MX29LV017BTI-90 [Macronix]

16M-BIT [2Mx8] CMOS SINGLE VOLTAGE 3V ONLY FLASH MEMORY; 16M - BIT [ 2Mx8 ] CMOS单电压3V仅限于Flash存储器
MX29LV017BTI-90
型号: MX29LV017BTI-90
厂家: MACRONIX INTERNATIONAL    MACRONIX INTERNATIONAL
描述:

16M-BIT [2Mx8] CMOS SINGLE VOLTAGE 3V ONLY FLASH MEMORY
16M - BIT [ 2Mx8 ] CMOS单电压3V仅限于Flash存储器

存储
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中文:  中文翻译
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MX29LV017B  
16M-BIT[2Mx8]CMOSSINGLEVOLTAGE  
3VONLYFLASHMEMORY  
FEATURES  
• Status Reply  
• Extended single - supply voltage range 2.7V to 3.6V  
• 2,097,152 x 8  
- Data# Polling & Toggle bit for detection of program  
anderaseoperationcompletion.  
• Singlepowersupplyoperation  
• Ready/Busy# pin (RY/BY#)  
- 3.0V only operation for read, erase and program  
operation  
-Providesahardwaremethodofdetectingprogramor  
eraseoperationcompletion.  
• Fast access time: 70/90ns  
• Sectorprotection  
• Fully compatible with MX29LV017A decice  
• Lowpowerconsumption  
- Hardware method to disable any combination of  
sectors from program or erase operations  
-Temporarysectorunprotectallowscodechangesin  
previously locked sectors.  
- 30mA maximum active current  
- 0.2uA typical standby current  
• Commandregisterarchitecture  
- Byte Programming (9us typical)  
- Sector Erase (Sector structure 64K-Byte x32)  
• Auto Erase (chip & sector) and Auto Program  
-Automaticallyeraseanycombinationofsectorswith  
Erase Suspend capability.  
• CFI (Common Flash Interface) compliant  
- Flash device parameters stored on the device and  
provide the host system to access  
• 100,000minimumerase/programcycles  
• Latch-up protected to 100mA from -1V to VCC+1V  
• Low VCC write inhibit is equal to or less than 1.4V  
• Package type:  
- Automatically program and verify data at specified  
address  
- 40-pin TSOP  
• Erasesuspend/EraseResume  
- Suspends sector erase operation to read data from,  
orprogramdatato,any sectorthatisnotbeingerased,  
then resumes the erase.  
• Compatibility with JEDEC standard  
- Pinout and software compatible with single-power  
supply Flash  
GENERAL DESCRIPTION  
The MX29LV017B is a 16-mega bit Flash memory orga-  
nized as 2M bytes of 8 bits. MXIC's Flash memories  
offer the most cost-effective and reliable read/write non-  
volatile random access memory. The MX29LV017B is  
packaged in 40-pin TSOP. It is designed to be repro-  
grammed and erased in system or in standard EPROM  
programmers.  
TTL level control inputs and fixed power supply levels  
during erase and programming, while maintaining maxi-  
mum EPROM compatibility.  
MXIC Flash technology reliably stores memory contents  
even after 100,000 erase and program cycles. The MXIC  
cell is designed to optimize the erase and programming  
mechanisms. In addition, the combination of advanced  
tunnel oxide processing and low internal electric fields  
for erase and program operations produces reliable cy-  
cling. The MX29LV017B uses a 2.7V~3.6VVCC supply  
to perform the High Reliability Erase and auto Program/  
Erase algorithms.  
The standard MX29LV017B offers access time as fast  
as 70ns, allowing operation of high-speed microproces-  
sors without wait states. To eliminate bus contention,  
the MX29LV017B has separate chip enable (CE#) and  
output enable (OE#) controls.  
MXIC's Flash memories augment EPROM functionality  
with in-circuit electrical erasure and programming. The  
MX29LV017B uses a command register to manage this  
functionality. The command register allows for 100%  
The highest degree of latch-up protection is achieved  
with MXIC's proprietary non-epi process. Latch-up pro-  
tection is proved for stresses up to 100 milliamperes on  
address and data pin from -1V to VCC + 1V.  
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MX29LV017B  
PIN CONFIGURATIONS  
PIN DESCRIPTION  
40 TSOP (Standard Type) (10mm x 20mm)  
SYMBOL PIN NAME  
A0~A20 Address Input  
A16  
A15  
A14  
A13  
A12  
A11  
A9  
1
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
A17  
GND  
A20  
A19  
A10  
Q7  
2
Q0~Q7  
CE#  
Data Input/Output  
Chip Enable Input  
Write Enable Input  
3
4
5
6
WE#  
7
Q6  
A8  
8
Q5  
RESET# Hardware Reset Pin/Sector Protect Unlock  
OE# Output Enable Input  
RY/BY# Ready/Busy Output  
WE#  
RESET#  
NC  
9
Q4  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
VCC  
VCC  
NC  
MX29LV017B  
RY/BY#  
A18  
A7  
Q3  
VCC  
GND  
Power Supply Pin (2.7V~3.6V)  
Ground Pin  
Q2  
A6  
Q1  
A5  
Q0  
A4  
OE#  
GND  
CE#  
A0  
A3  
A2  
A1  
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MX29LV017B  
BLOCK STRUCTURE  
Table 1: MX29LV017B SECTOR ARCHITECTURE  
Sector  
SA0  
A20  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
A19  
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
A18  
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
A17  
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
A16  
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Address Range (in hexadecimal)  
000000-00FFFF  
010000-01FFFF  
020000-02FFFF  
030000-03FFFF  
040000-04FFFF  
050000-05FFFF  
060000-06FFFF  
070000-07FFFF  
080000-08FFFF  
090000-09FFFF  
0A0000-0AFFFF  
0B0000-0BFFFF  
0C0000-0CFFFF  
0D0000-0DFFFF  
0E0000-0EFFFF  
0F0000-0FFFFF  
100000-10FFFF  
110000-11FFFF  
120000-12FFFF  
130000-13FFFF  
140000-14FFFF  
150000-15FFFF  
160000-16FFFF  
170000-17FFFF  
180000-18FFFF  
190000-19FFFF  
1A0000-1AFFFF  
1B0000-1BFFFF  
1C0000-1CFFFF  
1D0000-1DFFFF  
1E0000-1EFFFF  
1F0000-1FFFFF  
SA1  
SA2  
SA3  
SA4  
SA5  
SA6  
SA7  
SA8  
SA9  
SA10  
SA11  
SA12  
SA13  
SA14  
SA15  
SA16  
SA17  
SA18  
SA19  
SA20  
SA21  
SA22  
SA23  
SA24  
SA25  
SA26  
SA27  
SA28  
SA29  
SA30  
SA31  
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MX29LV017B  
BLOCK DIAGRAM  
WRITE  
STATE  
CE#  
OE#  
WE#  
CONTROL  
INPUT  
PROGRAM/ERASE  
HIGH VOLTAGE  
MACHINE  
(WSM)  
LOGIC  
RESET#  
STATE  
REGISTER  
ADDRESS  
LATCH  
FLASH  
ARRAY  
ARRAY  
A0-A20  
SOURCE  
HV  
AND  
COMMAND  
DATA  
BUFFER  
Y-PASS GATE  
DECODER  
PGM  
DATA  
HV  
SENSE  
AMPLIFIER  
COMMAND  
DATA LATCH  
PROGRAM  
DATA LATCH  
I/O BUFFER  
Q0-Q7  
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MX29LV017B  
dard microprocessor write timings. The device will auto-  
matically pre-program and verify the entire array. Then  
the device automatically times the erase pulse width,  
provides the erase verification, and counts the number  
of sequences. A status bit toggling between consecu-  
tive read cycles provides feedback to the user as to the  
status of the erasing operation.  
AUTOMATIC PROGRAMMING  
The MX29LV017B is byte programmable using the Au-  
tomatic Programming algorithm. The Automatic Pro-  
gramming algorithm makes the external system do not  
need to have time out sequence nor to verify the data  
programmed. The typical chip programming time at room  
temperature of the MX29LV017B is less than 18 sec-  
onds.  
Register contents serve as inputs to an internal state-  
machine which controls the erase and programming cir-  
cuitry. During write cycles, the command register inter-  
nally latches address and data needed for the program-  
ming and erase operations. During a system write cycle,  
addresses are latched on the falling edge, and data are  
latched on the rising edge of WE# or CE#, whichever  
happens first.  
AUTOMATIC PROGRAMMING ALGORITHM  
MXIC's Automatic Programming algorithm requires the  
user to only write program set-up commands (including  
2 unlock write cycle and A0H) and a program command  
(program data and address). The device automatically  
times the programming pulse width, provides the pro-  
gram verification, and counts the number of sequences.  
A status bit similar to Data# Polling and a status bit  
toggling between consecutive read cycles, provide feed-  
back to the user as to the status of the programming  
operation. Refer to write operation status, Table 7, for  
more information on these status bits.  
MXIC's Flash technology combines years of EPROM  
experience to produce the highest levels of quality, reli-  
ability, and cost effectiveness. The MX29LV017B elec-  
trically erases all bits simultaneously using Fowler-  
Nordheim tunneling. The bytes are programmed by us-  
ing the EPROM programming mechanism of hot elec-  
tron injection.  
During a program cycle, the state-machine will control  
the program sequences and command register will not  
respond to any command set. During a Sector Erase  
cycle, the command register will only respond to Erase  
Suspend command. After Erase Suspend is completed,  
the device stays in read mode. After the state machine  
has completed its task, it will allow the command regis-  
ter to respond to its full command set.  
AUTOMATIC CHIP ERASE  
The entire chip is bulk erased using 10 ms erase pulses  
according to MXIC's Automatic Chip Erase algorithm.  
Typical erasure at room temperature is accomplished in  
less than 25 second. The Automatic Erase algorithm  
automatically programs the entire array prior to electri-  
cal erase. The timing and verification of electrical erase  
are controlled internally within the device.  
AUTOMATIC SELECT  
AUTOMATIC SECTOR ERASE  
The automatic select mode provides manufacturer and  
device identification, and sector protection verification,  
through identifier codes output on Q7~Q0.This mode is  
mainly adapted for programming equipment on the de-  
vice to be programmed with its programming algorithm.  
When programming by high voltage method, automatic  
select mode requires VID (11.5V to 12.5V) on address  
pin A9. Other address pin A6, A1 and A0 as referring to  
Table 2.In addition, to access the automatic select codes  
in-system, the host can issue the automatic select com-  
mand through the command register without requiring  
VID, as shown in Table 4.  
The MX29LV017B is sector(s) erasable using MXIC's  
Auto Sector Erase algorithm. The Automatic Sector  
Erase algorithm automatically programs the specified  
sector(s) prior to electrical erase. The timing and verifi-  
cation of electrical erase are controlled internally within  
the device. An erase operation can erase one sector,  
multiple sectors, or the entire device.  
AUTOMATIC ERASE ALGORITHM  
MXIC's Automatic Erase algorithm requires the user to  
write commands to the command register using stan-  
To verify whether or not sector being protected, the sec-  
tor address must appear on the appropriate highest or-  
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MX29LV017B  
der address bit (seeTable 1).The rest of address bits, as  
shown inTable 2, are don't care.Once all necessary bits  
have been set as required, the programming equipment  
may read the corresponding identifier code on Q7~Q0.  
TABLE 2. MX29LV017B AUTOMATIC SELECT MODE BUS OPERATION (A9=VID)  
A20 A15 A9 A8 A6 A5 A1 A0  
Description  
CE# OE# WE# RE-  
|
|
|
A7  
X
|
A2  
X
Q7~Q0  
C2H  
SET# A16 A10  
Read Silicon ID  
Manufacturer Code  
Read Silicon ID  
(Device Code)  
L
L
L
L
H
H
H
H
X
X
X
X
VID  
VID  
L
L
L
L
L
X
X
X
X
H
C8H  
01H  
Sector Protection  
Verification  
L
L
H
H
SA  
X
VID  
L
H
L
(protected)  
00H  
(unprotected)  
Note : SA=Sector Address, X=Don't Care, L=Logic Low, H=Logic High  
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MX29LV017B  
The single cycle Query command is valid only when the  
device is in the Read mode, including Erase Suspend,  
Standby mode, and Automatic Select mode; however, it  
is ignored otherwise.  
QUERY COMMAND AND COMMON FLASH  
INTERFACE(CFI) MODE  
MX29LV017B is capable of operating in the CFI mode.  
This mode all the host system to determine the manu-  
facturer of the device such as operating parameters and  
configuration.Two commands are required in CFI mode.  
Query command of CFI mode is placed first, then the  
Reset command exits CFI mode. These are described  
in Table 3.  
The Reset command exits from the CFI mode to the  
Read mode, or Erase Suspend mode, or Automatic Se-  
lect mode. The command is valid only when the device  
is in the CFI mode.  
Table 3-1. CFI mode: Identification Data Values  
(All values in these tables are in hexadecimal)  
Description  
Address  
10  
Data  
51  
52  
59  
02  
00  
40  
00  
00  
00  
00  
00  
Query-unique ASCII string "QRY"  
11  
12  
Primary vendor command set and control interface ID code  
Address for primary algorithm extended query table  
13  
14  
15  
16  
Alternate vendor command set and control interface ID code (none)  
Address for secondary algorithm extended query table (none)  
17  
18  
19  
1A  
Table 3-2. CFI Mode: System Interface Data Values  
(All values in these tables are in hexadecimal)  
Description  
Address  
1B  
1C  
1D  
1E  
1F  
Data  
27  
36  
00  
00  
04  
00  
0A  
00  
05  
00  
04  
00  
VCC supply, minimum (2.7V)  
VCC supply, maximum (3.6V)  
VPP supply, minimum (none)  
VPP supply, maximum (none)  
Typical timeout for single word/byte write (2N us)  
Typical timeout for Minimum size buffer write (2N us) (not supported)  
Typical timeout for individual sector erase (2N ms)  
Typical timeout for full chip erase (2N ms)  
Maximum timeout for single word/byte write times (2N X Typ)  
Maximum timeout for buffer write times (2N X Typ)  
Maximum timeout for individual sector erase times (2N X Typ)  
Maximum timeout for full chip erase times (not supported)  
20  
21  
22  
23  
24  
25  
26  
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MX29LV017B  
Table 3-3. CFI Mode: Device Geometry Data Values  
(All values in these tables are in hexadecimal)  
Description  
Device size (2N bytes)  
Address  
27  
Data  
15  
00  
00  
00  
00  
01  
1F  
00  
00  
01  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
00  
Flash device interface code (asynchronous x 8)  
28  
29  
Maximum number of bytes in multi-byte write (not supported)  
2A  
2B  
2C  
2D  
2E  
2F  
30  
Number of erase sector regions  
Erase sector region 1 information (refer to the CFI publication 100)  
Erase sector region 2 information  
Erase sector region 3 information  
Erase sector region 4 information  
31  
32  
33  
34  
35  
36  
37  
38  
39  
3A  
3B  
3C  
Table 3-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values  
(All values in these tables are in hexadecimal)  
Description  
Address  
40  
Data  
50  
52  
49  
31  
30  
01  
02  
01  
01  
04  
00  
00  
00  
Query-unique ASCII string "PRI"  
41  
42  
Major version number, ASCII  
43  
Minor version number, ASCII  
44  
Address sensitive unlock (0=required, 1= not required)  
Erase suspend (2= to read and write)  
Sector protect (N= # of sectors/group)  
Temporarysectorunprotect(1=supported)  
Sector protect/chip unprotect scheme  
SimultaneousR/Woperation(0=notsupported)  
Burst mode type (0=not supported)  
Page mode type (0=not supported)  
45  
46  
47  
48  
49  
4A  
4B  
4C  
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MX29LV017B  
in the improper sequence will reset the device to the  
read mode. Table 4 defines the valid register command  
sequences. Note that the Erase Suspend (B0H) and  
Erase Resume (30H) commands are valid only while the  
Sector Erase operation is in progress.  
COMMAND DEFINITIONS  
Device operations are selected by writing specific ad-  
dress and data sequences into the command register.  
Writing incorrect address and data values or writing them  
TABLE 4. MX29LV017B COMMAND DEFINITIONS  
First Bus  
Bus Cycle  
Cycle Addr Data Addr  
Second Bus Third Bus  
Fourth Bus  
Cycle  
Fifth Bus  
Cycle  
Sixth Bus  
Cycle  
Command  
Cycle  
Cycle  
Data Addr  
Data Addr Data Addr  
Data Addr Data  
Reset  
1
1
4
4
XXXH F0H  
RA RD  
XXXH AAH XXXH 55H XXXH 90H ADI  
Read  
Read Silicon ID  
Sector Protect  
Verify  
DDI  
XXXH AAH XXXH 55H XXXH 90H (SA) 00H  
x02H 01H  
Byte Program  
Chip Erase  
4
6
6
1
1
1
XXXH AAH XXXH 55H XXXH A0H PA  
PD  
XXXH AAH XXXH 55H XXXH 80H XXXH AAH XXXH 55H  
XXXH 10H  
SA 30H  
Sector Erase  
Sector Erase Suspend  
Sector Erase Resume  
CFI Query  
XXXH AAH XXXH 55H XXXH 80H XXXH AAH XXXH 55H  
XXXH B0H  
XXXH 30H  
XXXH 98  
Notes:  
1. ADI = Address of Device identifier; A1=0, A0 = 0 for manufacturer code,A1=0, A0 = 1 for device code. A2-A20=do  
not care.  
(Refer to table 2)  
DDI = Data of Device identifier : C2H for manufacture code, C8H for device code.  
X = X can be VIL or VIH  
RA=Address of memory location to be read. RD=Data to be read at location RA.  
2. PA = Address of memory location to be programmed.  
PD = Data to be programmed at location PA.  
SA = Address of the sector to be erased.  
3. For Sector ProtectVerify operation:If read out data is 01H, it means the sector has been protected. If read out data  
is 00H, it means the sector is still not being protected.  
4. Any number of CFI data read cycles are permitted.  
5. The reset command is required to return to the read mode when the device is in the automatic select mode or if Q5  
goes high.  
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MX29LV017B  
TABLE 5. MX29LV017B BUS OPERATION  
ADDRESS  
DESCRIPTION  
CE# OE# WE# RESET# A20 A15 A9 A8 A6 A5 A1 A0 Q0~Q7  
A16 A10  
A7  
AIN  
AIN  
X
A2  
Read  
L
L
L
H
X
X
H
H
L
H
Dout  
DIN(3)  
High Z  
DIN  
Write  
H
Reset  
X
X
L
X
X
H
X
L
L
VID  
Temporary sector unlock  
Output Disable  
Standby  
AIN  
X
H
High Z  
High Z  
DIN  
VCC±0.3V X  
VCC±0.3V  
VID  
X
Sector Protect  
Chip Unprotect  
Sector Protection Verify  
L
L
L
H
H
L
SA  
X
X
X
X
X
X
X
L
H
L
X
X
X
H
H
H
L
L
L
VID  
X
DIN  
H
H
SA  
VID  
X
L CODE(5)  
Notes :  
1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 4.  
2. VID is the high voltage, 11.5V to 12.5V.  
3. Refer to Table 4 for valid Data-In during a write operation.  
4. X can be VIL or VIH.  
5. Code=00H means unprotected.  
Code=01H means protected.  
6. A20~A16=Sector address for sector protect.  
7. The sector protect and chip unprotect functions may also be implemented via programming equipment.  
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MX29LV017B  
Characteristics" section contains timing specification  
table and timing diagrams for write operations.  
REQUIREMENTS FOR READING ARRAY  
DATA  
To read array data from the outputs, the system must  
drive the CE# and OE# pins to VIL. CE# is the power  
control and selects the device. OE# is the output control  
and gates array data to the output pins.WE# should remain  
at VIH.  
STANDBY MODE  
When using both pins of CE# and RESET#, the device  
enter CMOS Standby with both pins held atVCC± 0.3V.  
If CE# and RESET# are held at VIH, but not within the  
range ofVCC ±0.3V, the device will still be in the standby  
mode, but the standby current will be larger.During Auto  
Algorithm operation, VCC active current (ICC2) is re-  
quired even CE# = "H" until the operation is completed.  
The device can be read with standard access time (tCE)  
from either of these standby modes, before it is ready to  
read data.  
The internal state machine is set for reading array data  
upon device power-up, or after a hardware reset. This  
ensures that no spurious alteration of the memory content  
occurs during the power transition. No command is  
necessary in this mode to obtain array data. Standard  
microprocessor read cycles that assert valid address on  
the device address inputs produce valid data on the device  
data outputs.The device remains enabled for read access  
until the command register contents are altered.  
OUTPUT DISABLE  
With the OE# input at a logic high level (VIH), output  
from the devices are disabled.This will cause the output  
pins to be in a high impedance state.  
WRITE COMMANDS/COMMAND SEQUENCES  
To program data to the device or erase sectors of memory  
, the system must drive WE# and CE# to VIL, and OE#  
to VIH.  
RESET# OPERATION  
An erase operation can erase one sector, multiple sectors  
, or the entire device.Table indicates the address space  
that each sector occupies. A "sector address" consists  
of the address bits required to uniquely select a sector.  
The Writing specific address and data commands or  
sequences into the command register initiates device  
operations. Table 1 defines the valid register command  
sequences.Writing incorrect address and data values or  
writing them in the improper sequence resets the device  
to reading array data. Section has details on erasing a  
sector or the entire chip, or suspending/resuming the erase  
operation.  
The RESET# pin provides a hardware method of resetting  
the device to reading array data.When the RESET# pin  
is driven low for at least a period of tRP, the device  
immediately terminates any operation in progress,  
tristates all output pins, and ignores all read/write  
commands for the duration of the RESET# pulse. The  
device also resets the internal state machine to reading  
array data.The operation that was interrupted should be  
re-initiated once the device is ready to accept another  
command sequence, to ensure data integrity.  
Current is reduced for the duration of the RESET# pulse.  
When RESET# is held at GND±0.3V, the device draws  
CMOS standby current (ICC4).If RESET# is held atVIL  
but not within GND±0.3V, the standby current will be  
greater.  
After the system writes the "read silicon-ID" and "sector  
protect verify" command sequence, the device enters  
the "read silicon-ID" and "sector protect verify" mode.  
The system can then read "read silicon-ID" and "sector  
protect verify" codes from the internal register (which is  
separate from the memory array) on Q7-Q0. Standard  
read cycle timings apply in this mode. Refer to the "read  
silicon-ID" and "sector protect verify" Mode and "read  
silicon-ID" and "sector protect verify" Command  
Sequence section for more information.  
The RESET# pin may be tied to system reset circuitry.  
A system reset would that also reset the Flash memory,  
enabling the system to read the boot-up firmware from  
the Flash memory.  
If RESET# is asserted during a program or erase  
operation, the RY/BY# pin remains a "0" (busy) until the  
internal reset operation is complete, which requires a  
ICC2 in the DC Characteristics table represents the active  
current specification for the write mode. The "AC  
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time of tREADY (during Embedded Algorithms). The  
system can thus monitor RY/BY# to determine whether  
the reset operation is complete. If RESET# is asserted  
when a program or erase operation is completed within a  
time of tREADY (not during Embedded Algorithms).The  
system can read data tRH after the RESET# pin returns  
to VIH.  
AUTOMATIC CHIP ERASE COMMANDS  
Chip erase is a six-bus cycle operation. There are two  
"unlock" write cycles. These are followed by writing the  
"set-up" command 80H. Two more "unlock" write cy-  
cles are then followed by the chip erase command 10H.  
The device does not require the system to entirely pre-  
program prior to executing the Automatic Chip Erase.  
Upon executing the Automatic Chip Erase, the device  
will automatically program and verify the entire memory  
for an all-zero data pattern. When the device is auto-  
matically verified to contain an all-zero pattern, a self-  
timed chip erase and verify begin. The erase and verify  
operations are completed when the data on Q7 is "1" at  
which time the device returns to the Read mode. The  
system is not required to provide any control or timing  
during these operations.  
Refer to the AC Characteristics tables for RESET#  
parameters and to Figure 22 for the timing diagram.  
READ/RESET COMMAND  
The read or reset operation is initiated by writing the  
read/reset command sequence into the command reg-  
ister. Microprocessor read cycles retrieve array data.  
The device remains enabled for reads until the command  
register contents are altered.  
When using the Automatic Chip Erase algorithm, note  
that the erase automatically terminates when adequate  
erase margin has been achieved for the memory array  
(no erase verification command is required).  
If program-fail or erase-fail happen, the write of F0H will  
reset the device to abort the operation. A valid com-  
mand must then be written to place the device in the  
desired state.  
If the Erase operation was unsuccessful, the data on  
Q5 is "1"(see Table 7), indicating the erase operation  
exceed internal timing limit.  
SILICON-ID READ COMMAND  
The automatic erase begins on the rising edge of the  
last WE# or CE# pulse, whichever happens first in the  
command sequence and terminates when either the data  
on Q7 is "1" at which time the device returns to the  
Read mode or the data on Q6 stops toggling for two  
consecutive read cycles at which time the device re-  
turns to the Read mode.  
Flash memories are intended for use in applications where  
the local CPU alters memory contents. As such, manu-  
facturer and device codes must be accessible while the  
device resides in the target system. PROM program-  
mers typically access signature codes by raising A9 to  
a high voltage (VID). However, multiplexing high volt-  
age onto address lines is not generally desired system  
design practice.  
The MX29LV017B contains a Silicon-ID-Read operation  
to supple traditional PROM programming methodology.  
The operation is initiated by writing the read silicon ID  
command sequence into the command register. Fol-  
lowing the command write, a read cycle with A1=VIL,  
A0=VIL retrieves the manufacturer code of C2H. A read  
cycle with A1=VIL, A0=VIH returns the device code of  
C8H for MX29LV017B.  
The system must write the reset command to exit the  
"Silicon-ID Read Command".  
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TABLE 6. SILICON ID CODE  
Pins  
A0  
A1  
Q7  
1
Q6  
1
Q5  
0
Q4  
0
Q3  
0
Q2  
0
Q1  
1
Q0  
0
Code(Hex)  
C2H  
Manufacturer code  
Device code  
Sector Protection  
Verification  
VIL VIL  
VIH VIL  
VIL VIH  
VIL VIH  
1
1
0
0
1
0
0
0
C8H  
0
0
0
0
0
0
0
1
01H (Protected)  
00H(Unprotected)  
0
0
0
0
0
0
0
0
READING ARRAY DATA  
RESET COMMAND  
The device is automatically set to reading array data  
after device power-up.No commands are required to re-  
trieve data.The device is also ready to read array data  
after completing an Automatic Program or Automatic  
Erase algorithm.  
Writing the reset command to the device resets the de-  
vice to reading array data.Address bits are don't care for  
this command.  
The reset command may be written between the se-  
quence cycles in an erase command sequence before  
erasing begins. This resets the device to reading array  
data.Once erasure begins, however, the device ignores  
reset commands until the operation is complete.  
After the device accepts an Erase Suspend command,  
the device enters the Erase Suspend mode. The sys-  
tem can read array data using the standard read tim-  
ings, except that if it reads at an address within erase-  
suspended sectors, the device outputs status data. Af-  
ter completing a programming operation in the Erase  
Suspend mode, the system may once again read array  
data with the same exception.See Erase Suspend/Erase  
Resume Commandsfor more information on this mode.  
The system must issue the reset command to re-en-  
able the device for reading array data if Q5 goes high, or  
while in the "read silicon-ID" and "sector protect verify"  
mode. See the "Reset Command" section, next.  
The reset command may be written between the se-  
quence cycles in a program command sequence be-fore  
programming begins. This resets the device to reading  
array data (also applies to programming in Erase Sus-  
pend mode). Once programming begins, however, the  
device ignores reset commands until the operation is  
complete.  
The reset command may be written between the se-  
quence cycles in an Automatic Select command se-  
quence. Once in the Automatic Select mode, the reset  
command must be written to return to reading array data  
(also applies to Automatic Select during Erase Suspend).  
If Q5 goes high during a program or erase operation, writ-  
ing the reset command returns the device to read-ing  
array data (also applies during Erase Suspend).  
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mand is issued during the sector erase operation, the  
device requires a maximum 20us to suspend the sector  
erase operation.However, when the Erase Suspend com-  
mand is written during the sector erase time-out, the  
device immediately terminates the time-out period and  
suspends the erase operation. After this command has  
been executed, the command register will initiate erase  
suspend mode. The state machine will return to read  
mode automatically after suspend is ready. At this time,  
state machine only allows the command register to re-  
spond to Erase Resume, program data to , or read data  
from any sector not selected for erasure.  
SECTOR ERASE COMMANDS  
The device does not require the system to entirely pre-  
program prior to executing the Automatic Sector Erase  
Set-up command and Automatic Sector Erase com-  
mand. Upon executing the Automatic Sector Erase com-  
mand, the device will automatically program and verify  
the sector(s) memory for an all-zero data pattern. The  
system is not required to provide any control or timing  
during these operations.  
When the sector(s) is automatically verified to contain  
an all-zero pattern, a self-timed sector erase and verify  
begin. The erase and verify operations are complete  
when either the data on Q7 is "1" at which time the de-  
vice returns to the Read mode or the data on Q6 stops  
toggling for two consecutive read cycles at which time  
the device returns to the Read mode. The system is not  
required to provide any control or timing during these  
operations.  
The system can determine the status of the program  
operation using the Q7 or Q6 status bits, just as in the  
standard program operation. After an erase-suspend pro-  
gram operation is complete, the system can once again  
read array data within non-suspended sectors.  
ERASE RESUME  
When using the Automatic Sector Erase algorithm, note  
that the erase automatically terminates when adequate  
erase margin has been achieved for the memory array  
(no erase verification command is required). Sector  
erase is a six-bus cycle operation. There are two "un-  
lock" write cycles. These are followed by writing the  
set-up command 80H. Two more "unlock" write cycles  
are then followed by the sector erase command 30H.  
The sector address is latched on the falling edge of WE#  
or CE#, whichever happens later, while the command  
(data) is latched on the rising edge of WE# or CE#, which-  
ever happens first. Sector addresses selected are  
loaded into internal register on the sixth falling edge of  
WE# or CE#, whichever happens later. Each succes-  
sive sector load cycle started by the falling edge of WE#  
or CE#, whichever happens later must begin within 50us  
from the rising edge of the preceding WE# or CE#, which-  
ever happens first. Otherwise, the loading period ends  
and internal auto sector erase cycle starts. (Monitor Q3  
to determine if the sector erase timer window is still open,  
see section Q3, Sector EraseTimer.) Any command other  
than Sector Erase(30H) or Erase Suspend(B0H) during  
the time-out period resets the device to read mode.  
This command will cause the command register to clear  
the suspend state and return back to Sector Erase mode  
but only if an Erase Suspend command was previously  
issued. Erase Resume will not have any effect in all  
other conditions. Another Erase Suspend command can  
be written after the device has resumed erasing.  
BYTE PROGRAM COMMAND SEQUENCE  
The device programs one byte of data for each program  
operation. The command sequence requires four bus  
cycles, and is initiated by writing two unlock write cycles,  
followed by the program set-up command. The program  
address and data are written next, which in turn initiate  
the Embedded Program algorithm. The system is not  
required to provide further controls or timings. The device  
automatically generates the program pulses and verifies  
the programmed cell margin. Table 4 shows the address  
and data requirements for the byte program command  
sequence.  
When the Embedded Program algorithm is complete,  
the device then returns to reading array data and  
addresses are no longer latched. The system can  
determine the status of the program operation by using  
Q7, Q6, or RY/BY#. See "Write Operation Status" for  
information on these status bits.  
ERASE SUSPEND  
This command only has meaning while the state ma-  
chine is executing Automatic Sector Erase operation,  
and therefore will only be responded during Automatic  
Sector Erase operation. When the Erase Suspend Com-  
Any commands written to the device during the Em-  
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MX29LV017B  
bedded Program Algorithm are ignored. Note that a  
hardware reset immediately terminates the programming  
operation. The Byte Program command sequence should  
be re-initiated once the device has reset to reading array  
data, to ensure data integrity.  
this, the device outputs the "complement," or "0". The  
system must provide an address within any of the sec-  
tors selected for erasure to read valid status information  
on Q7.  
After an erase command sequence is written, if all sec-  
tors selected for erasing are protected, Data# Polling on  
Q7 is active for approximately 100 us, then the device  
returns to reading array data. If not all selected sectors  
are protected, the Automatic Erase algorithm erases the  
unprotected sectors, and ignores the selected sectors  
that are protected.  
Programming is allowed in any sequence and across  
sector boundaries. A bit cannot be programmed from a  
"0" back to a "1". Attempting to do so may halt the  
operation and set Q5 to "1", or cause the Data# Polling  
algorithm to indicate the operation was successful.  
However, a succeeding read will show that the data is  
still "0". Only erase operations can convert a "0" to a  
"1".  
When the system detects Q7 has changed from the  
complement to true data, it can read valid data at Q7-Q0  
on the following read cycles. This is because Q7 may  
change asynchronously with Q0-Q6 while Output En-  
able (OE#) is asserted low.  
WRITE OPERATION STATUS  
The device provides several bits to determine the sta-  
tus of a write operation: Q2, Q3, Q5, Q6, Q7, and RY/  
BY#.Table 7 and the following subsections describe the  
functions of these bits.Q7, RY/BY#, and Q6 each offer a  
method for determining whether a program or erase op-  
eration is complete or in progress. These three bits are  
discussed first.  
RY/BY#:Ready/Busy  
The RY/BY# is a dedicated, open-drain output pin that  
indicates whether an Automatic Erase/Program algorithm  
is in progress or complete. The RY/BY# status is valid  
after the rising edge of the final WE# or CE#, whichever  
happens first, in the command sequence.Since RY/BY#  
is an open-drain output, several RY/BY# pins can be tied  
together in parallel with a pull-up resistor toVCC.  
Q7: Data# Polling  
The Data# Polling bit, Q7, indicates to the host system  
whether an Automatic Algorithm is in progress or com-  
pleted, or whether the device is in Erase Suspend.Data#  
Polling is valid after the rising edge of the finalWE# pulse  
in the program or erase command sequence.  
If the output is low (Busy), the device is actively erasing  
or programming. (This includes programming in the Erase  
Suspend mode.) If the output is high (Ready), the de-  
vice is ready to read array data (including during the  
Erase Suspend mode), or is in the standby mode.  
During the Automatic Program algorithm, the device out-  
puts on Q7 the complement of the datum programmed  
to Q7.This Q7 status also applies to programming dur-  
ing Erase Suspend.When the Automatic Program algo-  
rithm is complete, the device outputs the datum pro-  
grammed to Q7.The system must provide the program  
address to read valid status information on Q7. If a pro-  
gram address falls within a protected sector, Data# Poll-  
ing on Q7 is active for approximately 1 us, then the de-  
vice returns to reading array data.  
Table 7 shows the outputs for RY/BY# during write op-  
eration.  
Q6:Toggle BIT I  
Toggle Bit I on Q6 indicates whether an Automatic Pro-  
gram or Erase algorithm is in progress or complete, or  
whether the device has entered the Erase Suspend mode.  
Toggle Bit I may be read at any address, and is valid  
after the rising edge of the final WE# or CE#, whichever  
happens first, in the command sequence (prior to the  
program or erase operation), and during the sector time-  
out.  
During the Automatic Erase algorithm, Data# Polling pro-  
duces a "0" on Q7. When the Automatic Erase algo-  
rithm is complete, or if the device enters the Erase Sus-  
pend mode, Data# Polling produces a "1" on Q7.This is  
analogous to the complement/true datum out-put de-  
scribed for the Automatic Program algorithm: the erase  
function changes all the bits in a sector to "1" prior to  
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During an Automatic Program or Erase algorithm opera-  
tion, successive read cycles to any address cause Q6  
to toggle. The system may use either OE# or CE# to  
control the read cycles.When the operation is complete,  
Q6 stops toggling.  
are required for sectors and mode information. Refer to  
Table 7 to compare outputs for Q2 and Q6.  
Reading Toggle Bits Q6/ Q2  
Whenever the system initially begins reading toggle bit  
status, it must read Q7-Q0 at least twice in a row to  
determine whether a toggle bit is toggling. Typically, the  
system would note and store the value of the toggle bit  
after the first read. After the second read, the system  
would compare the new value of the toggle bit with the  
first. If the toggle bit is not toggling, the device has  
completed the program or erase operation. The system  
can read array data on Q7-Q0 on the following read cycle.  
After an erase command sequence is written, if all sec-  
tors selected for erasing are protected, Q6 toggles for  
approximately 100us and returns to reading array data.  
If not all selected sectors are protected, the Automatic  
Erase algorithm erases the unprotected sectors, and  
ignores the selected sectors that are protected.  
The system can use Q6 and Q2 together to determine  
whether a sector is actively erasing or is erase sus-  
pended.When the device is actively erasing (that is, the  
Automatic Erase algorithm is in progress), Q6 toggling.  
When the device enters the Erase Suspend mode, Q6  
stops toggling. However, the system must also use Q2  
to determine which sectors are erasing or erase-sus-  
pended. Alternatively, the system can use Q7.  
However, if after the initial two read cycles, the system  
determines that the toggle bit is still toggling, the sys-  
tem also should note whether the value of Q5 is high  
(see the section on Q5). If it is, the system should then  
determine again whether the toggle bit is toggling, since  
the toggle bit may have stopped toggling just as Q5 went  
high. If the toggle bit is no longer toggling, the device  
has successfully completed the program or erase op-  
eration. If it is still toggling, the device did not complete  
the operation successfully, and the system must write  
the reset command to return to reading array data.  
If a program address falls within a protected sector, Q6  
toggles for approximately 2 us after the program com-  
mand sequence is written, then returns to reading array  
data.  
Q6 also toggles during the erase-suspend-program mode,  
and stops toggling once the Automatic Program algo-  
rithm is complete.  
The remaining scenario is that system initially determines  
that the toggle bit is toggling and Q5 has not gone high.  
The system may continue to monitor the toggle bit and  
Q5 through successive read cycles, determining the sta-  
tus as described in the previous paragraph. Alterna-  
tively, it may choose to perform other system tasks. In  
this case, the system must start at the beginning of the  
algorithm when it returns to determine the status of the  
operation.  
Table 7 shows the outputs for Toggle Bit I on Q6.  
Q2:Toggle Bit II  
The "Toggle Bit II" on Q2, when used with Q6, indicates  
whether a particular sector is actively erasing (that is,  
the Automatic Erase algorithm is in process), or whether  
that sector is erase-suspended. Toggle Bit II is valid  
after the rising edge of the final WE# or CE#, whichever  
happens first, in the command sequence.  
Q5  
ExceededTiming Limits  
Q5 will indicate if the program or erase time has ex-  
ceeded the specified limits (internal pulse count). Under  
these conditions Q5 will produce a "1". This time-out  
condition indicates that the program or erase cycle was  
not successfully completed. Data# Polling and Toggle  
Bit are the only operating functions of the device under  
this condition.  
Q2 toggles when the system reads at addresses within  
those sectors that have been selected for erasure. (The  
system may use either OE# or CE# to control the read  
cycles.) But Q2 cannot distinguish whether the sector  
is actively erasing or is erase-suspended. Q6, by com-  
parison, indicates whether the device is actively eras-  
ing, or is in Erase Suspend, but cannot distinguish which  
sectors are selected for erasure. Thus, both status bits  
If this time-out condition occurs during sector erase op-  
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eration, it specifies that a particular sector is bad and it  
may not be reused. However, other sectors are still func-  
tional and may be used for the program or erase opera-  
tion. The device must be reset to use other sectors.  
Write the Reset command sequence to the device, and  
then execute program or erase command sequence. This  
allows the system to continue to use the other active  
sectors in the device.  
If this time-out condition occurs during the byte program-  
ming operation, it specifies that the entire sector con-  
taining that byte is bad and this sector may not be re-  
used, (other sectors are still functional and can be re-  
used).  
The time-out condition will not appear if a user tries to  
program a non blank location without erasing. Please  
note that this is not a device failure condition since the  
device was incorrectly used.  
If this time-out condition occurs during the chip erase  
operation, it specifies that the entire chip is bad or com-  
bination of sectors are bad.  
Table 7. WRITE OPERATION STATUS  
Status  
Q7  
Q6  
Q5  
Q3  
Q2 RY/BY#  
(Note1)  
(Note 2)  
Byte Program in Auto Program Algorithm  
Auto Erase Algorithm  
Q7# Toggle  
0
N/A  
1
No  
0
Toggle  
0
1
Toggle  
0
0
Toggle  
0
1
Erase Suspend Read  
(Erase Suspended Sector)  
No  
Toggle  
N/A Toggle  
In Progress  
Erase Suspended Mode  
Erase Suspend Read  
Data  
Data Data Data Data  
1
0
0
(Non-Erase Suspended Sector)  
Erase Suspend Program  
Q7# Toggle  
Q7# Toggle  
0
1
N/A N/A  
Byte Program in Auto Program Algorithm  
N/A  
1
No  
Toggle  
Exceeded  
Time Limits Auto Erase Algorithm  
0
Toggle  
1
1
Toggle  
0
0
Erase Suspend Program  
Q7# Toggle  
N/A N/A  
Notes:  
1. Q7 and Q2 require a valid address when reading status information. Refer to the appropriate subsection for further details.  
2. Q5 switches to '1' when an Auto Program or Auto Erase operation has exceeded the maximum timing limits.  
See "Q5:Exceeded Timing Limits " for more information.  
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Q3  
POWER SUPPLY DECOUPLING  
Sector Erase Timer  
In order to reduce power switching effect, each device  
should have a 0.1uF ceramic capacitor connected be-  
tween itsVCC and GND.  
After the completion of the initial sector erase command  
sequence, the sector erase time-out will begin. Q3 will  
remain low until the time-out is complete. Data# Polling  
andToggle Bit are valid after the initial sector erase com-  
mand sequence.  
POWER-UP SEQUENCE  
The MX29LV017B powers up in the Read only mode. In  
addition, the memory contents may only be altered after  
successful completion of the predefined command se-  
quences.  
If Data# Polling or theToggle Bit indicates the device has  
been written with a valid erase command, Q3 may be  
used to determine if the sector erase timer window is  
still open. If Q3 is high ("1") the internally controlled  
erase cycle has begun; attempts to write subsequent  
commands to the device will be ignored until the erase  
operation is completed as indicated by Data# Polling or  
Toggle Bit. If Q3 is low ("0"), the device will accept  
additional sector erase commands. To insure the com-  
mand has been accepted, the system software should  
check the status of Q3 prior to and following each sub-  
sequent sector erase command. If Q3 were high on the  
second status check, the command may not have been  
accepted.  
TEMPORARY SECTOR UNPROTECT  
This feature allows temporary unprotection of previously  
protected sector to change data in-system.TheTempo-  
rary Sector Unprotect mode is activated by setting the  
RESET# pin toVID(11.5V-12.5V). During this mode, for-  
merly protected sectors can be programmed or erased  
as un-protected sector. Once VID is remove from the  
RESET# pin, all the previously protected sectors are pro-  
tected again.  
DATA PROTECTION  
SECTOR PROTECTION  
The MX29LV017B is designed to offer protection against  
accidental erasure or programming caused by spurious  
system level signals that may exist during power transi-  
tion. During power up the device automatically resets  
the state machine in the Read mode. In addition, with  
its control register architecture, alteration of the memory  
contents only occurs after successful completion of spe-  
cific command sequences. The device also incorpo-  
rates several features to prevent inadvertent write cycles  
resulting fromVCC power-up and power-down transition  
or system noise.  
The MX29LV017B features hardware sector protection.  
This feature will disable both program and erase opera-  
tions for these sectors protected. To activate this mode,  
the programming equipment must forceVID on address  
pin A9 and OE# (suggest VID = 12V). Programming of  
the protection circuitry begins on the falling edge of the  
WE# pulse and is terminated on the rising edge.Please  
refer to sector protect algorithm and waveform.  
To verify programming of the protection circuitry, the pro-  
gramming equipment must forceVID on address pin A9  
( with CE# and OE# at VIL and WE# at VIH). When  
A1=VIH, A0=VIL, A6=VIL, it will produce a logical "1"  
code at device output Q0 for a protected sector. Other-  
wise the device will produce 00H for the unprotected sec-  
tor. In this mode, the addresses, except for A6, A1, A0,  
are don't care. Address locations with A6=A1=VIL are  
reserved to read manufacturer and device codes.(Read  
Silicon ID)  
WRITE PULSE "GLITCH" PROTECTION  
Noise pulses of less than 5ns(typical) on CE# or WE#  
will not initiate a write cycle.  
LOGICAL INHIBIT  
Writing is inhibited by holding any one of OE# = VIL,  
CE# = VIH or WE# = VIH. To initiate a write cycle, CE#  
and WE# must be a logical zero while OE# is a logical  
one.  
It is also possible to determine if the sector is protected  
in the system by writing a Automatic Select command.  
Performing a read operation with A1=VIH, it will produce  
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MX29LV017B  
a logical "1" at Q0 for the protected sector.  
The system must write the reset command to exit the  
Automatic Select mode.  
CHIP UNPROTECT  
TheMX29LV017Balsofeaturesthechipunprotectmode,  
sothatallsectorsareunprotectedafterchipunprotectis  
completed to incorporate any changes in the code. It is  
recommended to protect all sectors before activating  
chip unprotect mode.  
Toactivatethismode,theprogrammingequipmentmust  
force VID on control pin OE# and address pin A9. The  
CE# pinsmustbesetatVIL. PinsA6mustbesettoVIH.  
Refer to chip unprotect algorithm and waveform for the  
chip unprotect algorithm. The unprotection mechanism  
begins on the falling edge of the WE# pulse and is  
terminated on the rising edge.  
It is also possible to determine if the chip is unprotected  
inthesystembywritingtheAutomaticSelectcommand.  
PerformingareadoperationwithA1=VIH,itwillproduce  
00H at data outputs(Q0-Q7) for an unprotected sector.  
It is noted that all sectors are unprotected after the chip  
unprotect algorithm is completed.  
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MX29LV017B  
OPERATING RATINGS  
ABSOLUTE MAXIMUM RATINGS  
StorageTemperature  
Commercial (C) Devices  
Plastic Packages . . . . . . . . . . . . . ..... -65oC to +150oC  
Ambient Temperature (TA ). . . . . . . . . . . . 0°C to +70°C  
Industrial (I) Devices  
AmbientTemperature  
with Power Applied. . . . . . . . . . . . . .... -65oC to +125oC  
Voltage with Respect to Ground  
Ambient Temperature (TA ). . . . . . . . . . -40°C to +85° C  
VCC Supply Voltages  
VCC for regulated voltage range . . . . . +3.0 V to 3.6 V  
VCC for full voltage range. . . . . . . . . . . +2.7 V to 3.6 V  
VCC (Note 1) . . . . . . . . . . . . . . . . . -0.5 V to +4.0 V  
A9, OE#, and  
RESET# (Note 2) . . . . . . . . . . . ....-0.5 V to +12.5 V  
All other pins (Note 1) . . . . . . . -0.5 V to VCC +0.5 V  
Output Short Circuit Current (Note 3) . . . . . . 200 mA  
Operating ranges define those limits between which the  
functionality of the device is guaranteed.  
Notes:  
1. Minimum DC voltage on input or I/O pins is -0.5 V.  
During voltage transitions, input or I/O pins may over-  
shoot GND to -2.0 V for periods of up to 20 ns. Maxi-  
mum DC voltage on input or I/O pins is VCC +0.5 V.  
During voltage transitions, input or I/O pins may over-  
shoot to VCC +2.0 V for periods up to 20 ns.  
2.Minimum DC input voltage on pins A9, OE#, and RE-  
SET# is -0.5 V. During voltage transitions, A9, OE#,  
and RESET# may overshoot GND to -2.0V for periods  
of up to 20 ns. Maximum DC input voltage on pin A9  
is +12.5 V which may overshoot to 14.0 V for periods  
up to 20 ns.  
3.No more than one output may be shorted to ground at  
a time. Duration of the short circuit should not be  
greater than one second.  
Stresses above those listed under "Absolute Maximum  
Ratings" may cause permanent damage to the device.  
This is a stress rating only; functional operation of the  
device at these or any other conditions above those in-  
dicated in the operational sections of this data sheet is  
not implied. Exposure of the device to absolute maxi-  
mum rating conditions for extended periods may affect  
device reliability.  
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MX29LV017B  
CAPACITANCE TA = 25oC, f = 1.0 MHz  
SYMBOL PARAMETER  
MIN.  
TYP  
6
MAX.  
7.5  
9
UNIT  
CONDITIONS  
VIN = 0V  
CIN1  
CIN2  
COUT  
Input Capacitance  
pF  
pF  
pF  
Control Pin Capacitance  
Output Capacitance  
7.5  
8.5  
VIN = 0V  
12  
VOUT = 0V  
READ OPERATION  
Table 8. DC CHARACTERISTICS TA = -40oC TO 85oC, VCC = 2.7V~3.6V  
Symbol PARAMETER  
MIN.  
TYP  
MAX.  
± 1  
35  
± 1  
16  
4
UNIT  
uA  
CONDITIONS  
ILI  
Input Leakage Current  
VIN = GND to VCC, VCC= VCC max  
VCC=VCC max; A9=12.5V  
ILIT  
ILO  
ICC1  
A9 Input Leakage Current  
Output Leakage Current  
VCC Active Read Current  
uA  
uA  
VOUT = GND to VCC, VCC=VCC max  
9
mA  
mA  
mA  
uA  
CE#=VIL,  
OE#=VIH  
@5MHz  
@1MHz  
2
ICC2  
ICC3  
ICC4  
VCC Active write Current  
VCC Standby Current  
VCC Standby Current  
During Reset (See Conditions)  
Automotive sleep mode  
Input Low Voltage(Note 1)  
Input High Voltage  
20  
0.2  
0.2  
30  
15  
15  
CE#=VIL, OE#=VIH, WE#=VIL  
CE#; RESET#=VCC ± 0.3V  
RESET#=GND ± 0.3V  
uA  
ICC5  
VIL  
0.2  
15  
0.8  
uA  
V
VIH=VCC ± 0.3V; VIL=GND ± 0.3V  
-0.5  
VIH  
VID  
0.7xVCC  
VCC+ 0.3  
V
Voltage for Automotive  
Select and Temporary  
Sector Unprotect  
11.5  
12.5  
0.45  
V
VCC=3.3V  
VOL  
Output Low Voltage  
V
V
V
V
IOL = 4.0mA, VCC= VCC min  
IOH = -2mA, VCC=VCC min  
IOH = -100uA, VCC=VCC min  
VOH1  
VOH2  
VLKO  
Output High Voltage  
0.85xVCC  
VCC-0.4  
1.4  
Output High Voltage  
Low VCC Lock-out Voltage  
2.1  
Notes :  
1. VIL min. = -1.0V for pulse width is equal to or less than 50 ns.  
VIL min. = -2.0V for pulse width is equal to or less than 20 ns.  
2. VIH max. = VCC + 1.5V for pulse width is equal to or less than 20 ns  
If VIH is over the specified maximum value, read operation cannot be guaranteed.  
3. Automatic sleep mode enable the low power mode when addresses remain stable for tACC +30ns.  
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MX29LV017B  
AC CHARACTERISTICS  
TA = -40oC to 85oC, VCC = 2.7V~3.6V  
Table 9. READ OPERATIONS  
29LV017B-70  
29LV017B-90  
Symbol PARAMETER  
MIN.  
MAX. MIN.  
MAX.  
UNIT Conditions  
tRC  
Read CycleTime (Note 1)  
Address to Output Delay  
CE# to Output Delay  
70  
90  
90  
90  
35  
ns  
tACC  
tCE  
70  
70  
30  
25  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CE#=OE#=VIL  
OE#=VIL  
tOE  
tDF  
OE# to Output Delay  
CE#=VIL  
OE# High to Output Float (Note 2)  
Output Enable Read  
0
0
30  
CE#=VIL  
tOEH  
0
0
HoldTime  
Toggle and Data# Polling  
10  
0
10  
0
tOH  
Address to Output hold  
CE#=OE#=VIL  
Notes :  
1. Not 100% tested.  
2. tDF is defined as the time at which the output achieves  
the open circuit condition and data is no longer driven.  
TEST CONDITIONS:  
Input pulse levels: 0V/3.0V.  
Input rise and fall times is equal to or less than 5ns.  
Outputload:1TTLgate+100pF(Includingscopeand  
jig), for 29LV017B-90. 1 TTL gate + 30pF (Including  
scope and jig) for 29LV017B-70  
Reference levels for measuring timing: 1.5V.  
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MX29LV017B  
SWITCHING TEST CIRCUITS  
DEVICE UNDER  
TEST  
2.7K ohm  
+3.3V  
CL  
6.2K ohm  
DIODES=IN3064  
OR EQUIVALENT  
CL=100pF Including jig capacitance (MX29LV017B-90)  
CL=30pF Including jig capacitance (MX29LV017B-70)  
SWITCHING TEST WAVEFORMS  
3.0V  
TEST POINTS  
0V  
INPUT  
OUTPUT  
AC TESTING: Inputs are driven at 3.0V for a logic "1" and 0V for a logic "0".  
Input pulse rise and fall times are < 5ns.  
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MX29LV017B  
Figure 1. READ TIMING WAVEFORMS  
tRC  
VIH  
ADD Valid  
Addresses  
VIL  
tACC  
tCE  
VIH  
CE#  
VIL  
VIH  
WE#  
VIL  
tOE  
tDF  
tOEH  
VIH  
OE#  
VIL  
tACC  
tOH  
HIGH Z  
HIGH Z  
VOH  
VOL  
Outputs  
DATA Valid  
VIH  
VIL  
RESET#  
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MX29LV017B  
AC CHARACTERISTICS  
TA = -40oC to 85oC, VCC = 2.7V~3.6V  
Table 10. Erase/Program Operations  
29LV017B-70  
29LV017B-90  
SYMBOL  
tWC  
PARAMETER  
MIN.  
70  
0
MAX.  
MIN.  
90  
0
MAX.  
UNIT  
ns  
Write Cycle Time (Note 1)  
Address Setup Time  
tAS  
ns  
tAH  
Address Hold Time  
45  
35  
0
45  
45  
0
ns  
tDS  
Data Setup Time  
ns  
tDH  
Data Hold Time  
ns  
tOES  
tGHWL  
Output Enable Setup Time  
Read Recovery Time Before Write  
(OE# High to WE# Low)  
CE# Setup Time  
0
0
ns  
0
0
ns  
tCS  
0
0
ns  
ns  
ns  
ns  
us  
tCH  
CE# Hold Time  
0
0
tWP  
Write Pulse Width  
35  
35  
tWPH  
tWHWH1  
Write Pulse Width High  
ProgrammingOperation(Note2)  
(Byte program time)  
30  
30  
9(typ.)  
9(typ.)  
tWHWH2  
tVCS  
Sector Erase Operation (Note 2)  
VCC Setup Time (Note 1)  
Recovery Time from RY/BY#  
Sector Erase Valid to RY/BY# Delay  
Chip Erase Valid to RY/BY# Delay  
Program Valid to RY/BY# Delay  
Write pulse width for sector  
protect (A9, OE# Control)  
Write pulse width for sector  
unprotect (A9, OE# Control)  
0.7(typ.)  
0.7(typ.)  
sec  
us  
ns  
ns  
ns  
ns  
50  
0
50  
0
tRB  
tBUSY  
90  
90  
90  
90  
90  
90  
tWPP1  
tWPP2  
100ns  
100ns  
10us(typ.) 100ns  
10us(typ.)  
12ms(typ.) 100ns  
12ms(typ.)  
Notes :  
1. Not 100% tested.  
2. See the "Erase and Programming Performance" section for more information.  
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MX29LV017B  
AC CHARACTERISTICS  
TA = -40oC to 85oC, VCC = 2.7V~3.6V  
Table 11. Alternate CE# Controlled Erase/Program Operations  
29LV017B-70  
29LV017B-90  
SYMBOL  
tWC  
PARAMETER  
MIN.  
MAX.  
MIN.  
MAX.  
UNIT  
ns  
Write Cycle Time (Note 1)  
Address SetupTime  
Address HoldTime  
70  
90  
tAS  
0
0
ns  
tAH  
45  
45  
ns  
tDS  
Data SetupTime  
35  
45  
ns  
tDH  
Data HoldTime  
0
0
ns  
tOES  
tGHEL  
tWS  
Output Enable SetupTime  
Read RecoveryTime Before Write  
WE# SetupTime  
0
0
ns  
0
0
ns  
0
0
ns  
tWH  
WE# HoldTime  
0
0
ns  
tCP  
CE# PulseWidth  
35  
35  
ns  
tCPH  
tWHWH1  
tWHWH2  
CE# Pulse Width High  
Programming Operation(Note 2)  
Sector Erase Operation (Note 2)  
30  
30  
ns  
9(Typ.)  
0.7(Typ.)  
9(Typ.)  
0.7(Typ.)  
us  
sec  
Notes :  
1. Not 100% tested.  
2. See the "Erase and Programming Performance" section for more information.  
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MX29LV017B  
Figure 2. COMMAND WRITE TIMING WAVEFORM  
VCC  
3V  
VIH  
Addresses  
ADD Valid  
VIL  
tAH  
tAS  
VIH  
VIL  
WE#  
CE#  
tOES  
tWPH  
tWP  
tCWC  
VIH  
VIL  
tCS  
tCH  
tDH  
VIH  
VIL  
OE#  
Data  
tDS  
VIH  
VIL  
DIN  
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MX29LV017B  
AUTOMATIC PROGRAMMING TIMING WAVEFORM  
ing after automatic programming starts. Device outputs  
DATA# during programming and DATA# after programming  
on Q7.(Q6 is for toggle bit; see toggle bit, Data# Polling,  
timing waveform)  
One byte data is programmed. Verify in fast algorithm  
and additional verification by external control are not re-  
quired because these operations are executed automati-  
cally by internal control circuit. Programming comple-  
tion can be verified by Data# Polling or toggle bit check-  
Figure 3. AUTOMATIC PROGRAMMING TIMING WAVEFORM  
Program Command Sequence(last two cycle)  
Read Status Data (last two cycle)  
tWC  
tAS  
PA  
PA  
XXXh  
PA  
Address  
CE#  
tAH  
tCH  
tGHWL  
OE#  
WE#  
tWHWH1  
tWP  
tCS  
tWPH  
tDS tDH  
Status  
A0h  
PD  
DOUT  
Data  
tBUSY  
tRB  
RY/BY#  
tVCS  
VCC  
Note :  
1.PA=Program Address, PD=Program Data, DOUT is the true data the program address  
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MX29LV017B  
Figure 4. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART  
START  
Write Data AAH  
Write Data 55H  
Write Data A0H  
Write Program Data/Address  
Data Poll  
Increment  
Address  
from system  
No  
No  
Verify Data OK ?  
YES  
Last Address ?  
YES  
Auto Program Completed  
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MX29LV017B  
Figure 5. CE# CONTROLLED WRITE TIMING WAVEFORM  
PA for program  
XXX for program  
XXX for erase  
SA for sector erase  
XXX for chip erase  
Data# Polling  
Address  
PA  
tWC  
tWH  
tAS  
tAH  
WE#  
OE#  
tGHEL  
tCP  
tWHWH1 or 2  
CE#  
Data  
tWS  
tDS  
tCPH  
tBUSY  
tDH  
DOUT  
Q7  
PD for program  
30 for sector erase  
10 for chip erase  
A0 for program  
55 for erase  
tRH  
RESET#  
RY/BY#  
Notes :  
1. PA=Program Address, PD=Program Data, DOUT=Data Out, Q7=complement of data written to device.  
2. Figure indicates the last two bus cycles of the command sequence.  
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MX29LV017B  
AUTOMATIC CHIP ERASE TIMING WAVEFORM  
All data in chip are erased. External erase verification is  
not required because data is verified automatically by  
internal control circuit. Erasure completion can be veri-  
fied by Data# Polling or toggle bit checking after auto-  
matic erase starts. Device outputs 0 during erasure  
and 1 after erasure on Q7.(Q6 is for toggle bit; see toggle  
bit, Data# Polling, timing waveform)  
Figure 6. AUTOMATIC CHIP ERASE TIMING WAVEFORM  
Erase Command Sequence(last two cycle)  
Read Status Data  
VA  
tWC  
tAS  
VA  
XXXh  
XXXh  
Address  
CE#  
tAH  
tCH  
tGHWL  
OE#  
WE#  
tWHWH2  
tWP  
tCS  
tWPH  
tDS tDH  
In  
Progress  
55h  
10h  
Complete  
Data  
tBUSY  
tRB  
RY/BY#  
tVCS  
VCC  
Note :  
VA=Valid Address for reading status data(see "Write Operation Status").  
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MX29LV017B  
Figure 7. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART  
START  
Write Data AAH Address XXXH  
Write Data 55H Address XXXH  
Write Data 80H Address XXXH  
Write Data AAH Address XXXH  
Write Data 55H Address XXXH  
Write Data 10H Address XXXH  
Data Poll from System  
NO  
Data=FFh ?  
YES  
Auto Chip Erase Completed  
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MX29LV017B  
AUTOMATIC SECTOR ERASE TIMING WAVEFORM  
Sector indicated by A16 to A20 are erased. External  
erase verify is not required because data are verified  
automatically by internal control circuit. Erasure comple-  
tion can be verified by Data# Polling or toggle bit check-  
ing after automatic erase starts. Device outputs 0 dur-  
ing erasure and 1 after erasure on Q7.(Q6 is for toggle  
bit; see toggle bit, Data# Polling, timing waveform)  
Figure 8. AUTOMATIC SECTOR ERASE TIMING WAVEFORM  
Erase Command Sequence(last two cycle)  
Read Status Data  
tWC  
tAS  
VA  
VA  
XXXh  
SA  
Address  
CE#  
tAH  
tCH  
tGHWL  
OE#  
WE#  
tWHWH2  
tWP  
tCS  
tWPH  
tDS tDH  
In  
Progress  
55h  
30h  
Complete  
Data  
tBUSY  
tRB  
RY/BY#  
tVCS  
VCC  
Note :  
SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status").  
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MX29LV017B  
Figure 9. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART  
START  
Write Data AAH Address XXXH  
Write Data 55H Address XXXH  
Write Data 80H Address XXXH  
Write Data AAH Address XXXH  
Write Data 55H Address XXXH  
Write Data 30H Sector Address  
NO  
Last Sector  
to Erase  
YES  
Data Poll from System  
NO  
Data=FFh  
YES  
Auto Sector Erase Completed  
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MX29LV017B  
Figure 10. ERASE SUSPEND/ERASE RESUME FLOWCHART  
START  
Write Data B0H  
ERASE SUSPEND  
NO  
Toggle Bit checking Q6  
not toggled  
YES  
Read Array or  
Program  
Reading or  
NO  
Programming End  
YES  
Write Data 30H  
Continue Erase  
ERASE RESUME  
Another  
NO  
Erase Suspend ?  
YES  
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MX29LV017B  
Figure 11. IN-SYSTEM SECTOR PROTECT/CHIP UNPROTECTTIMINGWAVEFORM (RESET# Con-  
trol)  
VID  
VIH  
RESET#  
SA, A6  
A1, A0  
Valid*  
Valid*  
Valid*  
Sector Protect or Chip Unprotect  
Verify  
40h  
Status  
Data  
60h  
60h  
Sector Protect =150us  
Sector Unprotect =15ms  
1us  
CE#  
WE#  
OE#  
Note: When sector protect, A6=0, A1=1, A0=0. When sector unprotect, A6=1, A1=1, A0=0.  
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MX29LV017B  
Figure 12. SECTOR PROTECT TIMING WAVEFORM (A9, OE# Control)  
A1  
A6  
12V  
3V  
A9  
tVLHT  
tVLHT  
Verify  
12V  
3V  
OE#  
tVLHT  
tWPP 1  
WE#  
CE#  
tOESP  
Data  
01H  
F0H  
tOE  
Sector Address  
A20-A12  
Notes : tVLHT (Voltage transition time)=4us min.  
tWPP1 (Write pulse width for sector protect)=100ns min.  
tOESP (OE# setup time to WE# active)=4us min.  
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MX29LV017B  
Figure 13. SECTOR PROTECTION ALGORITHM (A9, OE# Control)  
START  
Set Up Sector Addr  
PLSCNT=1  
OE#=VID, A9=VID, CE#=VIL  
A6=VIL  
Activate WE# Pulse  
Time Out 150us  
Set WE#=VIH, CE#=OE#=VIL  
A9 should remain VID  
Read from Sector  
No  
Addr=SA, A6=VIL, A1=VIH, A0=VIL  
No  
Data=01H?  
PLSCNT=32?  
Yes  
Device Failed  
Yes  
Protect Another  
Sector?  
Remove VID from A9  
Write Reset Command  
Sector Protection  
Complete  
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MX29LV017B  
Figure 14. IN-SYSTEM SECTOR PROTECTION ALGORITHM WITH RESET#=VID  
START  
PLSCNT=1  
RESET#=VID  
Wait 1us  
No  
Temporary Sector  
Unprotect Mode  
First Write  
Cycle=60H  
Yes  
Set up sector address  
Write 60H to sector address  
with A6=0, A1=1, A0=0  
Wait 150us  
Verify sector protect :  
write 40H to sector address  
with A6=0, A1=1, A0=0  
Increment PLSCNT  
Reset PLSCNT=1  
Read from sector address  
with A6=0, A1=1, A0=0  
No  
No  
PLSCNT=25?  
Data=01H ?  
Yes  
Yes  
Device failed  
Yes  
Protect another  
sector?  
No  
Remove VID from RESET#  
Write reset command  
Sector protect complete  
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MX29LV017B  
Figure 15. IN-SYSTEM CHIP UNPROTECTION ALGORITHM WITH RESET#=VID  
START  
PLSCNT=1  
RESET#=VID  
Wait 1us  
No  
No  
Temporary Sector  
Unprotect Mode  
First Write  
Cycle=60H ?  
Yes  
All sector  
Protect all sectors  
protected?  
Yes  
Set up first sector address  
Chip unprotect :  
write 60H with  
A6=1, A1=1, A0=0  
Wait 15ms  
Verify sector unprotect  
write 40H to sector address  
with A6=1, A1=1, A0=0  
Increment PLSCNT  
Read from sector address  
with A6=1, A1=1, A0=0  
No  
No  
Set up next sector address  
PLSCNT=1000?  
Data=00H ?  
Yes  
Yes  
Device failed  
Yes  
Last sector  
verified?  
No  
Remove VID from RESET#  
Write reset command  
Chip unprotect complete  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
40  
MX29LV017B  
Figure 16. TIMING WAVEFORM FOR CHIP UNPROTECTION (A9, OE# Control)  
A1  
12V  
VCC 3V  
A9  
A6  
tVLHT  
Verify  
12V  
VCC 3V  
OE#  
tVLHT  
tVLHT  
tWPP 2  
WE#  
CE#  
tOESP  
Data  
00H  
F0H  
tOE  
A20-A16  
Sector Address  
Notes : tVLHT (Voltage transition time)=4us min.  
tWPP2 (Write pulse width for chip unprotect)=100ns min.  
tOESP (OE# setup time to WE# active)=4us min.  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
41  
MX29LV017B  
Figure 17. CHIP UNPROTECTION ALGORITHM (A9, OE# Control)  
START  
Protect All Sectors  
PLSCNT=1  
Set OE#=A9=VID  
CE#=VIL,A6=1  
Activate WE# Pulse  
Time Out 15ms  
Increment  
PLSCNT  
Set OE#=CE#=VIL  
A9=VID,A1=1,A6=A0=0  
Set Up First Sector Addr  
Read Data from Device  
No  
No  
Data=00H?  
Yes  
PLSCNT=1000?  
Increment  
Sector Addr  
Yes  
Device Failed  
No  
All sectors have  
been verified?  
Yes  
Remove VID from A9  
Write Reset Command  
Chip Unprotect  
Complete  
* It is recommended before unprotect whole chip, all sectors should be protected in advance.  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
42  
MX29LV017B  
WRITE OPERATION STATUS  
Figure 18. DATA# POLLING ALGORITHM  
Start  
Read Q7~Q0  
Add.=VA(1)  
Yes  
Q7 = Data ?  
No  
No  
Q5 = 1 ?  
Yes  
Read Q7~Q0  
Add.=VA  
Yes  
Q7 = Data ?  
(2)  
No  
FAIL  
Pass  
Notes : 1. VA=Valid address for programming  
2. Q7 should be re-checked even Q5="1" because Q7 may change  
simultaneously with Q5.  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
43  
MX29LV017B  
Figure 19. TOGGLE BIT ALGORITHM  
Start  
Read Q7-Q0  
Read Q7-Q0  
(Note 1)  
NO  
Toggle Bit Q6 =  
Toggle ?  
YES  
NO  
Q5= 1?  
YES  
Read Q7~Q0 Twice  
(Note 1, 2)  
NO  
Toggle bit Q6=  
Toggle?  
YES  
Program/Erase Operation  
Not Complete,Write  
Reset Command  
Program/Erase  
operation Complete  
Notes : 1. Read toggle bit twice to determine whether or not it is toggling.  
2. Recheck toggle bit because it may stop toggling as Q5 change to "1".  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
44  
MX29LV017B  
Figure 20. Data# Polling Timings (During Automatic Algorithms)  
tRC  
VA  
tACC  
tCE  
VA  
VA  
Address  
CE#  
tCH  
tOE  
OE#  
WE#  
tOEH  
tDF  
tOH  
High Z  
Complement  
Status Data  
Complement  
Status Data  
True  
True  
Valid Data  
Valid Data  
Q7  
High Z  
Q0-Q6  
tBUSY  
RY/BY#  
Note :  
VA=Valid address. Figure shows are first status cycle after command sequence, last status read cycle, and array data read cycle.  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
45  
MX29LV017B  
Figure 21. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)  
tRC  
VA  
VA  
VA  
VA  
Address  
CE#  
tACC  
tCE  
tCH  
tOE  
OE#  
tDF  
tOEH  
WE#  
tOH  
High Z  
Valid Status  
(second read)  
Valid Status  
(first read)  
Valid Data  
Valid Data  
Q6/Q2  
(stops toggling)  
tBUSY  
RY/BY#  
Note :  
VA=Valid address; not required for Q6. Figure shows first two status cycle after command sequence, last status read cycle, and  
array data read cycle.  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
46  
MX29LV017B  
Table 12. AC CHARACTERISTICS  
Parameter Std Description  
Test Setup All Speed Options Unit  
tREADY1  
RESET# PIN Low (During Automatic Algorithms)  
MAX  
20  
us  
to Read or Write (See Note)  
tREADY2  
RESET# PIN Low (NOT During Automatic  
Algorithms) to Read or Write (See Note)  
RESET# Pulse Width (During Automatic Algorithms)  
RESET# HighTime Before Read(See Note)  
RY/BY# Recovery Time(to CE#, OE# go low)  
MAX  
500  
ns  
tRP  
tRH  
tRB  
MIN  
MIN  
MIN  
500  
50  
0
ns  
ns  
ns  
Note : Not 100% tested  
Figure 22. RESET# TIMING WAVEFORM  
RY/BY#  
CE#, OE#  
tRH  
RESET#  
tRP  
tReady2  
Reset Timing NOT during Automatic Algorithms  
tReady1  
RY/BY#  
tRB  
CE#, OE#  
RESET#  
tRP  
Reset Timing during Automatic Algorithms  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
47  
MX29LV017B  
Table 13. TEMPORARY SECTOR UNPROTECT  
Parameter Std. Description  
Test Setup All Speed Options Unit  
tVIDR  
tRSP  
VID Rise and Fall Time (See Note)  
Min  
Min  
500  
4
ns  
us  
RESET# SetupTime forTemporary Sector Unprotect  
Note : Not 100% tested  
Figure 23. TEMPORARY SECTOR UNPROTECT TIMING DIAGRAM  
12V  
RESET#  
0 or VCC  
0 or VCC  
Program or Erase Command Sequence  
tVIDR  
tVIDR  
CE#  
WE#  
tRSP  
RY/BY#  
Figure 24. Q6 vs Q2 for Erase and Erase Suspend Operations  
Enter Embedded  
Erasing  
Erase  
Enter Erase  
Erase  
Suspend  
Suspend Program  
Resume  
Erase  
Erase  
Erase Suspend  
Read  
Erase  
Erase  
WE#  
Q6  
Suspend  
Program  
Complete  
Q2  
Note :  
The system can use OE# or CE# to toggle Q2/Q6, Q2 toggles only when read at an address within an erase-suspended  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
48  
MX29LV017B  
Figure 25. TEMPORARY SECTOR UNPROTECT ALGORITHM  
Start  
RESET# = VID (Note 1)  
Perform Erase or Program Operation  
Operation Completed  
RESET# = VIH  
Temporary Sector Unprotect Completed (Note 2)  
Notes : 1. All protected sectors are temporary unprotected.  
VID=11.5V~12.5V  
2. All previously protected sectors are protected again.  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
49  
MX29LV017B  
Figure 26. ID CODE READ TIMING WAVEFORM  
VCC  
3V  
VID  
ADD  
A9  
VIH  
VIL  
VIH  
VIL  
ADD  
A0  
tACC  
tACC  
VIH  
VIL  
A1  
ADD  
A2-A8  
VIH  
A10-A20 VIL  
CE#  
VIH  
VIL  
VIH  
VIL  
tCE  
WE#  
OE#  
tOE  
VIH  
VIL  
tDF  
tOH  
tOH  
VIH  
VIL  
DATA  
Q0-Q7  
DATA OUT  
C2H  
DATA OUT  
C8H  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
50  
MX29LV017B  
ERASE AND PROGRAMMING PERFORMANCE (1)  
LIMITS  
PARAMETER  
MIN.  
TYP.(2)  
0.7  
MAX.(3)  
UNITS  
sec  
Sector Erase Time  
Chip Erase Time  
15  
22.5  
9
sec  
Byte Programming Time  
Chip Programming Time  
Erase/Program Cycles  
300  
54  
us  
18  
sec  
100,000  
Cycles  
Notes : 1. Not 100% Tested, Excludes external system level over head.  
2.Typical values measured at 25° C, 3V.  
3. Maximum values measured at 85° C, 2.7V, 100,000 cycles.  
LATCH-UP CHARACTERISTICS  
MIN.  
-1.0V  
MAX.  
Input Voltage with respect to GND on all pins except I/O pins  
Input Voltage with respect to GND on all I/O pins  
VCC Current  
12.5V  
VCC + 1.0V  
+100mA  
-1.0V  
-100mA  
Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at a time.  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
51  
MX29LV017B  
ORDERING INFORMATION  
PART NO.  
ACCESS  
OPERATING  
STANDBY  
PACKAGE  
Remark  
TIME(ns) Current MAX.(mA) Current MAX.(uA)  
MX29LV017BTC-70  
MX29LV017BTC-90  
MX29LV017BTI-70  
MX29LV017BTI-90  
MX29LV017BTC-70G  
MX29LV017BTC-90G  
MX29LV017BTI-70G  
MX29LV017BTI-90G  
70  
90  
70  
90  
70  
90  
70  
90  
30  
30  
30  
30  
30  
30  
30  
30  
15  
15  
15  
15  
15  
15  
15  
15  
40 Pin TSOP  
(NormalType)  
40 Pin TSOP  
(NormalType)  
40 Pin TSOP  
(NormalType)  
40 Pin TSOP  
(NormalType)  
40 Pin TSOP  
(NormalType)  
40 Pin TSOP  
(NormalType)  
40 Pin TSOP  
(NormalType)  
40 Pin TSOP  
(NormalType)  
Pb-free  
Pb-free  
Pb-free  
Pb-free  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
52  
MX29LV017B  
PACKAGE INFORMATION  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
53  
MX29LV017B  
REVISION HISTORY  
Revision No. Description  
Page  
P52  
P1,2,52  
Date  
DEC/07/2004  
1.1  
1. Added Pb-free package information  
2. Removed 48-CSP information  
P/N:PM1086  
REV. 1.1, DEC. 07, 2004  
54  
MX29LV017B  
MACRONIX INTERNATIONALCO., LTD.  
Headquarters:  
TEL:+886-3-578-6688  
FAX:+886-3-563-2888  
Europe Office :  
TEL:+32-2-456-8020  
FAX:+32-2-456-8021  
Hong Kong Office :  
TEL:+86-755-834-335-79  
FAX:+86-755-834-380-78  
Japan Office :  
Kawasaki Office :  
TEL:+81-44-246-9100  
FAX:+81-44-246-9105  
Osaka Office :  
TEL:+81-6-4807-5460  
FAX:+81-6-4807-5461  
Singapore Office :  
TEL:+65-6346-5505  
FAX:+65-6348-8096  
Taipei Office :  
TEL:+886-2-2509-3300  
FAX:+886-2-2509-2200  
MACRONIX AMERICA, INC.  
TEL:+1-408-262-8887  
FAX:+1-408-262-8810  
http : //www.macronix.com  
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.  

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