2SK3353-S [NEC]

SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE; 切换N沟道功率MOS FET工业用
2SK3353-S
型号: 2SK3353-S
厂家: NEC    NEC
描述:

SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE
切换N沟道功率MOS FET工业用

开关
文件: 总4页 (文件大小:45K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
2SK3353  
SWITCHING  
N-CHANNEL POWER MOS FET  
INDUSTRIAL USE  
DESCRIPTION  
ORDERING INFORMATION  
PART NUMBER  
2SK3353  
The 2SK3353 is N-channel MOS Field Effect Transistor  
designed for high current switching applications.  
PACKAGE  
TO-220AB  
TO-262  
2SK3353-S  
FEATURES  
2SK3353-Z  
TO-220SMD  
Super low on-state resistance:  
DS(on)1  
GS  
D
R
R
= 9.5 mMAX. (V = 10 V, I = 41 A)  
DS(on)2  
GS  
D
= 14 mMAX. (V = 4 V, I = 41 A)  
iss  
iss  
Low C : C = 4650 pF TYP.  
Built-in gate protection diode  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)  
Drain to Source Voltage  
VDSS  
VGSS(AC)  
ID(DC)  
ID(pulse)  
PT  
60  
±20  
V
V
Gate to Source Voltage  
Drain Current (DC)  
±82  
A
Drain Current (pulse) Note1  
Total Power Dissipation (TC = 25°C)  
Total Power Dissipation (TA = 25°C)  
Channel Temperature  
±328  
95  
A
W
W
°C  
°C  
A
PT  
1.5  
Tch  
150  
Storage Temperature  
Tstg  
–55 to +150  
45  
Single Avalanche Current Note2  
Single Avalanche Energy Note2  
IAS  
EAS  
202  
mJ  
Notes 1. PW 10 µs, Duty cycle 1 %  
2. Starting Tch = 25 °C, RG = 25 Ω, VGS = 20 V 0 V  
THERMAL RESISTANCE  
Channel to Case  
Rth(ch-C)  
Rth(ch-A)  
1.32  
83.3  
°C/W  
°C/W  
Channel to Ambient  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No.  
Date Published June 1999 NS CP(K)  
Printed in Japan  
D14130EJ1V0DS00 (1st edition)  
The mark shows major revised points.  
1999  
©
2SK3353  
ELECTRICAL CHARACTERISTICS (TA = 25 °C)  
CHARACTERISTICS  
SYMBOL  
RDS(on)1  
RDS(on)2  
VGS(off)  
| yfs |  
IDSS  
TEST CONDITIONS  
VGS = 10V, ID = 41 A  
MIN. TYP. MAX. UNIT  
Drain to Source On-state Resistance  
7.5  
10.5  
2.0  
50  
9.5  
14  
mΩ  
mΩ  
V
VGS = 4V, ID = 41 A  
Gate to Source Cut-off Voltage  
Forward Transfer Admittance  
Drain Leakage Current  
Gate to Source Leakage Current  
Input Capacitance  
VDS = 10V, ID = 1 mA  
VDS = 10V, ID = 41 A  
1.5  
30  
2.5  
S
VDS = 60V, VGS = 0 V  
VGS = ±20 V, VDS = 0 V  
VDS = 10 V, VGS = 0 V, f = 1 MHz  
10  
µA  
µA  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
V
IGSS  
±10  
Ciss  
4650  
780  
380  
100  
1550  
280  
420  
90  
Output Capacitance  
Coss  
Crss  
Reverse Transfer Capacitance  
Turn-on Delay Time  
td(on)  
tr  
td(off)  
tf  
ID = 41 A, VGS(on) = 10 V, VDD = 30 V,  
Rise Time  
RG = 10 Ω  
Turn-off Delay Time  
Fall Time  
Total Gate Charge  
QG  
ID = 82 A , VDD = 48 V, VGS = 10 V  
Gate to Source Charge  
Gate to Drain Charge  
Body Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
QGS  
QGD  
VF(S-D)  
trr  
14  
38  
IF = 82 A, VGS = 0 V  
IF = 82 A, VGS = 0 V,  
di/dt = 100 A/µs  
1.0  
60  
ns  
nC  
Qrr  
110  
TEST CIRCUIT 1 AVALANCHE CAPABILITY  
TEST CIRCUIT 2 SWITCHING TIME  
D.U.T.  
L
D.U.T.  
V
GS  
R
L
R
G
= 25 Ω  
90%  
GS(on)  
V
GS  
Wave Form  
V
10%  
10%  
0
R
G
PG.  
PG.  
50 Ω  
V
DD  
RG = 10 Ω  
VDD  
VGS = 200V  
I
D
90%  
90%  
10%  
I
D
V
0
GS  
BVDSS  
I
D
0
Wave Form  
I
AS  
VDS  
τ
I
D
t
d(on)  
t
r
t
d(off)  
tf  
V
DD  
t
on  
toff  
τ = 1 µs  
Duty Cycle 1 %  
Starting Tch  
TEST CIRCUIT 3 GATE CHARGE  
D.U.T.  
= 2 mA  
I
G
RL  
PG.  
50 Ω  
V
DD  
2
Data Sheet D14130EJ1V0DS00  
2SK3353  
PACKAGE DRAWING (Unit: mm)  
1) TO-220AB (MP-25)  
2) TO-262 (MP-25 Fin Cut)  
4.8 MAX.  
1.3±0.2  
10.6 MAX.  
φ
3.6±0.2  
4.8 MAX.  
1.3±0.2  
10.0  
(10)  
4
4
1
2
3
1
2 3  
1.3±0.2  
1.3±0.2  
2.8±0.2  
0.5±0.2  
1.Gate  
0.75±0.1  
2.54 TYP.  
0.5±0.2  
2.8±0.2  
0.75±0.3  
2.54 TYP.  
2.54 TYP.  
2.54 TYP.  
1.Gate  
2.Drain  
3.Source  
4.Fin (Drain)  
2.Drain  
3.Source  
4.Fin (Drain)  
3) TO-220SMD (MP-25Z)  
EQUIVALENT CIRCUIT  
4.8 MAX.  
(10)  
4
1.3±0.2  
Drain  
Body  
Diode  
Gate  
1.4±0.2  
1.0±0.3  
Gate  
Protection  
Diode  
0.5±0.2  
Source  
2.54 TYP.  
2.54 TYP.  
1
2
3
1.Gate  
2.Drain  
3.Source  
4.Fin (Drain)  
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.  
When this device actually used, an additional protection circuit is externally required if a voltage  
exceeding the rated voltage may be applied to this device.  
3
Data Sheet D14130EJ1V0DS00  
2SK3353  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
No part of this document may be copied or reproduced in any form or by any means without the prior written  
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in  
this document.  
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property  
rights of third parties by or arising from use of a device described herein or any other liability arising from use  
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other  
intellectual property rights of NEC Corporation or others.  
Descriptions of circuits, software, and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these circuits,  
software, and information in the design of the customer's equipment shall be done under the full responsibility  
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third  
parties arising from the use of these circuits, software, and information.  
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,  
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or  
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety  
measures in its design, such as redundancy, fire-containment, and anti-failure features.  
NEC devices are classified into the following three quality grades:  
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a  
customer designated "quality assurance program" for a specific application. The recommended applications of  
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device  
before using it in a particular application.  
Standard: Computers, office equipment, communications equipment, test and measurement equipment,  
audio and visual equipment, home electronic appliances, machine tools, personal electronic  
equipment and industrial robots  
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems or medical equipment for life support, etc.  
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.  
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,  
they should contact an NEC sales representative in advance.  
M7 98. 8  

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