UPA867TS-A [NEC]
RF Small Signal Bipolar Transistor, 0.03A I(C), 2-Element, S Band, Silicon Germanium, NPN, LEAD FREE, 1007, SUPER LEADLESS MINIMOLD PACKAGE-6;型号: | UPA867TS-A |
厂家: | NEC |
描述: | RF Small Signal Bipolar Transistor, 0.03A I(C), 2-Element, S Band, Silicon Germanium, NPN, LEAD FREE, 1007, SUPER LEADLESS MINIMOLD PACKAGE-6 ISM频段 光电二极管 晶体管 |
文件: | 总6页 (文件大小:57K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
NPN SILICON + SiGe RF TWIN TRANSISTOR
µPA867TS
NPN SILICON + SiGe RF TRANSISTOR (WITH 2 DIFFERENT ELEMENTS)
IN A 6-PIN SUPER LEAD-LESS MINIMOLD (1007 PKG)
FEATURES
•
2 different built-in transistors (2SC5435, NESG2107M33)
Q1: High gain transistor
fT = 12.0 GHz TYP., S21e2 = 11 dB TYP. @ VCE = 3 V, IC = 10 mA, f = 2 GHz
Q2: Built-in low phase noise SiGe transistor suited for OSC applications
fT = 10.0 GHz TYP., S21e2 = 9.0 dB TYP. @ VCE = 1 V, IC = 5 mA, f = 2 GHz
6-pin super lead-less minimold package (1007 PKG)
•
BUILT-IN TRANSISTORS
Q1
2SC5435
−
Q2
Flat-lead 3-pin thin-type ultra super minimold part No.
3-pin super lead-less minimold part No.
−
NESG2107M33
ORDERING INFORMATION
Part Number
Order Number
Package
Quantity
Supplying Form
µPA867TS
µPA867TS-A
6-pin super lead-less
minimold package
(1007 PKG) (Pb-Free)Note
50 pcs
• 8 mm wide embossed taping
(Non reel)
• Pin 1 (Q1 Collector), Pin 6 (Q1 Base) face the
perforation side of the tape
µPA867TS-T3
µPA867TS-T3-A
10 kpcs/reel
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, contact your nearby sales office.
The unit sample quantity is 50 pcs.
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PU10423EJ02V0DS (2nd edition)
Date Published September 2005 CP(K)
Printed in Japan
The mark shows major revised points.
NEC Compound Semiconductor Devices, Ltd. 2003, 2005
µPA867TS
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Parameter
Symbol
Ratings
Unit
Q1
9
Q2
13
Collector to Base Voltage
Collector to Emitter Voltage
Emitter to Base Voltage
Collector Current
VCBO
VCEO
VEBO
IC
V
V
6
5
2
1.5
100
110
V
30
110
mA
mW
Note
Total Power Dissipation
Ptot
130 in 2 elements
150
Junction Temperature
Storage Temperature
Tj
°C
°C
Tstg
−65 to +150
Note Mounted on 1.08 cm2 × 1.0 mm (t) glass epoxy PCB
2
Data Sheet PU10423EJ02V0DS
µPA867TS
ELECTRICAL CHARACTERISTICS (TA = +25°C)
(1) Q1
Parameter
Collector Cut-off Current
Emitter Cut-off Current
DC Current Gain
Symbol
ICBO
Test Conditions
VCB = 5 V, IE = 0 mA
MIN.
−
TYP.
−
MAX.
Unit
nA
nA
−
100
100
150
−
IEBO
VEB = 1 V, IC = 0 mA
−
−
Note 1
hFE
VCE = 3 V, IC = 10 mA
75
10.0
7.0
−
110
12.0
11.0
1.5
Gain Bandwidth Product
Insertion Power Gain
Noise Figure
fT
VCE = 3 V, IC = 10 mA, f = 2 GHz
GHz
dB
dB
S21e2 VCE = 3 V, IC = 10 mA, f = 2 GHz
−
NF
VCE = 3 V, IC = 3 mA, f = 2 GHz,
ZS = Zopt
2.5
Note 2
Reverse Transfer Capacitance
Cre
VCB = 3 V, IE = 0 mA, f = 1 MHz
−
0.4
0.7
pF
(2) Q2
Parameter
Collector Cut-off Current
Emitter Cut-off Current
DC Current Gain
Symbol
ICBO
Test Conditions
VCB = 5 V, IE = 0 mA
MIN.
−
TYP.
−
MAX.
100
100
220
−
Unit
nA
IEBO
VEB = 0.5 V, IC = 0 mA
−
−
nA
Note 1
hFE
VCE = 1 V, IC = 5 mA
140
7.0
−
180
10.0
17.0
9.0
−
Gain Bandwidth Product (1)
Gain Bandwidth Product (2)
Insertion Power Gain (1)
Insertion Power Gain (2)
Associated Gain
fT
fT
VCE = 1 V, IC = 5 mA, f = 2 GHz
VCE = 1 V, IC = 20 mA, f = 2 GHz
GHz
GHz
dB
−
S21e2 VCE = 1 V, IC = 5 mA, f = 2 GHz
S21e2 VCE = 1 V, IC = 20 mA, f = 2 GHz
7.5
−
−
10.0
10.0
−
dB
Ga
VCE = 1 V, IC = 5 mA, f = 2 GHz,
ZS = Zopt
7.0
−
dB
Noise Figure
NF
VCE = 1 V, IC = 5 mA, f = 2 GHz,
ZS = Zopt
−
−
0.9
0.5
1.5
0.7
dB
pF
Note 2
Reverse Transfer Capacitance
Cre
VCB = 1 V, IE = 0 mA, f = 1 MHz
Notes 1. Pulse measurement: PW ≤ 350 µs, Duty Cycle ≤ 2%
2. Collector to base capacitance when the emitter grounded
hFE CLASSIFICATION
Rank
FB
xF
Marking
hFE Value of Q1
hFE Value of Q2
75 to 150
140 to 220
3
Data Sheet PU10423EJ02V0DS
µPA867TS
PACKAGE DIMENSIONS
6-PIN SUPER LEAD-LESS MINIMOLD (1007 PKG) (UNIT: mm)
0.9 0.05
0.7 0.05
(Top View)
Q1
C1
E1
C2
B1
E2
B2
1
6
5
4
2
3
Q2
PIN CONNECTIONS
1. Collector (Q1)
2. Emitter (Q1)
3. Collector (Q2)
4. Base (Q2)
5. Emitter (Q2)
6. Base (Q1)
4
Data Sheet PU10423EJ02V0DS
µPA867TS
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
•
The information in this document is current as of September, 2005. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
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semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
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The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
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(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
5
Data Sheet PU10423EJ02V0DS
µPA867TS
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
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TEL: +49-211-6503-0 FAX: +49-211-6503-1327
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TEL: +1-408-988-3500 FAX: +1-408-988-0279
http://www.cel.com/
0504
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