2SK660 [NEC]

N-CHANNEL SILICON JUNCTION FIELD EFFECT TRANSISTOR FOR IMPEDANCE CONVERTER OF ECM; N沟道硅结型场效应晶体管为ECM的阻抗转换器
2SK660
型号: 2SK660
厂家: NEC    NEC
描述:

N-CHANNEL SILICON JUNCTION FIELD EFFECT TRANSISTOR FOR IMPEDANCE CONVERTER OF ECM
N沟道硅结型场效应晶体管为ECM的阻抗转换器

晶体 转换器 晶体管 场效应晶体管
文件: 总8页 (文件大小:40K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
JUNCTION FIELD EFFECT TRANSISTOR  
2SK660  
N-CHANNEL SILICON JUNCTION FIELD EFFECT TRANSISTOR  
FOR IMPEDANCE CONVERTER OF ECM  
DESCRIPTION  
The 2SK660 is suitable for converter of ECM.  
FEATURES  
Compact package  
High forward transfer admittance  
fs  
DS  
D
| y | = 1200 µS TYP. (V = 5 V, I = 0 µA)  
Low capacitance  
iss  
C
DS  
GS  
= 4.5 pF (V = 5 V, V = 0 V, f = 1 MHz)  
Includes diode and high resistance at G - S  
ORDERING INFORMATION  
PART NUMBER  
2SK660  
PACKAGE  
SST  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)  
Drain to Source Voltage Note  
Gate to Drain Voltage  
Drain Current  
DSX  
V
20  
–20  
10  
V
V
EQUIVALENT CIRCUIT  
GDO  
V
D
I
mA  
mA  
mW  
°C  
Drain  
G
Gate Current  
I
10  
T
Total Power Dissipation  
Junction Temperature  
Storage Temperature  
P
100  
125  
Gate  
j
T
stg  
T
–55 to +125 °C  
Source  
Note VGS = –1.0 V  
Remark Please take care of ESD (Electro Static Discharge) when you handle the device in this document.  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No. D10753EJ2V0DS00 (2nd edition)  
Date Published January 2002 NS CP(K)  
Printed in Japan  
2002  
©
2SK660  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
CHARACTERISTICS  
Zero Gate Voltage Drain Cut-off Current  
Gate Cut-off Voltage  
SYMBOL  
IDSS  
TEST CONDITIONS  
VDS = 5.0 V, VGS = 0 V  
MIN. TYP. MAX. UNIT  
60  
500  
µA  
V
VGS(off)  
| yfs1 |  
| yfs2 |  
Ciss  
VDS = 5.0 V, ID = 1.0 µA  
1.0  
Forward Transfer Admittance  
Forward Transfer Admittance  
Input Capacitance  
VDS = 5.0 V, ID = 30 µA, f = 1.0 kHz  
VDS = 5.0 V, VGS = 0 V, f = 1.0 kHz  
150  
150  
µS  
µS  
pF  
pF  
pF  
µV  
1200  
4.5  
VDS = 5.0 V  
VGS = 0 V  
6.0  
3.0  
3.0  
3.0  
Output Capacitance  
Coss  
1.5  
f = 1.0 MHz  
Reverse Transfer Capacitance  
Noise Voltage  
Crss  
1.2  
NV  
See Test Circuit  
1.0  
NOISE VOLTAGE TEST CIRCUIT  
+4.5 V  
JIS A  
NV (r.m.s)  
R = 1 k  
C = 10 pF  
2
Data Sheet D10753EJ2V0DS  
2SK660  
TYPICAL CHARACTERISTICS (TA = 25°C)  
DRAIN CURRENT vs.  
DRAIN TO SOURCE VOLTAGE  
TOTAL POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
120  
500  
400  
300  
200  
100  
0
0.15 V  
0.10 V  
0.05 V  
100  
80  
60  
40  
20  
0
µ
V
GS = 0 V  
0.05 V  
0.10 V  
0.15 V  
0.20 V  
0.25 V  
0.30 V  
0
2
4
6
8
10  
0
30  
T
60  
90  
120  
150  
180  
V
DS - Drain to Source Voltage - V  
A
- Ambient Temperature - ˚C  
GATE TO SOURCE CURRENT vs.  
GATE TO SOURCE VOLTAGE  
DRAIN CURRENT vs.  
GATE TO SOURCE VOLTAGE  
40  
30  
1.0  
0.8  
0.6  
0.4  
0.2  
V
DS = 5 V  
20  
10  
µ
1.0 0.8 0.6 0.4 0.2  
10  
0
0.2 0.4 0.6 0.8 1.0  
20  
30  
40  
0.4  
0.2  
0
0.2  
0.4  
VGS - Gate to Source Voltage - V  
V
GS - Gate to Source Voltage - V  
FORWARD TRANSFER ADMITTANCE vs.  
GATE TO SOURCE VOLTAGE  
INPUT AND FEEDBACK CAPACITANCE vs.  
DRAIN TO SOURCE VOLTAGE  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
10  
8
V
DS = 0 V  
V
DS = 5 V  
f = 1.0 kHz  
C
ISS  
5
3
2
COSS  
1
1
2
5
10  
20  
50  
100  
0.4 0.3 0.2 0.1  
0
0.1 0.2 0.3 0.4  
V
GS - Gate to Source Voltage -  
V
VDS - Drain to Source Voltage - V  
3
Data Sheet D10753EJ2V0DS  
2SK660  
FORWARD TRANSFER ADMITTANCE AND  
GATE TO SOURCE CUT-OFF VOLTAGE vs. ZERO-  
GATE VOLTAGE DRAIN CURRENT CO-RELATION  
10.0  
VDS = 5 V  
5.0  
2.0  
| yfs |  
1.0  
0.5  
0.2  
0.1  
VGS (off)  
0.05  
0.02  
0.01  
10  
20  
50  
100  
200  
500 1000  
µ
Zero-Gate Voltage Drain Current -  
A
4
Data Sheet D10753EJ2V0DS  
2SK660  
PACKAGE DRAWING (Unit: mm)  
4.0±0.2  
2.0±0.2  
0.50 TYP.  
0.45 TYP.  
0.42 TYP.  
D
G
S
1.27 TYP.  
1.27 TYP.  
5
Data Sheet D10753EJ2V0DS  
2SK660  
[MEMO]  
6
Data Sheet D10753EJ2V0DS  
2SK660  
[MEMO]  
7
Data Sheet D10753EJ2V0DS  
2SK660  
The information in this document is current as of January, 2002. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or  
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all  
products and/or types are available in every country. Please check with an NEC sales representative  
for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4  

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