2SK660 [NEC]
N-CHANNEL SILICON JUNCTION FIELD EFFECT TRANSISTOR FOR IMPEDANCE CONVERTER OF ECM; N沟道硅结型场效应晶体管为ECM的阻抗转换器型号: | 2SK660 |
厂家: | NEC |
描述: | N-CHANNEL SILICON JUNCTION FIELD EFFECT TRANSISTOR FOR IMPEDANCE CONVERTER OF ECM |
文件: | 总8页 (文件大小:40K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
JUNCTION FIELD EFFECT TRANSISTOR
2SK660
N-CHANNEL SILICON JUNCTION FIELD EFFECT TRANSISTOR
FOR IMPEDANCE CONVERTER OF ECM
DESCRIPTION
The 2SK660 is suitable for converter of ECM.
FEATURES
• Compact package
• High forward transfer admittance
fs
DS
D
| y | = 1200 µS TYP. (V = 5 V, I = 0 µA)
• Low capacitance
iss
C
DS
GS
= 4.5 pF (V = 5 V, V = 0 V, f = 1 MHz)
• Includes diode and high resistance at G - S
ORDERING INFORMATION
PART NUMBER
2SK660
PACKAGE
SST
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage Note
Gate to Drain Voltage
Drain Current
DSX
V
20
–20
10
V
V
EQUIVALENT CIRCUIT
GDO
V
D
I
mA
mA
mW
°C
Drain
G
Gate Current
I
10
T
Total Power Dissipation
Junction Temperature
Storage Temperature
P
100
125
Gate
j
T
stg
T
–55 to +125 °C
Source
Note VGS = –1.0 V
Remark Please take care of ESD (Electro Static Discharge) when you handle the device in this document.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. D10753EJ2V0DS00 (2nd edition)
Date Published January 2002 NS CP(K)
Printed in Japan
2002
©
2SK660
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICS
Zero Gate Voltage Drain Cut-off Current
Gate Cut-off Voltage
SYMBOL
IDSS
TEST CONDITIONS
VDS = 5.0 V, VGS = 0 V
MIN. TYP. MAX. UNIT
60
500
µA
V
VGS(off)
| yfs1 |
| yfs2 |
Ciss
VDS = 5.0 V, ID = 1.0 µA
−1.0
Forward Transfer Admittance
Forward Transfer Admittance
Input Capacitance
VDS = 5.0 V, ID = 30 µA, f = 1.0 kHz
VDS = 5.0 V, VGS = 0 V, f = 1.0 kHz
150
150
µS
µS
pF
pF
pF
µV
1200
4.5
VDS = 5.0 V
VGS = 0 V
6.0
3.0
3.0
3.0
Output Capacitance
Coss
1.5
f = 1.0 MHz
Reverse Transfer Capacitance
Noise Voltage
Crss
1.2
NV
See Test Circuit
1.0
NOISE VOLTAGE TEST CIRCUIT
+4.5 V
JIS A
NV (r.m.s)
R = 1 kΩ
C = 10 pF
2
Data Sheet D10753EJ2V0DS
2SK660
TYPICAL CHARACTERISTICS (TA = 25°C)
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERATURE
120
500
400
300
200
100
0
0.15 V
0.10 V
0.05 V
100
80
60
40
20
0
µ
V
GS = 0 V
−0.05 V
−0.10 V
−0.15 V
−0.20 V
−0.25 V
−0.30 V
0
2
4
6
8
10
0
30
T
60
90
120
150
180
V
DS - Drain to Source Voltage - V
A
- Ambient Temperature - ˚C
GATE TO SOURCE CURRENT vs.
GATE TO SOURCE VOLTAGE
DRAIN CURRENT vs.
GATE TO SOURCE VOLTAGE
40
30
1.0
0.8
0.6
0.4
0.2
V
DS = 5 V
20
10
µ
−1.0 −0.8 −0.6 −0.4 −0.2
−10
0
0.2 0.4 0.6 0.8 1.0
−20
−30
−40
−0.4
−0.2
0
0.2
0.4
VGS - Gate to Source Voltage - V
V
GS - Gate to Source Voltage - V
FORWARD TRANSFER ADMITTANCE vs.
GATE TO SOURCE VOLTAGE
INPUT AND FEEDBACK CAPACITANCE vs.
DRAIN TO SOURCE VOLTAGE
3.0
2.5
2.0
1.5
1.0
0.5
0
10
8
V
DS = 0 V
V
DS = 5 V
f = 1.0 kHz
C
ISS
5
3
2
COSS
1
1
2
5
10
20
50
100
−0.4 −0.3 −0.2 −0.1
0
0.1 0.2 0.3 0.4
V
GS - Gate to Source Voltage -
V
VDS - Drain to Source Voltage - V
3
Data Sheet D10753EJ2V0DS
2SK660
FORWARD TRANSFER ADMITTANCE AND
GATE TO SOURCE CUT-OFF VOLTAGE vs. ZERO-
GATE VOLTAGE DRAIN CURRENT CO-RELATION
10.0
VDS = 5 V
5.0
2.0
| yfs |
1.0
0.5
0.2
0.1
VGS (off)
0.05
0.02
0.01
10
20
50
100
200
500 1000
µ
Zero-Gate Voltage Drain Current -
A
4
Data Sheet D10753EJ2V0DS
2SK660
PACKAGE DRAWING (Unit: mm)
4.0±0.2
2.0±0.2
0.50 TYP.
0.45 TYP.
0.42 TYP.
D
G
S
1.27 TYP.
1.27 TYP.
5
Data Sheet D10753EJ2V0DS
2SK660
[MEMO]
6
Data Sheet D10753EJ2V0DS
2SK660
[MEMO]
7
Data Sheet D10753EJ2V0DS
2SK660
•
The information in this document is current as of January, 2002. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
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Customers must check the quality grade of each semiconductor product before using it in a particular
application.
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