25T06H-BW [NELLSEMI]

TRIACs;
25T06H-BW
型号: 25T06H-BW
厂家: NELL SEMICONDUCTOR CO., LTD    NELL SEMICONDUCTOR CO., LTD
描述:

TRIACs

三端双向交流开关
文件: 总6页 (文件大小:613K)
中文:  中文翻译
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RoHS  
25T Series RoHS  
SEMICONDUCTOR  
TRIACs, 25A  
Snubberless and Standard  
FEATURES  
High current triac  
Low thermal resistance with clip bonding  
A2  
Low thermal resistance insulation ceramic  
for insulated TO-220AB & TO-3P package  
1
A1  
A2  
2
High commutation (4 quadrant) or very  
High commutation (3 quadrant) capability  
3
G
TO-220AB (non-Insulated)  
TO-220AB (lnsulated)  
25T series are UL certified (File ref: E320098)  
Packages are RoHS compliant  
(25TxxA)  
(25TxxAI)  
APPLICATIONS  
A2  
Applications include the ON/OFF function in  
applications such as static relays, heating  
regulation, induction motor starting circuits,  
etc., or for phase control operation in light  
dimmers, motor speed controllers, and silmilar.  
A1  
A2  
G
A1  
A2  
G
The snubberless versions are especially  
recommended for use on inductive loads,  
due to their high commutation performances.  
The 25T series provides an insulated tab  
(rated at 2500VRMS).  
TO-3P (non-Insulated)  
TO-3P (Insulated)  
(25TxxB)  
(25TxxBI)  
A2  
MAIN FEATURES  
2(A2)  
SYMBOL  
VALUE  
UNIT  
A
A1  
A2  
3(G)  
IT(RMS)  
G
25  
1(A1)  
TO-263 (D2PAK)  
VDRM/VRRM  
IGT(Q1)  
V
600 to 1200  
35 to 50  
(25TxxH)  
mA  
ABSOLUTE MAXIMUM RATINGS  
VALUE  
UNIT  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
Tc = 105ºC  
TO-3P  
IT(RMS)  
RMS on-state current (full sine wave)  
Tc = 100ºC  
Tc = 75ºC  
t = 20 ms  
t = 16.7 ms  
TO-263/TO-220AB/TO-3P insulated  
TO-220AB insulated  
F =50 Hz  
25  
A
250  
260  
340  
Non repetitive surge peak on-state  
ITSM  
A
current (full cycle, T initial = 25°C)  
j
F =60 Hz  
I2t  
I2t Value for fusing  
A2s  
t
= 10 ms  
p
Critical rate of rise of on-state current  
IG = 2xlGT, tr≤100ns  
Tj =125ºC  
Tj =125ºC  
A/µs  
F =100 Hz  
50  
dI/dt  
Tp =20 µs  
Tj =125ºC  
Peak gate current  
IGM  
4
1
A
PG(AV)  
Average gate power dissipation  
W
Tstg  
Tj  
Storage temperature range  
- 40 to + 150  
- 40 to + 125  
ºC  
Operating junction temperature range  
www.nellsemi.com  
Page 1 of 6  
RoHS  
25T Series RoHS  
SEMICONDUCTOR  
(TJ= 25 ºC unless otherwise specified)  
ELECTRICAL CHARACTERISTICS  
SNUBBERLESS and Logic level (3 quadrants)  
25Txxxx  
Unit  
SYMBOL  
TEST CONDITIONS  
QUADRANT  
BW  
CW  
(1)  
I - II - III  
I - II - III  
IGT  
35  
mA  
V
50  
VD = 12 V, RL = 30Ω  
MAX.  
VGT  
1.3  
0.2  
VD = VDRM, RL = 3.3KΩ  
Tj = 125°C  
I - II - III  
VGD  
MIN.  
MAX.  
MAX.  
V
(2)  
50  
IT = 500 mA  
IH  
mA  
75  
I - III  
70  
80  
80  
IG = 1.2 IGT  
IL  
mA  
II  
100  
dV/dt(2)  
500  
13  
VD = 67% VDRM gate open ,T = 125°C  
V/µs  
1000  
22  
,
j
MIN.  
(dI/dt)c(2)  
Without snubber, T = 125°C  
j
A/ms  
ELECTRICAL CHARACTERISTICS (TJ= 25 ºC unless otherwise specified)  
Standard (4 quadrants)  
25Txxxx  
B
TEST CONDITIONS  
SYMBOL  
UNIT  
QUADRANT  
50  
I - II - III  
(1)  
IGT  
MAX.  
mA  
VD = 12 V, RL = 30Ω  
IV  
100  
1.3  
VGT  
VGD  
V
V
ALL  
ALL  
VD = VDRM, RL = 3.3KΩ, Tj = 125°C  
IT = 500 mA  
0.2  
(2)  
mA  
IH  
MAX.  
MAX.  
80  
I - III - IV  
70  
IL  
IG = 1.2 IGT  
mA  
160  
II  
dV/dt(2)  
VD = 67% VDRM, gate open, Tj = 125°C  
(dI/dt)c =13.3 A/ms, Tj = 125°C  
V/µs  
V/µs  
MIN.  
MIN.  
500  
10  
(dV/dt)c(2)  
STATIC CHARACTERISTICS  
SYMBOL  
TEST CONDITIONS  
UNIT  
V
VALUE  
1.55  
0.85  
16  
(2)  
ITM = 35 A, tP = 380 µs  
Threshold voltage  
Tj = 25°C  
VTM  
MAX.  
MAX.  
MAX.  
(2)  
Tj = 125°C  
Vt0  
V
(2)  
Dynamic resistance  
Rd  
Tj = 125°C  
Tj = 25°C  
mΩ  
µA  
5
IDRM  
IRRM  
VD = VDRM  
VR = VRRM  
MAX.  
Tj = 125°C  
3
mA  
Note 1: Minimum lGT is guaranted at 5% of lGT max.  
Note 2: For both polarities of A2 referenced to A1.  
THERMAL RESISTANCE  
UNIT  
SYMBOL  
VALUE  
TO-3P  
0.6  
0.8  
TO-263/TO-220AB  
TO-3P Insulated  
TO-220AB Insulated  
TO-263  
Rth(j-c)  
Junction to case (AC)  
0.9  
1.7  
45  
60  
50  
S = 1 cm2  
°C/W  
Rth(j-a)  
TO-220AB Insulated, TO-220AB  
TO-3P, TO-3P Insulated  
Junction to ambient  
S = Copper surface under tab.  
www.nellsemi.com  
Page 2 of 6  
RoHS  
25T Series RoHS  
SEMICONDUCTOR  
PRODUCT SELECTOR  
VOLTAGE (xx)  
PART NUMBER  
SENSITIVITY  
TYPE  
PACKAGE  
600 V  
800 V  
1000 V  
1200 V  
25TxxA-B/25TxxAl-B  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
50 mA  
35 mA  
50 mA  
50 mA  
35 mA  
50 mA  
50 mA  
35 mA  
50 mA  
Standard  
Snubberless  
Snubberless  
Standard  
TO-220AB  
TO-220AB  
TO-220AB  
TO-3P  
25TxxA-CW/25TxxAl-CW  
25TxxA-BW/25TxxAl-BW  
25TxxB-B/25TxxBl-B  
25TxxB-CW/25TxxBl-CW  
25TxxB-BW/25TxxBl-BW  
25TxxH-B  
Snubberless  
Snubberless  
Standard  
TO-3P  
TO-3P  
D2PAK  
D2PAK  
D2PAK  
25TxxH-CW  
Snubberless  
Snubberless  
25TxxH-BW  
AI: Insulated TO-220AB package  
BI: Insulated TO-3P package  
ORDERING INFORMATION  
,
WEIGHT  
2.0g  
PACKAGE  
DELIVERY MODE  
ORDERING TYPE  
MARKING  
BASE Q TY  
25TxxA-yy  
25TxxA-yy  
TO-220AB  
50  
50  
Tube  
Tube  
25TxxAI-yy  
25TxxAI-yy  
TO-220AB (insulated)  
2.3g  
25TxxB-yy  
25TxxBI-yy  
25TxxB-yy  
25TxxBI-yy  
4.3g  
4.8g  
TO-3P  
30  
30  
Tube  
Tube  
TO-3P (insulated)  
D2PAK  
25TxxH-yy  
25TxxH-yy  
2.0g  
50  
Tube  
Note: xx = voltage, yy = sensitivity  
ORDERING INFORMATION SCHEME  
-
BW  
25 T 06  
A
Current  
25 = 25A  
Triac series  
Voltage  
06 = 600V  
08 = 800V  
10 = 1000V  
12 = 1200V  
Package type  
A = TO-220AB (non-insulated)  
AI = TO-220AB ( insulated)  
B = TO-3P (non-insulated)  
BI = TO-3P (insulated)  
H = TO-263 (D2PAK)  
I
GT  
Sensitivity  
BW = 50mA Snubberless  
CW = 35mA Snubberless  
B = 50mA Standard  
www.nellsemi.com  
Page 3 of 6  
RoHS  
25T Series RoHS  
SEMICONDUCTOR  
Fig.1 Maximum power dissipation versus RMS on-state  
current (full cycle)  
Fig.2 RMS on-state current versus case temperature  
(full cycle)  
P (W)  
IT(RMS) (A)  
30  
30  
TO-3P  
25  
20  
25  
20  
TO-220AB  
(insulated)  
15  
10  
5
15  
10  
5
TO-220AB  
TO-263  
TO-3P(insulated)  
IT(RMS)(A)  
TC(°C)  
0
0
0
25  
50  
75  
100  
125  
0
5
10  
15  
20  
25  
Fig.3 D2PAK RMS on-state current versus ambient  
temperature (printed circuit board FR4,  
copper thickness: 35µm)(full cycle)  
Fig.4 Relative variation of thermal impedance  
versus pulse duration.  
IT(RMS) (A)  
K=[Zth/Rth]  
4.0  
1E+0  
D2PAK  
Zth(j-c)  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
(S=1cm2)  
Zth(j-a)  
TO-263AB  
TO-220AB  
1E-1  
TO-220AB (insulated)  
1E-2  
1E-3  
Zth(j-a)  
TO-3P(insulated)  
0.5  
0.0  
Tamb(°C)  
tp(s)  
0
25  
50  
75  
100  
125  
1E-3  
1E-2  
1E-1  
1E+0  
1E+1  
1E+2 5E+2  
Fig.6 Surge peak on-state current versus number  
of cycles.  
Fig.5 On-state characteristics (maximum values).  
I
(A)  
ITSM (A)  
300  
250  
200  
150  
100  
300  
T max.  
j
to  
d
V
= 0.85 V  
t=20ms  
100  
10  
1
R
= 16 mΩ  
One cycle  
Non repetitive  
T =T max  
j
j
T initial=25°C  
j
T =25°C  
j
Repetitive  
T =75°C  
c
50  
0
VTM(V)  
Number of cycles  
1
10  
100  
1000  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
www.nellsemi.com  
Page 4 of 6  
RoHS  
25T Series RoHS  
SEMICONDUCTOR  
Fig.7 Non-repetitive surge peak on-state current  
for a sinusoidal pulse with width tp < 10ms.  
and corresponding value of l2t.  
Fig.8 Relative variation of gate trigger current,holding  
current and latching current versus junction  
temperature (typical values).  
lTSM (A), l2t(A2s)  
lGT,lH,lL[Tj] / lGT,lH,lL [Tj=25°C]  
3000  
1000  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Tj initial=25°C  
dI/dt limitation:  
50A/µs  
IGT  
ITSM  
IH & IL  
I2t  
Tj(°C)  
tp(ms)  
100  
0.01  
0.10  
1.00  
10.00  
-40  
-20  
0
20  
40  
60  
80  
100  
120 140  
Fig.9 Relative variation of critical rate of decrease  
Fig.10 Relative variation of critical rate of decrease  
of main current versus Tj  
of main current versus (dV/dt)c (typical values).  
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c  
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c  
6
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
5
4
CW/BW  
B
3
2
1
0
Tj(°C)  
(dV/dt)c (V/µs)  
0.1  
100.0  
1.0  
10.0  
0
25  
50  
75  
100  
125  
Fig.11 D2PAK thermal resistance junction to  
ambient versus copper surface under  
tab (printed circuit board FR4, copper  
thickness: 35µm)  
Rth(j-a)(°C/W)  
80  
70  
60  
50  
40  
TO-263  
30  
20  
10  
0
S(cm2)  
0
4
8
12  
16  
20  
24  
28  
32  
36  
40  
www.nellsemi.com  
Page 5 of 6  
RoHS  
25T Series RoHS  
SEMICONDUCTOR  
Case Style  
TO-220AB  
10.54 (0.415) MAX.  
4.70 (0.185)  
4.44 (0.1754)  
1.39 (0.055)  
1.14 (0.045)  
9.40 (0.370)  
9.14 (0.360)  
3.91 (0.154)  
3.74 (0.148)  
2.87 (0.113)  
2.62 (0.103)  
3.68 (0.145)  
3.43 (0.135)  
15.32 (0.603)  
14.55 (0.573)  
16.13 (0.635)  
15.87 (0.625)  
PIN  
8.89 (0.350)  
8.38 (0.330)  
1
2
3
4.06 (0.160)  
3.56 (0.140)  
29.16 (1.148)  
28.40 (1.118)  
2.79 (0.110)  
2.54 (0.100)  
1.45 (0.057)  
1.14 (0.045)  
14.22 (0.560)  
13.46 (0.530)  
2.67 (0.105)  
2.41 (0.095)  
0.90 (0.035)  
0.70 (0.028)  
5.20 (0.205)  
4.95 (0.195)  
2.65 (0.104)  
2.45 (0.096)  
0.56 (0.022)  
0.36 (0.014)  
TO-263(D2PAK)  
10.45 (0.411)  
9.65 (0.380)  
4.83 (0.190)  
4.06 (0.160)  
1.40 (0.055)  
1.14 (0.045)  
6.22 (0.245)  
1.40 (0.055)  
1.19 (0.047)  
9.14 (0.360)  
8.13 (0.320)  
15.85 (0.624)  
15.00 (0.591)  
0 to 0.254 (0 to 0.01)  
2.79 (0.110)  
2.29 (0.090)  
0.940 (0.037)  
0.686 (0.027)  
0.53 (0.021)  
0.36 (0.014)  
2.67 (0.105)  
2.41 (0.095)  
3.56 (0.140)  
2.79 (0.110)  
5.20 (0.205)  
4.95 (0.195)  
TO-3P  
15.50 (0.610)  
15.10 (0.594)  
4.60 (0.181)  
4.40 (0.173)  
1.55 (0.061)  
1.45 (0.057)  
R 4.60 (0.181)  
Φ4.17 (0.164)  
4.08 (0.160)  
21.10 (0.831)  
20.40 (0.803)  
16.50 (0.650)  
15.80 (0.622)  
3.65 (0.144)  
3.40 (0.134)  
1
2
3
1.40 (0.055)  
1.20 (0.047)  
15.60 (0.614)  
14.35 (0.565)  
2(A2)  
5.65 (0.222)  
5.40 (0.213)  
5.65 (0.222)  
5.40 (0.213)  
0.70 (0.028)  
0.50 (0.020)  
2.90 (0.114)  
2.70 (0.106)  
3(G)  
1(A1)  
www.nellsemi.com  
Page 6 of 6  

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