FP1L3N-A [NEC]

Small Signal Bipolar Transistor, 0.7A I(C), 25V V(BR)CEO, 1-Element, PNP, Silicon;


型号：	FP1L3N-A
厂家：	NEC
描述：	Small Signal Bipolar Transistor, 0.7A I(C), 25V V(BR)CEO, 1-Element, PNP, Silicon
文件：	总8页 (文件大小：146K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DATA SHEET

COMPOUND TRANSISTOR

FP1 SERIES

on-chip resistor PNP silicon epitaxial transistor

For mid-speed switching

FEATURES

PACKAGE DRAWING (UNIT: mm)

•

Up to 0.7 A current drive available

On-chip bias resistor

Low power consumption during drive

QUALITY GRADES

•

Standard

Please refer to “Quality Grades on NEC Semiconductor

Devices” (Document No. C11531E) published by NEC Corporation

to know the specification of quality grade on the devices and its

recommended applications.

FP1 SERIES LISTS

Products

FP1A4A

FP1L2Q

FP1A3M

FP1F3P

FP1J3P

FP1L3N

FP1A4M

Marking

S30

R¹(KΩ)

−

R²(KΩ)

S31

0.47

1.0

4.7

1.0

S32

S33

2.2

S36

3.3

S34

4.7

S35

ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)

Parameter

Collector to base voltage

Collector to emitter voltage

Emitter to base voltage

Collector current (DC)

Collector current (Pulse)

Base current (DC)

Symbol

V^CBO

V^CEO

V^EBO

I^C(DC)

I^C(pulse)*

I^B(DC)

P^T

Ratings

−25

Unit

−25

−10

−0.7

−1.0

−20

°C

Total power dissipation

Junction temperature

200

T^j

150

Storage temperature

T^stg

−55 to +150

* PW ≤ 10 ms, duty cycle ≤ 50 %

The information in this document is subject to change without notice. Before using this document, please

confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for

availability and additional information.

Document No. D16181EJ1V0DS00 (1st edition)

Date Published April 2002 N CP(K)

Printed in Japan

2002

1998

FP1 SERIES

FP1A4A

ELECTRICAL CHARACTERISTICS (Ta = 25°C)

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FP1L2Q

ELECTRICAL CHARACTERISTICS (Ta = 25°C)

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FP1A3M

ELECTRICAL CHARACTERISTICS (Ta = 25°C)

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Data Sheet D16181EJ1V0DS

FP1 SERIES

FP1F3P

ELECTRICAL CHARACTERISTICS (Ta = 25°C)

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FP1J3P

ELECTRICAL CHARACTERISTICS (Ta = 25°C)

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FP1L3N

ELECTRICAL CHARACTERISTICS (Ta = 25°C)

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Data Sheet D16181EJ1V0DS

FP1 SERIES

FB1A4M

ELECTRICAL CHARACTERISTICS (Ta = 25°C)

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$9ꢅꢉ9ꢝꢚꢂꢄꢏꢎꢏꢅꢁꢌꢙꢄ

8^"

** PW ≤ 350 µs, duty cycle ≤ 2 %

Data Sheet D16181EJ1V0DS

FP1 SERIES

TYPICAL CHARACTERISTICS (Ta = 25°C)

Data Sheet D16181EJ1V0DS

FP1 SERIES

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC sales representative.

Surface MOUNTING TYPE

For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

8ꢄꢙꢉꢃꢃꢄꢌꢍꢄꢍ

ꢆꢉꢊꢍꢄꢂꢎꢌ(ꢚꢐꢄꢅ)ꢉꢍ

ꢑꢌꢜꢂꢁꢂꢄꢍꢚꢂꢄꢜꢊꢉ6

ꢆꢉꢊꢍꢄꢂꢎꢌ(ꢚꢋꢉꢌꢍꢎꢅꢎꢉꢌꢏ

ꢋꢉꢌꢍꢎꢅꢎꢉꢌꢚꢆꢇꢃꢈꢉꢊ

ꢀꢁꢙ:ꢁ(ꢄꢚ7ꢄꢁ:ꢚꢅꢄꢃ7ꢄꢂꢁꢅꢛꢂꢄ<ꢚ"-%°ꢋ#ꢚꢔꢎꢃꢄ<ꢚ-%ꢚꢏꢄꢙꢓꢚꢃꢁ=ꢓꢚ0ꢁꢅꢚ"&%°ꢋꢚꢉꢂꢚ)ꢎ()ꢄꢂ1#

ꢋꢉꢛꢌꢅ<ꢚꢞꢌꢙꢄ#ꢚ$=7ꢉꢏꢛꢂꢄꢚꢊꢎꢃꢎꢅ<ꢚꢒꢉꢌꢄꢚ+

ꢑ8-%9%%

ꢀꢁꢙ:ꢁ(ꢄꢚ7ꢄꢁ:ꢚꢅꢄꢃ7ꢄꢂꢁꢅꢛꢂꢄ<ꢚ"&,°ꢋ#ꢚꢔꢎꢃꢄ<ꢚ4%ꢚꢏꢄꢙꢓꢚꢃꢁ=ꢓꢚ0ꢁꢅꢚ"%%°ꢋꢚꢉꢂꢚ)ꢎ()ꢄꢂ1#

ꢋꢉꢛꢌꢅ<ꢚꢞꢌꢙꢄ#ꢚ$=7ꢉꢏꢛꢂꢄꢚꢊꢎꢃꢎꢅ<ꢚꢒꢉꢌꢄꢚ+

ꢀꢆ

ꢀ&,9%%

ꢞ

ꢀꢎꢌꢚꢅꢄꢃ7ꢄꢂꢁꢅꢛꢂꢄ<ꢚꢚ-%%°ꢋꢚꢃꢁ=ꢓ#ꢚꢔꢎꢃꢄ<ꢚ&%ꢚꢏꢄꢙꢓꢚꢃꢁ=ꢓꢚ$=7ꢉꢏꢛꢂꢄꢚꢊꢎꢃꢎꢅ<ꢚꢒꢉꢌꢄꢚ+

ꢀꢁꢂꢅꢎꢁꢊꢚ)ꢄꢁꢅꢎꢌ(

* After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

Cautions 1. Do not use different soldering methods together (except for partial heating).

2. Prevent the resin surface temperature from being higher than the board temperature by 20°C or

more.

Data Sheet D16181EJ1V0DS

FP1 SERIES

[MEMO]

Data Sheet D16181EJ1V0DS

FP1 SERIES

•

The information in this document is current as of July, 2001. The information is subject to change

without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data

books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products

and/or types are available in every country. Please check with an NEC sales representative for

availability and additional information.

•

No part of this document may be copied or reproduced in any form or by any means without prior

written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.

NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of

third parties by or arising from the use of NEC semiconductor products listed in this document or any other

liability arising from the use of such products. No license, express, implied or otherwise, is granted under any

patents, copyrights or other intellectual property rights of NEC or others.

•

Descriptions of circuits, software and other related information in this document are provided for illustrative

purposes in semiconductor product operation and application examples. The incorporation of these

circuits, software and information in the design of customer's equipment shall be done under the full

responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third

parties arising from the use of these circuits, software and information.

While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers

agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize

risks of damage to property or injury (including death) to persons arising from defects in NEC

semiconductor products, customers must incorporate sufficient safety measures in their design, such as

redundancy, fire-containment, and anti-failure features.

NEC semiconductor products are classified into the following three quality grades:

"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products

developed based on a customer-designated "quality assurance program" for a specific application. The

recommended applications of a semiconductor product depend on its quality grade, as indicated below.

Customers must check the quality grade of each semiconductor product before using it in a particular

application.

"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio

and visual equipment, home electronic appliances, machine tools, personal electronic equipment

and industrial robots

"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support)

"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems and medical equipment for life support, etc.

The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's

data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not

intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness

to support a given application.

(Note)

(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.

(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for

NEC (as defined above).

M8E 00. 4

FP1L3N-A [NEC]

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