PS2565L-2-E4 [NEC]
AC Input-Transistor Output Optocoupler, 2-Element, 5000V Isolation, SURFACE MOUNT, PLASTIC PACKAGE-8;型号: | PS2565L-2-E4 |
厂家: | NEC |
描述: | AC Input-Transistor Output Optocoupler, 2-Element, 5000V Isolation, SURFACE MOUNT, PLASTIC PACKAGE-8 |
文件: | 总22页 (文件大小:207K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
PHOTOCOUPLER
PS2565-1,-2,-4,PS2565L-1,-2,-4
PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
HIGH ISOLATION VOLTAGE
AC INPUT RESPONSE TYPE
MULTI PHOTOCOUPLER SERIES
−NEPOC Series−
DESCRIPTION
The PS2565-1, -2, -4 are optically coupled isolators containing GaAs light emitting diodes and an NPN silicon
phototransistor.
The PS2565-1, -2, -4 are in a plastic DIP (Dual In-line Package) and the PS2565L-1, -2 -4 are lead bending type
(Gull-wing) for surface mount.
The PS2565L1-1, -2 -4 are lead bending type for long creepage distance.
The PS2565L2-1, -2 -4 are lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
•
AC input response
High Isolation voltage (BV = 5 000 Vr.m.s.)
High collector to emitter voltage (VCEO = 80 V)
High current transfer ratio (CTR = 200% TYP.)
High-speed switching (tr = 3 µs TYP., tf = 5 µs TYP.)
Ordering number of taping product: PS2565L-1-E3, E4, F3, F4, PS2565L-2-E3, E4, PS2565L2-1-E3, E4
UL approved: File No. E72422
CSA approved: No. CA 101391
BSI approved: No. 7112/7420
SEMKO approved: No. 0144211
NEMKO approved: No. A21409
DEMKO approved: No. 300535
FIMKO approved: No. FI10620A1
VDE approved (Option)
APPLICATIONS
•
•
•
Telephone/FAX.
FA/OA equipment
Programmable logic controller
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PN10236EJ02V0DS (2nd edition)
Date Published December 2003 CP(K)
Printed in Japan
The mark shows major revised points.
NEC Compound Semiconductor Devices 1992, 2003
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
PACKAGE DIMENSIONS (UNIT : mm)
DIP Type (New package)
PS2565-1
TOP VIEW
4.6±0.35
4
1
3
1. Anode,
Cathode
2. Cathode,
Anode
3. Emitter
4. Collector
2
7.62
0 to 15˚ +0.1
0.25–0.05
1.25±0.15
0.50±0.10
0.25
M
2.54
Caution New package 1-ch only
DIP Type
PS2565-1
PS2565-2
TOP VIEW
TOP VIEW
4.6±0.5
9.7±0.5
8
7
2
6
5
4
3
1. Anode,
Cathode
1, 3. Anode, Cathode
2, 4. Cathode, Anode
5, 7. Emitter
2. Cathode,
Anode
6, 8. Collector
3. Emitter
4. Collector
1
2
1
3
4
7.62
7.62
0 to 15˚ +0.1
0.25–0.05
0 to 15˚ +0.1
0.25–0.05
1.25±0.15
1.25±0.15
0.50±0.10
0.50±0.10
0.25
0.25
M
M
2.54
2.54
PS2565-4
TOP VIEW
19.8±0.5
16 15 14 13 12 11 10
9
8
1, 3, 5, 7. Anode, Cathode
2, 4, 6, 8. Cathode, Anode
9, 11, 13, 15. Emitter
10, 12, 14, 16. Collector
1
2
3
4
5
6
7
7.62
0 to 15˚ +0.1
0.25–0.05
1.25±0.15
0.50±0.10
0.25
M
2.54
2
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
Lead Bending Type (New package)
PS2565L-1
TOP VIEW
4.6±0.35
4
3
1. Anode,
Cathode
2. Cathode,
Anode
3. Emitter
4. Collector
1
2
1.25±0.15
0.25
0.9±0.25
9.60±0.4
M
0.15
2.54
Caution New package 1-ch only
Lead Bending Type
PS2565L-1
PS2565L-2
TOP VIEW
TOP VIEW
4.6±0.5
9.7±0.5
8
7
2
6
5
4
3
1. Anode,
Cathode
1, 3. Anode, Cathode
2, 4. Cathode, Anode
5, 7. Emitter
2. Cathode,
Anode
6, 8. Collector
3. Emitter
4. Collector
1
2
1
3
4
1.25±0.15
0.25
0.9±0.25
9.60±0.4
0.9±0.25
9.60±0.4
1.25±0.15
0.25
M
M
0.15
2.54
0.15
2.54
PS2565L-4
TOP VIEW
19.8±0.5
16 15 14 13 12 11 10
9
8
1, 3, 5, 7. Anode, Cathode
2, 4, 6, 8. Cathode, Anode
9, 11, 13, 15. Emitter
10, 12, 14, 16. Collector
1
2
3
4
5
6
7
0.9±0.25
9.60±0.4
1.25±0.15
0.25
M
0.15
2.54
3
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
Lead Bending Type For Long Creepage Distance (New Package)
PS2565L1-1
TOP VIEW
4.6±0.35
4
3
1. Anode,
Cathode
4
1
3
2. Cathode,
Anode
3. Emitter
4. Collector
1
2
2
10.16
0.50±0.1
0.25 M
+0.1
–0.05
1.25±0.15
0.25
0 to 15˚
2.54
Lead Bending Type For Long Creepage Distance
PS2565L1-1
PS2565L1-2
TOP VIEW
TOP VIEW
4.6±0.5
9.7±0.5
8
7
6
5
1, 3. Anode,
Cathode
4
3
1. Anode, Cathode
2. Cathode, Anode
3. Emitter
2, 4. Cathode,
Anode
5, 7. Emitter
6, 8. Collector
4. Collector
1
2
1
2
3
4
10.16
10.16
0 to 15˚
0 to 15˚
+0.1
+0.1
0.25
0.25
–0.05
–0.05
1.25±0.15
1.25±0.15
0.50±0.10
0.50±0.10
0.25
0.25
M
M
2.54
2.54
PS2565L1-4
TOP VIEW
19.8±0.5
16 15 14 13 12 11 10
9
8
1, 3, 5, 7. Anode, Cathode
2, 4, 6, 8. Cathode, Anode
9, 11, 13, 15. Emitter
10, 12, 14, 16. Collector
1
2
3
4
5
6
7
10.16
0 to 15˚
+0.1
0.25
–0.05
1.25±0.15
0.50±0.10
0.25
M
2.54
4
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
Lead Bending Type For Long Creepage Distance (Gull-Wing) (New Package)
PS2565L2-1
TOP VIEW
4.6±0.35
4
3
1. Anode,
4
3
Cathode
2. Cathode,
Anode
3. Emitter
4. Collector
1
2
1
2
0.9±0.25
0.25
1.25±0.15
0.25 M
10.16
+0.2
–0.5
11.8
2.54
Lead Bending Type For Long Creepage Distance (Gull-Wing)
PS2565L2-1
PS2565L2-2
4.6±0.5
9.7±0.5
TOP VIEW
TOP VIEW
4
3
8
7
6
5
1, 3. Anode,
Cathode
1. Anode, Cathode
2. Cathode, Anode
3. Emitter
2, 4. Cathode,
Anode
5, 7. Emitter
6, 8. Collector
4. Collector
1
2
1
2
3
4
10.16
10.16
1.25±0.15
0.25
0.9±0.25
1.25±0.15
0.9±0.25
+0.2
+0.2
M
11.8
0.25
M
11.8
–0.5
–0.5
0.25
0.25
2.54
2.54
PS2565L2-4
19.8±0.5
TOP VIEW
16 15 14 13 12 11 10
9
8
1, 3, 5, 7. Anode, Cathode
2, 4, 6, 8. Cathode, Anode
9, 11, 13, 15. Emitter
10, 12, 14, 16. Collector
1
2
3
4
5
6
7
10.16
1.25±0.15
0.25
0.9±0.25
+0.2
M
11.8
–0.5
0.25
2.54
5
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
MARKING EXAMPLE
PS2565-1
PS2565-2
No. 1 pin
Mark
No. 1 pin
Mark
Country Assembled
Assembly Lot
2565
M 003
PS2565-2
M 003
Assembly Lot
M
0
03
M
0
03
Week Assembled
Year Assembled
(Last 1 Digit)
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
In-house Code
CTR Rank Code
Package
Made in Japan Made in Taiwan
Package
Standard PKG
New PKG
Made in Japan Made in Taiwan
Blank
E
Blank
Standard PKG
New PKG
F
F
H
PS2565-4
No. 1 pin
Mark
Country Assembled
Assembly Lot
PS2565-4
M 003
M
0
03
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Package
Standard PKG
New PKG
Made in Japan Made in Taiwan
Blank
F
6
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
ORDERING INFORMATION (1/2)
Part Number
Package
4-pin DIP
Packing Style
Safety Standard
Approval
Application Part
Number*1
PS2565-1
Magazine case 100 pcs
Standard products
(UL, CSA, BSI,
NEMKO, SEMKO,
DEMKO, FIMKO
approved)
PS2565-1
PS2565L-1
PS2565L1-1
PS2565L2-1
PS2565L-1-E3
PS2565L-1-E4
PS2565L-1-F3
PS2565L-1-F4
PS2565L2-1-E3
PS2565L2-1-E4
PS2565-2
Embossed Tape 1 000 pcs/reel
Embossed Tape 2 000 pcs/reel
Embossed Tape 1 000 pcs/reel
Magazine case 45 pcs
8-pin DIP
PS2565-2
PS2565L-2
PS2565L1-2
PS2565L2-2
PS2565L-2-E3
PS2565L-2-E4
PS2565-4
Embossed Tape 1 000 pcs/reel
Magazine case 20 pcs
16-pin DIP
4-pin DIP
PS2565-4
PS2565-1
PS2565L-4
PS2565L1-4
PS2565L2-4
PS2565-1-V
Magazine case 100 pcs
VDE approved
PS2565L-1-V
PS2565L1-1-V
PS2565L2-1-V
PS2565L-1-V-E3
PS2565L-1-V-E4
PS2565L-1-V-F3
PS2565L-1-V-F4
PS2565L2-1-V-E3
PS2565L2-1-V-E4
products (Option)
Embossed Tape 1 000 pcs/reel
Embossed Tape 2 000 pcs/reel
Embossed Tape 1 000 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
7
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
ORDERING INFORMATION (2/2)
Part Number
Package
8-pin DIP
Packing Style
Safety Standard
Approval
Application Part
Number*1
PS2565-2-V
Magazine case 45 pcs
VDE approved
PS2565-2
PS2565L-2-V
PS2565L1-2-V
PS2565L2-2-V
PS2565L-2-V-E3
PS2565L-2-V-E4
PS2565-4-V
products (Option)
Embossed Tape 1 000 pcs/reel
Magazine case 20 pcs
16-pin DIP
PS2565-4
PS2565L-4-V
PS2565L1-4-V
PS2565L2-4-V
*1 For the application of the Safety Standard, following part number should be used.
8
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
PS2565-1 PS2565-2,-4
Unit
Diode
Forward Current (DC)
Power Dissipation Derating
Power Dissipation
IF
∆PD/°C
PD
80
mA
mW/°C
mW/ch
A
1.5
1.2
150
120
Peak Forward Current*1
IFP
1
80
7
Transistor Collector to Emitter Voltage
Emitter to Collector Voltage
Collector Current
VCEO
VECO
IC
V
V
50
mA/ch
mW/°C
mW/ch
Vr.m.s.
°C
Power Dissipation Derating
Power Dissipation
∆PC/°C
PC
1.5
1.2
150
120
Isolation Voltage*2
BV
5 000
Operating Ambient Temperature
Storage Temperature
TA
–55 to +100
–55 to +150
Tstg
°C
*1 PW = 100 µs, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
9
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
1.17
100
MAX.
1.4
Unit
V
Diode
Forward Voltage
Terminal Capacitance
IF = ±10 mA
Ct
V = 0 V, f = 1.0 MHz
VCE = 80 V, IF = 0 mA
pF
nA
Transistor Collector to Emitter Dark
Current
ICEO
100
400
3.0
Coupled
Current Transfer Ratio
(IC/IF)
CTR
IF = ±5 mA, VCE = 5 V
IF = 5 mA, VCE = 5 V
IF = ±10 mA, IC = 2 mA
80
200
1.0
%
CTR Ratio*1
CTR1/
CTR2
0.3
Collector Saturation
Voltage
VCE (sat)
0.3
V
Isolation Resistance
Isolation Capacitance
Rise Time*2
RI-O
CI-O
tr
VI-O = 1.0 kVDC
1011
Ω
V = 0 V, f = 1.0 MHz
0.5
3
pF
µs
VCC = 10 V, IC = 2 mA, RL = 100 Ω
Fall Time*2
tf
5
*1 CTR1 = IC1/IF1, CTR2 = IC2/IF2
IC1
IF1
VCE
IC2
IF2
*2 Test circuit for switching time
I
F
Pulse Input
V
CC
µ
PW = 100
s
Duty Cycle = 1/10
V
OUT
50 Ω
RL
= 100 Ω
10
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
150
100
150
100
50
PS2565-1
PS2565-1
PS2565-2,-4
1.5 mW/˚C
PS2565-2,-4
1.5 mW/˚C
50
0
1.2 mW/˚C
1.2 mW/˚C
100
25
50
75
125
(˚C)
150
0
25
50
75
100
125
(˚C)
150
Ambient Temperature T
A
Ambient Temperature T
A
FORWARD CURRENT vs.
FORWARD VOLTAGE
FORWARD CURRENT vs.
FORWARD VOLTAGE
100
50
80
60
40
20
T
A
= +100˚C
+60˚C
+25˚C
10
5
0˚C
–25˚C
–55˚C
0
1
–20
0.5
–40
–60
–80
0.1
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
Forward Voltage V (V)
–1.5 –1.0 –0.5
0
0.5
1.0
(V)
1.5
F
Forward Voltage V
F
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
40
10 000
1 000
100
10
V
CE = 80 V
40 V
10
5
24 V
10 V
5 V
IF
= 1 mA
1
0.5
1
0.1
–50
–25
0
25
50
75
100
1.0
0
0.2
0.4
0.6
0.8
Ambient Temperature T (˚C)
A
Collector Saturation Voltage VCE(sat) (V)
Remark The graphs indicate nominal characteristics.
11
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
1.2
70
60
50
40
30
20
10
1.0
0.8
0.6
0.4
0.2
0
I = 5 mA
F
Normalized to 1.0
at T = 25˚C,
= 5 mA, VCE = 5 V
A
I
F
0
4
8
10
–50
2
6
–25
0
25
50
75
100
Ambient Temperature T
A
(˚C)
Collector to Emitter Voltage VCE (V)
SWITCHING TIME vs.
LOAD RESISTANCE
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
1 000
100
10
450
400
350
300
250
t
f
I
V
F
= 5 mA,
CC = 5 V,
CTR = 290%
V
CE = 5 V
µ
ts
Sample A
B
C
200
150
100
t
r
50
0
td
1
100
0.05 0.1
0.5
Forward Current I
1
5
10
50
500 1 k
5 k 10 k
(Ω)
50 k 100 k
F
(mA)
Load Resistance R
L
SWITCHING TIME vs.
LOAD RESISTANCE
FREQUENCY RESPONSE
50
10
I = 5 mA,
F
I = 2 mA,
C
t
f
VCE = 5 V
VCC = 10 V,
tr
0
–5
CTR = 290%
µ
td
ts
–10
–15
–20
100 Ω
300 Ω
1
RL = 1 kΩ
0.1
10
10 k
50 100
500
5 k
0.5
1
2
5
10 20 50 100200 500
Frequency f (kHz)
1 k
(Ω)
Load Resistance R
L
Remark The graphs indicate nominal characteristics.
12
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
LONG TERM CTR DEGRADATION
1.2
1.0
0.8
0.6
0.4
0.2
TYP.
I = 5 mA
F
TA
= 25˚C
I
F
= 5 mA
A
T = 60˚C
0
103
Time (Hr)
102
104
105
Remark The graphs indicate nominal characteristics.
13
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
TAPING SPECIFICATIONS (UNIT : mm)
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
+0.1
4.5 MAX.
φ
1.5–0
1.55±0.1
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Tape Direction
PS2565L-1-E3
PS2565L-1-E4
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
φ
R 1.0
φ
φ
φ
21.0±0.8
17.5±1.0
21.5±1.0
15.9 to 19.4
Outer edge of
flange
Packing: 1 000 pcs/reel
14
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
Outline and Dimesions (Tape)
2.0±0.1
4.0±0.1
+0.1
4.5 MAX.
1.5
–0
1.55±0.1
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Tape Direction
PS2565L-1-F3
PS2565L-1-F4
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
φ
R 1.0
φ
φ
φ
21.0±0.8
17.5±1.0
21.5±1.0
15.9 to 19.4
Outer edge of
flange
Packing: 2 000 pcs/reel
15
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
4.4±0.2
1.55±0.1
0.38
2.05±0.1
6.6±0.2
12.0±0.1
Tape Direction
PS2565L2-1-E3
PS2565L2-1-E4
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
φ
φ
R 1.0
φ
φ
21.0±0.8
25.5±1.0
29.5±1.0
23.9 to 27.4
Outer edge of
flange
Packing: 1 000 pcs/reel
16
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
+0.1
1.5
–0
4.5 MAX.
10.4±0.1
4.0±0.1
1.55±0.1
12.0±0.1
0.3
Tape Direction
PS2565L-2-E4
PS2565L-2-E3
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
R 1.0
21.0±0.8
17.5±1.0
21.5±1.0
15.9 to 19.4
Outer edge of
flange
Packing: 1 000 pcs/reel
17
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
10 seconds or less
• Time of peak reflow temperature
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows
• Flux
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions
• Number of times
• Flux
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute
maximum ratings.
18
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
19
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Speck
Unit
Application classification (DIN VDE 0109)
for rated line voltages ≤ 300 Vr.m.s.
for rated line voltages ≤ 600 Vr.m.s.
IV
III
Climatic test class (DIN IEC 68 Teil 1/09.80)
55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.2 × UIORM, Pd < 5 pC
UIORM
890
Vpeak
Upr
1 068
Vpeak
Test voltage (partial discharge test, procedure b for all devices test)
Upr = 1.6 × UIORM, Pd < 5 pC
Upr
1 424
Vpeak
Vpeak
Highest permissible overvoltage
Degree of pollution (DIN VDE 0109)
Clearance distance
UTR
8 000
2
> 7.0
mm
mm
Creepage distance
> 7.0
Comparative tracking index (DIN IEC 112/VDE 0303 part 1)
Material group (DIN VDE 0109)
Storage temperature range
CTI
175
III a
Tstg
TA
–55 to +150
–55 to +100
°C
°C
Operating temperature range
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
VIO = 500 V dc at TA MAX. at least 100°C
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Tsi
Isi
175
400
700
°C
mA
mW
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
Psi
VIO = 500 V dc at TA = 175°C (Tsi)
Ris MIN.
109
Ω
20
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
•
The information in this document is current as of December, 2003. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
21
Data Sheet PN10236EJ02V0DS
PS2565-1,-2,-4,PS2565L-1,-2,-4,PS2565L1-1,-2,-4,PS2565L2-1,-2,-4
This product uses gallium arsenide (GaAs).
Caution GaAs Products
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
FAX: +852-3107-7309
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-01 FAX: +49-211-6503-487
California Eastern Laboratories, Inc.
TEL: +1-408-988-3500 FAX: +1-408-988-0279
http://www.cel.com/
0310
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