UPA2720GR-E2-A [NEC]

Power Field-Effect Transistor, 14A I(D), 30V, 0.01ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, LEAD FREE, POWER SOP-8;
UPA2720GR-E2-A
型号: UPA2720GR-E2-A
厂家: NEC    NEC
描述:

Power Field-Effect Transistor, 14A I(D), 30V, 0.01ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, LEAD FREE, POWER SOP-8

文件: 总6页 (文件大小:146K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
µ PA2720GR  
SWITCHING  
N-CHANNEL POWER MOSFET  
DESCRIPTION  
PACKAGE DRAWING (Unit: mm)  
The µ PA2720GR is N-channel MOS Field Effect Transistor  
designed for power management applications of notebook  
computers and Li-ion battery protection circuit.  
8
5
1, 2, ꢀ : Source  
4
: Gate  
5, 6, 7, 8: Drain  
FEATURES  
Low on-state resistance  
6.0 0.ꢀ  
4.4  
RDS(on)1 = 6.6 mMAX. (VGS = 10 V, ID = 7 A)  
RDS(on)2 = 10 mMAX. (VGS = 4.5 V, ID = 7 A)  
Low Ciss: Ciss = 2800 pF TYP. (VDS = 10 V, VGS = 0 V)  
Built-in gate protection diode  
1
4
5.ꢀ7 MAX.  
0.8  
0.5 0.2  
Small and surface mount package (Power SOP8)  
0.10  
1.27 0.78 MAX.  
+0.10  
–0.05  
0.40  
0.12 M  
ORDERING INFORMATION  
PART NUMBER  
µ PA2720GR-E1  
µ PA2720GR-E1-A  
µ PA2720GR-E2  
µ PA2720GR-E2-A  
PACKAGE  
Power SOP8  
Power SOP8  
Power SOP8  
Power SOP8  
Note  
Note  
EQUIVALENT CIRCUIT  
Drain  
Note Pb-free (This product does not contain Pb in external electrode and other parts.)  
Body  
Diode  
Gate  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, All terminals are connected.)  
Drain to Source Voltage (VGS = 0 V)  
Gate to Source Voltage (VDS = 0 V)  
Drain Current (DC)  
VDSS  
VGSS  
ID(DC)  
ID(pulse)  
PT1  
PT2  
Tch  
30  
20  
14  
140  
1.1  
V
V
A
Gate  
Protection  
Diode  
Source  
Drain Current (pulse) Note1  
A
Total Power Dissipation Note2  
Total Power Dissipation (PW = 10 sec) Note2  
Channel Temperature  
W
W
°C  
°C  
2.5  
150  
–55 to +150  
Storage Temperature  
Tstg  
Notes 1. PW 10 µs, Duty Cycle 1%  
2. Mounted on glass epoxy board of 1 inch x 1 inch x 0.8 mm  
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD. When  
this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated  
voltage may be applied to this device.  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. G17443EJ1V0DS00 (1st edition)  
Date Published July 2005 NS CP(K)  
Printed in Japan  
2005  
µ PA2720GR  
ELECTRICAL CHARACTERISTICS (TA = 25°C, All terminals are connected.)  
CHARACTERISTICS  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Zero Gate Voltage Drain Current  
Gate Leakage Current  
IDSS  
IGSS  
VGS(off)  
| yfs |  
RDS(on)1  
RDS(on)2  
Ciss  
VDS = 30 V, VGS = 0 V  
1
µA  
µA  
V
VGS = 20 V, VDS = 0 V  
VDS = 10 V, ID = 1 mA  
VDS = 10 V, ID = 7 A  
VGS = 10 V, ID = 7 A  
VGS = 4.5 V, ID = 7 A  
VDS = 10 V  
10  
2.5  
Gate Cut-off Voltage  
1.0  
8
Note  
Forward Transfer Admittance  
S
Note  
Drain to Source On-state Resistance  
5.2  
7.0  
2800  
540  
360  
16  
6.6  
10  
mΩ  
mΩ  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
V
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
Coss  
Crss  
VGS = 0 V  
f = 1 MHz  
td(on)  
tr  
VDD = 15 V, ID = 7 A  
VGS = 10 V  
25  
Turn-off Delay Time  
Fall Time  
td(off)  
tf  
RG = 10 Ω  
70  
26  
Total Gate Charge  
Gate to Source Charge  
Gate to Drain Charge  
QG  
VDD = 15 V  
27  
QGS  
QGD  
VF(S-D)  
trr  
VGS = 5 V  
7
ID = 14 A  
12  
Note  
Body Diode Forward Voltage  
IF = 14 A, VGS = 0 V  
IF = 14 A, VGS = 0 V  
di/dt = 50 A/µs  
0.8  
34  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
nC  
Qrr  
27  
Note Pulsed  
TEST CIRCUIT 1 SWITCHING TIME  
TEST CIRCUIT 2 GATE CHARGE  
D.U.T.  
D.U.T.  
IG  
= 2 mA  
R
L
V
V
GS  
0
R
L
90%  
V
GS  
Wave Form  
VGS  
10%  
90%  
R
G
PG.  
V
DD  
50 Ω  
PG.  
VDD  
DS  
90%  
V
0
GS  
V
DS  
10% 10%  
V
DS  
Wave Form  
0
τ
td(on)  
t
r
td(off)  
tf  
τ = 1 s  
µ
Duty Cycle 1%  
ton  
toff  
2
Data Sheet G17443EJ1V0DS  
µ PA2720GR  
TYPICAL CHARACTERISTICS (TA = 25°C)  
DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
FORWARD BIAS SAFE OPERATING AREA  
1 ms  
1000  
120  
100  
80  
I
D(pulse)  
100  
10  
µ
I
D(DC)  
60  
1
40  
T
A = 25°C  
0.1  
Single pulse  
20  
Mounted on glass epoxy board  
of 1 inch x 1 inch x 0.8 mm  
0.01  
0
0
20  
40 60  
80 100 120 140 160  
0.01  
0.1  
1
10  
100  
T
A
- Ambient Temperature - ˚C  
VDS - Drain to Source Voltage - V  
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH  
1000  
100  
10  
Rth(ch-A) = 114°C/W  
1
0.1  
T
A
= 25°C  
Single pulse  
Mounted on glass epoxy board of 1 inch x 1 inch x 0.8 mm  
0.01  
100 µ  
1 m  
10 m 100 m 10 100  
1
1000  
PW - Pulse Width - s  
DRAIN CURRENT vs.  
FORWARD TRANSFER CHARACTERISTICS  
DRAIN TO SOURCE VOLTAGE  
100  
10  
1
60  
50  
40  
30  
20  
10  
0
VGS = 10 V  
4.5 V  
T
ch = 55°C  
25°C  
75°C  
150°C  
0.1  
V
DS = 10 V  
Puls ed  
Pulsed  
0.01  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0
1
2
3
4
5
VGS - Gate to Source Voltage - V  
VDS - Drain to Source Voltage - V  
3
Data Sheet G17443EJ1V0DS  
µ PA2720GR  
GATE CUT-OFF VOLTAGE vs.  
CHANNEL TEMPERATURE  
FORWARD TRANSFER ADMITTANCE vs.  
DRAIN CURRENT  
3
2.5  
2
100  
10  
1
Tch  
=
55°C  
25°C  
1.5  
1
75°C  
150°C  
VDS = 10 V  
Pulsed  
V
DS = 10 V  
0.5  
0
Pulsed  
0.1  
0.01  
0.1  
1
10  
100  
-50  
0
50  
100  
150  
ID - Drain Current - A  
Tch - Channel Temperature - °C  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
DRAIN CURRENT  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
GATE TO SOURCE VOLTAGE  
20  
20  
Pulsed  
I
D
= 7 A  
Pulsed  
15  
10  
15  
10  
5
V
GS = 4.5 V  
10 V  
5
0
0
0.1  
1
10  
100  
0
5
10  
15  
20  
ID - Drain Current - A  
VGS - Gate to Source Voltage - V  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
CHANNEL TEMPERATURE  
CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE  
15  
10000  
1000  
100  
C
iss  
10  
V
GS = 4.5 V  
10 V  
C
oss  
C
rss  
5
0
I
D
= 7 A  
V
GS = 0 V  
Pulsed  
f = 1MHz  
10  
-50  
0
50  
100  
150  
0.1  
1
10  
100  
Tch - Channel Temperature - °C  
VDS - Drain to Source Voltage - V  
4
Data Sheet G17443EJ1V0DS  
µ PA2720GR  
SWITCHING CHARACTERISTICS  
DYNAMIC INPUT/OUTPUT CHARACTERISTICS  
1000  
100  
10  
30  
20  
10  
0
6
5
4
3
2
1
0
V
DD = 24 V  
15 V  
6 V  
t
t
d(off)  
d(on)  
t
f
t
r
V
GS  
V
V
DD = 15 V  
GS = 10 V  
R = 10 Ω  
G
V
DS  
1
0.1  
1
10  
100  
0
10  
20  
30  
ID - Drain Current - A  
QG - Gate Charge - nC  
SOURCE TO DRAIN DIODE FORWARD VOLTAGE  
100  
REVERSE RECOVERY TIME vs.  
DIODE FORWARD CURRENT  
1000  
100  
10  
di/dt = 100 A/ s  
µ
V
GS = 0 V  
10  
1
V
GS = 10 V  
0 V  
0.1  
0.01  
Pulsed  
1
1
0.1  
1
10  
100  
0
0.2  
0.4  
0.6  
0.8  
1.2  
VF(S-D) - Source to Drain Voltage - V  
IF - Diode Forward Current - A  
5
Data Sheet G17443EJ1V0DS  
µ PA2720GR  
The information in this document is current as of July, 2005. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or  
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all  
products and/or types are available in every country. Please check with an NEC Electronics sales  
representative for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without the prior  
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may  
appear in this document.  
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from the use of NEC Electronics products listed in this document  
or any other liability arising from the use of such products. No license, express, implied or otherwise, is  
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of a customer's equipment shall be done under the full  
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by  
customers or third parties arising from the use of these circuits, software and information.  
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,  
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To  
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Electronics products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment and anti-failure features.  
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and  
"Specific".  
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-  
designated "quality assurance program" for a specific application. The recommended applications of an NEC  
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and industrial robots.  
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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support).  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC  
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications  
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(Note)  
(1)  
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its  
majority-owned subsidiaries.  
(2)  
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as  
defined above).  
M8E 02. 11-1  

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