pF  
CONDITIONS  
VIN = 0V  
Input Capacitance  
Output Capacitance  
COUT  
12  
pF  
VOUT = 0V  
READ OPERATION  
DC CHARACTERISTICS (TA = 0°C TO 70°C, VCC = 5V±10%)  
SYMBOL PARAMETER  
MIN.  
TYP  
MAX.  
1
UNIT  
µA  
CONDITIONS  
ILI  
Input Leakage Current  
VIN = GND to VCC  
VOUT = GND to VCC  
CE = VIH  
ILO  
Output Leakage Current  
Standby VCC current  
10  
1
µA  
ISB1  
ISB2  
ICC1  
ICC2  
VIL  
mA  
µA  
1
5
CE = VCC + 0.3V  
IOUT = 0mA, f=1MH  
IOUT = 0mA, f=10MHz  
Operating VCC current  
30  
50  
V
mA  
mA  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
-0.3(NOTE 1) 0.8  
2.0  
VIH  
VCC + 0.3  
0.45  
V
V
V
VOL  
VOH  
IOL = 2.1mA  
IOH = -400uA  
2.4  
NOTES:  
1. VIL min. = -1.0V for pulse width 50 ns.  
VIL min. = -2.0V for pulse width 20 ns.  
2. VIH max. = VCC + 1.5V for pulse width 20 ns  
IfVIHisoverthespecifiedmaximumvalue, readoperation  
cannot be guaranteed.  
AC CHARACTERISTICS (TA = 0oC to 70oC, VCC = 5V±10%)  
29F004T/B-70 29F004T/B-90 29F004T/B-12  
SYMBOL PARAMETER  
MIN.  
MAX.  
70  
MIN. MAX.  
MIN. MAX.  
UNIT CONDITIONS  
tACC  
tCE  
tOE  
tDF  
Address to Output Delay  
90  
90  
40  
120  
120  
50  
ns  
ns  
ns  
ns  
ns  
CE=OE=VIL  
OE=VIL  
CE to Output Delay  
70  
OE to Output Delay  
40  
CE=VIL  
OE High to Output Float (Note1)  
Address to Output hold  
0
0
20  
0
0
30  
0
0
30  
CE=VIL  
tOH  
CE=OE=VIL  
TEST CONDITIONS:  
NOTE:  
Input pulse levels: 0.45V/2.4V  
1. tDF is defined as the time at which the output achieves the  
open circuit condition and data is no longer driven.  
Input rise and fall times: 10ns  
Output load: 1 TTL gate + 100pF (Including scope and jig)  
Reference levels for measuring timing: 0.8V, 2.0V  
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NOTICE:  
ABSOLUTE MAXIMUM RATINGS  
Stresses greater than those listed under ABSOLUTE  
MAXIMUM RATINGS may cause permanent damage to  
the device. This is a stress rating only and functional  
operational sections of this specification is not implied.  
Exposure to absolute maximum rating conditions for  
extended period may affect reliability.  
RATING  
VALUE  
Ambient Operating Temperature 0oC to 70oC  
Storage Temperature  
Applied Input Voltage  
Applied Output Voltage  
VCC to Ground Potential  
A9 & OE  
-65oC to 125oC  
-0.5V to 7.0V  
-0.5V to 7.0V  
-0.5V to 7.0V  
-0.5V to 13.5V  
NOTICE:  
Specifications contained within the following tables are  
subject to change.  
READ TIMING WAVEFORMS  
VIH  
ADD Valid  
Addresses  
VIL  
tCE  
VIH  
CE  
VIL  
VIH  
WE  
tDF  
VIL  
tOE  
VIH  
OE  
tACC  
VIL  
tOH  
HIGH Z  
HIGH Z  
VOH  
VOL  
Outputs  
DATA Valid  
COMMAND PROGRAMMING/DATA PROGRAMMING/ERASE OPERATION  
DC CHARACTERISTICS (TA = 0oC to 70oC, VCC = 5V±10%)  
SYMBOL  
ICC1 (Read)  
ICC2  
PARAMETER  
MIN.  
TYP  
MAX.  
30  
UNIT  
mA  
mA  
mA  
mA  
mA  
CONDITIONS  
Operating VCC Current  
IOUT=0mA, f=1MHz  
IOUT=0mA, F=10MHz  
In Programming  
50  
ICC3 (Program)  
ICC4 (Erase)  
ICCES  
50  
50  
In Erase  
VCC Erase Suspend Current  
2
CE=VIH, Erase Suspended  
NOTES:  
1. VIL min. = -0.6V for pulse width 20ns.  
3. ICCES is specified with the device de-selected. If the  
device is read during erase suspend mode, current draw is  
the sum of ICCES and ICC1 or ICC2.  
2. If VIH is over the specified maximum value, programming  
operation cannot be guranteed.  
4. All current are in RMS unless otherwise noted.  
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AC CHARACTERISTICS TA = 0oC to 70oC, VCC = 5V ± 10%  
29F004T/B-70 29F004T/B-90 29F004T/B-12  
SYMBOL PARAMETER  
MIN. MAX.  
MIN. MAX.  
MIN. MAX. UNIT CONDITIONS  
tOES  
tCWC  
tCEP  
tCEPH1  
tCEPH2  
tAS  
OE setup time  
50  
50  
50  
120  
50  
20  
20  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
s
Command programming cycle  
WE programming pulse width  
WE programming pluse width High  
WE programming pluse width High  
Address setup time  
70  
90  
35  
45  
20  
20  
20  
20  
0
0
tAH  
Address hold time  
45  
45  
50  
50  
0
tDS  
Data setup time  
30  
45  
tDH  
Data hold time  
0
0
tCES  
tCESC  
tDF  
CE setup time  
0
0
0
CE setup time before command write  
Output disable time (Note 1)  
Verify access time  
0
0
0
30  
40  
40  
tVA  
70  
4(TYP.)  
1(TYP.)  
7
90  
4(TYP.)  
1(TYP.)  
7
120  
tAETC  
tAETB  
tAVT  
tET  
Total erase time in auto chip erase  
Total erase time in auto block erase  
Total programming time in auto verify  
Standby time in erase  
4(TYP.)  
1(TYP.)  
s
7
µs  
ms  
µs  
µs  
ns  
ns  
µs  
µs  
µs  
ms  
10  
10  
10  
0.3  
80  
0
tBALC  
tBAL  
Block address load cycle  
Block address load time  
CE Hold Time  
0.3  
80  
0
30  
0.3  
80  
0
30  
30  
tCH  
tCS  
CE setup to WE going low  
Voltge Transition Time  
0
0
0
tVLHT  
tOESP  
tWPP1  
tWPP2  
4
4
4
OE Setup Time to WE Active  
Write pulse width for sector protect  
4
4
4
10  
10  
12  
10  
12  
Write pulse width for sector unprotect 12  
NOTES:  
1. tDF defined as the time at which the output achieves the  
open circuit condition and data is no longer driven.  
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SWITCHING TEST CIRCUITS  
DEVICE UNDER  
TEST  
1.8K ohm  
+5V  
CL  
6.2K ohm  
DIODES=IN3064  
OR EQUIVALENT  
CL=100pF Including jig capacitance  
SWITCHING TEST WAVEFORMS  
2.4V  
2.0V  
0.8V  
2.0V  
TEST POINTS  
0.8V  
0.45V  
INPUT  
OUTPUT  
AC TESTING: Inputs are driven at 2.4V for a logic "1" and 0.45V for a logic "0".  
Input pulse rise and fall times are <20ns.  
COMMAND WRITE TIMING WAVEFORM  
VCC  
5V  
VIH  
VIL  
Addresses  
ADD Valid  
tAH  
tAS  
VIH  
VIL  
WE  
CE  
tOES  
tCEPH1  
tCEP  
tCWC  
VIH  
VIL  
tCS  
tCH  
tDH  
VIH  
VIL  
OE  
tDS  
VIH  
VIL  
Data  
DIN  
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AUTOMATIC PROGRAMMING TIMING WAVEFORM  
bit checking after automatic verification starts. Device  
outputs DATA during programming and DATA after  
programming on Q7.(Q6 is for toggle bit; see toggle bit,  
DATA polling, timing waveform)  
One byte data is programmed. Verify in fast algorithm  
and additional programming by external control are not  
required because these operations are executed  
automatically by internal control circuit. Programming  
completion can be verified by DATA polling and toggle  
AUTOMATIC PROGRAMMING TIMING WAVEFORM  
Vcc 5V  
A11~A18  
ADD Valid  
2AAH  
555H  
ADD Valid  
tAVT  
A0~A10  
WE  
555H  
tAS  
tCWC  
tCEPH1  
tAH  
tCESC  
CE  
OE  
tCEP  
tDS tDH  
tDF  
Q0,Q1,  
DATA  
DATA  
Command In  
Command In  
Command In  
Data In  
Data In  
DATA polling  
Q4(Note 1)  
DATA  
Command In  
Command In  
Command In  
Q7  
Command #A0H  
Command #55H  
Command #AAH  
(Q0~Q7)  
tOE  
Notes:  
(1). Q6:Toggle bit, Q5:Timing-limit bit, Q3: Time-out bit, Q2: Toggle bit  
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AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART  
START  
Write Data AAH Address 555H  
Write Data 55H Address 2AAH  
Write Data A0H Address 555H  
Write Program Data/Address  
NO  
Toggle Bit Checking  
Q6 not Toggled  
YES  
NO  
Invalid  
Verify Byte Ok  
Command  
YES  
NO  
Q5 = 1  
Auto Program Completed  
YES  
Reset  
Auto Program Exceed  
Timing Limit  
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19  
INDEX  
MX29F004T/B  
AUTOMATIC CHIP ERASE TIMING WAVEFORM  
All data in chip are erased. External erase verification is  
not required because data is erased automatically by  
internal control circuit. Erasure completion can be  
verified by DATA polling and toggle bit checking after  
automaticerasestarts. Deviceoutputs0duringerasure  
and1aftererasureonQ7.(Q6isfortogglebit;seetoggle  
bit, DATA polling, timing waveform)  
AUTOMATIC CHIP ERASE TIMING WAVEFORM  
Vcc 5V  
A11~A18  
2AAH  
555H  
555H  
2AAH  
555H  
A0~A10  
WE  
555H  
tAS  
tCWC  
tAH  
tCEPH1  
tCESC  
tAETC  
CE  
OE  
tCEP  
tDF  
tDS tDH  
Q0,Q1,  
Command In  
Command In  
Command In  
Command In  
Command In  
Command In  
Q4(Note 1)  
DATA polling  
tDPA  
Command In  
Command In  
Command In  
Command In  
Command In  
Command In  
Q7  
Command #80H  
Command #AAH  
Command #55H  
Command #10H  
Command #AAH  
Command #55H  
(Q0~Q7)  
Notes:  
(1). Q6:Toggle bit, Q5:Timing-limit bit, Q3: Time-out bit, Q2: Toggle bit  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
20  
INDEX  
MX29F004T/B  
AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART  
START  
Write Data AAH Address 555H  
Write Data 55H Address 2AAH  
Write Data 80H Address 555H  
Write Data AAH Address 555H  
Write Data 55H Address 2AAH  
Write Data 10H Address 555H  
NO  
Toggle Bit Checking  
Q6 not Toggled  
YES  
NO  
Invalid  
DATA Polling  
Q7 = 1  
Command  
YES  
NO  
Q5 = 1  
Auto Chip Erase Completed  
Reset  
Auto Chip Erase Exceed  
Timing Limit  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
21  
INDEX  
MX29F004T/B  
AUTOMATIC BLOCK ERASE TIMING WAVEFORM  
checking after automatic erase starts. Device outputs 0  
during erasure and 1 after erasure on Q7.(Q6 is for  
togglebit;seetogglebit,DATApolling,timingwaveform)  
BlockdataindicatedbyA16toA18areerased. External  
erase verify is not required because data are erased  
automatically by internal control circuit. Erasure com-  
pletion can be verified by DATA polling and toggle bit  
AUTOMATIC BLOCK ERASE TIMING WAVEFORM  
Vcc 5V  
Block  
Block  
Block  
A16~A18  
Address 0  
Address 1  
Address N  
2AAH  
555H  
555H  
2AAH  
A0~A10  
WE  
555H  
tAS  
tCWC  
tAH  
tBAL  
tCESC  
tCEPH1  
tCEPH2  
tAETB  
CE  
OE  
tCEP  
tDF  
tDS tDH  
Command In  
Q0,Q1,  
Command In  
Command In  
Command In  
Command In  
Command In  
Command In  
Command In  
Command In  
Q4(Note 1)  
DATA polling  
tDPA  
Command In  
Command In  
Command In  
Command In  
Command In  
Command In  
Command In  
Q7  
Command #30H  
Command #80H  
Command #AAH  
Command #55H  
Command #30H  
Command #30H  
Command #AAH  
(Q0~Q7)  
Command #55H  
Notes:  
(1). Q6:Toggle bit, Q5:Timing-limit bit, Q3: Time-out bit, Q2: Toggle bit  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
22  
INDEX  
MX29F004T/B  
AUTOMATIC BLOCK ERASE ALGORITHM FLOWCHART  
START  
Write Data AAH Address 555H  
Write Data 55H Address 2AAH  
Write Data 80H Address 555H  
Write Data AAH Address 555H  
Write Data 55H Address 2AAH  
Write Data 30H Sector Address  
NO  
Toggle Bit Checking  
Invalid Command  
Q6 Toggled ?  
YES  
Load Other Sector Addrss If Necessary  
(Load Other Sector Address)  
NO  
Last Block  
to Erase  
YES  
NO  
NO  
Time-out Bit  
Checking Q3=1 ?  
YES  
Toggle Bit Checking  
Q6 not Toggled  
YES  
Q5 = 1  
DATA Polling  
Q7 = 1  
Reset  
Auto Block Erase Completed  
Auto Block Erase Exceed  
Timing Limit  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
23  
INDEX  
MX29F004T/B  
ERASE SUSPEND/ERASE RESUME FLOWCHART  
START  
Write Data B0H  
NO  
Toggle Bit checking Q6  
not toggled  
YES  
Read Array or  
Program  
Reading or  
NO  
Programming End  
YES  
Write Data 30H  
Continue Erase  
Another  
NO  
Erase Suspend ?  
YES  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
24  
INDEX  
MX29F004T/B  
TIMING WAVEFORM FOR CHIP PROTECTION FOR SYSTEM WITH 12V  
A1  
A6  
12V  
5V  
A9  
tVLHT  
tVLHT  
Verify  
12V  
5V  
OE  
tVLHT  
tWPP 1  
WE  
CE  
tOESP  
Data  
01H  
tOE  
TIMING WAVEFORM FOR CHIP UNPROTECTION FOR SYSTEM WITH 12V  
A1  
12V  
5V  
A9  
tVLHT  
A6  
Verify  
12V  
5V  
OE  
tVLHT  
tVLHT  
tWPP 2  
WE  
tOESP  
CE  
Data  
00H  
tOE  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
25  
INDEX  
MX29F004T/B  
SECTOR PROTECTION ALGORITHM FOR SYSTEM WITH 12V  
START  
PLSCNT=1  
OE=VID,A9=VID,CE=VIL  
A6=VIL  
Activate WE Pulse  
Time Out 10us  
Set WE=VIH, CE=OE=VIL  
A9 should remain VID  
Read Data with A1=1  
No  
No  
Data=01H?  
Yes  
PLSCENT=32?  
Yes  
Remove VID from A9  
Write Reset Command  
Device Failed  
Chip Protection  
Complete  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
26  
INDEX  
MX29F004T/B  
CHIP UNPROTECTION ALGORITHM FOR SYSTEM WITH 12V  
START  
PLSCNT=1  
Set OE=A9=VID  
CE=VIL, A6=1  
Activate WE Pulse  
Time Out 12ms  
Increment  
PLSCENT  
Set OE=CE=VIL  
A9=VID, A1=1  
Read Data from Device  
No  
No  
Data=00H?  
Yes  
PLSCENT=1000?  
Yes  
Remove VID from A9  
Write reset Command  
Device Failed  
Chip Unprotect  
Complete  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
27  
INDEX  
MX29F004T/B  
TIMING WAVEFORM FOR CHIP PROTECTION FOR SYSTEM WITHOUT 12V  
A1  
A6  
5V  
5V  
A9  
Q6 Toggle bit polling  
Verify  
OE  
tCEP  
WE  
CE  
*See following Note  
Don't  
Care  
Data  
01H  
tOE  
Note: Must issue "unlock for chip protect/unprotect" command  
before sector protection for a system without 12V provided.  
TIMING WAVEFORM FOR CHIP UNPROTECTION FOR SYSTEM WITHOUT 12V  
A1  
5V  
A9  
A6  
Q6 Toggle bit polling  
Verify  
5V  
OE  
tCEP  
WE  
*See following Note  
CE  
Don't  
Care  
Data  
00H  
tOE  
Note: Must issue "unlock for chip protect/unprotect" command  
before chip unprotection for a system without 12V provided.  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
28  
INDEX  
MX29F004T/B  
SECTOR PROTECTION ALGORITHM FOR SYSTEM WITHOUT 12V  
START  
PLSCNT=1  
Write "unlock for chip protect/unprotect"  
Command(Table1)  
OE=VIH, A9=VIH  
CE=VIL, A6=VIL  
Activate WE Pulse to start  
Data don't care  
No  
Toggle bit checking  
Q6 not Toggled  
Yes  
Increment PLSCNT  
Set CE=OE=VIL  
A9=VIH  
Read Data from chip,  
A1=1  
No  
No  
Data=01H?  
PLSCENT=32?  
Yes  
Write Reset Command  
Device Failed  
Chip Protection  
Complete  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
29  
INDEX  
MX29F004T/B  
CHIP UNPROTECTION ALGORITHM FOR SYSTEM WITHOUT 12V  
START  
PLSCNT=1  
Write "unlock for chip protect/unprotect"  
Command (Table 1)  
Set OE=A9=VIH  
CE=VIL, A6=1  
Active WE Pulse to start  
Data don't care  
Increment  
PLSCENT  
No  
Toggle bit checking  
Q6 not Toggled  
Yes  
Set OE==CE=VIL,  
A9=VIH, A1=1  
No  
Read Data from Device  
No  
PLSCENT=1000?  
Data=00H?  
Yes  
Yes  
Device Failed  
Write Reset Command  
Chip Unprotect  
Complete  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
30  
INDEX  
MX29F004T/B  
ID CODE READ TIMING WAVEFORM  
VCC  
5V  
VID  
ADD  
A9  
VIH  
VIL  
VIH  
VIL  
ADD  
A0  
tACC  
tACC  
VIH  
VIL  
A1  
ADD  
A2-A8  
VIH  
A10-A17 VIL  
CE  
VIH  
VIL  
VIH  
VIL  
tCE  
WE  
OE  
tOE  
VIH  
VIL  
tDF  
tOH  
tOH  
VIH  
VIL  
DATA  
Q0-Q7  
DATA OUT  
C2H  
DATA OUT  
58H/59H  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
31  
INDEX  
MX29F004T/B  
ORDERING INFORMATION  
PLASTIC PACKAGE  
(Top Boot Sector as an example, For Bottom Boot Sector ones, MX29F004TXX will be changed to MX29F004Bxx)  
PART NO.  
ACCESS  
OPERATING CURRENT  
STANDBY CURRENT PACKAGE  
TIME (ns) MAX.(mA)  
MAX.(µA)  
MX29F004TQC-70  
MX29F004TQC-90  
MX29F004TQC-12  
MX29F004TTC-70  
70  
50  
50  
50  
50  
100  
100  
100  
100  
32 Pin PLCC  
32 Pin PLCC  
32 Pin PLCC  
32 Pin TSOP  
(Normal Type)  
32 Pin TSOP  
(Normal Type)  
32 Pin TSOP  
(Normal Type)  
32 Pin TSOP  
(Reverse Type)  
32 Pin TSOP  
(Reverse Type)  
32 Pin TSOP  
(Reverse Type)  
32 Pin PDIP  
90  
120  
70  
MX29F004TTC-90  
MX29F004TTC-12  
MX29F004TRC-70  
MX29F004TRC-90  
MX29F004TRC-12  
90  
50  
50  
50  
50  
50  
100  
100  
100  
100  
100  
120  
70  
90  
120  
MX29F004TPC-70  
MX29F004TPC-90  
MX29F004TPC-120  
70  
50  
50  
50  
100  
100  
100  
90  
32 Pin PDIP  
120  
32 Pin PDIP  
P/N:PM0554  
REV. 0.4, AUG. 01, 1998  
32  
INDEX  
MX29F004T/B  
MACRONIX INTERNATIONAL CO., LTD.  
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http : //www.macronix.com  
MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice.  
33  

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