UPD72012GB-XXX-3B4 [NEC]
HUB CONTROLLER FOR UNIVERSAL SERIAL BUS; 集线器控制器通用串行总线
| 型号： | UPD72012GB-XXX-3B4 |
| 厂家： | 
NEC |
| 描述： | HUB CONTROLLER FOR UNIVERSAL SERIAL BUS |
| 文件： | 总36页 (文件大小：411K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
MOS INTEGRATED CIRCUIT
µPD72012
HUB CONTROLLER FOR UNIVERSAL SERIAL BUS
The µPD72012 is a dedicated LSI for a HUB connected to a universal serial bus (USB) system.
It is an upgrade of NEC’s µPD72011. It complies with USB specification revision 1.1.
By putting descriptors into ROM, information such as a user’s vendor ID can be implemented in the chip.
FEATURES
{ Compliant with Chapter 11 (HUB Specifications) of USB Specification 1.1.
{ Descriptors into ROM
• The user can customize the vendor ID and product ID by using Mask ROM option.
{ Supports 5 kinds of string descriptors (for Mask ROM code product only)
{ On-chip sequencer
• There is an on-chip descriptor and request response sequencer. External initial setup and control is not needed
and HUB functions can be realized using only the µPD72012.
{ Downstream ports
• Four or five ports can be selected using a pin function.
{ Power modes
• Bus power or self-power can be selected using a pin function (an external power control circuit is required).
{ Corresponds to standard descriptor products
• Two kinds of standard ROM code products are provided. Standard and HUB class descriptors are on-chip in
the µPD72012.
ROM code: 003 (individual overcurrent monitoring type Generic HUB)
ROM code: 004 (collective overcurrent monitoring type Generic HUB)
{ Supports two kinds of clock input
• 48 MHz oscillator input or a 4 MHz crystal resonator can be supported
{ Power control
• Port power control and overcurrent detection functions are on-chip. Individual port control or collective control
can be selected for these.
ORDERING INFORMATION
Part No.
Package
µPD72012CU-XXX
µPD72012GB-XXX-3B4
42-pin plastic SDIP (15.24 mm (600))
44-pin plastic QFP (10 × 10)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. S13918EJ3V0DS00 (3rd edition)
Date Published April 2001 NS CP(K)
Printed in Japan
The mark shows major revised points.
1999
µPD72012
2
Data Sheet S13918EJ3V0DS
µPD72012
PIN CONFIGURATION (Top View)
• 42-pin plastic SDIP (15.24 mm (600))
RST
UD0
1
2
DGND
PVSEL
PSSEL
DGND
DVDD
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
UD1
3
D10
4
D11
5
DGND
D20
6
PP5
7
PP4
D21
8
PP3
9
D30
PP2
D31
10
11
12
13
14
15
16
17
18
19
20
21
PP1
DGND
D40
DVDD (Buffer)
CLKSEL
CS5
D41
D50
CS4
D51
CS3
DGND
OSL
CS2
CS1
AVDD1
CLK/X2
X1
DGND (Buffer)
DVDD
AVDD2
AGND2
AGND1
Data Sheet S13918EJ3V0DS
3
µPD72012
• 44-pin plastic QFP (10×10)
44 43 42 41 40 39 38 37 36 35 34
DVDD
DGND
PSSEL
PVSEL
DGND
RST
1
33
32
31
30
29
28
27
26
25
24
23
CS2
2
CS1
3
DGND (Buffer)
DVDD
4
5
AVDD2
6
AGND2
AGND1
X1
UD0
7
UD1
8
D10
9
CLK/X2
AVDD1
D11
10
11
DGND
OSL
12 13 14 15 16 17 18 19 20 21 22
4
Data Sheet S13918EJ3V0DS
µPD72012
PIN NAME
AGND1
AGND2
AVDD1
: Analog GND1 (Xtal)
D41
: Downstream Port #4 D–
: Analog GND2 (DPLL)
: Analog VDD1 (Xtal)
D50
: Downstream Port #5 D+
: Downstream Port #5 D–
: Digital GND
D51
AVDD2
: Analog VDD2 (DPLL)
DGND
DGND (Buffer)
DVDD
DVDD (Buffer)
OSL
CLKSEL
CLK/X2
: Clock Frequency Control
: 48 MHz OSC, 4 MHz Xtal
Clock Input
: Digital GND (Buffer)
: Digital VDD
: Digital VDD (Buffer)
: OSC Suspend Output
: Port Power Control #1
: Port Power Control #2
: Port Power Control #3
: Port Power Control #4
: Port Power Control #5
: Powered Mode Control
: Down Port Value Control
: Reset
CS1
CS2
CS3
CS4
CS5
D10
D11
D20
D21
D30
D31
D40
: Over Current Detect #1
: Over Current Detect #2
: Over Current Detect #3
: Over Current Detect #4
: Over Current Detect #5
: Downstream Port #1 D+
: Downstream Port #1 D–
: Downstream Port #2 D+
: Downstream Port #2 D–
: Downstream Port #3 D+
: Downstream Port #3 D–
: Downstream Port #4 D+
PP1
PP2
PP3
PP4
PP5
PSSEL
PVSEL
RST
UD0
: Root Port #0 D+
UD1
: Root Port #0 D–
X1
: 4 MHz Xtal Clock Input
Data Sheet S13918EJ3V0DS
5
µPD72012
CONTENTS
1. PIN FUNCTIONS......................................................................................................................................................7
1.1 List of Pin Functions .........................................................................................................................................7
1.2 Tables by Pin Function...................................................................................................................................10
1.3 Equivalent Circuits of Pins..............................................................................................................................11
2. DESCRIPTORS......................................................................................................................................................12
2.1 Standard Device Descriptor............................................................................................................................12
2.2 Standard Configuration Descriptor .................................................................................................................14
2.3 Standard Interface Descriptor.........................................................................................................................16
2.4 Standard Endpoint Descriptor 1 .....................................................................................................................17
2.5 HUB Class Descriptor.....................................................................................................................................17
2.6 Standard String Descriptor 0 ..........................................................................................................................21
2.7 Standard String Descriptors 1 Through 5 .......................................................................................................21
3. ELECTRICAL SPECIFICATIONS ..........................................................................................................................22
4. PACKAGE DRAWINGS.........................................................................................................................................32
5. RECOMMENDED SOLDERING CONDITIONS .....................................................................................................34
6
Data Sheet S13918EJ3V0DS
µPD72012
1. PIN FUNCTIONS
1.1 List of Pin Functions
(1/3)
Pin No.Note Pin Name
I/O
I
Signal Name
RESET
Function
1(6)
2(7)
RST
UD0
Inputs reset signals.
I/O
Data0
Connects to upstream port #0 D+ signal line.
Pull up to 3.3 V line using 1.5 kΩ.
3(8)
4(9)
UD1
D10
I/O
I/O
Data1
Data0
Connects to upstream port #0 D– signal line.
Connects to downstream port #1 D+ signal line.
Pull down to GND using 15 kΩ.
5(10)
D11
I/O
Data1
Connects to downstream port #1 D– signal line.
Pull down to GND using 15 kΩ.
6(11)
7(12)
DGND
D20
-
DGND
Data0
Connect to GND.
I/O
Connects to downstream port #2 D+ signal line.
Pull down to GND using 15 kΩ.
8(13)
9(14)
10(15)
D21
I/O
I/O
I/O
-
Data1
Data0
Data1
DGND
Data0
Data1
Data0
Data1
Connects to downstream port #2 D– signal line.
Pull down to GND using 15 kΩ.
D30
Connects to downstream port #3 D+ signal line.
Pull down to GND using 15 kΩ.
D31
Connects to downstream port #3 D– signal line.
Pull down to GND using 15 kΩ.
11(16,
17)
DGND
D40
Connect to GND.
This pin is used as both pins 16 and 17 internally in the QFP product.
12(18)
13(19)
14(20)
15(21)
16(22)
I/O
I/O
I/O
I/O
-
Connects to downstream port #4 D+ signal line.
Pull down to GND using 15 kΩ.
D41
Connects to downstream port #4 D– signal line.
Pull down to GND using 15 kΩ.
D50
Connects to downstream port #5 D+ signal line.
Pull down to GND using 15 kΩ.
D51
Connects to downstream port #5 D– signal line.
Pull down to GND using 15 kΩ.
Test pin of µPD72012 (corresponds to TS3 pin in µPD72011). Connect
DGND
DGND
to GND.
(TS3)
17(23)
OSL
O
OSC CTL
Pin that outputs high level on suspend. Can be used by LED switch or to
turn oscillator ON/OFF on suspend.
CAUTION
For self-power, always input an oscillator output signal. If the clock
is cut-off, subsequent operation my not be possible.
Note QFP pin numbers are shown in ( ).
Data Sheet S13918EJ3V0DS
7
µPD72012
(2/3)
Pin No.Note 1 Pin Name
I/O
-
Signal Name
AVDD1
Function
18(24)
AVDD1
Power supply pin of on-chip clock drive circuit.
To stabilize the power supply, connect directly to a stable power
supply using the shortest wire possible or connect to GND via a
capacitor along the wire (3.3 V input).
19(25)
CLK / X2
I
CLOCK / XTAL
When you input a clock signal from an oscillator, input at the 48 MHz
CMOS level (5 V can be input).
When using a 4 MHz crystal oscillator, connect the oscillator to this
pin.
20(26)
21(27)
22(28)
23(29)
X1
I
-
-
-
XTAL
When using a 4 MHz crystal oscillator, connect the oscillator to this
pin.
AGND1
AGND2
AVDD2
AGND1
AGND2
AVDD2
GND pin of on-chip clock drive circuit.
Connect to GND.
GND pin of on-chip frequency multiplier (PLL).
Connect to GND.
Power supply pin of on-chip frequency multiplier (PLL).
To stabilize the power supply, connect directly to a stable power
supply using the shortest wire possible or connect to GND via a
capacitor along the wire (3.3 V input).
Test pin of µPD72012 (corresponds to TS1 pin in µPD72011).
24(30)
25(31)
26(32)
DVDD
-
-
I
DVDD
(TS1)
Connect to 3.3 V power supply.
DGND
DGND
Connect to GND.
(Buffer)
(Buffer)
CS1
CS2
CS3
CS4
CS5
PORTCURRENT1
PORTCURRENT2
PORTCURRENT3
PORTCURRENT4
PORTCURRENT5
Low active input pin that inputs overcurrent states detected by
external circuit of downstream port #1.
When not using this pin, connect it directly to VDD. Note 2
27(33)
28(34)
29(35)
30(36)
I
I
I
I
Low active input pin that inputs overcurrent states detected by
external circuit of downstream port #2.
When not using this pin, connect it directly to VDD. Note 2
Low active input pin that inputs overcurrent states detected by
external circuit of downstream port #3.
When not using this pin, connect it directly to VDD. Note 2
Low active input pin that inputs overcurrent states detected by
external circuit of downstream port #4.
When not using this pin, connect it directly to VDD. Note 2
Low active input pin that inputs overcurrent states detected by
external circuit of downstream port #5.
When not using this pin, connect it directly to VDD. Note 2
Notes 1. Pin numbers for QFP are shown in ( ).
2. For details, refer to Table 1-3 in 1.2 Tables by Pin Function.
8
Data Sheet S13918EJ3V0DS
µPD72012
(3/3)
Pin No.Note 1 Pin Name
I/O
I
Signal Name
CLK SELECT
Function
31(37)
32(38)
(39)
CLKSEL
Pin for selecting whether to use 48 MHz oscillator or 4 MHz crystal
oscillator (refer to Table 1-1).
DVDD
-
-
DVDD
Connect to 3.3 V power supply.
(Buffer)
(Buffer)
DVDD
DVDD
Connect to 3.3 V power supply. This pin is used together with pin No.
32 internally in the shrink DIP product.
33(40)
PP1
O
PORTPOWER#1
Low active open drain output pin that controls downstream port #1
power supply.
Input the output of this pin to the power control element of an external
circuit.
If not using this pin, leave it unconnected. Note 2
34(41)
35(42)
36(43)
37(44)
38(1)
PP2
PP3
PP4
PP5
DVDD
O
O
O
O
-
PORTPOWER#2
PORTPOWER#3
PORTPOWER#4
PORTPOWER#5
Low active open drain output pin that controls downstream port #2
power supply.
Input the output of this pin to the power control element of an external
circuit.
If not using this pin, leave it unconnected. Note 2
Low active open drain output pin that controls downstream port #3
power supply.
Input the output of this pin to the power control element of an external
circuit.
If not using this pin, leave it unconnected. Note 2
Low active open drain output pin that controls downstream port #4
power supply.
Input the output of this pin to the power control element of an external
circuit.
If not using this pin, leave it unconnected. Note 2
Low active open drain output pin that controls downstream port #5
power supply.
Input the output of this pin to the power control element of an external
circuit.
If not using this pin, leave it unconnected. Note 2
Test pin of µPD72012 (corresponds to TS0 pin in µPD72011).
DVDD
(TS0)
Connect to 3.3 V power supply.
39(2)
40(3)
DGND
-
I
DGND
Connect to GND.
PSSEL
Power SW
Pin that selects switching between bus power and self-power (refer to
Table 1-2).
To make high level, pull up to 3.3 V.
41(4)
42(5)
PVSEL
DGND
I
Port Value
Pin that selects switching between number (4 or 5) of downstream
ports (refer to Table 1-2).
To make high level, pull up to 3.3 V.
Test pin of µPD72012 (corresponds to TS2 pin in µPD72011).
-
DGND
(TS2)
Connect to GND.
Notes 1. QFP pin numbers are shown in ( ).
2. For details, refer to Table 1-4 of 1.2 Tables by Pin Function.
Data Sheet S13918EJ3V0DS
9
µPD72012
1.2 Tables by Pin Function
Table 1-1. Oscillator Circuit Switching Control (CLKSEL)
Type of oscillator circuit
CLKSEL
L
Input clocks from 48 MHz oscillator
Clock input using 4 MHz crystal resonator (drive circuit is incorporated)
H
Remark Directly connect to VDD when using CLKSEL=“H”. Even 5 V is no trouble.
Table 1-2. Power Mode/Downstream Port Number Control (PSSEL, PVSEL)
PSSEL
PVSEL
Power mode
Self-power Note 1
Self-power Note 1
Bus power Note 2
Prohibited Note 3
Port #1
Port #2
Port #3
Port #4
Port #5
×
L
L
L
H
L
{
{
{
–
{
{
{
–
{
{
{
–
{
{
{
–
{
×
H
H
H
–
Notes 1. Do not cut-off clock input when using self-power. If it is cut-off, internal functions stop and operation
may not be possible even if clocks are input again.
2. When using bus power, up to four ports can be used.
3. The combination PSSEL=“H”, PVSEL=“H” is prohibited. Operation in this case is not guaranteed.
Remark Also set according to this table when setting the number of ports in a Mask ROM code product to up to
5 ports. Directly connect data lines of unused ports to GND.
Table 1-3. Handling of Pins CS1 to CS5 According to Setting of wHubCharacteristics Field of HUB Class
Descriptor
wHubCharacteristics
Bits 4, 3
CS1
CS2
CS3
CS4
CS5
0b00
0b01
Common in all ports
Port #3
Port #1
Port #2
Port #4
Port #5
0b10 or 0b11
Not available
Not available
Not available
Not available
Not available
Remark Connect pins CS1 to CS5 to the Over Current Detect output pin of the power switch IC.
Clamp an unused or unavailable CS1 to CS5 pin to 3.3 V.
Table 1-4. Handling of Pins PP1 to PP5 According to Setting of wHubCharacteristics Field of HUB Class
Descriptor
wHubCharacteristics
Bits 1, 0
PP1
PP2
PP3
PP4
PP5
0b00
0b01
Common in all ports
Port #3
Port #1
Port #2
Port #4
Port #5
Remark Connect pins PP1 to PP5 to the Port Power Control input pin of the power switch IC.
Leave an unused or unavailable PP1 to PP5 pin open.
10
Data Sheet S13918EJ3V0DS
µPD72012
1.3 Equivalent Circuits of Pins
Type
Equivalent Circuit
Pins
Function
3.3 V Schmitt input pin with 5 V tolerant.
5 V tolerant
input pin
RST, CS1 to CS5
(Schmitt)
5 V Schmitt on-chip
5 V tolerant
input pin
CLKSEL, PSSEL,
PVSEL
3.3 V input pin with 5 V tolerant.
5 V
5 V tolerant
clock input
pin
X1, CLK/X2
3.3 V dedicated clock input pin with 5 V
tolerant.
5 V
5 V tolerant
3.3 V output
pin
OSL
3.3 V output pin with 5 V tolerant.
Pull-up to 5 V line is possible.
3.3 V, IOL=6 mA
Open-drain
output pin
PP1 to PP5
Open-drain structure pin.
USB buffer
UD0, UD1, D10 to
D50, D11 to D51
USB buffer. The two kinds of receiver are
DATA receiver and SE0 (single end 0) receiver
on the receiving side.
IN/OUT(D+)
(D–)
RxDATA
On the sending side, rise and fall times are
managed in the last stage of the buffer in
order to create a difference between low-speed
and full-speed.
RxSE0
TxDATA
Data Sheet S13918EJ3V0DS
11
µPD72012
2. DESCRIPTORS
Caution For a Mask ROM code product, we release the software to make a data for Mask ROM option.
Please contact to Local NEC to get the software if you would like to make Mask ROM code
product.
2.1 Standard Device Descriptor
(1/2)
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
004
0
bLength
1
Shows the size in bytes of the standard device
descriptor.
0x12
0x12
0x12
1
2
bDescriptorType
bcdUSB
1
2
Shows that this is a standard device descriptor.
0x01
0x01
0x01
Shows that the µPD72012 compliant with USB
0x0110
0x0110
0x0110
Specifications Revision 1.1.
4
5
6
7
8
bDeviceClass
bDeviceSubClass
bDeviceProtocol
bMaxPacketSize0
idVendor
1
1
1
1
2
HUB class code defined by USB
(HUB_CLASSCODE=“0x09”).
0x09
0x00
0x09
0x00
0x09
0x00
HUB subclass code defined by USB. Not defined in
HUB class.
Protocol code defined by USB. Not defined in HUB
class.
0x00
0x00
0x00
Shows the maximum packet size in bytes of
0x08
0x08
0x08
endpoint 0 of the µPD72012.
Shows the vendor ID code registered in USB
standards.
0x0409
0x0409
0xXXXX
For a standard ROM code product (003, 004), this is
“0x0409” (NEC vendor ID).
When using in a Mask ROM code product, set a
vendor ID for each manufacturer registered in USB
standards.
10 IdProduct
2
2
Shows the product ID code registered in USB
standards.
0x55AB
0x0200
0x55AB
0x0200
0xXXXX
0xXXXX
For a standard ROM code product (003, 004), this is
“0x55AB” (Generic_HUB).
In a Mask ROM code product, this value can be set
as you wish.
Shows the version number of the µPD72012 using
decimal notation in XX.XX format.
12 bcdDevice
For a standard ROM code product (003, 004), this is
“0x0200” (Ver. 2.0).
When using in a Mask ROM code product, manage
by varying the number for each ROM code.
12
Data Sheet S13918EJ3V0DS
µPD72012
(2/2)
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
004
14 iManufacture
1
1
1
1
Shows the index of the string descriptor for a
comment about a manufacturer using the HUB.
Since not used for a standard ROM code product
(003, 004), its value is “0x00”.
0x00
0x00
0x00
or
0x01
When using this for a Mask ROM code product, set it
to “0x01”.
15 iProduct
Shows the index of the string descriptor for a
comment about a product using the HUB.
Since not used for a standard ROM code product
(003, 004), its value is “0x00”.
0x00
0x00
0x01
0x00
0x00
0x01
0x00
or
0x02
When using this for a Mask ROM code product, set it
to “0x02”.
16 iSerialNumber
Shows the index of the string descriptor for the serial
number of a product using the HUB.
Since not used for a standard ROM code product
(003, 004), its value is “0x00”.
0x00
or
0x03
When using this for a Mask ROM code product, set it
to “0x03”.
17 bNumConfiguration
Shows the number of configurations that can be set
for this HUB.
0x01
Its value is fixed at “0x01” for the µPD72012
Data Sheet S13918EJ3V0DS
13
µPD72012
2.2 Standard Configuration Descriptor
(1/2)
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
004
0
1
2
bLength
1
1
2
Shows the size in bytes of the standard
configuration descriptor.
0x09
0x09
0x09
0x02
bDescriptorType
wTotalLength
Shows that this is a standard configuration
descriptor.
0x02
0x02
Shows the total length of descriptors returned on a
host Get_Descriptor (Configuration) request
(standard configuration, standard interface, each
standard endpoint, and HUB class descriptors).
0x0019
0x0019
0x0019
4
5
6
bNumInteface
1
1
1
Shows the number of interfaces that can be set in
this configuration.
0x01
0x01
0x00
0x01
0x01
0x00
0x01
0x01
Its value is fixed at “0x01” for the µPD72012.
bConfigurationValue
iConfiguration
Specifying this value in a Set_Configuration request
from the host sets this configuration in the
µPD72012.
Shows the index of the string descriptor for a
comment about the configuration of a product using
the HUB.
0x00
or
0x04
Since not used for a standard ROM code product
(003, 004), its value is “0x00”.
When using this for a Mask ROM code product, set it
to “0x04”.
7
bmAttributes
1
Uses a bitmap to show the power supply attributes
0xE0
0xE0
0xE0
or
of this configuration of the µPD72012.
0xA0
Caution Since the information “Self-power” in
the status returned on a Get_Status
request from the host reflects the level
input to the PSSEL pin, be sure that
there are no inconsistencies.
“0xE0”: Corresponds to both “bus power” and “self-
power” modes and shows that “Remote Wakeup” is
supported. A standard ROM code product has this
setting.
Use this setting when using in “self-power” mode
only or when switching between “bus power” and
“self-power” by performing a PSSEL pin function.
“0xA0”: Corresponds to “bus power” mode only and
shows that “Remote Wakeup” is supported.
Make this setting when using in “bus power” mode
only.
14
Data Sheet S13918EJ3V0DS
µPD72012
(2/2)
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask ROM
code
product
003
004
8
MaxPower
1
Shows the maximum current the HUB consumes in
normal operation in hexadecimal notation using
units of 2 mA.
0x32
0x32
0x32
(PSSEL=“L”) (PSSEL=“L”) (PSSEL=“L”)
or
or
or
Since it provides 1 UnitLoad (= 100 mA) to each
0x32
0x32
0x32
port downstream, this is not included in MaxPower. (PSSEL=“H”) (PSSEL=“H”) (PSSEL=“H”)
However, if a non-removable device is connected
downstream, this is included (for details inquire in
the USB-IF).
(recommen-
ded value)
Switching the input level of the PSSEL pin changes
the value that is returned. In short, two-way setting
of the µPD72012 is possible for “self-power” and
“bus power”.
Mask ROM code product
For a “bus power” setting (PSSEL=“H”), normally set
this to 0x32 (100 mA). However, when making a
subordinate port a non-removable port, add the
current consumed by the device connected to that
port when you set the MaxPower value. On the
other hand, For a “self-power” setting (PSSEL=“L”),
0x32 (100 mA) is fixed.
Data Sheet S13918EJ3V0DS
15
µPD72012
2.3 Standard Interface Descriptor
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
004
0
bLength
1
Shows the size in bytes of the standard interface
descriptor.
0x09
0x09
0x09
1
2
bDescriptorType
bInterfaceNumber
1
1
Shows that this is a standard interface descriptor.
0x04
0x00
0x04
0x00
0x04
0x00
If there are multiple interfaces, the host specifying
this value in a Set_Interface request selects this
interface.
This is “0x00” for the µPD72012.
3
4
5
bAlternateSetting
bNumEndpoints
bIntefaceClass
1
1
1
This value is used if there is an alternate setting of
0x00
0x01
0x09
0x00
0x01
0x09
0x00
0x01
0x09
the interface. It is “0x00” for the µPD72012.
Shows the number of endpoints defined in this
interface.
HUB class code defined by USB
(HUB_CLASSCODE=“0x09”).
6
7
bInterfaceSubClass
bInterfaceProtocol
1
1
HUB subclass code defined by USB.
0x00
0x00
0x00
0x00
0x00
0x00
Protocol code defined by USB. Not defined in HUB
class.
8
iInteface
1
Shows the index of the string descriptor for a
comment about the interface of a product using the
HUB.
0x00
0x00
0x00
or
0x05
Since not used for a standard ROM code product
(003, 004), its value is “0x00”.
When using this for a Mask ROM code product, set it
to “0x05”.
16
Data Sheet S13918EJ3V0DS
µPD72012
2.4 Standard Endpoint Descriptor 1
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
004
0
bLength
1
Shows the size in bytes of standard endpoint
descriptor 1.
0x07
0x07
0x07
1
2
3
bDescriptorType
bEndpointAddress
bmAttributes
1
1
1
Shows that this is a standard endpoint descriptor.
Shows the EndpointAddress of endpoint 1.
0x05
0x81
0x03
0x05
0x81
0x03
0x05
0x81
0x03
Shows the attributes of endpoint 1
(Interrupt=“0x03”).
4
6
wMaxPacketSize
bInterval
2
1
Shows the maximum packet size of endpoint 1.
0x0001
0xFF
0x0001
0xFF
0x0001
0xFF
For an Interrupt attribute endpoint, shows the polling
time in milliseconds using hexadecimal notation. For
a HUB, the maximum value that can be set (“0xFF”)
is entered.
2.5 HUB Class Descriptor
(1/4)
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
0x09
0x29
0x04
004
0x09
0x29
0x04
0
1
2
bDescLength
bDescriptorType
bNbrPort
1
1
1
Shows the size in bytes of the HUB class descriptor.
Shows that this is a HUB class descriptor.
0x09
0x29
0xXX
Shows the number of downstream ports the HUB
supports in a set.
(PVSEL=“L”) (PVSEL=“L”) (PVSEL=“L”)
For a standard ROM code product (003, 004), the
value varies according to the PVSEL pin setting.
It is “0x05” for a 5-port HUB (PVSEL=“H”), and
“0x04” for a 4-port HUB (PVSEL=“L”).
or
or
or
0x05
0x05
0xYY
(PVSEL=“H”) (PVSEL=“H”) (PVSEL=“H”)
For a Mask ROM code product, the value in this field
can be set arbitrarily. Since two-way setting by
switching the PVSEL input level is possible for these
values, perform two-way specification. Note that the
values that are set for PVSEL=“H” are from “0x01” to
“0x05”, and the values that are set for PVSEL=“L”
are from “0x01” to “0x04”. The µPD72012 enables
ports in turn starting from the smallest port number.
Data Sheet S13918EJ3V0DS
17
µPD72012
(2/4)
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
0x0009
004
Uses a bitmap to show attributes of the µPD72012.
3
wHubCharacteristics
2
0x0000
0x00XX
The meaning of each bit is as follows.
Bits 1,0: Show the power switch switching attribute.
“0b00”: Enable all power switches at once.
This is the value for a standard ROM code
product (004).
If this value is set for a Mask ROM code
product, all of pins PP1 to PP5 operate at
once.
“0b01”: Enable power switches individually for
each port.
This is the value for a standard ROM code
product (003).
If this value is set for a Mask ROM code
product, pins PP1 to PP5 operate
individually.
“0b1X”: Reserved. Used only on 1.0 compliant
hubs that implement no power switching.
You can not use this setting for µPD72012.
Bit 2:
Identifier of a compound device. Set this
to “0b0” when using the µPD72012 as a
unit HUB and to “0b1” when using it as
compound devices.
“0b0”: Shows that the µPD72012 is standalone
HUB unit.
“0b1”: Shows that µPD72012 is a part of
compound devices.
Bits 4,3: Show the overcurrent protection switching
attribute.
“0b00”: Monitor overcurrent for all ports in a batch.
Since this is the value for a standard ROM
code product (004), a circuit that can
control all overcurrent protection functions
at once externally is needed.
If this value is set for a Mask ROM code
product, when one of the pins CS1 to CS5
detect overcurrent, Hub reports
overcurrent on per- hub basis.
18
Data Sheet S13918EJ3V0DS
µPD72012
(3/4)
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
004
3
wHubCharacteristics
2
“0b01”: Monitor overcurrent for each port
individually.
0x0009
0x0000
0x00XX
Since this is the setting for a standard
ROM code product (003), a circuit that can
individually control overcurrent protection
functions externally is needed.
If this value is set for a Mask ROM code
when one of the pins CS1 to CS5 detect
overcurrent, Hub reports overcurrent on
per- port basis.
“0b1X”: Shows that there is no overcurrent
protection function. This setting is allowed
only for bus-powered hubs that do not
implement over-current protection.
If this value is set for a Mask ROM code
product, clamp all of the pins CS1 to CS5
to 3.3 V.
Bits 15-5: These bits are reserved in the USB
standard for future extended functions.
For a Mask ROM code product, be sure to
set these bits to “0”.
Caution Be sure to set the values in bits 3 and 0
the same in Mask ROM code product
settings.
5
6
bPowerOn2PwrGood
bHubContrCurrent
1
1
Shows the time from detecting a device at a port and
starting the power-on sequence until the power
supply stabilizes.
0x32
0x50
0x32
0x50
0x32
0xXX
Two milliseconds are taken as one unit. This is 100
ms for the µPD72012.
Shows the maximum current consumption of the
HUB in mA. Note that this value does not show the
rated current consumption value for the µPD72012
itself.
For a standard ROM code product, “0x50” is applied
for compatibility with the µPD72011. This value can
be defined for a Mask ROM code product. However,
this value should not be less than the current
consumption value of the µPD72012 that is
described in 3. ELECTRICAL SPECIFICATIONS.
Data Sheet S13918EJ3V0DS
19
µPD72012
(4/4)
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
004
7
bDeviceRemovable
1
Uses a bitmap to show whether or not removable
devices are connected to HUB ports.
0x00
0x00
0xXX
“1” shows that the connected device is non-
removable, and “0” shows that it is removable. Set
“1” if a port that is used cannot be connected nor
disconnected using an external circuit.
Note that, if a non-removable device is connected to
a downstream port of the HUB, bit 2 of
wHubCharacteristics field should be set to “1”.
When the number of ports that can be port enabled
is limited by the PVSEL pin setting or Mask ROM
code product settings, set “0” for all ports that are
not port enabled. The meaning of the bitmap is as
follows.
Bit 0:
Bit 1:
Always set to “0”.
If “1”, the device connected to port 1 is
non-removable.
Bit 2:
Bit 3:
Bit 4:
Bit 5:
If “1”, the device connected to port 2 is
non-removable.
If “1”, the device connected to port 3 is
non-removable.
If “1”, the device connected to port 4 is
non-removable.
If “1”, the device connected to port 5 is
non-removable.
Bits 7,6: Always set to “0”.
For a standard ROM code product (003, 004), all
ports are removable.
8
bPortPwrCtrlMask
1
This field exists for reasons of compatibility with
software written for 1.0 compliant devices. All bits in
this field should be set to 1B.
0xFF
0xFF
0xFF
20
Data Sheet S13918EJ3V0DS
µPD72012
2.6 Standard String Descriptor 0
Standard string descriptor 0 cannot be used in a standard ROM code product.
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
0x00
0x00
004
0x00
0
1
2
bLength
1
1
2
Shows the size of standard string descriptor 0.
Shows that this is a standard string descriptor.
0x04
0x03
bDescriptorType
wLANGID[0]
0x00
Shows the LanguageID of standard string descriptor
0. The LanguageID used is “0x0409” (Generic).
The µPD72012 uses this LanguageID in common for
all string descriptors.
0x0000
0x0000
0x0409
2.7 Standard String Descriptors 1 Through 5
Standard string descriptors 1 through 5 cannot be used in a standard ROM code product.
This format is the common format for standard string descriptors #1 through #5 of the µPD72012.
No.
Field
Size
Contents
Value
(Bytes)
Standard ROM code
product
Mask
ROM code
product
003
004
0
bLength
1
Shows the size of standard string descriptors 1
through 5. Its value is fixed at 66 bytes (0x42). The
string itself is this size –2 (64 bytes).
0x00
0x00
0x42
1
2
bDescriptorType
bString
1
Shows that this is a standard string descriptor.
0x00
All 0
0x00
All 0
0x03
–
64
Stores the standard string descriptor in UNICODE.
A string requires 2 bytes for each character. Strings
of up to 32 characters can be specified. If there are
white space characters, pad using NULL characters
(0x0000).
Remark Five kinds of standard string descriptors can be defined and these describe the following contents
using 32 UNICODE characters.
Index
Contents
1
2
3
4
5
Comment about manufacturer (Manufacture) that uses HUB
Comment about product (Product) that uses HUB
Serial number (SerialNumber) of product that uses HUB
Comment about configuration (Configuration) of product that uses HUB
Comment about interface (Interface) of product that uses HUB
Refer to “The Unicode Standard, Worldwide Character Encoding, Version 1.0, Volume 1 and 2”, The Unicode
Consortium, Addison-Wesley Publishing Company, Reading, Massachusetts regarding UNICODE.
Data Sheet S13918EJ3V0DS
21
µPD72012
3. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Parameter
Power supply voltage
Input voltage
Symbol
VDD
Conditions
Rating
Unit
V
–0.5 to +4.6
–0.5 to +4.6
VI
USB buffer
V
UD0, UD1, D10 to D50, D11 to D51
Clock input buffer
X1, CLK/X2
–0.5 to +6.6
–0.5 to +6.6
–0.5 to +4.6
–0.5 to +4.6
–0.5 to +6.6
–0.5 to +6.6
V
V
V
V
V
V
5 V Schmitt input buffer
RST, CS1 to CS5
5 V input buffer
CLKSEL, PSSEL, PVSEL
Output voltage
VO
USB buffer
UD0, UD1, D10 to D50, D11 to D51
Open drain output buffer
PP1 to PP5
5 V output buffer
OSL
Output current
Operating ambient temperature TA
Storage temperature
IO
100
mA
°C
0 to +70
°C
Tstg
–65 to +150
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for
any parameter. That is, the absolute maximum ratings are rated values at which the product is
on the verge of suffering physical damage, and therefore the product must be used under
conditions that ensure that the absolute maximum ratings are not exceeded.
Recommended Operating Conditions (TA = 0 to +70°C)
Parameter
Power supply voltage
High level input voltage
Low level input voltage
High level input voltage
Low level input voltage
Input rise time for RST
High level input voltage
Low level input voltage
High level input voltage
Low level input voltage
Clock input frequency
Symbol
VDD
Conditions
MIN.
3.0
2.0
0
TYP.
3.3
MAX.
3.6
VDD
0.8
5.5
0.8
10
Unit
V
VIH
VIL
VIH
VIL
tr
USB pin
V
UD0, UD1, D10 to D50, D11 to D51
V
5 V Schmitt input pin
RST, CS1 to CS5
2.3
0
V
V
0.3 V to 2.7 V
ms
V
VIH
VIL
VIH
VIL
fCK
5 V input pin
2.0
0
5.5
0.8
5.5
0.8
CLKSEL, PSSEL, PVSEL
V
Clock input pin (at 48 MHz input)
X1, CLK/X2
2.3
0
V
V
Oscillator input (+100 ppm)
Oscillator input (+50 ppm)
48.00
4.0
MHz
MHz
22
Data Sheet S13918EJ3V0DS
µPD72012
Recommended Oscillator Circuit Constants
Crystal oscillator (TA = 0 to +70°C)
Manufacturer
Product name
Frequency (MHz)
Oscillator circuit constant (pF)
C1
10
9
C2
10
9
DAISHINKU CORP.
AT-49
HC-49/U
4.000
4.000
X1
X2
C1
C2
Cautions 1. The oscillator circuit constants, which show the conditions for stabilizing and oscillating,
do not guarantee oscillation frequency accuracy. If the mounting circuit requires oscillation
frequency accuracy, it must be possible to adjust the oscillation frequency of the oscillator
in the mounting circuit. Therefore, ask the manufacturer of the oscillator you use about this
directly.
2. When using an oscillator circuit, wire portions shown using broken lines in the figure as
follows to avoid affecting wire capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wring near a signal line through which a high fluctuating current flows.
• Always keep the ground point of the oscillator capacitor to the same potential as VSS.
• Do not ground the capacitor to a ground pattern in which a high current flows.
• Do not fetch signals from the oscillator.
Data Sheet S13918EJ3V0DS
23
µPD72012
DC Characteristics (VDD = 3.3 V +0.3 V, TA = 0 to +70°C)
(1) Current consumption
Parameter
Symbol
IDD
Conditions
fCK = 48 MHz, 4 MHz
MIN.
TYP.
MAX.
40
Unit
Current consumption
mA
µA
Current consumption (during
suspend)
IDD(SUS)
120
(2) USB input/output buffer
Parameter
Symbol
VOH
Conditions
14.2 kΩ RH for GND
MIN.
2.8
0
TYP.
MAX.
3.6
Unit
V
High level output voltage
Low level output voltage
Differential common mode range
1.42 kΩ RL for 3.6 V
VOL
0.3
V
VCM
Includes VDI range
Absolute value of (D+) – (D–)
0.2 Vmin
0.8
2.5
V
10
µA
Data line leakage current in input
pin high impedance state
ILO
0 V < VIN < 3.3 V
Crossover output voltage
VCRS
1.3
2.0
V
(3) 5 V output buffer
Parameter
High level output voltage
Low level output voltage
Symbol
VOH
Conditions
IOH = –6 mA
MIN.
TYP.
MAX.
2.4
Unit
V
VOL
IOH = 6 mA
0.4
V
(4) Open drain output buffer
Parameter
Symbol
Conditions
IOL = 6 mA
MIN.
TYP.
MAX.
0.4
Unit
V
Low level output voltage
VOL
24
Data Sheet S13918EJ3V0DS
µPD72012
AC Characteristics (VDD = 3.3 V +0.3 V, TA = 0 to +70°C)
(1) Full-speed output driver characteristics
Parameter
Symbol
tFR, tFF
Conditions
MIN.
4
TYP.
MAX.
20
Unit
ns
Output rise time (FS)
Output fall time (FS)
UD0, UD1
CL = 50 pF, TA = 25°C,
10% to 90%
1.3
28
2.0
44
V
Ω
Crossover output voltage
Driver output resistance
Full-speed data rate
VCRS
ZDRV
tFDRATE
tDJ1
12Mbps 0.25%
Continuous transition
Pair transition
11.97
12.03
3.5
Mbps
ns
Differential driver jitter (FS)
4.0
ns
tDJ2
–2
+5
ns
Source jitter on SE0 transition from tFDEOP
differential transition (FS)
18.5
9
ns
ns
ns
ns
ns
ns
Receiver jitter (FS)
tJR1
Continuous transition
Pair transition
tJR2
26
One-way propagation delay
EOP source SE0 interval
EOP receiver SE0 interval
tFPROP
tFEOPT
tFEOPR
tFST
160
82
175
Accept as effective EOP.
14
SE0 time interval on differential
transition
(2) HUB repeater characteristics (Full-speed)
Parameter
Symbol
tr, tf
Conditions
MIN.
4
TYP.
MAX.
20
Unit
ns
Output rise time (LS)
Output fall time (LS)
D10 to D50, D11 to D51
CL = 50 pF, TA = 25°C,
10% to 90%
Differential data delay (LS)
Differential driver jitter (LS)
tHDD1
tHDD2
tHDJ1
tHDJ2
With cable
70
44
3
ns
ns
ns
ns
ns
Without cable
Continuous transition
Pair transition
1
Data bit length distortion after SOP tFSOP
(LS)
+5
HUB EOP delay for tHDD1
tFEOPD
tFHESK
0
15
15
ns
ns
EOP output width skew (LS)
Data Sheet S13918EJ3V0DS
25
µPD72012
(3) HUB event timing
Parameter
Symbol
tDCNN
Conditions
MIN.
2.5
TYP.
MAX.
2000
Unit
µs
Time to detect downstream port
connection event (wake-up HUB)
µs
µs
µs
Time to detect downstream port
connection event (suspend HUB)
2.5
2
12000
2.5
Time to detect disconnect event at
downstream port (wake-up HUB)
tDDIS
Time to detect disconnect event at
downstream port (suspend HUB)
2
10000.0
Period to drive resume at downstream
port (from control HUB only)
tDRSMDN
20
ms
µs
µs
µs
Time from detecting downstream
resume to re-broadcasting
tURSM
100
5.5
Time to detect long K state from
upstream
tURLK
2.5
2.5
Time to detect long SE0 from upstream tURLSE0
10000
23
Period to repeat SE0 upstream
tURPSE0
FS Bit
time
Period to transmit SE0 upstream after
EOF1
tUDEOP
Optional
2
FS Bit
time
26
Data Sheet S13918EJ3V0DS
µPD72012
(4) Device event timing
Parameter
Symbol
tSIGATT
Conditions
MIN.
TYP.
MAX.
100
Unit
ms
Time from internal power becoming
effective until device pulls D+/D–
above VIHZ (MIN.) (signal attach)
Time for USB system software to
perform debounce after attach
tATTDB
100
10
ms
ms
Time for which bus is continuously in
idling state, maximum time device
draws more power than suspend
power
t2SUSP
Maximum value of average suspend
time
tSUSAVGI
1
s
Period to drive upstream on resume
Resume restore period
tDRSMUP
tRSMRCY
1
15
ms
ms
Supplied by USB system
software
10
µs
Time to detect reset from upstream
Reset restore time
tDETRST
tRSTRCY
tIPD
Same as tURLSE0
2.5
2
10000
10
ms
Inter-packet delay
Bit time
Bit time
Inter-packet delay of device
tPDRSP1
6.5
7.5
responses using detachable cable
Inter-packet delay of device
responses using captive cable
tPDRSP2
Bit time
SetAddress() completion time
tDSETADDR
50
50
ms
ms
Time to complete standard request
without data stage
tDRQCMPLTND
Time to deliver first and subsequent
data (excluding last) for standard
request
tDRETDATA1
500
50
ms
ms
Time to deliver last data for standard
request
tDRETDATAN
Data Sheet S13918EJ3V0DS
27
µPD72012
Measurement Conditions
(1) Differential data jitter
tPERIOD
Crossover
points
Differential data lines
Continuous
transition
N × tPERIOD + txJR1
Pair transition
N × tPERIOD + txDJ2
(2) EOP transition skew and EOP length differential
tPERIOD
Extension
crossover points
Crossover point
Differential data lines
From differential
data until SE0 skew
N × tPERIOD + tDEOP
Source EOP width: tFEOPT, tLEOPT
Receiver EOP width: tFEOPR, tLEOPR
(3) Permissible range of receiver jitter
tPERIOD
Differential data lines
tJR
tJR1
tJR2
Continuous transition
N × tPERIOD + tJR1
Pair transition
N × tPERIOD + tJR2
Remark tPERIOD is the data rate of a receiver that has the range that is defined in paragraph 7.1.11 of USB
Specification Revision 1.1.
28
Data Sheet S13918EJ3V0DS
µPD72012
(4) HUB differential delay, differential jitter, and SOP distortion
(a) Downstream HUB delay including cable (b) Downstream HUB delay excluding cable
Upstream
Upstream
Crossover point
port of HUB
end of cable
50% point of
initial swing
VSS
VSS
50% point of
initial swing
HUB delay
downstream
tHDD2
Downstream
end of HUB
Downstream
port of HUB
HUB delay
downstream
tHDD1
VSS
VSS
(c) Upstream HUB delay with and without cable
Crossover point
Downstream
port of HUB
VSS
Crossover point
Upstream port or
end of cable
HUB delay
upstream
tHDD1, tHDD2
VSS
HUB operation jitter:
tHDJ1 = tHDDx(J) − tHDDx(K) or tHDDx(K) − tHDDx(J) Continuous transition
tHDJ2 = tHDDx(J) − tHDDx(J) or tHDDx(K) − tHDDx(K) Pair transition
Bit after SOP width distortion (same as data jitter of next transition of SOP):
tFSOP = tHDDx(next J) − tHDDx(SOP)
The low-speed timing below is determined by the same method.
tLHDD, tLDHJ1, tLDJH2, tLUHJ1, tLUJH2, and tLSOP
Data Sheet S13918EJ3V0DS
29
µPD72012
(5) HUB EOP delay and EOP skew
(a) Downstream EOP delay including cable
(b) Downstream EOP delay excluding cable
50% point of
initial swing
Expansion
Upstream port
of HUB
Upstream
crossover points
end of cable
VSS
VSS
tEOP-
tEOP-
tEOP+
tEOP+
Downstream
port of HUB
Downstream
end of HUB
VSS
VSS
(c) Downstream EOP delay with and without cable
Expansion
crossover points
Downstream
port
VSS
tEOP+
tEOP-
Expansion
crossover points
Upstream port or
end of cable
VSS
EOP delay:
tEOPD = tEOPy − tEHDDx
(tEOPy means apply this expression to tEOP– and tEOP+.)
EOP skew:
tHESK = tEOP+ − tEOP–
The low speed timing below is determined by the same method.
tLEOPD, tLHESK
30
Data Sheet S13918EJ3V0DS
µPD72012
CS Timing Chart
500 µsec
500 µsec
500 µsec
500 µsec
HUB power supply
Up port D+ line
BUS reset
PP pin output
CS pin input
Output cut-off
DEVICE
connection
inrush current
Overcurrent
generation
Port power
supply ON
CS pin operation
region
Power supply ON
Bus power: Up port connection
Self-power: Power supply ON
CS detection
delay time
CS active period
Remark The active period of the CS pin is in effect only when the PP pin is ON.
There is a delay time of approximately 500 µsec duration at the CS pin.
Data Sheet S13918EJ3V0DS
31
µPD72012
4. PACKAGE DRAWINGS
42-PIN PLASTIC SDIP (15.24mm(600))
42
22
1
21
A
K
L
J
I
F
M
R
B
C
D
M
N
H
G
NOTES
1. Each lead centerline is located within 0.17 mm of
ITEM MILLIMETERS
A
B
C
D
F
G
H
I
39.13 MAX.
1.78 MAX.
1.778 (T.P.)
0.50 0.10
0.9 MIN.
its true position (T.P.) at maximum material condition.
2. Item "K" to center of leads when formed parallel.
3.2 0.3
0.51 MIN.
4.31 MAX.
5.08 MAX.
15.24 (T.P.)
13.2
J
K
L
+0.10
0.25
M
−0.05
N
R
0.17
0∼15°
P42C-70-600A-2
32
Data Sheet S13918EJ3V0DS
µPD72012
44-PIN PLASTIC QFP (10x10)
A
B
23
22
33
34
detail of lead end
S
C
D
R
Q
12
11
44
1
F
G
J
M
H
I
P
K
M
S
N
S
L
NOTE
Each lead centerline is located within 0.15 mm of
its true position (T.P.) at maximum material condition.
ITEM MILLIMETERS
A
B
C
D
F
13.6 0.4
10.0 0.2
10.0 0.2
13.6 0.4
1.0
G
1.0
+0.08
H
0.35
−0.07
0.15
I
J
K
L
0.8 (T.P.)
1.8 0.2
0.8 0.2
+0.08
M
0.17
−0.07
0.10
N
P
Q
R
S
2.7 0.1
0.1 0.1
5° 5°
3.0 MAX.
P44GB-80-3B4-5
Data Sheet S13918EJ3V0DS
33
µPD72012
5. RECOMMENDED SOLDERING CONDITIONS
The µPD72012 should be soldered and mounted under the following recommended conditions. For the details of
the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology
Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Surface mount type soldering conditions
µPD72012GB-XXX-3B4: 44-pin plastic QFP (10 × 10)
Soldering Method
Infrared reflow
VPS
Soldering Conditions
Recommended
Condition Code
Peak package temperature: 235°C, Time: 30 sec. max. (210°C min.), Count: three
IR35-00-3
VP15-00-3
WS60-00-1
times or less
Peak package temperature: 215°C, Time: 40 sec. max. (200°C min.), Count: three
times or less
Solder bath temperature: 260°C max., Time: 10 sec. max., Count: once,
Preheating temperature: 120°C max. (package surface temperature)
Pin temperature: 300°C max., Time: 3 sec. max. (per device side)
Wave soldering
Pin partial heating
–
Caution Avoid using different soldering methods together. (However, the pin partial heating method is
excluded.)
Through-hole type soldering conditions
µPD72012CU-XXX: 42-pin plastic SDIP (15.24 mm (600))
Soldering Method
Soldering Conditions
Solder bath temperature: 260°C max., Time: 10 sec. max.
Wave soldering (pins
only)
Pin temperature: 300°C max., Time: 3 sec. max. (per pin)
Pin partial heating
Caution Apply wave soldering only to the pins, and exercise care that solder does not directly contact
the package.
34
Data Sheet S13918EJ3V0DS
µPD72012
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Data Sheet S13918EJ3V0DS
35
µPD72012
The export of this product from Japan is prohibited without governmental license. To export or re-export this product from
a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
•
The information in this document is current as of April, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
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