UPA1930TE-T1-A [NEC]

Power Field-Effect Transistor, 4.5A I(D), 30V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET,;
UPA1930TE-T1-A
型号: UPA1930TE-T1-A
厂家: NEC    NEC
描述:

Power Field-Effect Transistor, 4.5A I(D), 30V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET,

文件: 总6页 (文件大小:100K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
μPA1930  
P-CHANNEL MOSFET  
FOR SWITCHING  
DESCRIPTION  
The μPA1930 is a P-channel MOSFET designed for power  
PACKAGE DRAWING (Unit : mm)  
–0.05  
+0.1  
+0.1  
0.32  
0.16  
–0.06  
switch of portable machine and so on.  
FEATURES  
4.5 V drive available  
RDS(on)1 = 77 mΩ MAX. (VGS = 10 V, ID = 2.5 A)  
RDS(on)2 = 100 mΩ MAX. (VGS = 4.5 V, ID = 2.5 A)  
6
1
5
2
4
3
0 to 0.1  
ORDERING INFORMATION  
0.65  
0.95 0.95  
1.9  
PART NUMBER  
μPA1930TE-T1-A  
μPA1930TE-T2-A  
PACKAGE  
0.9 to 1.1  
SC-95 (Mini Mold Thin Type)  
2.9 0.2  
Remark "-A" indicates Pb-free (This product does not contain  
Pb in external electrode and other parts).  
"-T1", "-T2" indicates the unit orientation (8 mm embossed  
carrier tape, 3,000 pcs/reel).  
1
3
4
, 2, 5, 6 : Drain  
: Gate  
: Source  
Marking : UA  
EQUIVALENT CIRCUIT  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)  
Drain  
Drain to Source Voltage (VGS = 0V)  
Gate to Source Voltage (VDS = 0V)  
Drain Current (DC) Note1  
VDSS  
VGSS  
ID(DC)  
ID(pulse)  
PT1  
30  
m20  
V
V
Body  
m4.5  
A
Diode  
Gate  
Drain Current (pulse) Note2  
m18  
A
Total Power Dissipation  
0.2  
W
W
°C  
°C  
Gate  
Total Power Dissipation Note1  
Channel Temperature  
PT2  
2.0  
Source  
Protection  
Diode  
Tch  
150  
Storage Temperature  
Tstg  
55 to +150  
Notes 1. Mounted on FR-4 Board 2500 mm2 × 1.6 mm, t 5 sec  
2. PW 10 μs, Duty Cycle 1%  
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When this  
device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage  
may be applied to this device.  
Caution This product is electrostatic-sensitive device due to low ESD capability and should be handled with caution for  
electrostatic discharge. VESD ± 150 V TYP. (C = 200 pF, R = 0 Ω, Single pulse)  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. G18030EJ1V0DS00 (1st edition)  
Date Published April 2006 NS CP(K)  
Printed in Japan  
2006  
μPA1930  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
CHARACTERISTICS  
SYMBOL  
TEST CONDITIONS  
VDS = 30 V, VGS = 0 V  
MIN.  
TYP.  
MAX.  
UNIT  
1  
Zero Gate Voltage Drain Current  
Gate Leakage Current  
μA  
μA  
V
IDSS  
IGSS  
m10  
2.5  
VGS = m16 V, VDS = 0 V  
VDS = 10 V, ID = 1.0 mA  
VDS = 10 V, ID = 2.5 A  
VGS = 10 V, ID = 2.5 A  
VGS = 4.5 V, ID = 2.5 A  
VDS = 10 V  
1.0  
Gate to Source Cut-off Voltage  
Forward Transfer Admittance Note  
Drain to Source On-state Resistance Note  
VGS(off)  
| yfs |  
RDS(on)1  
RDS(on)2  
Ciss  
1
S
58  
77  
77  
mΩ  
mΩ  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
100  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
325  
78  
Coss  
Crss  
VGS = 0 V  
f = 1.0 MHz  
65  
VDD = 15 V, ID = 2.5 A,  
VGS = 10 V,  
td(on)  
tr  
td(off)  
tf  
8.5  
3.5  
33  
Turn-off Delay Time  
Fall Time  
RG = 6 Ω  
19.5  
QG  
Total Gate Charge  
Gate to Source Charge  
Gate to Drain Charge  
Diode Forward Voltage Note  
Note Pulsed  
nC  
nC  
nC  
V
VDD = 24 V,  
7.5  
VGS = 10 V,  
QGS  
QGD  
1.1  
2.3  
ID = 4.5 A  
0.93  
VF(S-D)  
IF = 4.5 A, VGS = 0 V  
TEST CIRCUIT 1 SWITCHING TIME  
TEST CIRCUIT 2 GATE CHARGE  
V
V
GS()  
D.U.T.  
D.U.T.  
90%  
V
GS  
Wave Form  
V
GS  
10%  
I
G
= 2 mA  
R
L
0
R
L
DS()  
RG  
PG.  
V
DD  
50 Ω  
PG.  
V
DD  
90%  
90%  
V
DS  
10% 10%  
V
DS  
Wave Form  
0
V
GS ()  
0
t
d(on)  
tr  
t
d(off)  
tf  
τ
t
on  
toff  
τ = 1  
μs  
Duty Cycle 1%  
2
Data Sheet G18030EJ1V0DS  
μPA1930  
TYPICAL CHARACTERISTICS (TA = 25°C)  
DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
TOTAL POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
120  
100  
80  
60  
40  
20  
0
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Mounted on FR-4 board of  
2500 mm2 × 1.6 mm  
t < 5sec  
0
25  
50  
75 100 125 150 175  
0
25  
50  
75 100 125 150 175  
TA - Ambient Temperature - °C  
TA - Ambient Temperature - °C  
FORWARD BIAS SAFE OPERATING AREA  
-100  
-10  
R
DS(on) Limited  
I
D(pulse)  
(VGS = 10 V)  
PW= 100 μs  
I
D(DC)  
-1  
1 ms  
10 ms  
100 ms  
5 s  
-0.1  
Single Pulse  
Mounted on FR-4 board of  
2500 mm2 × 1.6 mm  
-0.01  
-0.1  
-1  
-10  
-100  
VDS - Drain to Source Voltage - V  
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH  
1000  
100  
10  
1
Single Pulse  
Mounted on FR-4 board of  
2500 mm2 × 1.6 mm  
0.1  
100 μ  
1 m  
10 m  
100 m  
1
10  
100  
1000  
PW - Pulse Width – s  
3
Data Sheet G18030EJ1V0DS  
μPA1930  
DRAIN CURRENT vs.  
FORWARD TRANSFER CHARACTERISTICS  
DRAIN TO SOURCE VOLTAGE  
-20  
-16  
-12  
-8  
-10  
-1  
VDS  
Puls ed  
= 10 V  
Pulsed  
V
GS = 10 V  
TA = 125°C  
4.5 V  
-0.1  
75°C  
25°C  
25°C  
-0.01  
-0.001  
-0.0001  
-4  
0
-0.5  
-1  
-1.5  
-2  
-2.5  
-3  
-3.5  
0
-1  
-2  
-3  
-4  
VDS - Drain to Source Voltage - V  
VGS - Gate to Source Voltage - V  
GATE CUT-OFF VOLTAGE vs.  
CHANNEL TEMPERATURE  
FORWARD TRANSFER ADMITTANCE vs.  
DRAIN CURRENT  
-1.8  
-1.6  
-1.4  
-1.2  
-1.0  
-0.8  
10  
1
VDS = 10 V  
Puls ed  
VDS  
= 10 V  
ID= 1.0 mA  
TA = 25°C  
25°C  
75°C  
125°C  
0.1  
0.01  
-50  
0
50  
100  
150  
-0.01  
-0.1  
-1  
-10  
Tch - Channel Temperature - °C  
ID - Drain Current - A  
DRAIN TO SOURCE ON-STATE  
DRAIN TO SOURCE ON-STATE  
RESISTANCE vs. DRAIN CURRENT  
RESISTANCE vs. DRAIN CURRENT  
200  
150  
100  
50  
200  
150  
100  
50  
VGS  
Pulsed  
= 10 V  
TA  
= 125°C  
75°C  
25°C  
25°C  
TA = 125°C  
75°C  
25°C  
25°C  
VGS = 4.5 V  
Pulsed  
0
0
-0.1  
-1  
-10  
-100  
-0.1  
-1  
-10  
-100  
ID - Drain Current - A  
ID - Drain Current - A  
4
Data Sheet G18030EJ1V0DS  
μPA1930  
DRAIN TO SOURCE ON-STATE RESISTANCE  
vs. CHANNEL TEMPERATURE  
DRAIN TO SOURCE ON-STATE RESISTANCE  
vs. GATE TO SOURCE VOLTAGE  
200  
200  
150  
100  
50  
I
D
= 2.5 A  
ID = 2.5 A  
Puls ed  
Pulsed  
150  
100  
50  
VGS=4.5V
10V
0
0
-50  
0
50  
100  
150  
0
-4  
-8  
-12  
-16  
-20  
VGS - Gate to Source Voltage - V  
Tch - Channel Temperature - °C  
CAPACITANCE vs.  
SWITCHING CHARACTERISTICS  
DRAIN TO SOURCE VOLTAGE  
1000  
100  
10  
100  
V
GS = 0 V  
f = 1.0 MHz  
t
d(off)  
C
iss  
t
f
t
d(on)  
10  
C
oss  
t
r
C
rss  
V
V
DD = 15 V  
GS = 10 V  
R = 6 Ω  
G
1
-0.1  
-0.1  
-1  
-10  
-100  
-1  
-10  
VDS - Drain to Source Voltage - V  
ID - Drain Current - A  
DYNAMIC INPUT CHARACTERISTICS  
SOURCE TO DRAIN DIODE FORWARD VOLTAGE  
-10  
-8  
-6  
-4  
-2  
0
100  
VGS = 0 V  
Pulsed  
I
D
= 4.5 A  
VDD = 6.0 V  
10  
15 V  
24 V  
1
0.1  
0.01  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
0
-2  
-4  
-6  
-8  
QG - Gate Charge - nC  
VF(S-D) - Source to Drain Voltage - V  
5
Data Sheet G18030EJ1V0DS  
μPA1930  
The information in this document is current as of April, 2006. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or  
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all  
products and/or types are available in every country. Please check with an NEC Electronics sales  
representative for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without the prior  
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may  
appear in this document.  
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from the use of NEC Electronics products listed in this document  
or any other liability arising from the use of such products. No license, express, implied or otherwise, is  
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of a customer's equipment shall be done under the full  
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by  
customers or third parties arising from the use of these circuits, software and information.  
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,  
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To  
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC  
Electronics products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment and anti-failure features.  
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and  
"Specific".  
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-  
designated "quality assurance program" for a specific application. The recommended applications of an NEC  
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of  
each NEC Electronics product before using it in a particular application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots.  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support).  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC  
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications  
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to  
determine NEC Electronics' willingness to support a given application.  
(Note)  
(1)  
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its  
majority-owned subsidiaries.  
(2)  
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as  
defined above).  
M8E 02. 11-1  

相关型号:

UPA1930TE-T2-A

Power Field-Effect Transistor, 4.5A I(D), 30V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET,
NEC

UPA1930TE-T2-A

4.5A, 30V, P-CHANNEL, Si, POWER, MOSFET
RENESAS

UPA1930TE-T2-AT

TRANSISTOR,MOSFET,P-CHANNEL,30V V(BR)DSS,4.5A I(D),TSOP
RENESAS

UPA1931

MOS FIELD EFFECT TRANSISTOR
RENESAS

UPA1931TE-T1-AT

MOS FIELD EFFECT TRANSISTOR
RENESAS

UPA1931TE-T2-AT

MOS FIELD EFFECT TRANSISTOR
RENESAS

UPA1950

P-CHANNEL MOS FIELD EFFECT TRANSISTOR FOR SWITCHING
NEC

UPA1950TE

P-CHANNEL MOS FIELD EFFECT TRANSISTOR FOR SWITCHING
NEC

UPA1950TE-A

2.5A, 12V, 0.205ohm, 2 CHANNEL, P-CHANNEL, Si, POWER, MOSFET, PLASTIC, SC-95, 6 PIN
RENESAS

UPA1951

P-CHANNEL MOS FIELD EFFECT TRANSISTOR FOR SWITCHING
NEC

UPA1951TE

P-CHANNEL MOS FIELD EFFECT TRANSISTOR FOR SWITCHING
NEC

UPA1951TE-A

2.5A, 12V, 0.133ohm, 2 CHANNEL, P-CHANNEL, Si, POWER, MOSFET, PLASTIC, SC-95, 6 PIN
RENESAS